JP3222301U - Processing device - Google Patents

Abstract

A processing apparatus for supplying a liquid to a processing tool appropriately for each process is provided. A processing apparatus includes a cutting blade 50 for cutting a workpiece, and a plurality of supply nozzles 58 that supply liquid to the cutting blade and have different positions relative to the cutting blade. [Selection] Figure 2

Description

  The present invention relates to a processing device.

  A processing apparatus for cutting or grinding a semiconductor wafer, a package substrate, a ceramic substrate, a glass substrate or the like while supplying a liquid includes processing tools such as a cutting blade or a grinding wheel. For example, Patent Document 1 describes that a processing tool is provided with a nozzle for injecting a liquid for cooling or processing. The nozzle has a fixed angle with respect to the processing tool.

Patent No. 5149035

  Here, in order to appropriately supply the liquid from the nozzle to the processing tool, it is desirable to change the angle of the nozzle with respect to the processing tool in accordance with the processing process. In this case, although it is necessary to replace the nozzle for each process, it takes time to replace the nozzle, and for example, there is a possibility that the non-skilled worker may cause the nozzle to be replaced incorrectly. Therefore, in the processing apparatus, it is required to appropriately supply the liquid to the processing tool for each process.

  The present invention has been made in view of such problems, and an object thereof is to provide a processing apparatus capable of appropriately supplying a liquid to a processing tool for each process.

  In order to solve the problems described above and to achieve the object, a processing device according to the present invention is provided with a cutting blade for cutting a workpiece, and a plurality of liquid supplies to the cutting blade and different positions with respect to the cutting blade. And a supply nozzle.

  Preferably, the supply nozzle supplies a liquid to the outer periphery of the cutting blade, with an injection port for injecting the liquid facing the outer periphery of the cutting blade.

  It is preferable to have a first processing unit including the cutting blade and the plurality of supply nozzles, and a second processing unit including the cutting blade and the plurality of supply nozzles.

  It is preferable to further include a control unit that controls the supply of the liquid by the supply nozzle, and the control unit selects the supply nozzle that supplies the liquid from the plurality of supply nozzles.

  The processing apparatus of the present invention can appropriately supply the liquid to the processing tool for each process.

FIG. 1 is a perspective view showing an appearance configuration of a processing apparatus according to the present embodiment. FIG. 2 is a schematic view of a processing unit according to the present embodiment. FIG. 3 is a block diagram of a control device according to the present embodiment. FIG. 4 is a view showing an example of a screen for setting a supply nozzle for supplying a liquid.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or modifications of the configuration can be made without departing from the scope of the present invention. In the following embodiments, the X axis direction, the Y axis direction, and the Z axis direction used in the following description are assumed to be perpendicular to each other.

  FIG. 1 is a perspective view showing an appearance configuration of a processing apparatus according to the present embodiment. First, the to-be-processed object 100 processed by the processing apparatus 2 which concerns on embodiment is demonstrated. The workpiece 100 is, as shown in FIG. 1, a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium or the like as the substrate 101. The device 104 is formed in a region of the workpiece 100 partitioned in a lattice shape by a plurality of planned dividing lines 103 formed on the surface 102 of the substrate 101.

  In the workpiece 100, a dicing tape 106, which is an adhesive tape having a larger diameter than the substrate 101, is attached to the back surface 105 on the back side of the surface 102, and an annular frame 107 is attached to the outer periphery of the dicing tape 106. That is, the workpiece 100 is supported at the opening of the annular frame 107 via the dicing tape 106.

  The material, shape, structure, size, and the like of the substrate 101 of the workpiece 100 are not limited, and, for example, using the substrate 101 of an arbitrary shape made of a material such as ceramic, resin, or metal as the workpiece 100 You can also. Further, the type, number, shape, structure, size, arrangement, and the like of the devices 104 are not limited. Furthermore, on the surface 102 of the substrate 101 of the workpiece 100, a low dielectric constant insulator film also referred to as a low-k layer as a functional layer is laminated, and the low dielectric constant insulator film supports the circuit constituting the device 104. It is good also as composition.

