JP3232133U - Component carrier inspection station that inspects component carriers during component carrier manufacturing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component carrier inspection station capable of inspecting a component carrier during manufacturing of a component carrier, shortening the production of the component carrier, and improving inspection accuracy. A component carrier includes an ID mark, and a manufacturing execution system accesses a file server in which a manufacturing history file containing information about a manufacturing history of the component carrier is stored. The component carrier inspection station 1 communicates with the manufacturing execution system via an interface in order to acquire at least a manufacturing history file from the manufacturing execution system. The component carrier inspection station 1 is configured to perform the first inspection of the presence and grade of the ID mark and the second inspection of the existence and contents of the manufacturing history file. If at least one of the first and second inspections determines that the component carriers are defective, the component carriers are sorted. [Selection diagram] Fig. 1

Description

The present invention relates to a component carrier inspection station that inspects a component carrier during the manufacture of a component carrier, a production line that includes a component carrier inspection station, and a method of inspecting a component carrier during the manufacture of a component carrier. The component carrier inspection station can be, in particular, a component carrier survey / sort device that uses traceability analysis during the manufacture of component carriers.

A conventional production line consists of a solder mask inspection station configured to inspect the solder masks of the component carriers, a functional inspection station configured to inspect the electrical function of the component carriers, and optics. An optical inspection station configured to inspect the element carrier, a visual inspection station configured to allow visual inspection of the component carrier, and a defective marking indicating the inspection result of the preceding station on the component carrier. Includes a defective marking station configured to form and a packaging station configured to package the component carriers. The defective product marking station can be realized as a laser marking station that generates laser marking as defective product marking. Other embodiments of defective marking are formed by mechanical drilling or printing.

An object of the present invention is to inspect a component carrier during the manufacture of a component carrier, a production line including a component carrier inspection station, and a component carrier during the manufacture of the component carrier. To provide a method, which can shorten the manufacture of component carriers and improve inspection accuracy. This object is achieved by embodiments of the present invention.

According to an exemplary embodiment of the present invention, the component carrier inspection station is provided to inspect (check) the component carriers while manufacturing the component carriers using the manufacturing execution system. The component carrier includes an ID mark, and the manufacturing execution system accesses a file server that stores a manufacturing history file, for example, an EMAP file, which contains information about the manufacturing history of the component carrier. The component carrier inspection station communicates with the manufacturing execution system via an interface so as to obtain at least the manufacturing history file from the manufacturing execution system. An EMAP file is a specific data medium in XML or CSV format capable of transferring test / evaluation data of a component carrier from each test / evaluation unit to a storage server or file server. The manufacturing history of component carriers may include any events during the preceding manufacturing process. That is, it may include information about where, when, and / or how a particular event or error occurred. The component carrier inspection station is configured to perform the first inspection of the presence and grade of the ID mark and the second inspection of the existence and contents of the manufacturing history file. If at least one of the first and second inspections determines that the component carriers are defective, the component carriers are sorted.

The ID mark can be one-dimensional, two-dimensional or multidimensional. In the context of the present invention, one-dimensional ID marks, such as barcodes, are scanned in one dimension only, and two-dimensional ID marks, such as QR codes®, are scanned in only two dimensions.

According to another exemplary embodiment of the present invention, a production line comprising the component carrier inspection station described above is provided. The production line can further include at least one of the following stations located on the upstream side of the production line, preferably immediately in front of the component carrier inspection station. That is, a solder mask inspection station configured to inspect the solder mask of the component carrier, a functional inspection station configured to inspect the electrical function of the component carrier, and an optical device to inspect the component carrier. An optical inspection station configured to allow visual inspection of the component carrier, and a defective marking station configured to form a defective marking on the component carrier. .. The production line can further include a package station configured to package the component carriers, which are located on the downstream side of the production line, preferably immediately after the component carrier inspection station. That is, a second inspection of the existence and content of the manufacturing history file is verified just before packaging the component carrier and sending it to the customer, taking into account all preceding inspection stations (without interruption).

Another exemplary embodiment of the invention provides a method of inspecting a component carrier while manufacturing the component carrier using a manufacturing execution system. The component carrier comprises an ID mark, and the manufacturing execution system accesses a file server in which a manufacturing history file, for example, an EMAP file is stored, which contains information about the manufacturing history of the component carrier. The history of component carriers is also referred to as traceability. This method consists of a first inspection step for inspecting the presence and grade of the ID mark, a second inspection step for inspecting the existence and content of the manufacturing history file, and at least one of the first inspection and the second inspection. Includes a sort step to sort the component carriers if it is determined to be bad.

The term "bad" may include situations where the component carrier's ID mark is absent or damaged, or the ID mark is inferior in grade. For example, the grade of the ID mark may be determined according to ISO / IEC15415.

