JP3227483B2 - Method and apparatus for assembling magnetic head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for assembling a thin film head which is applied to assemble a magnetic head by bonding a thin film head to a gimbal.

[0002]

2. Description of the Related Art Conventionally, to bond and fix a thin film head to a gimbal, a thin film head H wire-bonded with its back face upward as shown in FIG. The instant adhesive is applied to the back of the thin film head H, and the two holes C ₁ and C ₂ are fitted to the positioning pins 2 and 3 of the jig 1 as shown in FIG. Temporary bonding. After this, FIG.
As shown at 9, the gimbal G is turned over, and a thermosetting conductive agent or reinforcing agent is applied to the joint between the thin film head and the gimbal and thermoset, so that the thin film head H is bonded and fixed to the gimbal G. Things are going on.

However, in such assembling means, if the type of the magnetic head is different, it is necessary to provide individual jigs according to the difference in the hole position and diameter of the gimbal G or the supply position of each material. Further, since the gimbal G is positioned with respect to the thin film head H only by fitting the two holes C ₁ and C ₂ to the positioning pins 2 and 3, it is difficult to position the gimbal G with the thin film head H with high accuracy. Products tend to vary. In addition, the application of a reinforcing agent or a conductive agent requires a time for assembling since a step of temporarily removing the gimbal from the jig with the thin film head temporarily adhered thereto and turning it over is included.

[0004]

SUMMARY OF THE INVENTION According to the present invention, the gimbal can be positioned and fixed to the thin film head with high precision using simple equipment, and the productivity of the magnetic head can be increased by rapidly assembling the thin film head and the gimbal. It is an object of the present invention to provide an improved magnetic head assembling method and apparatus which can be generalized even if the product types are different.

[0005]

According to the method of assembling a magnetic head according to the first aspect of the present invention, a thin film head is positioned and mounted on a jig with its rear surface facing upward, and an instant adhesive, a conductive agent and the like are mounted. A liquid material such as a reinforcing agent is applied to the back of the thin film head, while the gimbal is sucked by the suction head, and the mounting posture of the thin film head in the jig and the holding posture of the gimbal by the suction head are taken by the camera and imaged. After processing, the position of the suction head is corrected based on the position correction data obtained by the image processing, and the gimbal is pressed and fixed to the thin film head by the position-corrected suction head.

In the magnetic head assembling apparatus according to a second aspect of the present invention, a jig for positioning and mounting the thin film head with the back surface facing upward, and a liquid material such as an instant adhesive, a conductive agent, and a reinforcing agent. A supply device for a liquid material to be applied to the back of the thin film head, a supply device for a gimbal equipped with a suction head capable of holding the gimbal at the nozzle tip and correcting the position,
A gimbal supply device having an image processing device for taking an image of the mounting posture of the thin film head in the jig and the holding posture of the gimbal by the suction head with a camera, and correcting the position based on the position correction data of the image processing device Is configured as a mechanism for pressing and fixing the gimbal to the thin film head by the suction head.

[0007]

In the magnetic head assembling method according to the first aspect of the present invention, the thin film head is positioned and mounted on a jig, and a liquid material such as an instant adhesive, a conductive agent, or a reinforcing agent is applied to the back of the thin film head. After that, the gimbal is pressed against the back surface of the thin film head by the suction head to fix the gimbal to the thin film head, so that the step of turning the gimbal upside down is not included, and the magnetic head can be assembled quickly and efficiently. At the time of gimbal press contact, the camera mounts the image of the mounting posture of the thin film head in the jig and the holding posture of the gimbal by the suction head, and performs position correction on the suction head based on the position correction data from this image processing. Since the gimbal is pressed against the thin film head of the jig, the gimbal can be positioned with high accuracy, and can be used for general purposes even if the type is different.

