JP3229456U - Heat dissipation embedded package structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation embedded package structure in which heat dissipation efficiency is improved by increasing the heat dissipation area of a device and performing heat dissipation in multiple directions. SOLUTION: The heat radiation embedded package structure is provided with at least one through hole and several vertically provided first copper columns 14, a device 2 is provided in the through hole, and the lower part of the through hole is exposed to light. 1. It includes a second circuit layer 16 that is electrically connected to the copper column together with the first line layer. Since the second circuit layer wraps the upper surface of the device and at least a part of the side surface, the heat dissipation efficiency is improved. [Selection diagram] Fig. 2

Description

The present invention relates to the field of semiconductor packaging, and particularly to the package structure.

With the rapid development of the electronics industry, existing electronic products are becoming more and more thin, and their degree of integration and functionality are improving day by day, so circuit boards for mounting electronic devices such as resistors, capacitors or chips. Will inevitably develop in the direction of lightening, which will lead to circuit board packaging technology. Here, embedded packaging technology is widely used and becoming more and more popular in power management products such as filters and power amplifiers. Embedded packaging technology is a high-density packaging technology that embeds electronic devices in an embedded package substrate, which can shorten the length of the circuit, improve the electrical characteristics, and reduce the soldering points on the surface of the circuit board. It can improve the reliability of packaging and reduce the cost. However, as electronic components become more and more integrated, heat dissipation becomes one of the most important factors in embedded packaging design.

The embedded packaging technology in the prior art employs a single-sided heat dissipation packaging method, that is, a through hole is formed on the back surface of the embedded package substrate by laser drilling or plasma etching, and the through hole is metallized to form a thermally conductive copper column. A large-area copper sheet is directly formed on the back surface of the embedded package substrate, and such a single-sided heat-dissipating package structure has a limited heat-dissipating area, a high manufacturing cost, and a long manufacturing cycle.

An object of the present invention is to solve at least one of the technical problems existing in the prior art. Therefore, the present invention provides a heat dissipation embedded package structure capable of increasing the heat dissipation area of the device, reducing the manufacturing cost, and shortening the manufacturing cycle.

The heat dissipation embedded package structure according to the embodiment of the present invention is provided with at least one through hole and several vertically provided first copper columns, a device is provided in the through hole, and a lower portion of the through hole is provided. Is filled with a photosensitive insulating material, the lower surface is the first surface, and the upper surface is the second surface, and the first circuit layer provided on the first surface and electrically connected to the device. A part fills the upper part of the through hole and wraps the upper surface and at least a part side surface of the device, another part covers the upper end of the first copper column, and the first line layer is formed on the first copper column. Includes a second circuit layer, which is electrically connected with.

Compared to traditional single-sided heat dissipation package construction, the present invention increases the heat dissipation area of the device because the second circuit layer wraps the top surface and at least some sides of the device with at least the following beneficial effects: This allows the device to dissipate heat in multiple directions, which improves heat dissipation efficiency.

According to some embodiments of the present invention, a first sealing layer and some second copper columns are provided below the first circuit layer and between the first circuit layer and the first circuit layer. (Ii) A third circuit layer in which a copper column penetrates the first sealing layer and is electrically connected to the second copper column together with the first circuit layer, and is provided on the second circuit layer. A second sealing layer and some of the second copper columns are provided between the second circuit layer, the second copper columns penetrate the second sealing layer, and the second circuit is formed in the second copper columns. It further includes a fourth circuit layer that is electrically connected with the layer.

According to some examples of the present invention, both the first sealing layer and the second sealing layer are made of resin.

According to some embodiments of the present invention, a photosensitive insulating material is further filled between the second circuit layer and the second surface.

According to some embodiments of the present invention, a first seed layer is provided on the upper surface of the first circuit layer, and a second seed layer is provided on the lower surface of the second circuit layer.

According to some embodiments of the present invention, the frame is made of resin.
The above and / or additional aspects and advantages of the present invention will become apparent and easier to understand from the description of the examples combined with the drawings below.

It is a vertical sectional view of one Example of this invention. It is a vertical sectional view of another Example of this invention.