Also, the term "bad" is not valid when the manufacturing history file is incomplete or does not exist, is in an incorrect format, or the contents of the manufacturing history file are compared to a standard reference manufacturing history file. May include the situation. For example, if the inspection result of the inspection station in the production line is not included in the production history file, the production history file is not complete. For example, a production line can be equipped with a plurality of different inspection stations, each inspection station inspecting a particular quality problem. Each inspection station may upload reports, files or inspection results to a file server. All reports, files or test results are merged into the (final) manufacturing history file. For example, if the file or inspection result of at least one inspection station in the production line is not included in the final production history file, it may be determined that the production history file is not complete. The inspection of whether or not the manufacturing history file is completed may be performed by comparing the manufacturing history file with the reference manufacturing history file that can be stored in advance in the file server.

According to the present invention, the format of the manufacturing history file and the contents of the manufacturing history file are inspected and confirmed in the background by the manufacturing execution system, so that a defective component carrier, for example, a component carrier without a manufacturing history file, is sent to the customer. It will not be delivered. Further, since the ID mark can be inspected according to the customer's request, a damaged ID mark or a defective component carrier with an incorrect ID mark is not delivered to the customer.

If the component carriers are an array containing multiple cards, they will have the ability to sort the component carriers according to their position and the number of bad cards. Further, when inspecting component carriers of different lots, the mixed lot number or mixed part number can be separated by simply inspecting the ID mark of the component carrier.

Hereinafter, further exemplary embodiments of the present invention will be described.

The component carrier may include at least one of the following features: The component carrier comprises at least one component (component) surface-mounted and / or embedded in the component carrier, the at least one component being an electronic component, a non-conductive and. / Or conductive inlays, heat transfer units, optical inductance elements, optical elements, bridges, energy harvesting units, active electronic components, passive electronic components, electronic chips, storage devices, filters, integrated circuits, signal processing components, power Management components, optoelectronic interface elements, voltage converters, cryptographic components, transmitters and / or receivers, electromechanical transducers, actuators, microelectromechanical systems, microprocessors, capacitors, resistors, inductances (inductors), accumulators, It is specifically selected from a group that includes switches, cameras, antennas, magnetic components, additional component carriers, and logic chips. At least one of the conductive layered structures of the component carriers comprises at least one of the group containing copper, aluminum, nickel, silver, gold, palladium and tungsten, any of these materials being optionally. , Coated with a superconducting material such as graphene. The electrically insulating layer structure is a resin, particularly a reinforced resin or a non-reinforced resin, for example, an epoxy resin or a bismaleimide-triazine resin, FR-4, FR-5, a cyanate ester, a polyphenylene derivative, a glass, a prepreg material, a polyimide. , Polyimides, liquid crystal polymers, epoxy-based build-up films, polytetrafluoroethylene, ceramics, and at least one of the group comprising metal oxides. The component carrier is in the shape of a plate, the component carrier is configured as one of a group including a printed circuit board, a substrate, and an interposer, and the component carrier is configured as a laminated component carrier. To.

In one embodiment, the component carrier inspection station is further configured to perform at least one of measuring the warpage of the component carrier and measuring the thickness of the component carrier.

In one embodiment, a component carrier inspection station is a loading device configured to load a component carrier from another station into the component carrier inspection station and a detection unit configured to scan an ID mark. And so that a plurality of containers, at least one first container of the plurality of containers, receives a component carrier determined to be defective by at least one of the first inspection and the second inspection. At least one second container of the plurality of containers is configured to receive component carriers determined by the first and second inspections to be non-defective. Further, it is provided with a removing device configured to remove the component carriers determined to be defective to at least one first container and to remove the component carriers determined to be non-defective to the second container. ing. The detection unit may be a scanner unit for scanning the ID mark, for example, a one-dimensional or two-dimensional scanner unit.

In one embodiment, the component carrier inspection station comprises a three-dimensional laser measuring tool configured to measure the warpage of the component carrier and a touch sensor configured to measure the thickness of the component carrier. The flipper unit further comprises at least one of a first table configured to receive element carriers from the loading device and a second table configured to receive component carriers from the first table. The component carriers are configured to be transported from the first table to the second table while rotating the element carriers, and as a result, the detection unit scans the first ID mark provided on the main bottom surface of the component carriers and is configured. It is configured to scan the second ID mark provided on the main upper surface of the element carrier. It is also possible to provide a flipper unit without a second table.

In one embodiment of the production line, the component carrier is an array containing a plurality of cards, and defective markings on the component carriers are marked by a defective marking station on the cards of the array, which is a solder mask. At least one of the inspection station, the functional inspection station, the optical inspection station, and the visual inspection station failed the inspection. The defective marking station uploads the file to a file server, which contains information about the marked card. The component carrier inspection station is configured to download the uploaded file from the file server, scan the defective markings, and compare the scanned result with the information contained in the downloaded file. The component carrier inspection station is configured to give the comparison results to the manufacturing execution system, or alerts if there is a discrepancy between the scanned results and the information contained in the downloaded file. It is configured as follows.

In one embodiment, the method is performed using the component carrier inspection station described above.

In one embodiment, the method further performs at least one of a component carrier warpage measurement and a component carrier thickness measurement.

In one embodiment, the method comprises loading a component carrier from another station into a component carrier inspection station, scanning an ID mark, and at least one component carrier determined to be defective. It includes a step of removing into one first container and a step of removing component carriers determined to be non-defective in a second container. At least one first container is configured to receive component carriers determined to be defective by at least one of the first and second inspection steps, and the second container is configured to receive the first inspection step. And to receive the component carriers determined by the second inspection step to be non-defective.

In one embodiment, the method further comprises at least one of the following steps: That is, the first table receives the component carrier from the loading device and scans the first ID mark provided on one of the main bottom surface and the main upper surface of the component carrier, and the first table while rotating the component carrier. The step of transporting the component carrier from the second table to the second table and receiving the component carrier by the second table, the step of scanning the second ID mark provided on the other of the main bottom surface and the main upper surface of the component carrier, and the first ID. While the mark is provided on one of the main bottom surface and the main top surface of the component carrier, the step of turning the component carrier by, for example, a flipper unit and the inspection of the other of the main bottom surface and the main top surface of the component carrier are performed. It further comprises at least one of a step, particularly a step of scanning a second ID mark provided on the other of the main bottom surface and the main top surface of the component carrier.

In the context of this application, the term "component carrier" can accommodate one or more components on and / or in order to provide mechanical support and / or electrical connectivity. The support structure may be specifically represented. In other words, the component carriers may be configured as mechanical and / or electronic carriers for the components. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) board. Further, the component carrier may be a hybrid board in which different components carriers of the above types are combined.

In one embodiment, the component carrier comprises a stack of at least one electrically insulating layered structure and at least one conductive layered structure. For example, the component carrier may be a laminate of the above-mentioned electrically insulating layer structure and the conductive layer structure, which is formed particularly by applying mechanical pressure and / or thermal energy. Not only can this stack provide a large mounting surface for additional components, but it can also provide a plate-shaped component carrier that is very thin and compact. The term "layer structure" may specifically refer to continuous layers, patterned layers, or multiple discontinuous islands in a common plane.

According to one embodiment, the component carrier is in the shape of a plate. This contributes to a compact configuration and the component carrier nevertheless provides a broad foundation for implementing the components. Further, in particular, the bare die, as an example of an embedded electronic component, may be conveniently embedded in a thin plate such as a printed circuit board due to its thin thickness.

In one embodiment, the component carrier is configured as one of a group including a printed circuit board, a board (particularly an IC board), and an interposer.

In the context of this application, the term "printed circuit board" (PCB) refers to some conductive layered structures and some electrically insulating ones, for example by applying pressure and / or supplying thermal energy. A component carrier in the shape of a plate formed by laminating in a layered structure may be particularly represented. As a preferred material for PCB technology, the conductive layer structure is made of copper, while the electrically insulating layer structure may include resin and / or glass fiber, the so-called prepreg or FR4 material. The various conductive layered structures connect to each other in the desired manner by forming through holes through the laminate, for example with a laser drill or mechanical drill and filling with a conductive material (particularly copper). It may be, thereby forming a via as a through-hole connection. Aside from one or more components that can be embedded in a printed circuit board, a printed circuit board typically houses one or more components on one or both opposite surfaces of a printed circuit board. It is configured to do. It may be connected to each main surface by soldering. The dielectric portion of the PCB may be composed of a resin having reinforcing fibers (for example, glass fibers).

In the context of this application, the term "board" may particularly represent a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB, on which one or more components may be mounted, acting as a connecting medium between one or more chips and another PCB. Good. For example, the substrate may have substantially the same size as the components (particularly electronic components) mounted on it (eg, in the case of a chip scale package (CSP)). More specifically, the board is a carrier for electrical connections or networks, as well as component carriers that are comparable to printed circuit boards but have a fairly high density of connections arranged laterally and / or vertically. May be understood as. The lateral connection may be, for example, a conductive path, while the vertical connection may be, for example, a drill hole. These lateral and / or vertical connections are arranged within the substrate. In particular, electrical, thermal and / or mechanical connections of accommodating or non-accommodating members (such as bare dies) of IC chips may be used to provide printed circuit boards or intermediate printed circuit boards. Therefore, the term "board" also includes "IC board". The dielectric portion of the substrate may be composed of a resin having reinforcing particles (for example, reinforcing spheres, particularly glass spheres).

The substrate or interposer is at least a glass layer, a silicon layer (Si), or a layer of photoimage-forming or dry-etchable organic material such as an epoxy-based build-up material (eg, an epoxy-based build-up film), or polyimide. , Polybenzoxazole or benzocyclobutene, may include or consist of at least a layer of a polymeric compound.

In one embodiment, the at least one electrically insulating layered structure is a resin (eg, a reinforced or non-reinforced resin, such as an epoxy resin or a bismaleimide triazine resin), a cyanate ester, a polyphenylene derivative, a glass (particularly glass fiber). , Multilayer glass, glass-like material), prepreg material (eg FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based build-up film, polytetrafluoroethylene (Teflon®) , Includes at least one of the groups comprising ceramics and metal oxides. For example, reinforcing materials such as webs, fibers or spheres made of glass (multilayer glass) can be used as well. Prepregs, especially FR4, are usually preferred for hard PCBs, but other materials, especially epoxy-based build-up films or photoimaging dielectric materials, can be used as well. For high frequency applications, electrical insulation of high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins, low temperature co-fired ceramics (LTCC), or other low, ultra low, or ultra low DK materials. It can be implemented in the component carrier as a layered structure of.