According to a second aspect of the present invention, there is provided an apparatus for assembling a magnetic head, comprising: a jig for positioning and mounting a thin film head with its rear side facing upward; A liquid material such as a reinforcing agent is applied from above by a material supply device, and the gimbal is held by an adsorption head to press the gimbal against the thin film head from above and adhere and fix the thin film head and the gimbal. It can be assembled quickly with simple equipment. In addition, since the camera is equipped with an image processing device that captures the mounting attitude of the thin film head in the jig and the holding attitude of the gimbal by the suction head with a camera and corrects the position of the suction head, the gimbal can be positioned with high precision, and the type differs You can assemble things.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 to 26, the assembling process of the magnetic head shown in FIG.
0, a wire bonding part 11 for connecting and fixing the lead wire to the thin film head, a UV resin for covering the connection part of the lead wire and a supply part 12 for a liquid material containing an instant adhesive, a thermosetting conductive agent and other reinforcing agents, a gimbal. And a take-out unit 14 for the magnetic head assembly. In the process of assembling the magnetic head, the thin film head H is bonded and fixed to the plate surface near the leading end of the gimbal G, and the lead wire R is connected and fixed to the end surface of the thin film head H as shown in FIG. The magnetic head is provided with two or more lead wires R, and the leading direction is set in front of the gimbal G.
It can be set to either side or rear.

The steps of assembling the magnetic head are as follows.
The continuous processing can be carried out by connecting 14 with upper and lower two-stage conveyors 15. Further, the ascending elevator 16a and the descending elevator 16b are connected to the two-stage conveyor 15.
The jigs for supplying the thin film heads are sequentially fed to the respective sections 10 to 14 on the upper stage side of the two-stage conveyor 15 to assemble the magnetic heads. The jig of the thin-film head is provided so as to be sent from the upper side of the two-stage conveyor 15 to the lower side by the descending elevator 16b and to be sent from the lower side of the two-stage conveyor 15 to the upper side by the ascending elevator 16a so as to be circulated. .

The supply section 10 of the thin film head includes X, Y,
A 4-axis operation robot 10a in the Z and θ directions is arranged. The four-axis operation robot 10a includes a suction head (not shown) of a thin film head, and is provided so as to take out and move to a predetermined position in front by sucking the thin film head from the tray 10b with the tip of the nozzle of the suction head. . Further, a camera 10c is provided for imaging the suction attitude of the thin film head on a television screen in order to check the suction attitude of the thin film head by the suction head.

The wire bonding section 11 connects and fixes a lead wire to the end face of the thin film head.
A bonding device 11a that operates on a shaft is provided. The bonding apparatus 11a includes a magnifying camera 11b, and is configured so that a wire bonding state can be checked on a monitor television 11c.

The supply section 12 for the liquid material containing the UV resin includes a UV resin coating device 120 for coating the connection portion of the lead wire with the UV resin, an instant adhesive for bonding and fixing the gimbal to the thin film head, a conductive agent, and the like. A liquid material application device 121 for applying a liquid material such as a reinforcing agent to the thin film head is provided. The UV resin coating device 120 includes a discharge nozzle 120a such as a dispenser on the X table 120b,
By moving the X table 120b, the adjustment camera 120c for adjusting the application position of the UV resin from above,
120d. A liquid material application device 121 such as an instant adhesive includes a microdispenser and a four-axis operation robot 121a in X, Y, Z, and θ directions, and an adjustment camera 1 similar to the UV resin application device 120.
21b and 121c.

The gimbal supply unit 13 includes X, Y, Z,
The U-axis operation robot 13a is arranged. The X,
The Y-, Z-, and U-axis operation robot 13a includes a suction head (not shown) for holding the gimbal.
It is configured to take out and move to a predetermined position in front by sucking from the nozzle b at the nozzle tip of the suction head.
In addition, the suction posture of the gimbal by the suction head is determined by the camera 1.
An image processing device 13d is provided for taking an image at 3c and correcting the position of the suction head based on the suction posture of the gimbal. As a pre-process of the gimbal supply unit 13, an image processing unit 17 that obtains the position correction data of the suction head by capturing the mounting posture of the thin film head on the jig with the camera 17 a is disposed between the gimbal supply unit 13 and the liquid material supply unit 13. Have been.