Examples of the present invention will be described in detail below, examples of the above embodiments are shown in the drawings, and the same or similar symbols are the same or similar elements, or elements having the same or similar functions throughout the present specification. Represents. The examples described below with reference to the drawings are exemplary and are used only to interpret the invention, but should not be understood as limiting the invention.

In the description of the present invention, regarding the explanation of the direction, for example, the orientation or the positional relationship shown in "up", "bottom", etc., is based on the orientation or the positional relationship shown in the drawing, and the present invention is briefly explained and explained. It should be understood that it is for brevity only and is not intended to indicate or imply that the device or element shown will always have a particular orientation and will be constructed and operated in a particular orientation. Therefore, it should not be understood as a limitation of the present invention.

In the description of the present invention, some means one or more, and plural means two or more. If there are first, second, third, and fourth explanations used only to distinguish the components, they indicate or suggest relative importance, or the number or indication of the components shown. It should be understood that it does not implicitly indicate the order of the components.

In the description of the present invention, terms such as installation, connection, and bonding should be understood in a broad sense unless otherwise specified, and those skilled in the art can combine the specific contents of the technical solution to describe the above in the present invention. The specific meaning of the term can be reasonably determined.

With reference to FIG. 1, the present invention discloses a heat dissipation embedded package structure including a frame 1, a first circuit layer 15, and a second circuit layer 16.

Here, the frame 1 is provided with at least one through hole 13 and some vertically provided first copper columns 14, a device 2 is provided in the through hole 13, and the lower portion of the through hole 13 is photosensitive. An insulating material is filled, the lower surface of the frame 1 is the first surface 11, the upper surface of the frame 1 is the second surface 12, the first circuit layer 15 is provided on the first surface 11, and the device 2 is the first circuit. Electrically connected to layer 15, some second circuit layer 16 fills the top of the through hole 13 and wraps the top surface and at least some side surfaces of the device 2, with another portion of the second circuit layer 16. The first line layer 15 and the second circuit layer 16 are electrically connected to the first copper column 14 so as to cover the upper end of the first copper column 14.

As will be appreciated, the second circuit layer 16 wraps the top surface and at least some of the sides of the device 2 so that the present invention increases the heat dissipation area of the device 2 as compared to a conventional single-sided heat dissipation package structure. As a result, the device 2 can dissipate heat in multiple directions, thereby improving the heat dissipation efficiency.

Specifically, each of the through holes 13 and the first copper pillar 14 may be one or more, a plurality of through holes 13 are distributed in the frame 1, and some first copper pillars 14 are in the frame 1. It is distributed. The device 2 may be a passive device such as a resistor, a capacitor, an inductor, or an active device such as a chip, and the device 2 may be a single device 2 and is stacked back to back. It may be a combination of the plurality of devices 2 obtained.

Referring to FIG. 2, some embodiments of the present invention include a third circuit layer 171 and a fourth circuit layer 181.

Here, the third circuit layer 171 is provided below the first circuit layer 15, and between the first circuit layer 15 and the third circuit layer 171 is a first sealing layer 17 and some second copper columns 3. The second copper column 3 penetrates the first sealing layer 17 and electrically connects the first circuit layer 15 and the third circuit layer 171. The fourth circuit layer 181 is the second circuit layer 16. Provided above, a second sealing layer 18 and some second copper columns 3 are provided between the second circuit layer 16 and the fourth circuit layer 181, and the second copper columns 3 provide the second sealing layer 18. It penetrates and electrically connects the second circuit layer 16 and the fourth circuit layer 181. Both the first sealing layer 17 and the second sealing layer 18 are made of resin.

In some embodiments of the present invention, a photosensitive insulating material is further filled between the second circuit layer 16 and the second surface 12. A photosensitive insulating material is a substance that can be converted into a solid organic polymer product by the action of light rays or high energy rays. The photosensitive insulating material is a stable low-molecular-weight unsaturated organic oligomer cross-linked and polymerized by the action of light (ultraviolet light or visible light) or high-energy rays (mainly electron beam) with the effect of a specific catalyst. It is a solid organic polymer product, which has a dielectric constant of 2.5 to 3.4, a dielectric loss of 0.001 to 0.01, a dielectric strength of 100 KV to 400 KV, a surface resistance and a bulk resistance of 10e17Ω. It has a good dielectric property (electrical insulation) of m, and is, for example, PI polyimide, PPO polyoxyxylene, or the like.

