JP3213402B2 - Coating device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for applying a coating agent in a syringe on a printed circuit board through a nozzle provided below the syringe.

[0002]

2. Description of the Related Art An example of this kind of prior art is disclosed in Japanese Patent Application Laid-Open No. 3-29391 filed earlier by the present applicant. In this method, a heater is embedded in a nozzle holder holding a nozzle, and the coating agent in the nozzle is always set at an appropriate temperature by heat conduction.

In recent years, the amount of application and the number of application points for one component have also increased in accordance with various chip component sizes, and in order to cope with this, various types of nozzles have been prepared, and the ejection diameter and ejection section are different. It became necessary to replace it with a nozzle. Therefore, the present applicant has devised a method in which the nozzle is divided into a nozzle body and a nozzle tip, and the nozzle can be replaced with a desired nozzle tip according to application conditions.

However, in this case, since the nozzle body and the nozzle tip are separable, they are not integrated, so that the thermal conductivity is reduced and the coating agent at the nozzle tip does not sufficiently warm. .

[0005]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to sufficiently transmit heat to the tip of a nozzle and to maintain the coating agent at the tip at an appropriate temperature.

[0006]

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a coating apparatus for coating a coating agent in a syringe on a printed circuit board via a nozzle provided below the syringe. And a nozzle holder for fixing the nozzle to the vertical mechanism. The nozzle is detachably attached to a nozzle body at a tip end thereof, and the nozzle holder wraps the nozzle body. A heater for holding the coating agent in the nozzle at an appropriate temperature is buried inside the nozzle and is extended at the tip of the nozzle.

[0007]

With the above arrangement, the nozzle held by the nozzle holder in such a manner as to wrap the nozzle body is fixed to an up-and-down mechanism which moves up and down while being guided by a guide by driving of a driving source via the holder. Further, the nozzle holder is extended from a nozzle tip portion detachably attached to the nozzle body, and a coating agent in the nozzle tip portion is warmed by a heater embedded in the nozzle body.

[0008]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 6A shows a printed circuit board on which an adhesive as a coating agent is applied in order to mount a chip component (not shown). The XY movement is performed by an X-axis motor (2) and a Y-axis motor (3). Is placed on the XY table (4).

(5) an adhesive application unit for applying an adhesive to the substrate (1); (6) a nozzle for discharging the adhesive to apply the adhesive on the substrate (1); ) Is a syringe that is connected above the nozzle (6) and stores the adhesive. Compressed air supplied from an air supply source (not shown) is fed into the syringe, and the adhesive is discharged from a discharge portion (6A) of the nozzle (6). Is discharged.

Hereinafter, the coating unit (5) will be described in detail with reference to FIG.

(8) and (9) are a rotor gear as a first holding portion for holding the nozzle (6) and a nozzle holder as a second holding portion, which are inserted in the insertion holes (10) and (11), respectively. Inserted. The rotor gear (8) and the nozzle holder (9) are spaced apart from each other at a predetermined distance from the vertical position by a pair of recesses (12) provided below the rotor gear (8) and a pair of recesses provided above the nozzle holder (9). Recess of the (13)
A bolt (15) is inserted from below through a concave portion of the nozzle holder (9) so as to penetrate the spring (14) through the compression spring (14). When the threaded portion is fitted into the rotor gear (8), the rotor gear (8) and the nozzle holder (9) are urged to separate from each other, but are attached in a regulated state. (16) is a slide bearing. On the rotor gear (8) side, the flange (17) of the nozzle (6) is inserted into the insertion hole (10).
The lower limit position of the nozzle (6) is set by inserting the nozzle (6) until it comes into contact with the bottom surface of the nozzle (6). At this time, the positioning surface (74) of the flange portion (17), which will be described later, is in contact with the protrusion (8A).
Is positioned by abutting on.

The mechanism for fixing the nozzle (6) to the nozzle holder (9) will be described below with reference to FIG.

A nozzle fixing pin (19) is inserted into a groove (18) formed over the entire circumference of the peripheral side surface of the nozzle (6).

Reference numeral (20) denotes an insertion hole formed between the nozzle holder (9) and a spring stopper (21) fixed to the side surface of the holder (9). 22) is inserted until it abuts against one end of the slide bearing (23).