An operator is arranged in the take-out section 14 in the final process, or a mechanical take-out means is provided so that the magnetic head assembled in the previous process is removed from the jig and accommodated in the bucket 14a. Have been.

As shown in FIG. 3, the jig 18 of the thin film head is formed as a cubic or rectangular parallelepiped in which the jig body 180 has flatness, parallelism, and right angle on each surface. . Since the jig body 180 uses a thin film head as a work, the jig body 180 is formed as a small metal block body having a length, width and width of about 30 mm.

As shown in FIG. 4, the jig 18 is provided with a work mounting portion 182 for mounting the thin film head H on one corner 181. The work mounting part 182
Is provided by partially shaving off the top surface of the corner side portion 181. This corner side portion 181 has a workpiece mounting portion 18.
A concave portion 183 having a predetermined length is provided to be lowered from step 2. Also, a concave groove 184 is formed on the inner surface side of the jig main body 180 by shaving a predetermined width over the entire length, thereby forming the corner side portion 18.
1 is provided in parallel. Inside the concave groove 184, a chuck 19 for fixing and supporting the thin film head H to the work mounting portion 182 inside the notch 182 is provided.

The chuck 19 has a linear chuck main body 190, and the jig main body 18 is moved from the chuck main body 190 to the jig main body 18.
It is formed by including a protruding piece portion 191 that is bent at a right angle outside the zero, and a substantially L-shaped chuck portion 192 that projects laterally from the chuck body 190 to the concave portion 183. Further, on the tip side of the chuck portion 192, a thin plate-shaped claw portion 19 located on the surface of the work mounting portion 182 is provided.
3 are protrudingly formed.

The chuck 19 is assembled inside the concave groove 184 so as to be urged outward by a compression spring 194 from the jig body. The compression spring 194 is housed and located in the concave portion 185 which is formed to be lower from the concave groove 184, and the spring end on one side is disposed in contact with the inside of the protruding piece portion 192 so that the chuck 19 is pressed outwardly of the jig main body 180. Assembled to energize. Further, the chuck 19 has the chuck portion 192 formed in the concave portion 18.
3 and slidably disposed on the surface of the work mounting portion 182.

As shown in FIG. 5, the chuck 19 is supported inside the concave groove 184 by a pressing plate 195 in which the chuck main body 190 is screwed and fixed to the jig main body 180. An auxiliary plate 197 having a notch 182 and a rising portion 196 which is located on the inner side is fixed to the holding plate 195 by screwing. This auxiliary plate 1
The work mounting portion 182 is provided so as to exhibit a space for fixing and holding the thin film head H from the claw portion 193 of the chuck 19 together with the rising portion 196 of the 97.

The jig 18 of the thin film head is a pallet 20 for positioning and mounting a jig body 180 as shown in FIGS.
By using the two-stage conveyor 15 each part 10-1
4 and 17. The jig 18 has two sets of round holes 186a and 186b as shown in FIG.
Are provided on the bottom side of the jig main body 180. The pallet 20 is provided with positioning pins 200a and 200b that are fitted with the respective round holes 186a and 186b on the plate surface. The round holes 186a and 186b and the positioning pins 200
The jig 18 is assembled with the pallet 20 so that it can be stably placed on the plate surface of the pallet 20 with a clearance provided between the pallet 20 and the jig 18. The pallet 20 has insertion holes 201a, 201 for guide posts for guiding the pallet up and down as described later.
01b is provided on the diagonal plate surface near the corner.