  Next, the processing device 2 according to the embodiment will be described. As shown in FIG. 1, the processing device 2 is placed on the θ table 10, the table base 20 disposed above the θ table 10, and the mounting surface of the table base 20 and is detachably fixed. The chuck table 30 suction-holds the workpiece 100 on the holding surface 33 of the upper surface, and the processing unit 40 cutting the workpiece 100 held by the chuck table 30.

  The θ-table 10 is provided with a rotational drive source (not shown) such as a motor, and rotates the table base 20 and the chuck table 30 disposed above about a rotational axis substantially parallel to the Z-axis direction which is a cutting feed direction. .

  The table base 20 is formed of a conductor such as metal, and is disposed on an outer peripheral portion of the main body 21 for mounting, supporting and fixing the chuck table 30, and holds the frame 107. And a clamp 22 which is four frame holding parts to be fixed. The main body portion 21 has a flat mounting surface on which the chuck table 30 is mounted and supported.

  The clamp 22 is provided so as to be movable in the radial direction with respect to the main body portion 21, and the size in the radial direction of the chuck table 30 can be replaced and used depending on the size of the workpiece 100 and the frame 107 in the radial direction. It moves appropriately and is used on the basis of Further, at a position close to the chuck table 30, a transport mechanism (not shown) for transporting the workpiece 100 to the chuck table 30 is provided.

  The chuck table 30 includes a suction unit 31 forming a flat holding surface 33 on the upper surface, and a table main body 32 forming a flat rear surface. The suction unit 31 is provided on the upper surface of the table main body 32. The suction unit 31 is made of porous ceramics or the like provided with a large number of porous holes, and suction-holds the workpiece 100 through the dicing tape 106 across the entire holding surface 33.

  The back surface 34 of the table main body 32 is mounted on the mounting surface of the table base 20 and the chuck table 30 is mounted on the table base 20. The chuck table 30 is fixed to the table base 20 by suctioning and holding the back surface 34 of the table base 20 in close contact with the mounting surface by negative pressure from a suction source (not shown). . In addition, the chuck table 30 sucks and holds the workpiece 100 on the holding surface 33 via the dicing tape 106.

  The processing device 2 includes, as a processing unit 40, a first processing unit 40A and a second processing unit 40B. The first processing unit 40A and the second processing unit 40B are provided to sandwich the chuck table 30 in the Y-axis direction. In the present embodiment, two processing units 40 are provided as described above. However, the present invention is not limited thereto, and only one or three or more processing units may be provided.

  The processing apparatus 2 includes an X-axis moving mechanism 12 which moves the θ table 10 on which the table base 20 and the chuck table 30 are disposed upward along the X-axis direction. The X-axis moving mechanism 12 moves the table base 20 and the chuck table 30 relative to the processing unit 40 along the X-axis direction which is the processing feed direction.

  The processing apparatus 2 includes a Y-axis moving mechanism 14 that moves each processing unit 40 along the Y-axis direction. The Y-axis moving mechanism 14 moves the table base 20 and the chuck table 30 relative to the processing unit 40 along the Y-axis direction which is the indexing feed direction.

  The processing apparatus 2 includes a Z-axis moving mechanism 16 that moves each processing unit 40 along the Z-axis direction. The Z-axis moving mechanism 16 moves the table base 20 and the chuck table 30 relative to the processing unit 40 along the Z-axis direction which is a cutting feed direction.

  At a position adjacent to the processing unit 40, a camera 42, which is an imaging unit for imaging the workpiece 100, is provided. The camera 42 moves together with the processing unit 40, is indexed and fed by the Y-axis moving mechanism 14, and is cut and fed by the Z-axis moving mechanism 16.