A compression spring (24) is engaged with one end of the spring stopper (21) and a spring flange (22) so that the pin (19) passes therethrough.

(25) is a knob with a knurl.

(30) is a discharge portion (6A) of the nozzle (6)
When the adhesive discharged to the tip is applied to the substrate (1), the stopper pin contacts the substrate (1) to form a predetermined gap between the nozzle (6) and the substrate (1).

Reference numeral (34) denotes a nozzle up-down mechanism for moving the nozzle (6) up and down. Referring to FIG.
Is a fixed base (3) via a ball screw (37) rotated by the drive of a speed-adjustable vertical motor (36).
The upper and lower blocks are guided by a linear guide (not shown) fixed to 8) and moved up and down. (39) is a ball screw nut.

Numeral (27) is a nozzle upper and lower arm (27) which is loosely inserted into a groove (40) formed in the upper and lower blocks (35), respectively. The upper and lower blocks (35) are driven by the upper and lower motors to move up and down. The linear guide (61) (see FIG. 3) attached to the fixed base (38) moves up and down while being guided. The arm (27) has a bearing (2
The nozzle (6) is moved up and down by the up and down movement of the arm (27) because the nozzle (6) is fixed to the rotor gear (8) through (8). The downward movement of the nozzle (6) is detected by each sensor (not shown) corresponding to each nozzle (6). Further, the gear portion (2) on the upper part of the rotor gear (8)
The nozzle (6) is rotated by meshing a gear (not shown) rotated by a rotation mechanism (not shown) in (9).

Reference numeral (41) denotes a slide claw receiver standing upright on the upper and lower blocks (35).

(42) The nozzle upper and lower arm (27)
A spring stopper (44) fixed to one concave portion (43) of the slide claw (41) and the arm (27) by an H-shaped slide claw attached to the upper portion so as to be slidable in the direction of the slide claw receiver (41). , And is biased in the direction of the slide claw receiver (41) by a compression spring (45) interposed therebetween, and the tapered portion (46) of the slide claw receiver (41) is urged.
And the tapered portion (47) of the slide claw (42) are engaged. In addition, the flange (48) of the arm (27) comes into contact with the projection (49) formed on the upper part of the groove (40) of the upper and lower blocks (35) by this engagement.
7) is raised and lowered by the engagement of the slide claw (42) and the slide claw receiver (41) via the above-described tapered portions (46) and (47) and the contact of the flange portion (48) and the protrusion (49). It is so-called integrated with the block (35), and moves up and down together with the up and down movement of the upper and lower blocks (35). With these,
It constitutes a lock mechanism.

The release mechanism (52) for releasing the fixing of the arm (27) and the upper and lower blocks (35) will be described below.

An air cylinder (53) is fixed to a base of a coating apparatus (not shown). A rod (54) has a claw return block (55) formed at the tip thereof. The driving of the air cylinder (53) causes the claw return block (55) to move forward, and the contact portion (56) of the block (55) comes into contact with the contact portion (57) of the slide claw (42). Spring (4
By pushing back the slide claw (42) against the biasing force of 5), the engagement between the slide claw (42) and the slide claw receiver (41) via the tapered portions (46) and (47) and the flange portion (41) are performed. 48) and the projection (49) are released from contact, so that the arm (2) can be moved even if the upper and lower blocks (35) are moved up and down.
7) does not move up and down because it is in a free state with respect to the upper and lower blocks (35). The forward and backward movements of the air cylinder (53) are detected by sensors (58) and (59) shown in FIG. 20, respectively, and the timer corresponding to each cylinder (53) measures the time over of the forward and backward operation. You.

(32) The adhesive application unit (5)
The CCD camera fixed to the upper and lower blocks (35) so as to be located at the center of the four nozzles (6) arranged in parallel with each other applies the adhesive applied to the substrate (1) and the adhesive applied to the substrate (1). A board recognition mark (not shown) is recognized.

Hereinafter, the configuration of the nozzle (6) will be described with reference to FIGS.