When the jig 18 moves to the thin-film head supply section 10, the thin-film head supply section 10 holds the chuck 19 of the jig 18 against the compression spring 195.
Is pressed by a pusher (not shown) or the like, and the chuck 19 is pressed.
Is moved inward of the jig main body 180 to operate to expand the space of the work mounting portion 182. At the same time, the four-axis operating robot 10a sucks the thin film head accommodated in the tray 10b from the back with the suction head, and after confirming the sucking posture of the thin film head with the camera 10c, the thin film head is extended by the jig 18. It moves so as to be placed on the work placement part 182 that has been placed.

When the suction head mounts the thin film head on the work mounting portion 182 of the jig 18, the chuck 19 is released from being pressed by the pusher or the like, and is returned to the original position by the compression spring 194. Along with this, the thin film head is pressed by the claw portion 193 of the chuck 19, and a predetermined space defined by the rising portion 196 of the auxiliary plate 197 on the inner surface of the work mounting portion 182 with the back side facing upward. Fixedly supported. Thereafter, the jig 18 moves to the wire bonding section 11 so as to connect and fix the lead wire to the end face of the thin film head, and moves to the liquid material supply section 13 after this wire bonding processing.

In the liquid material supply section 12, UV resin is first adhered to the end face of the thin film head by the discharge nozzle 120a of the coating apparatus 120 so as to cover the connection portion of the lead wire with the UV resin. After the UV resin is cured by irradiation with ultraviolet light, the jig 18 moves to the supply device 121 for the instant adhesive, the conductive agent, and the reinforcing agent. Each of the agent supply devices 121
In this case, the instant adhesive A, the conductive agent B, and the reinforcing agent C can be attached to the back surface of the thin film head H from above based on each application pattern as shown in FIGS.

After the application of the liquid material, the jig 18 moves to the gimbal supply unit 13. In the gimbal supply unit 13, the X, Y, Z, and U-axis operation robot 13 a sucks the gimbal with the suction head, and moves the gimbal toward the thin film head positioned and held by the jig 18. During this movement, the gimbal holding posture of the suction head is captured by the camera 13c, and the position correction data of the suction head is obtained by the image processing device 13d. In the case of a gimbal as shown in FIG.
As shown by 2 and 13, the gimbal G sucked by the suction head 13 e is irradiated from below with the ring illumination 13 f to the hole C.
Obtained by may SHOOTING _1, the positions of the C ₂ camera 13c.

Prior to this, an image processing unit 17 disposed between the liquid material supply unit 12 and the gimbal supply unit 13 is provided.
In, the mounting posture of the thin film head in the jig can be photographed by the camera 17a and obtained as correction data for correcting the position of the suction head of the gimbal. The position correction data of the suction head is stored in the thin film head H in the jig 18 as shown in FIG.
Are defined as X1 to X6 and Y1 to Y6, and as shown in FIG. 11, an X dimension reference × A: X = (X1 + X2) / 2,
X dimension basis x B: X = (X5 + X6) / 2, Y dimension basis: Y = (Y3 + Y4) / 2.

Based on the data obtained from the mounting posture of the thin film head H on the jig 18 and the holding posture of the gimbal by the suction head, as shown in FIG.
Of correcting the U angle, and the suction head 13e is lowered dynamic if a proper state by re-check the position of the holes C ₂ presses the gimbal G to the thin film head. The suction head 13
e temporarily stops until the gimbal is fixed to the thin film head with the instant adhesive, and thereafter returns to the original position by releasing the holding of the gimbal.

In this manner, when assembling the thin film head and the gimbal, not only can they be applied versatilely even if the types are different, but also the magnetic head can be assembled with high precision using simple equipment without variation. In addition, when applying a conductive agent, a reinforcing agent, or the like, there is no need to turn the gimbal over, so that the magnetic head can be quickly assembled and the productivity can be improved.

In the above-described embodiment, the lead wire can be connected to the end face of the thin film head from the optimum direction, and the UV resin can be applied or the instant adhesive, the conductive agent, and the reinforcing agent can be applied from the optimum direction. As shown in FIG.
As shown by reference numerals 6 and 17, it is provided so as to be rotatable about a horizontal axis and a vertical axis.

