JP3246265B2 - Electronic component using bonding wire, method of manufacturing the same, and method of forming wire - Google Patents

Electronic component using bonding wire, method of manufacturing the same, and method of forming wire

Info

Publication number
JP3246265B2
JP3246265B2 JP09691595A JP9691595A JP3246265B2 JP 3246265 B2 JP3246265 B2 JP 3246265B2 JP 09691595 A JP09691595 A JP 09691595A JP 9691595 A JP9691595 A JP 9691595A JP 3246265 B2 JP3246265 B2 JP 3246265B2
Authority
JP
Japan
Prior art keywords
wire
bonding
bonding pad
electronic component
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP09691595A
Other languages
Japanese (ja)
Other versions
JPH08293518A (en
Inventor
真嗣 山崎
光平 村上
徹 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP09691595A priority Critical patent/JP3246265B2/en
Publication of JPH08293518A publication Critical patent/JPH08293518A/en
Application granted granted Critical
Publication of JP3246265B2 publication Critical patent/JP3246265B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85444—Gold (Au) as principal constituent
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
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    • H01L2924/01—Chemical elements
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】この発明はワイヤボンディングに
より接続する電子部品の改良に関するもので、より詳し
くはボンディングパッドと導体パターンをワイヤにより
接続されるボンディングワイヤを用いた電子部品並びに
その製造方法及びそのワイヤ成形方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in an electronic component connected by wire bonding, and more particularly, to an electronic component using a bonding wire in which a bonding pad and a conductor pattern are connected by a wire, a method of manufacturing the same, and a method of manufacturing the same. The present invention relates to a wire forming method .

【０００２】[0002]

【従来の技術】従来の電子部品を図８を参照して説明す
る。図８は特開平４−２９４５５２号公報に開示された
ワイヤボンディングを用いた電子部品の側面図である。
図８において、リードフレームのアイランド１にペレッ
ト２を付け、ペレット２の配線電極であるボンディング
パッド３に突起電極４を介してステッチボンディングを
するものである。2. Description of the Related Art A conventional electronic component will be described with reference to FIG. FIG. 8 is a side view of an electronic component using wire bonding disclosed in Japanese Patent Application Laid-Open No. 4-294552.
In FIG. 8, a pellet 2 is attached to an island 1 of a lead frame, and stitch bonding is performed via a protruding electrode 4 to a bonding pad 3 serving as a wiring electrode of the pellet 2.

【０００３】ボンディングパッド３に金ボールを変形接
着させ、その後、金ワイヤ５をクランパにて保持したま
ま引き上げ、金ボールネック部にて切断し、バンプ状態
にする。その後、バンプ整形用キャピラリーツールにて
バンプを上部より押し、凸部をほぼ平坦な形に整形す
る。バンプの形成によりキャピラリーツールの先端がボ
ンディングパッド３に接触しないでステッチボンディン
グが可能となる。また、金ワイヤ５はペレット２の端部
に対して充分な距離と高さが保たれ、長いワイヤであっ
てもワイヤたれ等によるペレット２との接触が防止でき
る。[0003] A gold ball is deformed and bonded to the bonding pad 3 and then pulled up while holding the gold wire 5 with a clamper, and cut at a gold ball neck to form a bump. Thereafter, the bump is pressed from above by a bump shaping capillary tool to shape the convex portion into a substantially flat shape. By forming the bumps, stitch bonding can be performed without the tip of the capillary tool coming into contact with the bonding pad 3. In addition, the gold wire 5 is maintained at a sufficient distance and height from the end of the pellet 2, so that even a long wire can be prevented from contacting the pellet 2 due to wire dripping or the like.

【０００４】従来の電子部品を図９を参照して説明す
る。図９は特開昭６０−９１５０号公報に開示された電
子部品で、この電子部品は配線電極の表面層が純度の異
なる二層の金電極からなる半導体基板を用いて、ワイヤ
ボンディング性の向上を図ったものである。半絶縁性Ｇ
ａＡｓ基板１１の酸化膜窓開きされた領域にイオン注入
法を用い、動作層５５を形成後に、フォトレジストを塗
布形成し、これにドレインおよびソース電極窓開きし、
このレジスタ膜上方より真空蒸着法によりＡｕＧｅを２
００Å、Ａｕを４００Åの厚さに順次被着形成し、その
後のレジスト膜を除去し、電極７７を形成する。その
後、加熱処理して動作層５５との間にオーミック接触を
形成する。A conventional electronic component will be described with reference to FIG. FIG. 9 shows an electronic component disclosed in Japanese Patent Application Laid-Open No. 60-9150. This electronic component uses a semiconductor substrate in which the surface layer of a wiring electrode is composed of two layers of gold electrodes having different purities to improve the wire bonding property. It is intended. Semi-insulating G
Using an ion implantation method in the region where the oxide film window of the aAs substrate 11 is formed, after forming the operation layer 55, a photoresist is applied and formed, and the drain and source electrode windows are opened on this,
AuGe is deposited from above the register film by vacuum evaporation.
Then, Au and Au are sequentially deposited to a thickness of 400 °, and the resist film is removed to form an electrode 77. Thereafter, a heat treatment is performed to form an ohmic contact with the operation layer 55.