The nozzle body (63) has a fitting groove (66) formed in the lower part thereof for fitting the fitting part (65) of the nozzle tip (64), and the flat surface of the flange part (67). Until it contacts the lower part of the nozzle body (63). When the fitting portion (65) and the fitting groove (66) are fitted, a positioning surface (68) formed on the flange portion (67) shown in FIG. 11 is projected from the lower part of the nozzle body (63). Positioning surface (70) formed inside the protruding piece (69)
Angle positioning is performed in such a way as to match Thus, with the nozzle tip (64) fitted in the nozzle body (63), the cap nut (71) is inserted into the nozzle tip (64) through the insertion hole (72) of the cap nut (71). As shown in FIG. 3, nuts are screwed through lower portions of the nozzle body (63) through screw portions (73) formed on the lower side surface. As shown in FIG. 10, a positioning surface (74) is formed on the flange portion (17) of the nozzle body (363).

Here, the nozzle (6) is connected to the rotor gear (8).
And attached to the nozzle holder (9) in the following manner, and will be described with reference to FIGS. 1, 7 and 8.

First, the operator inserts the nozzle (6) into the rotor gear (8) and the nozzle holder (9) with the upper part of the nozzle body (63) as shown in FIG. Then, as shown in FIG. 8, the tip of the nozzle fixing pin (19) slides on the side surface of the nozzle body (63), and the nozzle fixing pin (19) fits in the groove (18) as shown in FIG. It is inserted further until it gets stuck. At this time, the lower end position of the nozzle (6) is set by inserting the nozzle (6) until the flange portion (17) is brought into contact with the bottom portion of the insertion hole (10). Further, as shown in FIG. 3, the positioning is performed by abutting the positioning surface (74) of the flange portion (17) against the projection (8A). The replacement of the syringe (7) when the adhesive in the syringe (7) runs out is performed in the same manner. That is, the nozzle (6) is lifted while pulling the nozzle fixing pin (19), pulled out from the rotor gear (8) and the nozzle holder (9), and the syringe cap (80) is rotated so that the syringe (7) and the syringe cap (80) are rotated. Then, a syringe (7) containing an adhesive (the nozzle (6) is also fixed) is attached to the syringe cap (80), and the nozzle (6) is connected to the rotor gear ( 8) and fixed to the nozzle holder (9).

The nozzle holder (9) also functions as a heater block, and as shown in FIG.
The nozzle holder (9) is fitted by heat conduction.
The heat is transmitted to the nozzle (6) via the nozzle, and the adhesive in the nozzle (6) is maintained at an appropriate temperature. Since the nozzle holder (9) is extended so as to cover the nozzle tip (64) and the nozzle tip (64) is inserted through the insertion hole (9A), only the nozzle body (63) is used. The heat is also transmitted to the nozzle tip (64).

(78) shown in FIG. 12 is an air tube (7).
A heat-radiating copper tube for preventing the temperature inside the syringe (7) from rising due to the air pressure supplied via 9) and curing the adhesive inside the syringe (7), and the syringe cap (80). And an air tube (79).

Reference numeral (81) denotes a rubber seal ring that closes a fitting portion between the syringe cap (80) and the syringe (7) so that air supplied into the syringe (7) does not leak.

(84) receives the substrate (1) conveyed from an upstream device (not shown) and receives the XY table (4).
A supply conveyor (85) is a supply conveyor for supplying the substrate (1) to the table (4), and discharging the substrate (1) on the table (4) after the application of the adhesive is completed to a downstream device.

The substrate positioning mechanism which is a part of the structure of the XY table (4) will be described below with reference to FIGS.

(87A) and (87B) correspond to the supply conveyor (8).
A pair of fixed blocks constituting a board transfer section of an XY table (4) that guides while supporting both side ends of the board (1) that is transferred from 4) to a conveyor (not shown) as shown in FIG. To one fixed block (87
A) is located above the fixing plate (88) having a U-shaped cross section, and the other fixing block (87B) is located on the bottom surface of the fixing plate (88) by a moving mechanism (described later).
Is provided above the movable plate (89) which is moved via the. A part of the fixed block (87) on the movable plate (89) side is constituted by a slide block (90). As shown in FIG. 15, the slide block (90) is provided with a pin (9) set up on a movable plate (89) in an elongated hole (91) formed in the slide block (90).
With the 2) inserted, a compression spring (one end of which is in contact with the slide block (90) from the side and the other end is in contact with an inverted L-shaped mounting piece (93) provided on the side of the movable plate (89). It is movably attached to the movable plate (89) by pressing against the fixed plate (88) side by 94). The slide block (90) is prevented from falling out of the pin (92) by a stopper (not shown).