Referring to FIG. 1, in some embodiments of the present invention, the first seed layer 111 is provided on the upper surface of the first circuit layer 15, and the second seed layer 121 is provided on the lower surface of the second circuit layer 16. Be done. Here, the first seed layer 111 and the second seed layer 121 may be metals including, but not limited to, metallic titanium, copper, titanium-tungsten alloy, and the like. The first seed layer 111 and the second seed layer 121 better adhere the subsequent first and second metal layers to the corresponding regions during electroplating.

In some embodiments of the present invention, the frame 1 is made of resin.
The manufacturing process of the heat dissipation embedded package structure in the present invention is as follows: A frame 1 having at least one through hole 13 is made, and several first copper columns 14 are vertically provided in the frame 1. The lower surface of the device is the first surface 11, the tape is adhered to the first surface 11 so that the adhesive surface of the tape is attached to the first surface 11, the device 2 is arranged in the through hole 13, and the contacts of the device 2 are contacted. Attached to the tape, the photosensitive insulating material was cured into a portion of the space of the through hole 13, which exposed the top surface of the device 2 and at least some side surfaces of the device 2. The tape is removed, the first surface 11 is electroplated to form a first metal layer, and the upper surface and side surfaces of the device 2, the upper surface of the photosensitive insulating material, and the upper end surface of the first copper column 14 are electroplated and second. A first circuit is formed by forming a metal layer, the second metal layer covering the upper end surface of the first copper column 14 and the upper surface and at least a part of the side surface of the device 2, and etching the first metal layer and the second metal layer. Layers 15 and second circuit layers 16 are obtained, respectively, the contacts of the device 2 are electrically connected to the first circuit layer 15, and the upper and lower ends of the first copper column 14 are the second circuit layer 16 and the first circuit, respectively. It was electrically connected to layer 15.

Although the embodiment of the present invention has been described in detail in combination with the drawings above, the present invention is not limited to the above-mentioned embodiment, and various things can be made within the knowledge of those skilled in the art without deviating from the gist of the present invention. You can make changes.

Frame 1, first surface 11, first seed layer 111, second surface 12, second seed layer 121, through hole 13, first copper column 14, first circuit layer 15, second circuit layer 16, first sealing Layer 17, third circuit layer 171, second sealing layer 18, fourth circuit layer 181, device 2, second copper column 3.

Claims (6)

It has a heat dissipation embedded package structure,
At least one through hole (13) and some vertically provided first copper columns (14) are provided, a device (2) is provided in the through hole (13), and the through hole (13) is provided. The lower part of the frame (1) is filled with a photosensitive insulating material, the lower surface is the first surface (11), and the upper surface is the second surface (12).
A first circuit layer (15) provided on the first surface (11) and to which the device (2) is electrically connected,
A portion fills the upper portion of the through hole (13) and wraps the upper surface and at least a part of the side surface of the device (2), and another portion covers the upper end of the first copper column (14). A heat radiation embedded package structure including a second circuit layer (16) electrically connected to a copper column (14) together with the first line layer (15). A first sealing layer (17) and some second copper columns (3) are provided below the first circuit layer (15) and between the first circuit layer (15). A third circuit layer (171) in which the two copper columns (3) penetrate the first sealing layer (17) and are electrically connected to the second copper column (3) together with the first circuit layer (15). )When,
A second sealing layer (18) and some of the second copper columns (3) are provided above the second circuit layer (16) and between the second circuit layer (16). A fourth circuit layer (3) in which the second copper column (3) penetrates the second sealing layer (18) and is electrically connected to the second copper column (3) together with the second circuit layer (16). The heat-dissipating embedded package structure according to claim 1, further comprising 181). The heat-dissipating embedded package structure according to claim 2, wherein the first sealing layer (17) and the second sealing layer (18) are both made of resin. The heat-dissipating embedded package structure according to claim 1, wherein a photosensitive insulating material is further filled between the second circuit layer (16) and the second surface (12). A first seed layer (111) is provided on the upper surface of the first circuit layer (15), and a second seed layer (121) is provided on the lower surface of the second circuit layer (16). The heat dissipation embedded package structure according to claim 1. The heat-dissipating embedded package structure according to claim 1, wherein the frame (1) is made of resin.

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