JP3230792B2 - Method and apparatus for forming flattening film - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a device for forming a flattening film that will be required in manufacturing the devices of the multilayer wiring structure.

[0002]

2. Description of the Related Art To manufacture a device having a multilayer wiring structure, as shown in FIG. 3, after an Al wiring 101 is formed on a substrate W, a hillock prevention film 102 is formed by CVD, and SOG ( Spin-On-Glass: A solution in which a silicon compound is dissolved in an organic solvent, and a coating film 103 such as a silicon oxide film formed by applying and baking this solution. After flattening the surface of the film 103, another wiring is formed on the coating film 103,
The lower layer wiring and the upper layer wiring are electrically connected through through holes to manufacture a device.

As a method of forming the above-mentioned SOG film,
After setting the substrate on the inner cup placed in the outer cup, dropping the SOG coating solution at the center of the substrate, rotating the inner cup at high speed, and evenly spreading the coating solution by centrifugal force, then drying under reduced pressure The present applicant has previously proposed a method for performing the above-mentioned method as Japanese Patent Application Laid-Open No. 3-101866.

[0004]

In the case where a flattening film is formed, it is preferable that the etch-back amount is as small as possible. That is, in FIG. 3, the flattening rate is A / B × 1.
It is expressed by 00 (%), and the flattening rate is preferably closer to 100. However, if the drying after application is performed by drying under reduced pressure, although the drying time is shortened, a conformal film having the same SOG thickness between the Al wirings (twin portion) and on the Al wirings is formed. .

[0005] In addition, there are air drying and standing as drying methods. However, in the case of air drying, there is a problem that the uniformity of the film is deteriorated and in the case of standing, it takes time.

In order to solve the above-mentioned problems, a method of forming a flattening film according to the present invention comprises disposing a drying device adjacent to a coating device.
An apparatus for forming a SOG flattening film comprising:
And the drying device, respectively,
ー The inner cup that can be rotated inside the cup
The lid that closes the top opening of the inner cup
A vacuum chuck for holding by suction, and the drying device
Is an inner cup that can be rotated at low speed.
Was. Further, in the flattening film forming apparatus according to the present invention,
The coating device includes a substrate set in an inner cup.
Attached to the lower surface of the lid so as to face the surface
It is preferable to provide a current plate.

The rotation speed of the substrate in the drying device is 10 rpm.
It is preferable to set it to 30 rpm or less. This is 10rpm
If it is less than 30 rpm, the drying time will be long, and if it exceeds 30 rpm, the air current on the substrate will be turbulent and turbulent, and the flatness will be poor. Incidentally, the drying time when the number of rotations is 10 rpm or more and 30 rpm or less may be a guide as long as interference fringes are generated in the coating liquid, and specifically, about 60 seconds is sufficient.

In the apparatus for forming a flattening film according to the present invention, a drying apparatus is arranged adjacent to a coating apparatus, and the coating apparatus is rotated at a high speed in the outer cup and the outer cup. An inner cup and a lid for closing an upper opening of the inner cup are provided.
Further, the drying device is provided with an inner cup which is rotated at a low speed by a spinner and on which a substrate is set.

An outer cup, an inner cup rotated in the outer cup, a lid for closing an upper opening of the inner cup, and a substrate for holding the substrate by suction.
Using a coating device and a drying device each having a vacuum chuck to hold, the coating liquid diffused over the entire surface of the substrate by high-speed rotation has fluidity even after the completion of coating, and then is rotated at a low speed. When drying, flattening is performed by the flow of the coating solution (flowing from a high place to a low place).

[0010]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is an overall plan view of a flattening film forming apparatus according to the present invention, and FIG. 2 is an enlarged sectional view of a main part of the flattening film forming apparatus.

An apparatus for forming a flattening film has an upstream portion on the left side of FIG. 1, and a substantially circular wafer W loading section 1 is provided at the upstream section. A coating apparatus 2 according to the present invention is provided downstream of the loading section 1. Are arranged, and a drying device 3 and a
Backside cleaning device 4 for wafer W and hot plate 5a
And a heating unit 5 having a cooling plate 5b is arranged, and the wafer W is transported from the loading unit 1 to the heating unit 5 while the lower surfaces of the front and rear ends of the wafer W are supported by the transport unit 6. The wafer W is sequentially transferred on each hot plate 5a while the lower surface of the wafer W is supported by the transfer device 7 which makes a crank motion in a vertical plane, and finally the wafer W is transferred while the temperature is adjusted by the cooling plate 5b. ing.

The coating device 2 comprises a base 10, an inner cup 20, an outer cup 30, and a lid 40.
A bearing 11 is attached to the base 10.
To support the hollow rotary shaft 12 of the spinner device,
An inner cup 20 is fixed to the upper end of the rotating shaft 12.

A vacuum chuck 1 is provided in the hollow rotary shaft 12.
3, the suction portion of the vacuum chuck 13 faces the central opening 25 of the inner cup 20. The vacuum chuck 13 can be moved up and down so as to receive and deliver the wafer W at the raised position, and to be flush with or slightly lower than the upper surface of the inner cup 20 at the lowered position shown in the figure.