The side of the slide block (90) swings around a light-shielding plate swinging fulcrum (96) erected on a fulcrum bearing (95) projecting from the side of the movable plate (89). A light blocking plate (97) is abutted as much as possible. The light shielding plate (97) is provided with a compression spring receiver (102) provided at one end thereof so that the contact portion (98) is always in contact with the slide block (90).
It is urged by a compression spring (100) inserted into an insertion hole (99) formed in the side surface of (7).

Reference numeral (101) denotes a substrate positioning sensor composed of a transmission type photosensor, and the light projected from the light projecting portion without the substrate (1) on the XY table (4) is transmitted by the light shielding plate (97). The light is shielded from being received by the light receiving unit.

(103) is a pulse motor of a moving mechanism for moving the movable plate (89).
By the driving of 3), the ball screw (105) supported by the fixed plate (88) rotates via the bearing (104), and the movable plate (88) to which the slider portion (106) is fixed is moved by the linear guide (86). And horizontally moved in the substrate width direction.

In the step (107), a large number of backup pins (108) are pressed against the back surface of the substrate (1) supported by the fixing block (87), for example, the substrate (1) is warped downward. The backup base is also supported horizontally, and is moved up and down by a vertical mechanism (not shown) provided on the bottom surface of the fixed plate (88). In addition, a positioning pin (not shown) for temporary positioning that enters a positioning hole (not shown) formed in the substrate (1) is also provided upright on the base (107).

Reference numeral (110) denotes a substrate detection sensor for detecting that the substrate (1) has passed, and the light projected from the light projecting portion, which is located above the substrate transport level, is reflected by the substrate (1) and reflected therefrom. The light is detected by being received by the light receiving unit.

Reference numeral (111) denotes a substrate stopper which contacts the rear end of the substrate (1) and regulates the return operation of the substrate (1), and is moved up and down by a vertical mechanism (not shown).

In FIG. 20, (115) is a discard timer provided to correspond to each nozzle (6) and measures the non-use time of each nozzle (6). (116) corresponds to each nozzle (6). Is a use timer for measuring the use time of the nozzle (6).

The discarding is a coating operation performed for cleaning the nozzle (6) irrespective of the main coating.

(117) is the C of the adhesive which is provided in correspondence with each nozzle (6) and is test-punched by each nozzle (6).
The application diameter recognized by the CD camera (32) is R
This is a pass counter which is decremented by 1 every time the value falls within the set application range stored in the AM (131). Reference numeral (118) denotes a rejection counter provided corresponding to each nozzle (6) and decremented by one each time the application diameter of the adhesive test-trimmed by each nozzle (6) falls outside the set application range.

Note that the trial hitting is a coating operation performed to recognize the coating diameter irrespective of the main coating operation.

An operation section 120 of FIG. 20 generates various data by operating each key. Screens of a keyboard (121) for setting various data, a cursor instruction key (122), a numeric keypad (123), and a CRT (124). Select key (12
5), an automatic key (126) for setting the coating apparatus to the automatic operation mode, and a manual key (12) for setting the coating apparatus to the manual mode.
7) A start key (128), an operation key (129), and a stop key (130).

Reference numeral 131 denotes a RAM as a storage device for storing NC data (see FIG. 21) and coating condition data (see FIG. 22) relating to the coating operation.

(132) is a ROM as a storage device for storing a program relating to the coating operation.

(133) is a CPU as a control device for performing general control of the coating device.

(134) is an interface.

A drive circuit (135) is an X-axis motor (2), a Y-axis motor (3), a CCD camera (32), a vertical motor (36), an air cylinder (53), and a sensor (5).
8), (59), heater (76), substrate positioning sensor (101), pulse motor (103), substrate detection sensor (110), discard timer (115), use timer (1)
16), pass counter (117), reject counter (1
18) are connected.

The operation will be described below.

First, when the operation of the coating apparatus is started, the XY table (4) is raised to the substrate (1) transfer level (the height origin position detected by a sensor (not shown)) as shown in FIG. . At this time, the positioning mechanism is in an open state (the substrate transport section is wider than the substrate width so that the transported substrate (1) can enter).