As shown in FIG. 18, the rotation of each of the axes is performed by a holding arm 30 having a flat end at the front end in contact with the jig body 180, and a holding arm 31 having the front end bent and formed into an L-shape. It can be performed by using a rotation support such as a holder provided with In order to stably and securely clamp the jig main body 180 between the rotation supports 30 and 31, FIGS.
As shown by reference numeral 20, receiving grooves 187a and 187b are provided on predetermined surfaces in parallel with the horizontal axis and the vertical axis of the jig body 180, respectively. Each of the receiving grooves 187a and 187b is
In order to conform to the shape of the front end, it is preferable to form a tapered expanding portion and a narrow concave portion continuing to the deep side of the expanding portion.

The jig body 18 has two sets of round holes 186a and 186b as described above, and a set of round holes 188a, 188b and 18b as shown in FIG.
8c and 188d are provided on the side surface. These round holes 1
88a, 188b, 188c, and 188d are formed as a set of right and left and up and down, and are fitted to the positioning pins 210a and 210b of the pallet 20 at rotational positions around the horizontal and vertical axes of the jig main body 180.

The jig 18 is provided so as to be able to regulate the positioning of the jig main body 180 at a predetermined position on the plate surface of the pallet 20 in each step of sequentially feeding the jig 18 on the pallet 20. As this positioning regulating means,
As shown in FIG. 22, a pusher 40 and a bracket 41 having an L-shaped receiving surface are provided for each process.
Also, the jig body 180 is provided with a pusher 4 at a predetermined corner side.
A chamfered portion 189a pressed at 0 is formed, and a corner side portion 189b located on a diagonal line thereof is formed as a positioning portion engaged with the receiving surface of the bracket 41.

Since the above-described embodiment includes the step of connecting lead wires, the jig 18 is provided with a wire winding roller 50 as shown in FIGS. . The wire winding roller 50
Are wound around a lead wire connected to the thin film head and supported without slack. Notch grooves 51a, 51b,... The wire winding roller 50 is attached by being rotated by a rubber roller or a winding pin of the wire bonding portion 11 and interposing a sponge rubber slip stop plate 52 between the jig body 180 and the jig body 180. Wire guide pins 53a and 53b are provided on the front side of the jig body 16 via a work mounting portion 182 on which a thin film head is arranged.
Are protruding. A leaf spring 54 for fixing the paddle is provided on the front side of the wire winding roller 50.

In addition to the accessory equipment described above, a push-up pin 60 for pushing up the pallet 20 upward from the upper side of the two-stage conveyor 15 as shown in FIG. Equipped as The pallet 2
The reference numeral 0 moves up and down along the guide frames 61 and 62, and stoppers 63 and 64 for positioning and locking the pallet 20 ascending are provided above the guide frames 61 and 62, as shown in FIG. At the position where the pallet 20 is pushed up, processing in each step of the thin film head and positioning control of the jig 18 on the plate surface of the pallet are performed.

In the direction change position of the jig 18, the pallet and the jig body are completely moved to positions above the guide frames 61 and 62 so that the jig body can be held by the rotary support so that the direction can be changed. Equipped with a push-up pin similar to. For the direction change, a unique identification such as a bar code is provided on the plane of the jig main body 180, the identification is read, a conversion program for each jig is set in advance, and each mechanism is set according to a predetermined program. It can be done by operating.

[0036]

As described above, according to the method and apparatus for assembling a magnetic head according to the present invention, the gimbal can be bonded and fixed to the thin-film head with high efficiency and high precision, and the thin-film head and the gimbal can be quickly connected. As a result of being assembled, productivity can be enhanced, and general-purpose assembly can be performed for any type of product.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a magnetic head assembling apparatus according to the present invention.

FIG. 2 is a plan view showing an example of a magnetic head assembled by the same device.