In one embodiment, the at least one conductive layered structure comprises at least one of a group comprising copper, aluminum, nickel, silver, gold, palladium and tungsten. Copper is usually preferred, but other materials or coated forms thereof are also possible, especially coated with a superconducting material such as graphene.

At least one component is a non-conductive inlay, a conductive inlay (preferably a metal inlay containing copper or aluminum), a heat transfer unit (eg, a heat pipe), a light guide element (eg, an optical waveguide or a light guide). It can be selected from a group that includes a connection), an optical element (eg, a lens), an electronic component, or a combination thereof. For example, the components are active electronic components, passive electronic components, electronic chips, storage devices (eg DRAM or other data memory), filters, integrated circuits, signal processing components, power management components, optoelectronic interface elements, light emission. Diodes, photocouplers, voltage converters (eg DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors , Capacitors, resistors, inductances (inductors), batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be embedded within the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (eg, a ferromagnetic element, an antiferromagnetic element, a multiferromagnetic element, or a ferrimagnetic element such as a ferrite core), or may be a paramagnetic element. However, the component may further be a substrate, an interposer, or, for example, an additional component carrier of the in-board configuration. The components may be surface mounted on the component carriers and / or embedded therein. In addition, other components, in particular components that generate and emit electromagnetic radiation, and / or components that are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

In one embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a combination of a plurality of layered structures stacked and connected to each other by applying pressing force and / or heat.

After processing the internal layer structure of the component carrier, one or more of the main surfaces on one or both opposite sides of the treated layer structure are covered with one or more additional electrically insulating layer structures and / or conductive layers. The structure can be covered symmetrically or asymmetrically (especially by stacking). In other words, the buildup can continue until the desired number of layers is obtained.

After the formation of the stack of the electrically insulating layer structure and the conductive layer structure is completed, it is possible to proceed with the surface treatment of the obtained layer structure or the component carrier.

In particular, the electrically insulating solder resist may be applied to the main surfaces of the stack of layers or one or both of the component carriers on opposite sides of each other from the viewpoint of surface treatment. For example, a solder resist or the like is formed over the entire main surface so as to expose one or more conductive surface portions used to electrically bond component carriers to electronic peripherals, followed by solder. It is possible to pattern the resist layer. The surface portion of the component carrier, in particular the surface portion containing copper, remains coated with the solder resist, but may be effectively protected against oxidation or corrosion.

With respect to surface treatment, it is also possible to selectively apply a surface finish to the exposed conductive surface portion of the component carrier. Such a surface finish is a conductive cover material on an exposed conductive layered structure on the surface of the component carrier (particularly, a pad, a conductive track, etc., containing or composed of copper). It may be. If such an exposed conductive layer structure is left unprotected, the exposed conductive component carrier material (particularly copper) may oxidize, reducing the reliability of the component carriers. The surface finish can then be formed, for example, as an interface between the surface mount components and the component carriers. The surface finish has the function of protecting the exposed conductive layered structure (particularly copper circuits) and allowing the joining process with one or more components, for example by soldering. Examples of suitable materials for surface finishing are organic solderable preservatives (OSP), electroless nickel dip (ENIG), gold (especially hard gold), chemical tin, nickel-gold, nickel-palladium, etc. is there.

The embodiments defined above and further embodiments of the present invention will be apparent from the examples of embodiments described below and will be described with reference to the examples of these embodiments.

A schematic diagram of a component carrier inspection station according to an exemplary embodiment of the present invention is shown. A plan view of a component carrier according to an exemplary embodiment of the present invention is shown. A schematic diagram of the concept of a production line according to an exemplary embodiment of the present invention is shown. It is a figure which shows a part of the inspection method of a component carrier by an exemplary embodiment of this invention.

The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

FIG. 1 shows a schematic plan view of a component carrier inspection station 1 according to an exemplary embodiment of the present invention. FIG. 2 shows a plan view of the component carrier 100 according to an exemplary embodiment of the present invention. FIG. 3 shows a schematic diagram of the concept of a production line according to an exemplary embodiment of the present invention comprising the component carrier inspection station 1.

As shown in FIG. 3, during the manufacture of the component carrier 100, the component carrier inspection station (inspection device, inspection device) 1 uses the manufacturing execution system (MES) 2 that controls the production line to control the component carrier. Inspect 100. The manufacturing execution system 2 accesses the file server 4 in which the manufacturing history file 600, which is also called the EMAP file 600, is stored. The manufacturing history file 600 contains information regarding the manufacturing history of the component carrier 100. The component carrier inspection station 1 is connected to the interface 5 to communicate with the manufacturing execution system 2 in order to acquire at least the manufacturing history file 600 from the manufacturing execution system 2. Further, the interface 5 is connected to the file server 4. In addition to this, the component carrier inspection station 1 is configured to download another manufacturing history file 400, also referred to as the EMAP file 400, to the manufacturing execution system 2 via the interface 5. The EMAP file 400 can be called from the manufacturing execution system 2 in the customer request format when necessary.