  As shown in FIG. 1, the processing unit 40 has a cutting blade 50 having an annular cutting edge at its outer peripheral edge, mounted on one end side of a spindle having a rotation axis substantially parallel to the holding surface 33 of the chuck table 30. And cutting the workpiece 100 held by the chuck table 30. The rotational axis of the spindle is generally perpendicular to the X and Z axis directions and generally parallel to the Y axis direction. A rotating drive source (not shown) such as a motor is connected to the other end side of the spindle, and the cutting blade 50 is rotated by the torque of the rotating drive source transmitted through the spindle. By the rotational movement of the cutting blade 50, a cutting groove is formed on the workpiece 100 along the planned dividing line 103, and the cutting groove is singulated into each device 104.

  The processing unit 40 will be described in more detail below. FIG. 2 is a schematic view of a processing unit according to the present embodiment. As shown in FIG. 2, the processing unit 40 includes a cutting blade 50, a spindle 52, a blade cover 54, a connection pipe 55, a supply nozzle 56, and a plurality of supply nozzles 58. The configuration of the processing unit 40 of FIG. 2 is applied to both the first processing unit 40A and the second processing unit 40B.

  The cutting blade 50 is attached to the tip of the spindle 52 by a fixing nut that holds the cutting blade 50 together with a mounting flange (not shown). The cutting blade 50 is rotationally driven by the spindle 52 to cut the workpiece 100. The axial centers of the cutting blade 50 and the spindle 52 are set parallel to the Y-axis direction.

  The cutting blade 50 is a so-called hub blade, and is fixed to the outer periphery of a disk-shaped base formed of metal (for example, aluminum), and includes an annular cutting blade for cutting the workpiece 100. The cutting blade is made of abrasive grains such as diamond and CBN (Cubic Boron Nitride), and a bonding material (bonding material) containing metal, resin and the like, and formed to a predetermined thickness. In addition, you may use the washer blade comprised only with the cutting blade as a cutting blade.

  The blade cover 54 is a cover that covers the outer peripheral portion of the cutting blade 50. The connection pipe 55 is provided on the blade cover 54. In the present embodiment, four connection pipes 55 a, 55 b, 55 c, 55 d are provided as the connection pipe 55. However, the number of connection pipes 55 is not limited to four and is arbitrary.

  The two connection pipes 55a and 55b erected along the Y-axis direction are provided on both sides of the cutting blade 50, and are connected to a pair of supply nozzles 56 (the cooling nozzles on the opposite side are not shown). The supply nozzle 56 jets the liquid to the side surface of the cutting blade 50. That is, the supply nozzle 56 is provided on the + Y axial direction side and the −Y axial direction side of the cutting blade 50, and the surface (side surface) on the + Y axial direction side of the cutting blade 50 and the surface (side surface) on the −Y axial direction side And inject the liquid. The liquid jetted by the supply nozzle 56 may be a coolant or a cutting fluid.

  A plurality of supply nozzles 58 are connected to the connection pipes 55c and 55d. The supply nozzle 58 is provided at its tip end with an injection port 59 which is an opening for injecting a liquid. The supply nozzle 58 is provided on the X-axis direction side of the cutting blade 50, and the injection port 59 faces the outer periphery 50 a of the cutting blade 50. The supply nozzle 58 jets the liquid from the jet port 59 toward the outer periphery 50 a of the cutting blade 50. The liquid jetted by the supply nozzle 56 may be a coolant or a cutting fluid.

  The supply nozzles 58 are disposed at different positions with respect to the cutting blade 50 to eject liquid to different positions on the outer periphery 50 a of the cutting blade 50. In the present embodiment, supply nozzles 58a, 58b and 58c are provided as the supply nozzles 58. The supply nozzles 58a, 58b, 58c are installed at different positions with respect to the cutting blade 50. The supply nozzles 58a, 58b, 58c are aligned in the Z-axis direction in the present embodiment. The supply nozzle 58 a is installed so that the injection port 59 faces the 3 o'clock position of the outer periphery 50 a of the cutting blade 50 when viewed in the Y-axis direction. The supply nozzle 58 b is installed such that the injection port 59 faces the 4 o'clock position of the outer periphery 50 a of the cutting blade 50 when viewed in the Y-axis direction. The supply nozzle 58 c is installed such that the injection port 59 faces the position of 5 o'clock of the outer periphery 50 a of the cutting blade 50 when viewed from the Y-axis direction.