Arms 50 and 51 are disposed above the inner cup 20 and the outer cup 30 as shown in FIG. The arms 50 and 51 can move linearly, rotate, move up and down, or combine them, so that they do not interfere with each other. A nozzle for dropping a coating liquid such as an SOG liquid is attached to the arm 50, and a shaft 52 extending downward is attached to the tip of the arm 51 supporting the lid 40, and a nozzle hole is formed in the shaft 52. And
A nitrogen gas or a cleaning liquid is ejected from the nozzle hole.

A boss 53 is rotatably fitted to the shaft 52 via a bearing and a magnetic seal. The boss 53 is formed of a disc-shaped aluminum for closing the upper opening of the inner cup 20. Attach the manufacturing of the cover 41, set the current plate 42 on the lower surface of the cover 41 for preventing the turbulence in the inner cup 20 to the inner cup 20
Attached so as to face the substrate surface to be bets, also, the tip lower surface of the upper arm 51 of the cover 41 are fixed to the lid 43 for closing the upper opening of the outer cup 30.

On the other hand, the drying device 3 comprises a base 10, an inner cup 20 and an outer cup 30 in the same manner as the coating device 2.
And a member corresponding to the lid 40 of the coating apparatus 2 is not provided. However, a lid may be provided similarly to the coating device 2 and drying may be performed while suppressing turbulence in the inner cup 20.

The drying device 3 is provided with a bearing 11 on a base 10 similarly to the coating device 2. The bearing 11 penetrates the bearing 11 to support a hollow rotary shaft 12 of a spinner device. The cup 20 is fixed, and a vertically movable vacuum chuck 13 is inserted into the hollow rotary shaft 12.

In the above, the wafer W having the Al wiring formed on the surface is set in the inner cup 20 of the coating apparatus 2, the SOG solution is dropped on the center of the wafer W, and then placed on the inner cup 20 and the outer cup 30. By rotating the arm 51 and lowering the arm 51, the upper surface of the inner cup 20 is closed by the lid 41, and the lid 4 is closed.
3, the upper surface opening of the outer cup 30 is closed, and then the vacuum chuck 13 and the inner cup 20 are integrally rotated by a spinner, so that the SOG coating liquid 103 is applied to the wafer W as shown in FIG. Apply to the surface.

Next, the wafer W on which the SOG coating solution 103 has been applied is set on the inner cup 20 of the drying device 3, and the SOG coating solution is dried. Drying is wafer W
At a low speed of 10 rpm or more and 30 rpm or less. Since the SOG coating liquid has fluidity at the beginning of the drying step, the SOG coating liquid flows in the direction of the arrow in FIG. 3 and the flatness is improved.

Although the coating device and the drying device are provided separately in the illustrated flattening film forming device, the coating device also functions as the drying device by changing the rotation speed of the inner cup of the coating device. It may be.

[0021]

According to the present invention, the substrate coated with the coating liquid is rotated at a low speed of 10 rpm or more and 30 rpm or less to dry the coating liquid, so that the coating film can be flattened.

In the apparatus for forming a flattening film according to the present invention, a drying device is disposed adjacent to the coating device, the coating device comprising an outer cup, and an inner member which is rotated at a high speed in the outer cup. A cup, a lid closing an upper opening of the inner cup, and a rectifying plate attached to a lower surface of the lid so as to face a substrate surface set in the inner cup. Since the outer cup and the inner cup which is rotated at a low speed by a spinner in the outer cup and on which the substrate is set are provided, common parts can be used between the coating apparatus and the drying apparatus. Simplification of the configuration of the entire apparatus and cost reduction can be achieved.

[Brief description of the drawings]

FIG. 1 is an overall plan view of a flattening film forming apparatus according to the present invention.

FIG. 2 is an enlarged sectional view of a main part of the flattening film forming apparatus.

FIG. 3 is an enlarged sectional view of a substrate on which an SOG film is formed.

[Explanation of symbols]

2 ... Coating device, 3 ... Drying device, 10 ... Base, 20 ... Inner cup, 30 ... Outer cup, 40 ... Lid, 1
03: SOG coating liquid, W: wafer.

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Hideya Kobari 150 Nakamurako, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Tokyo Ohka Kogyo Co., Ltd. (56) References JP-A-4-168442 (JP, A) JP-A-3 JP-A-245875 (JP, A) JP-A-4-98823 (JP, A) JP-A-6-170315 (JP, A) JP-A-7-137803 (JP, A) JP-A-7-221087 (JP, A) JP-A-5-283331 (JP, A) JP-A-1-67735 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/316 H01L 21/31 H01L 21 / 027

Claims (2)

(57) [Claims] 1. An SOG flattening film forming apparatus comprising a drying device disposed adjacent to a coating device, wherein the coating device and the drying device are respectively rotated by an outer cup and an outer cup. A flattening film, comprising: an inner cup that can be closed; a lid that closes an upper surface opening of the inner cup; and a vacuum chuck that sucks and holds the substrate; and wherein the drying device is an inner cup that can be rotated at a low speed. Forming equipment. 2. The rectifying plate according to claim 1, wherein the coating device is attached to a lower surface of the lid so as to face a substrate surface set in an inner cup. An apparatus for forming a flattening film, comprising: