JP3245862U - パワーモジュールのパッケージ構造及び運転機器 - Google Patents

パワーモジュールのパッケージ構造及び運転機器 Download PDF

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Publication number
JP3245862U
JP3245862U JP2023004703U JP2023004703U JP3245862U JP 3245862 U JP3245862 U JP 3245862U JP 2023004703 U JP2023004703 U JP 2023004703U JP 2023004703 U JP2023004703 U JP 2023004703U JP 3245862 U JP3245862 U JP 3245862U
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Prior art keywords
substrate
power module
package structure
terminal
module package
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JP2023004703U
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English (en)
Japanese (ja)
Inventor
ワン，ダーピン
ジャオ，ヨンチアン
シエ，クン
レン，ジーヘン
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FAW Group Corp
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FAW Group Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023004703U 2023-10-27 2023-12-28 パワーモジュールのパッケージ構造及び運転機器 Active JP3245862U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202311403631.3 2023-10-27
CN202311403631.3A CN117153798B (zh) 2023-10-27 2023-10-27 一种功率模块的封装结构

Publications (1)

Publication Number Publication Date
JP3245862U true JP3245862U (ja) 2024-02-28

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ID=88884622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023004703U Active JP3245862U (ja) 2023-10-27 2023-12-28 パワーモジュールのパッケージ構造及び運転機器

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JP (1) JP3245862U (zh)
CN (1) CN117153798B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118471965A (zh) * 2024-07-12 2024-08-09 浙江翠展微电子有限公司 一种碳化硅芯片四并联布局的tpak封装结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117577610A (zh) * 2024-01-17 2024-02-20 中国第一汽车股份有限公司 功率模块以及信号处理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3997730B2 (ja) * 2001-06-20 2007-10-24 株式会社日立製作所 電力変換装置及びそれを備えた移動体
CN114121907A (zh) * 2020-08-25 2022-03-01 华中科技大学 一种全碳化硅双面散热模块的封装结构及其封装方法
CN217822755U (zh) * 2022-04-27 2022-11-15 蔚来动力科技(合肥)有限公司 采用石墨铜垫块的双面散热模块的封装结构和电动汽车
CN115084040B (zh) * 2022-06-09 2022-11-22 北京萃锦科技有限公司 一种低电感的塑封模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118471965A (zh) * 2024-07-12 2024-08-09 浙江翠展微电子有限公司 一种碳化硅芯片四并联布局的tpak封装结构

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Publication number Publication date
CN117153798A (zh) 2023-12-01
CN117153798B (zh) 2024-03-26

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