【０００５】次に、アルミニウムを厚さ７００Åで真空
蒸着し、リストオフ法で、電極６６を形成後に、バッフ
ァメタル層８８としてチタンを厚さ２０００Å、白金を
１５００Åに順次前面に真空蒸着する。後に、最上層の
金メッキ層を形成させるためのメッキ用のフォトレジス
タ膜９９の膜を形成し、バッファメタル層８８をメッキ
用の導電膜として、まず、純度９９．９％の金を析出す
るメッキ液を使い、硬質メッキ層を厚さ３０００Åに被
着させ第１の金メッキ層１００及び１００Ｇを形成す
る。続いて、第２のメッキ層として純度９９．９９％の
軟質金メッキ層を析出形成するメッキ液により厚さ１μ
ｍに被着させ、第２金メッキ層１１０および１１０Ｇを
形成する。図９（ａ）はこの第１、第２金メッキ工程完
了状態を示してある。[0005] Next, aluminum is vacuum-deposited to a thickness of 700 °, an electrode 66 is formed by a wrist-off method, and titanium is then vacuum-deposited as a buffer metal layer 88 to a thickness of 2000 ° and platinum to 1500 ° in order. Later, a photoresist film 99 for plating for forming the uppermost gold plating layer is formed, and the buffer metal layer 88 is used as a conductive film for plating. First, plating is performed to deposit 99.9% pure gold. Using a solution, a hard plating layer is applied to a thickness of 3000 ° to form first gold plating layers 100 and 100G. Subsequently, a 1 μm thick plating solution is used to deposit and form a soft gold plating layer having a purity of 99.99% as a second plating layer.
m to form second gold plated layers 110 and 110G. FIG. 9A shows a state in which the first and second gold plating steps are completed.

【０００６】次に、フォトレジスタ膜９９を除去し、図
９（ｂ）を得る。バッファメタル層８８の不要部分を金
メッキ層マスクとしてエッチングにより除去することに
より図９（ｃ）に示すようにゲート電極２２、ドレイン
電極２４を得て電極工程が終了する。Next, the photoresist film 99 is removed to obtain FIG. 9B. Unnecessary portions of the buffer metal layer 88 are removed by etching using a gold plating layer mask to obtain the gate electrode 22 and the drain electrode 24 as shown in FIG. 9C, and the electrode process is completed.

【０００７】[0007]

【発明が解決しようとする課題】従来の電子部品は、突
起電極を形成し、この突起電極により金ワイヤとペレッ
ト端部に対して充分な距離と高さを保ち、ワイヤたれ等
によるペレットとの接触を防止していた。In the conventional electronic parts, a protruding electrode is formed, and the protruding electrode keeps a sufficient distance and height between the gold wire and the end of the pellet, thereby forming a contact between the gold wire and the pellet due to wire dripping or the like. Contact was prevented.

【０００８】しかしながら、図１０に示すように電力を
制御するパワー素子３００、このパワー素子３００のゲ
ートを制御する制御用ＩＣ１０２が同一のプリント基板
１０１に搭載された電子部品において、制御用ＩＣ１０
２のボンディングパッド１１４と導体パターン１０５と
を第１のワイヤ１１５によって接続され、パワー素子３
００のボンディングパッド３１４およびゲート電極３１
５と導体パターン１０５を第２のワイヤ３３０によって
接続されている。かかる電子部品において、２種類ある
ワイヤを第２のワイヤ３３０の１種類にできれば、キャ
ピラリーツールの種類等を減少せしめて省力化を図るこ
とができるが、従来の電子部品によれば、制御用ＩＣ１
０２のボンディングパッド１１４に形成される突起電極
を大きくしなければならず、実装面等の制約から突起電
極の形成が困難であるという問題点があった。However, as shown in FIG. 10, a power device 300 for controlling the power and a control IC 102 for controlling the gate of the power device 300 are mounted on the same printed circuit board 101.
2 are connected to the conductive pattern 105 by the first wire 115, and the power element 3
00 bonding pad 314 and gate electrode 31
5 and the conductor pattern 105 are connected by a second wire 330. In such an electronic component, if two types of wires can be replaced by one type of the second wire 330, the type of the capillary tool can be reduced to save labor. However, according to the conventional electronic component, the control IC 1
02 a bonding pad 114 must be increased projection electrode formed on the, had problems points will have the formation of the protruding electrodes from the constraints of the mounting surface or the like to be difficult to.