Next, the substrate (1) is transported from the supply conveyor (84) onto the XY table (4) via the conveyor, and the passage of the substrate (1) is detected by the substrate detection sensor (110). Then, the conveyor supply conveyor (84)
In addition, the drive of the conveyer is stopped, and the substrate stopper (1
11) is lowered by the vertical mechanism. The stopper (11
After lowering 1), the conveyor is driven to rotate in the reverse direction, the rear end of the substrate (1) is regulated by the stopper (111), and its movement stops. At this time, the substrate (1) is
A timer (not shown) is set to have a sufficient time for contact with 1), and after the timer expires, the reverse rotation drive of the conveyor is stopped. The presence of the substrate (1) is detected by the substrate detection sensor (110).

The substrate stopper (111) is raised, and XY
The substrate transport section of the table (4) is lowered by the vertical mechanism. At this time, the substrate (1) is backed up by the backup pins (108) on the backup base (107), and the positioning pins enter the positioning holes to perform temporary positioning of the substrate (1). After the table (4) is lowered to a predetermined lower limit position, a substrate positioning process (final positioning) is performed. That is, the pulse motor (103)
Is driven by a designated number of pulses, and the ball screw (105) is rotated by this drive, guided by the linear guide (86), and the movable plate (89) is moved in a direction to narrow the space between the fixed blocks (87). At this time, the movable plate (89)
As a result, the fixed block (87) and the slide block (90) on the movable plate (89) are moved together, but as shown in FIG. 15, the slide block (90) supporting the substrate (1) is ) Restricts the movement, so that only the fixed block (87) is moved from a certain position. The fixed block (87) continues to move with respect to the slide block (90) whose movement is restricted at a certain position as shown in FIGS. 15 to 17 and further, FIGS. The light shielding plate (97) in contact with the side surface of the light shielding plate swinging fulcrum (96)
Is rotated clockwise with the fulcrum as a fulcrum, and as shown in FIG. 19, the light of the substrate positioning sensor (101) whose light is shielded by the light shielding plate (97) is transmitted therethrough.
U (133) judges that the positioning of the substrate (1) has been completed, and the CPU (133) starts the coating operation after recognizing the substrate positioning mark attached to the substrate (1) by the CCD camera (32). I do.

If it is detected by the sensor (101) that positioning cannot be performed (the presence of a substrate is not detected), the CPU (133) determines that the positioning is abnormal as shown in FIG. Drive to open the positioning mechanism.

At the start of operation, the non-use time indicated by the time (TIME) of the discard data (WASTE DISPENSE DATA) shown in FIG. 23 which is normally set in the discard timer (115) of each nozzle (6) is increased. Since it has not been performed, the application operation is started as it is.

The coating operation is performed based on the NC data related to the coating operation shown in FIG. That is, step 00
01 indicates a substrate (1) indicated by X coordinate data or Y coordinate data
The adhesive is applied to the upper coordinate position (X1, Y1) under the application condition indicated by the application condition data shown in FIG. That is, D (application condition data number) of the NC data in FIG.
The nozzle (6) having the nozzle number 2 based on the nozzle number (NOZZLE) 2, the gauge (GAUGE) 1, and the ejection time (TIME) T1 set to 001 corresponding to the application condition data in FIG. The compressed air is supplied from the supply source to the syringe (7) via the air tube (79) through the air tube (79) for the discharge time T1 to discharge a predetermined amount of the adhesive from the nozzle (6). Coating on substrate (1). Therefore, since the nozzle (6) of the nozzle number 2 (the second nozzle (6) from the left in FIG. 2) is designated based on the application condition data shown in FIG. 22, the application operation is started via the nozzle (6). I do. The coating operation will be described with reference to FIG. FIG. 2 shows a state in which only the used nozzle (6) (second from left) can be moved up and down, and other nozzles (6) (only the leftmost nozzle is shown) are not moved up and down. Is shown. That is, the slide claw (42) is moved toward the slide claw receiver (41) by the urging force of the compression spring (45), and the slide claw receiver (41) is moved.
The slide claw (42) and the slide claw receiver (41) are engaged with each other via the tapered portion (46) and the tapered portion (47) of the slide claw (42). As a result, the flange portion (48) of the nozzle upper / lower arm (27) is connected to the upper and lower blocks (3
Since the arm (27) comes into contact with the convex portion (49) formed on the upper portion of the groove (40) of (5), the arm (27) has the above-mentioned tapered portion (4).
6) A form in which the slide pawl (42) and the slide pawl receiver (41) are engaged via the (47), and the flange (48) and the convex part (49) abut on the upper and lower blocks (35). So-called integration. Accordingly, as the upper and lower blocks (35) are moved downward by the rotation of the ball screw (37) driven by the vertical motor (36), they are guided by the linear guide (61) shown in FIG. Then, as shown in FIG. 4, the stopper pin (30) of the nozzle tip (64) comes into contact with the substrate (1), and as shown in FIG. 5, the adhesive is applied to the substrate (1) while being pushed further. During the above-mentioned pushing operation, the compression spring (14) has a sufficient force to apply the adhesive, and is overloaded (for example, the tip of the stopper pin (30) is bent or the substrate (1) is broken). The nozzle (6) is lifted while sliding on the inner surface of the rotor gear (8) so as not to cover. The lowering of the nozzle (6) is detected by a sensor, and when the lowering of the nozzle (6) is not detected by the sensor, the CPU (133) stops the application device. Further, the device may be stopped and the operator may be notified by a notifying device (not shown).

The other nozzles (6) which are not used have the lock mechanism releasing the nozzle (6) and the upper and lower blocks (35) from being released by the release mechanism (52). The description will be made based on the first nozzle (6) from the left. The first air cylinder (53) from the left is pushed out (at the same time, a timer is counted). The claw return block (55) advances through the rod (54), and the contact portion ( 56) and the contact portion (57) of the slide claw (42) are brought into contact with each other, and the slide claw (42) is pressed against the urging force of the compression spring (45) by a further pushing operation, so that the slide claw receiver (4) is pressed.
Slide claw receiver (4) moved away from 1)
1) is disengaged (the pushing operation by the air cylinder (53) is detected by the sensor (58), and C
The PU (133) stops the timer after receiving the detection signal. ). Thereby, the flange portion (48) of the nozzle upper and lower arms (27) and the upper and lower blocks (35)
Since the contact with the convex portion (49) formed on the upper part of the groove (40) is released, the arm (27) and the upper and lower blocks (3) are released.
Integration with 5) is also released. Therefore, the vertical motor (3
Even if the upper and lower blocks (35) are lowered by the rotation of the ball screw (37) driven by 6), the nozzle upper and lower arms (27) are not lowered and the nozzle (6) is not lowered.
Note that the air cylinder (5
When the push-out operation of 3) is not completed, or when the lowering of the unused nozzle (6) is detected by the sensor, the application device is stopped. In addition, the device may be stopped, and the operator may be notified by a notifying device (not shown).

Next, in step 0002, the inside of the syringe (7) is pressurized at the coordinate position (X2, Y2) on the substrate (1) by the pressure of the gauge 2 to the nozzle (6) of the nozzle number 1 for the discharge time T2. Then, the discharged adhesive is applied.
At this time, the leftmost nozzle (6) and the upper and lower blocks (3
5) is fixed by a lock mechanism, and the above-mentioned step 00 is fixed.
The fixing between the nozzle (6) used in step 01 and the upper and lower blocks (35) is released. That is, as shown in FIG. 28, when the upper and lower blocks (35) are at the height origin position detected by the sensor, the leftmost air cylinder (53) is retracted (at the same time, a timer is counted). 54), the claw return block (55) is retracted, and the contact between the contact portion (56) of the block (55) and the contact portion (57) of the slide claw (42) is released. Slide claws (4
2) is moved toward the slide claw receiver (41) by the urging force of the compression spring (45), and the tapered portion (46) of the slide claw receiver (41) and the tapered portion (47) of the slide claw (42).
Slide claw (42) and slide claw receiver (41)
(The retraction operation by the air cylinder (53) is detected by the sensor (59) and the CPU (13
3) Stops the timer after receiving the detection signal. ). As a result, the flange portion (48) of the nozzle upper and lower arm (27) comes into contact with the convex portion (49) formed above the groove (40) of the upper and lower block (35). The upper and lower blocks (35) are engaged by the engagement of the slide claw (42) and the slide claw receiver (41) via the tapered portions (46) and (47) and the abutment of the flange (48) and the protrusion (49). The ball screw (3) driven by the vertical motor (36)
As the upper and lower blocks (35) are moved down by the rotation of (7), the nozzle (6) is lowered via the arm (27) to apply the adhesive onto the substrate (1) (this descent). The movement is detected by the sensor.) If the retracting operation of the air cylinder (53) is not completed within a predetermined time by the timer, or if the lowering of the nozzle (6) is not detected by the sensor, the apparatus is stopped. In addition, the device may be stopped, and the operator may be notified by a notifying device (not shown). Then, the aforementioned step 00
In order to fix the nozzle (6) and the upper and lower blocks (35) used in step 01 by the lock mechanism, the second air cylinder (53) from the left is pushed out in the same manner as described in step 0001 (the timer is simultaneously measured). The claw return block (55) moves forward through the rod (54), and the contact portion (56) of the block (55) and the slide claw (4) are moved forward.
The slide claw (42) is moved in a direction away from the slide claw receiver (41) against the urging force of the compression spring (45) by the further pushing operation by the contact portion (57) of (2) being abutted. The engagement with the slide claw receiver (41) is released (the pushing operation by the air cylinder (53) is performed by the sensor (5)
8), the CPU (133) stops the timer after receiving the detection signal. ), A convex portion (4) formed on the flange portion (48) of the nozzle upper and lower arm (27) and the groove (40) of the upper and lower block (35).
The contact with the arm (27) and the upper and lower blocks (35) is released because the contact with the nozzle (6) is released.
Does not descend. If the pushing operation of the air cylinder (53) is not completed within a predetermined time by the timer, or if the lowering of the unused nozzle (6) is detected by the sensor, the apparatus is stopped. In addition, the device may be stopped, and the operator may be notified by a notifying device (not shown).