As shown in FIG. 2, the component carrier 100 is a so-called array (also referred to as a "strip") including a plurality of cards. These cards usually have the same architecture and will be fragmented from the array in a later step. The component carrier 100 has a first ID mark 3 shown on the left side of FIG. 2 and a second ID mark 3 shown on the right side of FIG. The ID mark 3 may have a barcode, a QR code, an ECC200 code, an alphanumeric code, or any other structure. The ID mark 3 may be formed by a pattern of conductive layered structures arranged on top of an electrically insulating layered structure, especially by photolithography and etching methods or defective marking. Further, the ID mark 3 may be formed of a dielectric material and may be visualized by light having a specific wavelength such as UV light.

The component carrier 100 has a first ID mark 3 provided on one of the main bottom surface and the main upper surface of the component carrier 100, and a second ID mark 3 provided on the other of the main bottom surface and the main upper surface of the component carrier 100. It is possible to prepare.

The component carrier inspection station 1 performs the first inspection of the existence and grade of the ID mark 3, the second inspection of the existence and contents of the manufacturing history file, and at least one of the first inspection and the second inspection. It is configured to sort the component carrier 100 when it is determined that the component carrier 100 is defective.

The term "bad" may include situations where the ID mark 3 of the component carrier 100 is absent, in the wrong format, or damaged, or the grade of the ID mark 3 is inferior. For example, the grade of ID mark 3 may be determined according to ISO / IEC15415. In particular, grade measures such as A (very good) to F (very bad), or 4 (very good) to 0 (very bad) may be defined. For example, the scales in Table 1 below may be set.

Grade A, B or Grade 4, Grade 3.5, Grade 3 can be determined to be non-defective and Grade C, D, E or Grade 2.5, Grade 2, Grade 1.5, Grade 1, Grade 1. 0.5, grade 0 can be determined to be defective. However, the above-mentioned scales and the above-mentioned classifications are merely examples and do not limit the present invention.

Further, the term "defective" includes a situation in which the manufacturing history file 600 is not complete or does not exist, or a situation in which the contents of the manufacturing history file 600 are not valid when compared with the reference manufacturing history file. Good. For example, if the inspection result of the inspection station in the production line is not included in the production history file 600, the production history file 600 is not perfect. As will be described later, the production line can include a plurality of different inspection stations 14, 15, 16, 17 and each inspection station 14, 15, 16, 17 inspects a particular quality problem. Each inspection station 14, 15, 16, 17 may upload a report, file, or inspection result to a file server. All reports, files or inspection results are merged into the manufacturing history file 600. For example, if the files or inspection results of at least one inspection station 14, 15, 16, 17 in the production line are not included in the production history file 600, it may be determined that the production history file 600 is not complete. The check for completeness of the manufacturing history file 600 may be performed by comparing the manufacturing history file with a reference manufacturing history file that can be stored in advance in the file server 4.

Further, the component carrier inspection station 1 is configured to perform at least one of the measurement of the warp of the component carrier 100 and the measurement of the thickness of the component carrier 100. For these purposes, the component carrier inspection station 1 is such that, with reference to FIG. 1, the component carrier 100 is preferably measured for warpage (surface warpage) of the component carrier 100 at the main upper surface and the main bottom surface of the component carrier 100. The three-dimensional laser measuring tool 10 configured in the above and the touch sensor 11 configured to measure the thickness of the component carrier 100 with respect to the reference table 32 are further provided. The thickness of the component carrier 100 can be measured on one side, which means that the component carrier 100 does not need to be flipped or rotated on the reference table 32.

According to FIG. 1, the component carrier inspection station 1 further includes a non-contact loading device 6 configured to load the component carrier 100 from another station into the component carrier inspection station 1 and an ID mark 3. It includes detection units 7, 8 configured to scan and a plurality of bins 21, 22, 23, 24. At least one first container of the plurality of containers is configured to receive the component carrier 100 determined to be defective by at least one of the first inspection and the second inspection, and of the plurality of containers. The second container is configured to receive the component carrier 100 determined by the first inspection and the second inspection to be not defective. The component carrier inspection station 1 is configured to remove the component carrier 100 determined to be defective to at least one first container and the component carrier 100 determined to be non-defective to the second container. The non-contact removing device 9 is provided. Association of containers 21, 22, 23, 24 to either at least one first container or second container can be performed by those skilled in the art as needed.

At least one second container of the plurality of containers is configured to accept the component carrier 100 determined by the first and second inspections to be non-defective. Further, a plurality of second containers may be provided, in which case the non-defective component carriers 100 can be sorted according to their quality (eg, one second container for grade A and one first for grade B). 2 containers, or 1 second container for grade 4.0, 1 second container for grade 3.5, 1 second container for grade 3.0).

Preferably, the loading device 6 and the removing device 9 can handle the component carrier 100 with an interleaf (insertion paper). This means stacking the component carriers 100 separated from each other by an interleaf sheet so that the separated component carriers 100 do not come into contact with each other. Preferably, the loading device 6 and the removing device 9 also do not come into contact with the component carrier 100 due to the spaced interleaves. Therefore, scratches or other damage to the component carrier 100 is reduced. The loading device 6 and the removing device 9 allow automatic handling without the need for manual operation. The handling by the loading device 6 and the removing device 9 is automatic and fast.