【０００９】[0009]

【００１０】この発明の目的は上記問題点を解決するた
めになされたもので、パワー素子と、このパワー素子の
ゲートを制御する制御用ＩＣが同一の基板上に搭載され
た電子部品において、導体パターンと制御用ＩＣ及びパ
ワー素子のボンディングパッドとを接続するワイヤの種
類を削減すると共に、ボンディングパッドに形成される
突起電極を無くし、ワイヤたれ等によるペレットとの接
触を防止することができるボンディングワイヤを用いた
電子部品並びにその製造方法及びそのワイヤ成形器を提
供することを目的とする。[0010] The present purpose of the invention has been made to solve the above Kitoi problem points, and the power element, an electronic component where the control IC is mounted on the same board for controlling the gate of the power element In the above, it is possible to reduce the types of wires connecting the conductor pattern and the bonding pads of the control IC and the power element, eliminate the protruding electrodes formed on the bonding pads, and prevent contact with the pellet due to wire dripping or the like. It is an object of the present invention to provide an electronic component using a bonding wire that can be used, a method for manufacturing the same, and a wire forming device therefor.

【００１１】[0011]

【００１２】[0012]

【課題を解決するための手段】第１の発明に係るボンデ
ィングワイヤを用いた電子部品は、導体パターンを有す
るプリント基板と、上記プリント基板に搭載される電力
を制御するパワー素子と、上記プリント基板に搭載され
ると共に、上記パワー素子のゲートを制御するペレット
を備えた制御用ＩＣと、上記ペレットの表面に設けた第
１のボンディングパッドと、上記パワー素子に設けた第
２のボンディングパッドと、第１のボンディングパッド
および上記導体パターンを電気的に接続する第１のワイ
ヤと、上記第２のボンディングパッドと上記導体パター
ンを電気的に接続する第２のワイヤとを備えたボンディ
ングワイヤを用いた電子部品であって、上記第１のワイ
ヤは端部の一方が上記第１のボンディングパッドの幅と
ほぼ同一以下であると共に、電気的、機械的な接合を満
たす幅以上である細線部と、上記端部の他方が上記第２
のワイヤと同一形状である太線部とを設けたことを特徴
とするものである。An electronic component using a bonding wire according to a first aspect of the present invention includes a printed board having a conductor pattern, a power element mounted on the printed board for controlling electric power, and a printed circuit board. A control IC provided with a pellet for controlling a gate of the power element, a first bonding pad provided on a surface of the pellet, and a second bonding pad provided on the power element; A bonding wire including a first wire for electrically connecting the first bonding pad and the conductor pattern and a second wire for electrically connecting the second bonding pad and the conductor pattern were used. An electronic component, wherein one end of the first wire is substantially equal to or less than the width of the first bonding pad. Together, electrical, and fine line portion is greater than width to meet the mechanical interface, the other is the second of the end portion
And a thick line portion having the same shape as the above-mentioned wire.

【００１３】第２の発明に係るボンディングワイヤを用
いた電子部品の製造方法は、制御用ＩＣのペレットに形
成された第１のボンディングパッドと、上記制御用ＩＣ
により制御されるパワー素子に設けた第２のボンディン
グパッドと、上記第１のボンディングパッドとプリント
基板に形成された導体パターンを電気的に接続する第１
のワイヤと、上記第２のボンディングパッドと上記導体
パターンを電気的に接続する第２のワイヤとを備えたボ
ンディングワイヤを用いた電子部品の製造方法であっ
て、上記導体パターンに上記第２のワイヤと同一形状で
ある上記第１のワイヤ端部の一方を接合し、上記第１の
ワイヤ端部の他方を第１のボンディングパッドの幅とほ
ぼ同一以下であると共に、電気的、機械的な接合を満た
す幅以上である細線部に加工し、上記第１のワイヤの細
線部を上記第１のボンディングパッドに接合することを
特徴とするものである。According to a second aspect of the present invention, there is provided a method of manufacturing an electronic component using a bonding wire, comprising: a first bonding pad formed on a pellet of a control IC;
A second bonding pad provided on the power element controlled by the first bonding pad and a first bonding pad electrically connecting the first bonding pad to a conductor pattern formed on a printed circuit board.
And a second wire for electrically connecting the second bonding pad and the conductor pattern. A method for manufacturing an electronic component using a bonding wire, the method comprising: One end of the first wire end having the same shape as the wire is joined, and the other end of the first wire end is substantially equal to or less than the width of the first bonding pad, and is electrically and mechanically connected. The method is characterized in that the thin wire portion is processed into a thin wire portion having a width equal to or larger than the width satisfying the joining, and the thin wire portion of the first wire is joined to the first bonding pad.

【００１４】[0014]

【００１５】第３の発明に係るワイヤ成形方法は、第１
のワイヤの細線部をプレスまたは絞り加工により得るこ
とを特徴とするものである。A wire forming method according to a third aspect of the present invention is the
The thin wire portion of the wire is obtained by pressing or drawing.

【００１６】[0016]

【作用】第１の発明に係るボンディングワイヤを用いた
電子部品によれば、第１のワイヤの細線部は端部の一方
が上記第１のボンディングパッドの幅とほぼ同一以下で
あると共に、電気的、機械的な接合を満たす幅以上であ
り、第１のワイヤの太線部は、上記端部の他方が上記第
２のワイヤと同一形状である。According to the electronic component using the bonding wire according to the first aspect of the present invention, one of the ends of the thin wire portion of the first wire is substantially equal to or less than the width of the first bonding pad. The width of the thick wire portion of the first wire is equal to or larger than the width satisfying the mechanical and mechanical joining, and the other end of the thick wire portion has the same shape as the second wire.

【００１７】第２の発明に係る電子部品によれば、第１
のワイヤ端部の他方を第１のボンディングパッドの幅と
ほぼ同一以下であると共に、電気的、機械的な接合を満
たす幅以上である細線部に加工し、この細線部を上記第
１のボンディングパッドに接合する。According to the electronic component of the second invention, the first
The other end of the wire is processed into a thin wire portion having a width substantially equal to or less than the width of the first bonding pad and a width not less than the width satisfying the electrical and mechanical bonding, and this thin wire portion is formed into the first bonding pad. Join to the pad.

【００１８】[0018]

【００１９】第３の発明に係るワイヤ成形方法によれ
ば、プレスまたは絞り加工はワイヤの細線部得る。According to the wire forming method of the third invention, the thin portion of the wire is obtained by pressing or drawing.

【００２０】[0020]

【実施例】実施例１． この発明の一実施例である電子部品を図１に基づいて説
明する。図１において、１０１はプリント基板で、この
プリント基板１０１の基材は樹脂、セラミック等により
形成されている。１０２ａは制御用ＩＣ１０２のペレッ
トで、このペレット１０２ａの一方の面はニッケルめっ
き１０６ａが施され、半田１１２を介して第１の導体パ
ターン１０５ａに接合されている。ペレット１０２ａの
他方の面にはアルミニウムから成るボンディングパッド
１１４が接合されている。第２の導体パターン１０５ｂ
の一方の面にはニッケルめっき１０６ｂが施され、この
ニッケルめっき１０６ｂの表面に金フラッシュめっき１
１７が施されている。１１５は第１のワイヤで、このワ
イヤ１１５は端部の一方が細い細線部１１５ａと、ワイ
ヤ１１５の端部の他方が第２のワイヤ３３０と同一形状
である太線部１１５ｂとから形成されており、細線部１
１５ａの先端部がボンディングパッド１１４に接合さ
れ、太線部１１５ｂの先端部が導体パターン１０５ｂの
金フラッシュめっき１１７に接合されている。[Embodiment 1] An electronic component according to an embodiment of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 101 denotes a printed circuit board, and a base material of the printed circuit board 101 is formed of resin, ceramic, or the like. Reference numeral 102a denotes a pellet of the control IC 102. One surface of the pellet 102a is plated with nickel 106a and is joined to the first conductor pattern 105a via the solder 112. A bonding pad 114 made of aluminum is bonded to the other surface of the pellet 102a. Second conductor pattern 105b
Is plated with nickel plating 106b, and the surface of this nickel plating 106b is
17 is given. Reference numeral 115 denotes a first wire. The wire 115 is formed of a thin wire portion 115a having one thin end and a thick wire portion 115b having the same shape as the second wire 330 at the other end of the wire 115. , Thin line part 1
The tip of 15a is joined to the bonding pad 114, and the tip of the thick line 115b is joined to the gold flash plating 117 of the conductor pattern 105b.

【００２１】ここで、ワイヤ１１５の細線部１１５ａの
幅はボンディングパッド１１４に接合した後、ボンディ
ングパッド１１４の幅とほぼ同一になる寸法に形成され
ている。これは、ボンディングパッド１１４からワイヤ
１１５の細線部１１５ａがはみ出すことを防ぐためであ
る。したがって、超音波ボンディングによる接合では細
線部１１５ａの塑性変形によりワイヤ１１５の幅寸法の
約１．２倍に拡大されるので、接合前における細線部１
１５ａの原寸法はボンディングパッド１１４の幅の約
０．８倍に形成されている。一方、固相ボンディングで
はこの塑性変形がほとんど生じないので、細線部１１５
ａの原寸法幅はボンディングパッド１１４の幅とほぼ同
一に形成されている。なお、熱圧着法によるボンディン
グもあるが、接合の際、原幅寸法の数倍に拡大するため
適切でない。また、ワイヤ１１５の細線部１１５ａの太
さは電気的、機械的な接合条件を満たすことは言うまで
もない。Here, the width of the thin line portion 115 a of the wire 115 is formed to be substantially the same as the width of the bonding pad 114 after bonding to the bonding pad 114. This is to prevent the thin line portion 115a of the wire 115 from protruding from the bonding pad 114. Therefore, in the bonding by ultrasonic bonding, the width of the wire 115 is enlarged to about 1.2 times the width of the wire 115 due to plastic deformation of the fine wire 115a.
The original size of 15a is formed to be about 0.8 times the width of the bonding pad 114. On the other hand, since this plastic deformation hardly occurs in the solid-phase bonding, the thin wire portion 115
The original dimension width of “a” is formed substantially the same as the width of the bonding pad 114. In addition, although there is bonding by a thermocompression bonding method, it is not appropriate at the time of bonding because the size is increased to several times the original width. Needless to say, the thickness of the thin line portion 115a of the wire 115 satisfies the electrical and mechanical joining conditions.