Further, when the substrate (1) falls due to some cause during the automatic operation (for example, a crack or vibration of the substrate (1)), it is detected by the substrate positioning sensor (101). That is, the light blocking plate (97) in the state of FIG. 19 falls on the slide block (9) whose forward movement is restricted by the substrate (1).
0) moves forward while being urged by the compression spring (94), so that the light shielding plate (97) is rotated counterclockwise as shown in FIG. 17 and FIG. Therefore, as shown in FIG. 15, the light shielding plate (97) shields the light emitted from the light emitting portion of the substrate positioning sensor (101), so that the CPU (133) determines that the substrate (1) has fallen, Stop. Further, the device may be stopped and the operator may be notified by a notifying device (not shown).

Next, the replacement operation of the nozzle (6) will be described with reference to FIGS. 3 and 9 to 12. This nozzle replacement is performed, for example, because the device has a different discharge diameter and the discharge unit (6
Although four nozzles (6) having different numbers of A) are provided, another nozzle (6) may be provided by switching the type of the substrate (1).
Or when the nozzle (6) in which the adhesive is clogged is replaced with a non-clogged nozzle (6).

First, with the worker pulling out the nozzle (6) from the rotor gear (8) and the nozzle holder (9), the cap nut (71) is rotated as shown in FIG. 64), the fitting portion (65) of the nozzle tip (64) and the nozzle body (6) are removed.
3) The fitting with the fitting groove (66) is released. And
A desired nozzle tip portion (64) is fitted to the fitting groove (66) until the flat surface of the flange portion (67) comes into contact with the lower portion of the nozzle body (63). The positioning surface (68) formed on the flange portion (67) shown in FIG. 11 at the time of fitting of the positioning surface (70) formed on the inside of a protruding piece (69) protruding from the lower part of the nozzle body (63). Insert while performing angular positioning to match Thus, with the nozzle tip (64) fitted in the nozzle body (63), the cap nut (71) is inserted into the nozzle tip (64) through the insertion hole (72) of the cap nut (71). As shown in FIG. 3, nuts are screwed through lower portions of the nozzle body (63) through screw portions (73) formed on the lower side surface.

A heater (76) is fitted into the nozzle holder (9) as shown in FIG. 1, and heat is transmitted to the nozzle (6) through the nozzle holder (9) by heat conduction. The adhesive in the nozzle (6) is maintained at an appropriate temperature by a temperature control device (not shown) for the heater (76). Further, since the nozzle holder (9) is set to cover the nozzle tip (64), heat is transmitted not only to the nozzle body (63) but also to the nozzle tip (64).