The present invention can provide the ability to sort the array according to the location of the bad cards in the array and / or the large number of bad cards in the array. Arrays with the same position or with the same number of bad cards may be sorted in the same container. For example, all arrays with bad cards in the upper right corner of component carrier 100 of FIG. 2 may be sorted by container 21 and all arrays with bad cards in the center left of component carrier 100 of FIG. The array may be sorted by container 22, and so on. Also provided are a plurality of first containers, i.e., a container in which the defective component carrier 100 is sorted, the first container being at least one first container for the defective component carrier 100 that can be repaired. And at least one first container for a defective (waste) component carrier 100 that cannot be repaired. It is also conceivable to provide a plurality of first containers, i.e., to provide containers in which the defective component carriers 100 are sorted, and each first container may be associated with a particular error code. The component carrier inspection station 1 may basically include, for example, up to 20 containers.

The monitoring unit 31 may display detailed information about the defective component carrier 100, for example, the position and / or number of defective cards in the array (component carrier 100).

If component carriers 100 from a plurality of lots are inspected and the component carrier 100 of a particular lot is identified by scanning its ID mark 3, component carrier inspection station 1 will inspect these from a particular lot. Only the component carriers 100 may be sorted. Thereby, the separation of the different component carriers 100 can be easily performed at no additional cost.

Further, the component carrier inspection station 1 can sort the component carrier 100 based on different sorting scenarios such as dimensions and defective codes based on the manufacturing history file 600 by easily scanning the ID mark 3. You can do it.

According to FIG. 1, the component carrier inspection station 1 is configured to receive a first table 12 configured to receive the component carrier 100 from the loading device 6 and a component carrier 100 from the first table 12. It also has a second table 13. The flipper unit 34 is configured to convey the component carrier 100 from the first table 12 to the second table 13 while rotating (reversing) the component carrier 100. Further, the detection units 7 and 8 are configured to scan the first ID mark 3 provided on the main bottom surface of the component carrier 100 and the second ID mark 3 provided on the main upper surface of the component carrier 100. There is. Each of the detection units 7 and 9 includes grade evaluators 27 and 28 for evaluating the grade of each ID mark 3. The flipper unit 34 or other unit may transfer the component carrier 100 from the second table 12 to the reference table 32. The removal device 9 may move the component carrier 100 from the reference table 32 to the respective containers 21, 22, 23, 24.

The flipper unit 34 is arbitrary. If one or more ID marks are placed on the same side of the component carrier 100, there is no need to flip. If the inspection station 1 has inspection functions on both sides or a plurality of sides of the component carrier 100 other than inspecting and / or scanning the (two-dimensional) ID mark 3, the total function of the inspection station 1 is the flipper unit 34. Can be performed on both sides or more sides of the component carrier 100 by using.

The 3D laser measuring tool 10 described above can access the first and second tables 12 and 13 to measure the warpage on both the top and bottom surfaces of the component carrier 100, while the touch described above. The sensor 11 can only access the reference table 32 to measure the thickness of the component carrier 100.

Reference numeral 30 in FIG. 1 represents a connection portion and a utility. Reference numeral 31 represents a monitoring unit for the user. The monitoring unit 31 functions as a user interface between the user and the component carrier inspection station 1. The monitoring unit 31 may display information about the inspected component carrier 100, especially if it is defective.

According to FIG. 3, the production line includes a solder mask inspection station 14 configured to inspect the solder mask of the component carrier 100 and a functional inspection configured to inspect the electrical function of the component carrier 100. It further includes a station 15, an optical inspection station 16 configured to inspect the component carrier 100 by an optical device, and a visual inspection station 17 configured to allow visual inspection of the component carrier 100. In particular, the visual inspection station 17 is associated with human interactions that can lead to errors.

The production line further comprises a defective marking station 18 configured to form defective markings on the component carrier 100. The defective product marking station 18 may be realized as a laser marking station for performing laser marking. Other embodiments of defective marking are formed by mechanical drilling or printing. The defective marking station 18 downloads the EMAP file 600 from the file server 4 and thus obtains information about the tests performed at the solder mask inspection station 14, the functional inspection station 15, the optical inspection station 16 and the visual inspection station 17. .. The defective product marking station 18 forms a defective product marking on the component carrier 100, which includes information on the inspection results of the preceding stations 14, 15, 16, and 17. As shown in FIG. 2, the defective product marking station 18 forms an “X” symbol on these cards of the component carrier 100 as defective product markings. This failed the tests performed at the solder mask inspection station 14, the functional inspection station 15, the optical inspection station 16, and / or the visual inspection station 17. The same information is uploaded to the file server 4 as a file 400, especially in XML format. This file may be referred to as the EMAP file 400. In addition to this, the EMAP file 400 contains information about these cards marked with defective markings.