【００２２】なお、この実施例における各部の数値は例
えば、以下に示すものであるが、この発明がこの数値に
限定されることがないことは言うまでもない。パワー素
子３００の電流容量はペレットサイズは８ｍｍ角で、基
板の放熱特性等より５０Ａ程度である。また、制御用Ｉ
Ｃ１０２の電流容量は主としてパワー素子３００の増幅
率により決定されるが、数ｍｍＡ程度である。金フラッ
シュめっき１１７のメッキ厚さは０．０１μｍ程度であ
る。また、ボンディングパッド１１４の幅は制御用ＩＣ
１０２のペレット１０２ａに接続されるワイヤ１１５の
本数等によって決定されるが１００μｍ程度となる。The numerical values of each part in this embodiment are, for example, as follows, but it goes without saying that the present invention is not limited to these numerical values. The current capacity of the power element 300 is about 8 A in a pellet size of 8 mm square and about 50 A due to heat radiation characteristics of the substrate. The control I
The current capacity of C102 is mainly determined by the amplification factor of power element 300, but is about several milliamps. The plating thickness of the gold flash plating 117 is about 0.01 μm. Further, the width of the bonding pad 114 is determined by the control IC.
Although it is determined by the number of wires 115 connected to the pellet 102a of 102, it is about 100 μm.

【００２３】また、導体パターン１０５はパワー素子３
００に接続されるので、電流容量等を確保するためにパ
ターンの幅がボンディングパッド１１４に比較して広く
形成されている。The conductor pattern 105 is a power element 3
00, the pattern width is formed wider than the bonding pad 114 in order to secure current capacity and the like.

【００２４】実施例２． この発明に用いるワイヤを製造するワイヤ成形器の実施
例を図２及び図３を参照して説明する。図２および図３
において、２１１はＶ字形溝２１１ａを設けたキャピラ
リーツール、２２０はワイヤ１１５を成形するダイス
で、このダイス２２０は、対称形状の分離、結合可能な
上部２２０ａおよび下部２２０ｂから成り、挿入口２２
０ｃと挿出口２２０ｄから成るロート状の孔が穿設され
ている。挿出口２２０ｄの孔径はワイヤ１１５の細線部
１１５ａとほぼ同一になっていて、挿入口２２０ｃの孔
径はワイヤ１１５の太線部１１５ｂよりもやや大きくな
っている。なお、ダイス２２０の材質は工具用炭素鋼で
ある。Embodiment 2 FIG. An embodiment of a wire former for producing a wire used in the present invention will be described with reference to FIGS. 2 and 3
In the figure, 211 is a capillary tool provided with a V-shaped groove 211a, 220 is a die for forming the wire 115, and the die 220 is composed of an upper part 220a and a lower part 220b which can be separated and connected in a symmetrical shape, and
A funnel-shaped hole consisting of 0c and an insertion port 220d is provided. The hole diameter of the insertion opening 220d is substantially the same as the thin line portion 115a of the wire 115, and the hole diameter of the insertion hole 220c is slightly larger than the thick line portion 115b of the wire 115. The material of the die 220 is carbon steel for tools.

【００２５】以上のように構成されたワイヤ成形器によ
りワイヤを製造する方法について説明する。図１に示す
ようにワイヤ１１５の太線部１１５ｂの先端が金フラッ
シュめっき１１７に接合された後、ダイス２２０の上部
２２０ａと下部２２０ｂとを分離し、ワイヤ１１５をロ
ート状の孔に嵌合させる。上部２２０ａと下部２２０ｂ
とを結合させ、図示しないアームでダイス２２０の表面
を圧接する。ダイス２２０を矢印と反対の方向に水平移
動させ、ワイヤ１１５がダイス２２０のロート状の孔を
通過させ、この通過の際にワイヤ１１５を削ることによ
り挿出口２２０ｄからワイヤ１１５の細線部１１５ａが
削成される。A description will be given of a method of manufacturing a wire using the wire forming device having the above-described configuration. As shown in FIG. 1, after the tip of the thick line portion 115b of the wire 115 is joined to the gold flash plating 117, the upper part 220a and the lower part 220b of the die 220 are separated, and the wire 115 is fitted into the funnel-shaped hole. Upper part 220a and lower part 220b
And the surface of the die 220 is pressed against the surface of the die 220 by an arm (not shown). The die 220 is horizontally moved in the direction opposite to the arrow, and the wire 115 passes through the funnel-shaped hole of the die 220. At this time, the wire 115 is cut, so that the thin line portion 115a of the wire 115 is cut from the insertion port 220d. Is done.

【００２６】次に、ワイヤ１１５の細線部１１５ａをキ
ャピラリーツール２１１のＶ字形溝２１１ａに嵌合さ
せ、１ｋｇｆ程度の荷重を加えながら、数十〜数百ＫＨ
ｚ程度の周波数による微小振動を加え、ボンディングパ
ッド１１４にワイヤ１１５の細線部１１５ａの先端を圧
接して接合する。以上により図１に示すワイヤ１１５の
接合が完了する。Next, the thin wire portion 115a of the wire 115 is fitted into the V-shaped groove 211a of the capillary tool 211, and while applying a load of about 1 kgf, several tens to several hundreds KH are applied.
A minute vibration with a frequency of about z is applied, and the distal end of the thin line portion 115a of the wire 115 is pressed against the bonding pad 114 and joined. Thus, the bonding of the wires 115 shown in FIG. 1 is completed.

【００２７】実施例３． この発明に用いるワイヤを製造するワイヤ成形器の他の
実施例を図４及び図５を参照して説明する。この実施例
はワイヤ１１５の細線部１１５ｃを断面が長方形の形状
に加工し、この細線部１１５ｃをボンディングパッド１
１４に接合するものである。これは、細線部１１５ｃの
形状を長方形のボンディングパッド１１４に対応させた
ものである。図４及び図５において、２１４はワイヤ１
１５を塑性変形させるプレス機構で、このプレス機構２
１４は左右方向に移動可能な一対の圧接部２１４ａ、２
１４ｂから成っている。２１６はキャピラリーツール
で、このキャピラリーツール２１６は先端に溝２１６ａ
が設けられていて、この溝２１６ａの形状はワイヤ１１
５の細線部１１５ｃが嵌合可能となっており、ワイヤ１
１５の細線部１１５ｃを溝２１６ａに嵌合させた状態に
おいて、キャピラリーツール２１６の先端部から図示の
Ｘの距離を突出されるように形成されている。このＸの
距離は例えば３５μｍ突出される。Embodiment 3 FIG. Another embodiment of a wire former for producing a wire used in the present invention will be described with reference to FIGS. In this embodiment, a thin wire portion 115c of a wire 115 is processed into a rectangular cross section, and this thin wire portion 115c is
14. In this case, the shape of the thin line portion 115c is made to correspond to the rectangular bonding pad 114. 4 and 5, reference numeral 214 denotes a wire 1
15 is a press mechanism for plastically deforming the press mechanism 15.
Reference numeral 14 denotes a pair of press-contact portions 214a, 2
14b. A capillary tool 216 has a groove 216a at its tip.
Are provided, and the shape of the groove 216a is
5 can be fitted with the thin wire portion 115c.
In a state where the fifteen thin wire portions 115c are fitted into the grooves 216a, they are formed so as to protrude from the distal end portion of the capillary tool 216 by a distance X in the drawing. This X distance is projected, for example, by 35 μm.

【００２８】以上のように構成されたワイヤ成形器によ
りワイヤを製造する方法について説明する。ワイヤ１１
５の太線部１１５ｂの先端が金フラッシュめっき１１７
に接合された後、プレス機構２１４の圧接部２１４ａと
圧接部２１４ｂの間にワイヤ１１５を送出し、ワイヤ１
１５をクランプし、圧接部２１４ａ、２１４ｂを矢印の
ように移動させ、圧縮力３〜１２Ｋｇ／ｍｍ2を与え、
ワイヤ１１５の端部を断面が長方形の形状である細線部
１１５ｃに塑性変形させる。A method of manufacturing a wire using the wire forming device configured as described above will be described. Wire 11
The top of the thick line portion 115b of No. 5 is gold flash plating 117.
After that, the wire 115 is sent out between the press contact portions 214a and 214b of the press mechanism 214, and the wire 1
15 is clamped, and the press contact portions 214a and 214b are moved as shown by arrows, and a compressive force of 3 to 12 kg / mm 2 is given.
The end of the wire 115 is plastically deformed into a thin line portion 115c having a rectangular cross section.

【００２９】次に、ワイヤ１１５の細線部１１５ｃをキ
ャピラリーツール２１６の溝２１６ａに嵌合させ、実施
例２と同様にボンディングパッド１１４にワイヤ１１５
の細線部１１５ｃの先端を圧接して接合する。以上によ
り図１に示すワイヤ１１５の接合が完了する。Next, the thin wire portion 115c of the wire 115 is fitted into the groove 216a of the capillary tool 216, and the wire 115 is attached to the bonding pad 114 as in the second embodiment.
Of the thin wire portion 115c is pressed and joined. Thus, the bonding of the wires 115 shown in FIG. 1 is completed.

【００３０】なお、参考例として図６において、導体パ
ターン１０５ｂの表面にニッケルめっき１０６ｂを介し
て金フラッシュめっき１１７が施されている。金フラッ
シュめっき１１７に半田１１２ｂを介して金属片１２８
が接合されている。 As a reference example, in FIG. 6, a gold flash plating 117 is applied to the surface of the conductor pattern 105b via a nickel plating 106b. A metal piece 128 is applied to the gold flash plating 117 via the solder 112b.
But that has been joined.

【００３１】また、図７に示すように３０μｍ程度の厚
さを有する金リボンまたは金箔から成る金片１４１を金
フラッシュめっき１１７にリボンボンダーにより熱圧着
させても良い。 Further, but it may also be allowed to thermocompression bonding by a ribbon bonder to the gold flash plating 117 gold pieces 141 of gold ribbon or foil having a thickness of about 30μm, as shown in FIG.

【００３２】[0032]

【発明の効果】第１の発明によれば、第１のワイヤは端
部の一方が第１のボンディングパッドの幅とほぼ同一以
下であると共に、電気的、機械的な接合を満たす幅以上
である細線部と、上記端部の他方が第２のワイヤと同一
形状である太線部とを設けたので、キャピラリーツール
の種類等を減少せしめて省力化を図ることができ、更
に、制御用ＩＣのボンディングパッドに突起電極を形成
することなく、ペレット端部に対して充分な距離と高さ
を保ち、ワイヤたれ等によるペレットとの接触を防止で
きるという効果がある。According to the first aspect of the present invention, one end of the first wire has a width substantially equal to or less than the width of the first bonding pad and a width greater than a width satisfying the electrical and mechanical bonding. Since a thin wire portion and a thick wire portion having the other end having the same shape as the second wire are provided, it is possible to reduce the number of types of capillary tools and the like to save power, and furthermore, to control the IC. Thus, there is an effect that a sufficient distance and height can be maintained to the end of the pellet without forming a protruding electrode on the bonding pad, and the contact with the pellet due to wire dripping or the like can be prevented.

【００３３】第２の発明によれば、導体パターンに第２
のワイヤと同一形状である第１のワイヤ端部の一方を接
合し、上記第１のワイヤ端部の他方を第１のボンディン
グパッドの幅とほぼ同一以下であると共に、電気的、機
械的な接合を満たす幅以上である細線部に加工し、上記
第１のワイヤの細線部を上記第１のボンディングパッド
に接合したので、キャピラリーツールの種類等を減少せ
しめて省力化を図ることができ、更に、制御用ＩＣのボ
ンディングパッドに突起電極を形成することなく、ペレ
ット端部に対して充分な距離と高さを保ち、ワイヤたれ
等によるペレットとの接触を防止できるという効果があ
る。According to the second invention, the second conductive pattern is formed.
One end of a first wire having the same shape as the first wire is joined, and the other end of the first wire is substantially equal to or less than the width of the first bonding pad, and is electrically and mechanically connected. Since the thin wire portion is processed into a thin wire portion having a width equal to or larger than the width satisfying the joining, and the thin wire portion of the first wire is joined to the first bonding pad, it is possible to reduce the number of types of the capillary tool and the like, thereby saving labor. Furthermore, there is an effect that a sufficient distance and height can be maintained to the end of the pellet without forming a protruding electrode on the bonding pad of the control IC, and contact with the pellet due to wire dripping or the like can be prevented.

【００３４】[0034]

【００３５】第３の発明によれば、第１のワイヤの細線
部をプレスまたは絞り加工により得るので、簡易に一方
の端部が太線部を有し、他方の端部が細線部を備えたボ
ンディングワイヤを製造できるという効果がある。According to the third aspect of the present invention, the thin wire portion of the first wire is obtained by pressing or drawing, so that one end has a thick wire portion and the other end has a thin wire portion. There is an effect that a bonding wire can be manufactured.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 この発明の実施例よる電子部品の内部側面図
である。FIG. 1 is an internal side view of an electronic component according to an embodiment of the present invention.

【図２】 この発明の実施例よるワイヤ成形器の要部図
である。FIG. 2 is a main part view of a wire forming device according to an embodiment of the present invention.

【図３】 この発明の実施例よるワイヤ接合部の断面図
である。FIG. 3 is a sectional view of a wire joint according to an embodiment of the present invention.

【図４】 この発明の他の実施例よるワイヤ成形器の要
部図である。FIG. 4 is a main part view of a wire former according to another embodiment of the present invention.

【図５】 この発明の他の実施例よるワイヤ接合部の断
面図である。FIG. 5 is a sectional view of a wire bonding portion according to another embodiment of the present invention.

【図６】 電子部品の内部側面図である。6 is an internal side view of the electronic components.

【図７】 電子部品の内部側面図である。7 is an internal side view of the electronic components.

【図８】 従来の電子部品の内部側面図である。FIG. 8 is an internal side view of a conventional electronic component.

【図９】 従来の電子部品の断面図である。FIG. 9 is a cross-sectional view of a conventional electronic component.

【図１０】 従来の電子部品の全体図である。FIG. 10 is an overall view of a conventional electronic component.