  In addition, it can be said that the supply nozzles 58a, 58b, 58c have different angles with respect to the cutting blade 50. That is, an angle between the central axis AXa of the supply nozzle 58a and a tangent Ba at a position where the injection port 59 of the outer periphery 50a of the cutting blade 50 is opposite is an angle θa. Further, an angle between the central axis AXb of the supply nozzle 58b and a tangent Bb at a position where the injection port 59 of the outer periphery 50a of the cutting blade 50 opposes is defined as an angle θb. In addition, an angle between the central axis AXc of the supply nozzle 58b and a tangent Bc of a portion where the injection port 59 of the outer periphery 50a of the cutting blade 50 faces is defined as an angle θc. In this case, the angles θa, θb, and θc are different from one another.

  The supply nozzles 58a, 58b, and 58c are not limited to being provided at the above-described positions as long as the positions with respect to the cutting blade 50 are set to be different from each other. Further, the number of supply nozzles 58 is not limited to three, and may be any number as long as it is plural.

  At the time of cutting of the workpiece 100, the cutting blade 50 is rotated at high speed (for example, 30000 rpm) while spraying the liquid from the supply nozzles 56 and 58. In this state, the workpiece 100 is cut by processing feed of the chuck table 30.

  As shown in FIG. 1, the processing device 2 includes a control device 70 that controls the processing device 2. The controller 70 controls the supply of the liquid by the supply nozzle 58, and selects the supply nozzle 58 for supplying the liquid from the plurality of supply nozzles 58. That is, the control device 70 supplies the liquid to a part of the plurality of supply nozzles 58. Further, the control device 70 may supply the liquid to all of the plurality of supply nozzles 58.

  FIG. 3 is a block diagram of a control device according to the present embodiment. The control device 70 in the present embodiment is, for example, a computer, and as shown in FIG. 3, includes an input unit 72, an output unit 74, a storage unit 76, and a control unit 78. The input unit 72 is an input device that receives an operation of a worker. The output unit 74 is a display device that displays control content of the control unit 78 and the like. The storage unit 76 is a memory for storing operation contents of the control unit 78 and information of a program, and, for example, a RAM (Random Access Memory), a main storage device such as a ROM (Read Only Memory), and an HDD (Hard). And at least one external storage device such as a disk drive). The control unit 78 is an arithmetic device, that is, a CPU (Central Processing Unit).

  The control device 70 inputs selection information, which is information on which supply nozzle 58 the operator uses to supply the liquid, to the input unit 72 of the control device 70, for example. When the input unit 72 receives the selection information, the control unit 78 causes the liquid to be supplied from the supply nozzle 58 of the plurality of supply nozzles 58 that is supplied with the liquid in the selection information. Thus, the processing apparatus 2 can switch the supply nozzle 58 for supplying the liquid for each processing step without replacing the supply nozzle 58, and can appropriately supply the liquid to the processing unit for each process. .

  FIG. 4 is a view showing an example of a screen for setting a supply nozzle for supplying a liquid. As shown in FIG. 4, the control device 70 causes the output unit 74 to display the setting image P. The setting image P is a screen for setting a supply nozzle for supplying a liquid. In the example of FIG. 4, the setting image P is to set the supply nozzle 58 for supplying the liquid for each of the first channel, ie, the first processing unit 40A, and the second channel, ie, the second processing unit 40B. It has become. In the example of FIG. 4, in the setting image P, conditions Z1 and Z2 which are a plurality of conditions can be set in the first channel and the second channel. In each of the conditions Z1 and Z2, the image P1 for setting whether to supply the liquid for each supply nozzle 58 at 3 o'clock (supply nozzle 58a), 4 o'clock (supply nozzle 58b) and 5 o'clock (supply nozzle 58c) is included. It is done. For example, when the operator selects the image P1, it is set which supply nozzle 58 is to supply the liquid for each condition in the first channel and the second channel.