FIG. 3 is a depression perspective view of a jig mounted on the apparatus.

FIG. 4 is a front view of the jig.

FIG. 5 is a plan view of the jig.

FIG. 6 is a plan view of a pallet provided in the apparatus.

FIG. 7 is a front view of the pallet.

FIG. 8 is a bottom view of the jig shown in FIG.

FIG. 9 is an explanatory diagram showing an application pattern of an instant adhesive, a conductive agent, and a reinforcing agent applied by the liquid material supply device of FIG. 1;

FIG. 10 is an explanatory diagram showing another application pattern of each agent.

FIG. 11 is a plan view of a gimbal constituting the magnetic head of FIG. 2;

FIG. 12 is an explanatory view showing one step of an image processing means for correcting the position of the suction head of the gimbal.

FIG. 13 is an explanatory view showing a step that follows the image processing step of FIG. 12;

FIG. 14 is an explanatory diagram for obtaining position correction data of a suction head from a thin film head.

FIG. 15 is an explanatory diagram showing a suction head whose position has been corrected based on the position correction data obtained in FIGS. 11, 12, and 13.

FIG. 16 is an explanatory view showing the jig of FIG. 3 rotated around a horizontal axis.

FIG. 17 is an explanatory view showing the jig rotated around a vertical axis.

FIG. 18 is an explanatory view showing a rotation support tool of the jig.

FIG. 19 is a left side view of the jig.

FIG. 20 is a right side view of the jig.

FIG. 21 is a rear view of the jig.

FIG. 22 is a plan view showing positioning restriction means of the jig.

FIG. 23 is a front view of a jig provided with a wire winding roller.

FIG. 24 is a plan view of the jig.

FIG. 25 is an explanatory view showing a pallet pushing-up means.

FIG. 26 is an explanatory diagram of the operation of the push-up means.

FIG. 27 is an explanatory view showing a jig for a thin film head according to a conventional example.

FIG. 28 is a plan view showing a mounted state of the gimbal in the jig.

FIG. 29 is an explanatory view showing a step of supplying a conductive agent and a reinforcing agent to the gimbal.

[Explanation of symbols]

 H Thin film head G Gimbal 10 Thin film head supply unit 12 Liquid material supply unit 13 Gimbal supply unit 13c Camera 13d Image processing device 13e Suction head 18 Jig

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshio Inomata 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDC Corporation (72) Inventor Hiroshi Shindo 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDD (56) References JP-A-6-176313 (JP, A) JP-A-6-76236 (JP, A) JP-A-4-162272 (JP, A) (58) Fields investigated (Int. Cl. ^7, DB name) G11B 5/31 G11B 5/127 G11B 5/49 G11B 5/60

Claims (2)

(57) [Claims] 1. A thin film head is positioned and mounted on a jig with a rear surface facing upward, and a liquid material such as an instant adhesive, a conductive agent, and a reinforcing agent is applied to the rear surface of the thin film head.
The gimbal is sucked by the suction head, the mounting posture of the thin film head in the jig and the holding posture of the gimbal by the suction head are captured by a camera, and image processing is performed, and the suction head is positioned based on the position correction data based on the image processing. A method of assembling a magnetic head, wherein a gimbal is fixed to a thin-film head by a suction head whose position has been corrected and the position of which has been corrected. 2. A jig for positioning and mounting the thin film head with the back surface facing upward, a liquid material supply device for applying a liquid material such as an instant adhesive, a conductive agent, and a reinforcing agent to the back surface of the thin film head; A gimbal supply device equipped with a suction head that can hold the gimbal at the nozzle tip and that can correct the position, and mounts the thin-film head on a jig and the suction posture of the gimbal by the suction head with a camera and performs image processing. A magnetic head assembling apparatus comprising: an image processing device; and a mechanism for pressing and fixing the gimbal to the thin film head by a suction head of the gimbal supply device whose position is corrected based on the position correction data of the image processing device. .