【符号の説明】[Explanation of symbols]

１０１ 基板、１０２ 制御用ＩＣ、１０２ａ ペレッ
ト、１０５、１０５ａ第１の導体パターン、１０５ｂ
第２の導体パターン、１１２ 半田、１１４第１のボン
ディングパッド、１１５ 第１のワイヤ、１１５ａ ワ
イヤの細線部、１１５ｂ ワイヤの太線部、１２８ 金
属片、２１４ プレス機構、２２０ダイス、３００ パ
ワー素子、３１４ 第２のボンディングパッド、３３０
第２のワイヤ101 substrate, 102 control IC, 102a pellet, 105, 105a first conductor pattern, 105b
Second conductor pattern, 112 solder, 114 first bonding pad, 115 first wire, 115a thin wire portion, 115b thick wire portion, 128 metal piece, 214 press mechanism, 220 dice, 300 power element, 314 Second bonding pad, 330
Second wire

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−44729（ＪＰ，Ａ) 特開 平２−139943（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ────────────────────────────────────────────────── (5) References JP-A-58-44729 (JP, A) JP-A-2-139943 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 導体パターンを有するプリント基板と、
上記プリント基板に搭載される電力を制御するパワー素
子と、上記プリント基板に搭載されると共に、上記パワ
ー素子のゲートを制御するペレットを備えた制御用ＩＣ
と、上記ペレットの表面に設けた第１のボンディングパ
ッドと、上記パワー素子に設けた第２のボンディングパ
ッドと、第１のボンディングパッドおよび上記導体パタ
ーンを電気的に接続する第１のワイヤと、上記第２のボ
ンディングパッドと上記導体パターンを電気的に接続す
る第２のワイヤとを備えたボンディングワイヤを用いた
電子部品であって、上記第１のワイヤは端部の一方が上
記第１のボンディングパッドの幅とほぼ同一以下である
と共に、電気的、機械的な接合を満たす幅以上である細
線部と、上記端部の他方が上記第２のワイヤと同一形状
である太線部とを設けたことを特徴とするボンディング
ワイヤを用いた電子部品。A printed circuit board having a conductor pattern;
A power element mounted on the printed circuit board for controlling power, and a control IC mounted on the printed circuit board and comprising a pellet for controlling a gate of the power element
A first bonding pad provided on the surface of the pellet, a second bonding pad provided on the power element, a first wire electrically connecting the first bonding pad and the conductor pattern, An electronic component using a bonding wire including the second bonding pad and a second wire for electrically connecting the conductive pattern, wherein one end of the first wire has the first wire. A thin line portion that is substantially equal to or less than the width of the bonding pad and is equal to or larger than a width that satisfies electrical and mechanical bonding, and a thick line portion whose other end has the same shape as the second wire is provided. An electronic component using a bonding wire. 【請求項２】 制御用ＩＣのペレットに形成された第１
のボンディングパッドと、上記制御用ＩＣにより制御さ
れるパワー素子に設けた第２のボンディングパッドと、
上記第１のボンディングパッドとプリント基板に形成さ
れた導体パターンを電気的に接続する第１のワイヤと、
上記第２のボンディングパッドと上記導体パターンを電
気的に接続する第２のワイヤとを備えたボンディングワ
イヤを用いた電子部品の製造方法であって、上記導体パ
ターンに上記第２のワイヤと同一形状である上記第１の
ワイヤ端部の一方を接合し、上記第１のワイヤ端部の他
方を第１のボンディングパッドの幅とほぼ同一以下であ
ると共に、電気的、機械的な接合を満たす幅以上である
細線部に加工し、上記第１のワイヤの細線部を上記第１
のボンディングパッドに接合することを特徴とするボン
ディングワイヤを用いた電子部品の製造方法。2. A first IC formed on a pellet of a control IC.
A second bonding pad provided on a power element controlled by the control IC;
A first wire for electrically connecting the first bonding pad to a conductor pattern formed on a printed circuit board;
A method of manufacturing an electronic component using a bonding wire including the second bonding pad and a second wire for electrically connecting the conductive pattern, wherein the conductive pattern has the same shape as the second wire. The width of one of the first wire ends is substantially equal to or less than the width of the first bonding pad, and the other of the first wire ends is filled with electrical and mechanical bonds. The fine wire portion is processed as described above, and the fine wire portion of the first wire is processed by the first wire.
A method for manufacturing an electronic component using a bonding wire, characterized by bonding to a bonding pad. 【請求項３】 請求項１記載の上記第１のワイヤの細線
部をプレスまたは絞り加工により得ることを特徴とする
ワイヤ成形方法。3. A wire forming method according to claim 1, wherein the thin wire portion of the first wire is obtained by pressing or drawing.
JP09691595A 1995-04-21 1995-04-21 Electronic component using bonding wire, method of manufacturing the same, and method of forming wire Expired - Fee Related JP3246265B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09691595A JP3246265B2 (en) 1995-04-21 1995-04-21 Electronic component using bonding wire, method of manufacturing the same, and method of forming wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09691595A JP3246265B2 (en) 1995-04-21 1995-04-21 Electronic component using bonding wire, method of manufacturing the same, and method of forming wire

Publications (2)

Publication Number Publication Date
JPH08293518A JPH08293518A (en) 1996-11-05
JP3246265B2 true JP3246265B2 (en) 2002-01-15

Family

ID=14177664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09691595A Expired - Fee Related JP3246265B2 (en) 1995-04-21 1995-04-21 Electronic component using bonding wire, method of manufacturing the same, and method of forming wire

Country Status (1)

Country Link
JP (1) JP3246265B2 (en)

Also Published As

Publication number Publication date
JPH08293518A (en) 1996-11-05

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