The above-mentioned stations 14, 15, 16, 17, and 18 are arranged on the production line on the upstream side of the component carrier inspection station 1 and immediately before the components carrier inspection station 1. The production line further comprises a packaging station 19, eg, a vacuum packaging chamber, configured to package the component carrier 100, which is on the downstream side of the component carrier inspection station 1 and immediately thereafter. Is placed in the production line. Thereby, the second inspection regarding the existence and contents of the manufacturing history file is verified immediately before the component carrier 100 is packaged and sent to the customer, taking into account all the preceding inspection stations 14, 15, 16, 17, and 18. File.

Reference numeral 300 represents a central server connected to the solder mask inspection station 14 and the manufacturing execution system 2, and reference numeral 500 represents a SAP® system.

Each of the stations 16, 17, and 18 is connected to the file server 4 in order to download data from the file server 4. Further, the stations 15, 16, 17, and 18 are connected to the file server 4 in order to upload each file showing a part of the manufacturing history of the component carrier 100. Such a file can be formatted as an XML file and may be referred to as an EMAP file. For example, each station 15, 16, 17, 18 uploads a file showing each report or inspection result of the related stations 15, 16, 17, 18 as a part of the manufacturing history of the component carrier 100. Good.

The solder mask inspection station 14 is connected to the manufacturing execution system 2 via the central server 300, and outputs a report or an inspection result of the solder mask inspection station 14.

All relevant EMAP files from stations 14, 15, 16, 17, 18, 1 on the production line include the entire production history of the component carrier 100 leaving the component carrier inspection station 1, the final production history described above. Merged into file 400. Such a final file is stored in the file server 4 and output in a format requested by the customer via the manufacturing execution system 2, and may be referred to as an EMAP file 400. Each EMAP file 400 is uniquely linked to an ID mark 3 (or a plurality of ID marks 3) provided on the component carrier 100. For example, if the files or inspection results of at least one inspection station 14, 15, 16, 17 in the production line are not included in the final production history file 400, it may be determined that the production history file 400 is not complete. .. The check for completeness of the final manufacturing history file 400 may be performed by comparing the manufacturing history file 400 with a reference manufacturing history file that may be stored in advance in the file server 4.

FIG. 4 shows a portion of a method of inspecting component carrier 100 according to an exemplary embodiment of the present invention.

In step S1, it is determined whether or not the ID mark 3 to be inspected is provided on both the main bottom surface and the main top surface of the component carrier 100.

If the response in step S1 is affirmative (Y), the method proceeds to step S2, where both ID marks 3 are scanned by the respective detection units 7 and 8, respectively. Optionally, the detection units 7 and 8 can also scan at least one other ID mark that has been prevented from being inspected, such as the manufacturer's internal ID. In contrast to the manufacturer's in-house ID, the ID mark 3 may be referred to as a customer ID.

In step S3, it is determined whether or not both the main bottom surface of the component carrier 100 and the ID mark 3 on the main top surface match each other. If the response in step S3 is negative (N), the process proceeds to step S10 and ends this part of the method. If the response in step S3 is affirmative (Y), the method proceeds to step S5, which will be described later.

If the response in step S1 is negative (N), the method proceeds to step S4, and only the ID mark 3 provided on either the main bottom surface or the main top surface of the component carrier 100 is the respective detection unit 7, respectively. Scanned by 8.

It should be noted that steps S1 to S4 can be executed on the front surface 1000 of the interface 5 when viewed from the component carrier inspection station 1.

In addition to this, the component carrier inspection station 1 may perform at least one of the measurement of the warp of the component carrier 100 and the measurement of the thickness of the component carrier 100 on the front surface 1000 of the interface 5. The component carrier inspection station 1 may further sort these component carriers 100 determined to be defective at the front surface 1000 of the interface 5.

In step S5, it is determined whether or not the format of the ID mark 3 is accurate. If the format is correct, you may conclude that ID mark 3 is present.

In step S6, the component carrier inspection station 1 scans the defective markings created by the defective marking station on the component carrier 100. In step S7, the component carrier inspection station 1 downloads the EMAP file 600 previously uploaded by the defective marking station 18 from the file server 4.

In step S8, the scanned result is compared with the EMAP file 600. If there is a discrepancy, the comparison result is provided to the manufacturing execution system 2, especially the package station 19. In addition to or instead, alerts may be given to notify the user of the required operation.

If there is no discrepancy in step S8, the method proceeds to step S9, where the scanned result is stored in the file server 4 and an EMAP file provided to the package station 19, such as the EMAP file 400, is created. This part of the method finally ends.

It should be noted that steps S5 to S10 may be executed on the back surface 2000 of the interface 5 when viewed from the component carrier inspection station 1. Instead, the component carrier inspection station 1 may include an interface 5 and perform all steps S1 to S9.

In yet another embodiment, the component carrier inspection station 1 may include the entire manufacturing execution system 2, or the controller and its control algorithm related to the function of the component carrier inspection station 1 according to the embodiment of the present invention. The part of the manufacturing execution system 2 may be included. Such a portion of the manufacturing execution system 2 may be associated with a component carrier inspection station 1.

It should be noted that the term "provide" does not exclude other elements or steps, and "a" or "an" does not exclude more than one. Also, the elements described in relation to different embodiments may be combined.

It should also be noted that the reference code of the claims should not be construed as limiting the claims.

Implementation of the present invention is not limited to the preferred embodiments shown in the drawings and described above. Instead, various modifications are possible using the illustrated solutions and the principles of the present invention, even in the case of essentially different embodiments.

Claims (7)

A component carrier inspection station that inspects the component carrier while manufacturing the component carrier using the manufacturing execution system. The component carrier includes an ID mark, and the manufacturing execution system has a manufacturing history file. Accessing the stored file server, the manufacturing history file contains information about the manufacturing history of the component carrier.
The component carrier inspection station communicates with the manufacturing execution system via an interface so as to acquire the manufacturing history file from at least the manufacturing execution system.
The component carrier inspection station is configured to perform the first inspection of the presence and grade of the ID mark and the second inspection of the existence and contents of the manufacturing history file, and the first inspection and the second inspection of the first inspection and the second inspection. A component carrier inspection station that sorts the component carriers if at least one determines that the component carriers are defective. The component carrier inspection station according to claim 1, wherein the component carrier inspection station is further configured to perform at least one of the measurement of the warp of the component carrier and the measurement of the thickness of the component carrier. .. Component carrier inspection station
A loading device configured to load the component carrier from another station into the component carrier inspection station.
A detection unit configured to scan the ID mark and
A plurality of containers, at least one first container of the plurality of containers receives the component carrier determined to be defective by at least one of the first inspection and the second inspection. A plurality of containers configured such that at least one second container of the plurality of containers receives the component carrier determined by the first inspection and the second inspection to be not defective. With and
A removal device configured to remove the component carriers determined to be defective in at least one of the first containers and remove the component carriers determined to be non-defective in the second container. The component carrier inspection station according to claim 1 or 2. Component carrier inspection station
A three-dimensional laser measurement tool configured to measure the warpage of the component carrier,
A touch sensor configured to measure the thickness of the component carrier,
A first table configured to receive the component carrier from the loading device, and
Further comprising at least one of a second table configured to receive the component carriers from the first table.
The flipper unit is configured to transport the component carrier from the first table to the second table while rotating the component carrier, and the detection unit is provided on the main bottom surface of the component carrier. The component carrier inspection station according to claim 3, which is configured to scan the first ID mark and scan the second ID mark provided on the main upper surface of the component carrier. A production line including the component carrier inspection station according to any one of claims 1 to 4.
A solder mask inspection station located on the production line upstream of the component carrier inspection station and configured to inspect the solder masks of the component carriers.
A functional inspection station located on the production line upstream of the component carrier inspection station and configured to inspect the electrical function of the component carrier,
An optical inspection station located on the production line upstream of the component carrier inspection station and configured to inspect the component carriers by optics.
A visual inspection station located on the production line on the upstream side of the component carrier inspection station and configured to allow visual inspection of the component carriers.
A defective marking station located on the production line on the upstream side of the component carrier inspection station and configured to form defective markings on the component carrier.
A production line further comprising at least one of a station with a package station located on the downstream side of the component carrier inspection station and configured to package the component carriers. A component carrier is an array containing multiple cards.
The defective marking on the component carrier is marked by the defective marking station on the card of the array, and the marked card is at least one of a solder mask inspection station, a functional inspection station, an optical inspection station and a visual inspection station. It failed one test and
The defective marking station uploads the file to a file server, which contains information about the marked cards in the array.
The component carrier inspection station is configured to download the uploaded file from the file server, scan the defective markings, and compare the scanned result with the information contained in the downloaded file.
The component carrier inspection station is configured to give the comparison results to the manufacturing execution system, or alerts if there is a discrepancy between the scanned results and the information contained in the downloaded file. 5. The production line according to claim 5. A component carrier inspected by the component carrier inspection station according to any one of claims 1 to 4.
(A) The component carrier comprises at least one component surface-mounted and / or embedded in the component carrier, the at least one component being an electronic component, non-conductive and / or. Conductive inlays, heat transfer units, optical waveguide elements, optical elements, bridges, energy harvesting units, active electronic components, passive electronic components, electronic chips, storage devices, filters, integrated circuits, signal processing components, power management configurations Elements, optoelectronic interface elements, voltage converters, cryptographic components, transmitters and / or receivers, electromechanical transducers, actuators, microelectromechanical systems, microprocessors, capacitors, resistors, inductors, accumulators, switches, cameras, antennas , Magnetic components, additional component carriers, and selection from the group containing logic chips,
(B) At least one of the conductive layered structures of the component carriers comprises at least one of the group containing copper, aluminum, nickel, silver, gold, palladium and tungsten and is a superconducting material of graphene. Covered with
(C) The electrically insulating layer structure includes resin, reinforced resin or non-reinforced resin, epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivative, glass, prepreg material, polyimide, etc. Includes at least one of the groups comprising polyamides, liquid crystal polymers, epoxy-based build-up films, polytetrafluoroethylene, ceramics, and metal oxides.
(D) The component carrier has a plate shape and is in the shape of a plate.
(E) The component carrier is configured as one of a group including a printed circuit board, a board, and an interposer.
(F) The component carrier is configured as a laminated component carrier.
A component carrier comprising at least one of the above features (A) to (F).

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