  In the example of FIG. 4, in condition Z1 of the first channel (first processing unit 40A), the liquid is set to be supplied from the supply nozzle 58 at 3 o'clock (supply nozzle 58a) and 4 o'clock (supply nozzle 58b) In condition Z2 of the first channel, the liquid is supplied from the supply nozzle 58 at 4 o'clock (supply nozzle 58b). Further, in the example of FIG. 4, in condition Z1 of the second channel (the second processing unit 40B), the liquid is set to be supplied from the supply nozzle 58 at 4 o'clock (supply nozzle 58b). Under the condition Z2, the liquid is supplied from the supply nozzle 58 at 4 o'clock (supply nozzle 58b) and 5 o'clock (supply nozzle 58c). The processing apparatus 2 can switch the supply nozzle 58 which supplies the liquid for each processing step, for example, by switching the conditions Z1 and Z2 for each processing step. By displaying the setting image P in this manner, the control device 70 enables the operator to easily set the supply nozzle 58 that supplies the liquid for each processing step.

  As described above, the processing apparatus 2 according to the present embodiment supplies the cutting blade 50 for cutting the workpiece 100 and a plurality of supply nozzles 58 that supply the liquid to the cutting blade 50 and the positions with respect to the cutting blade 50 are different from each other. And. The processing apparatus 2 according to the present embodiment can switch the supply nozzle 58 that supplies the liquid for each processing step, and can supply the liquid to an appropriate position for each processing step. Further, it is possible to switch the supply nozzle 58 for supplying the liquid for each processing step without replacing the supply nozzle 58. Therefore, the processing apparatus 2 according to the present embodiment can appropriately supply the liquid to the processing tool for each process.

  Further, the supply nozzle 58 supplies the liquid to the outer periphery 50 a of the cutting blade 50 with the injection port 59 for ejecting the liquid facing the outer periphery 50 a of the cutting blade 50. According to the processing apparatus 2 according to the present embodiment, the liquid can be appropriately supplied to the processing tool for each process.

  The processing apparatus 2 according to the present embodiment includes a first processing unit 40A including a cutting blade 50 and a plurality of supply nozzles 58, and a second processing unit 40B including a cutting blade 50 and a plurality of supply nozzles 58. Have. By providing processing units for a plurality of channels in this manner, it is possible to appropriately supply liquid to the processing tool for each process.

  Further, the processing device 2 according to the present embodiment further includes a control unit 78 that controls the supply of the liquid by the supply nozzle 58. The control unit 78 selects a supply nozzle 58 for supplying liquid from the plurality of supply nozzles 58. According to the processing apparatus 2 according to the present embodiment, the liquid can be appropriately supplied to the processing tool for each process.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention.

Reference Signs List 2 processing apparatus 40 processing unit 50 cutting blade 52 spindle 58 supply nozzle 70 control device 78 control unit 100 workpiece

Claims (4)

A cutting blade for cutting a workpiece;
A plurality of supply nozzles for supplying liquid to the cutting blade and having different positions with respect to the cutting blade;
And processing equipment.   2. The processing apparatus according to claim 1, wherein the supply nozzle supplies the liquid to the outer periphery of the cutting blade such that an injection port for ejecting the liquid faces the outer periphery of the cutting blade. A first processing unit comprising the cutting blade and a plurality of the supply nozzles;
The processing apparatus according to claim 1, further comprising: a second processing unit including the cutting blade and the plurality of supply nozzles. It further comprises a control unit that controls the supply of liquid by the supply nozzle,
The processing apparatus according to any one of claims 1 to 3, wherein the control unit selects the supply nozzle that supplies the liquid from the plurality of supply nozzles.

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