Further, even if the temperature in the syringe (7) rises due to the air pressure supplied through the air tube (79) applied to the syringe (7) while the coating operation is continued, the heat is radiated. To dissipate heat with the copper tube (78)
The adhesive in the syringe (7) is prevented from hardening.

Hereinafter, the discard operation will be described.

If the nozzle (6) to be used this time is, for example, the nozzle (6) of the nozzle number 2, as shown in FIG. 23, the non-use time (TIME) 30 [SEC] ( (Seconds), the discarding is performed twice based on the number of discards (WASTE) twice before the main coating operation. At this time, the XY table (4) is moved by driving the X-axis motor (2) and the Y-axis motor (3),
The margin on the substrate (1) is positioned below the nozzle (6), and the adhesive in the syringe (7) is discharged to the tip of the nozzle (6) by the air supplied through the air tube (79). In this state, the nozzle (6) is moved down to scrape the adhesive into the margin on the substrate (1).

The nozzle (6) of another nozzle number is similarly discarded.

Next, the application operation is performed sequentially, and the operation of recognizing the application diameter of the nozzle (6) will be described below.

When the main coating operation is performed based on each step, and the nozzle (6) to be used next is, for example, the nozzle (6) of the nozzle number 2, the usage time is set as shown in FIG. 1000 [S] of time (TIME)
EC] (seconds), a trial shot is performed before the main coating operation. At this time, the XY table (4) is moved by driving the X-axis motor (2) and the Y-axis motor (3),
The margin on the substrate (1) is positioned below the nozzle (6), and the adhesive in the syringe (7) is discharged to the tip of the nozzle (6) by the air supplied through the air tube (79). In this state, the nozzle (6) is lowered and the adhesive is tested.

The XY table (4) is moved so that the CCD camera (32) is located above the margin of the substrate (1) on which the adhesive has been tested.

Then, this test-struck adhesive is applied to CC
It is recognized by the D camera (32). CP based on this imaging result
A calculator (not shown) in U (133) determines the diameter of the adhesive. The CPU (133) compares the diameter with the setting data (including the allowable range) stored in the RAM (131) by a comparing device (not shown) and compares the diameter with the setting data (including the allowable range). It is determined whether or not.
Here, the content of the pass counter (117) is decremented by 1 if the pass is judged by the judging device, and the content of the reject counter (118) is decremented by 1 if judged as reject.

Hereinafter, a case where the above-mentioned judgment result is a pass will be described. The nozzle (6) of the nozzle number 2 is set to pass (OK) twice as shown in FIG.
A trial shot is performed again. Then, if the above operation is repeated and the test is passed, the content of the pass counter (117) becomes "0", and the main application operation is started. If the second pass is determined to be rejected, the pass counter (11
7) is cleared and the rejection counter (1
After subtracting 1 from the content of 18), the application amount is adjusted, the test is performed again, and such an operation is repeated twice consecutively until the test is successful.

In the re-recognition operation after the rejection is judged, the content of the rejection number counter (118) is set as shown in FIG.
Can be continuously performed until the number of times set for re-recognition (RETRY) shown in (2) (nozzle (6) of nozzle number 2 is twice) is reduced to “0”. If the application diameter does not fall within the set range even if the content of the rejection counter (118) becomes "0", the apparatus is stopped.
Further, the device may be stopped and the operator may be notified by a notifying device (not shown).

The nozzles (6) of the other nozzle numbers are similarly subjected to the test firing.

It is to be noted that the discarding and the trial hitting may be performed not only on the blank portion of the substrate (1) but also by providing a dedicated discarded substrate.

In addition to the non-use time of the present embodiment, the conditions for performing the discarding may include, for example, the use time, the number of times of use, the number of times of non-use, one substrate, or a plurality of substrates. still,
At the start of the operation, it is possible to always perform the discarding or to perform the trial driving.

Further, as conditions for performing the test hitting, in addition to the use time of the present embodiment, for example, the non-use time, the number of times of use, the number of times of non-use, one substrate or every plural substrates can be considered.

At this time, since the CCD camera (32) is arranged at the center of the four nozzles (6) provided, the coating operation is performed by the nozzles (6) and then the camera (32) is positioned below the camera (32) to recognize the coating diameter. When the XY table (4) is moved to position the adhesive applied on the substrate (1), the moving distance of the table (4) can be reduced and the moving time can be saved. Time is also shorter.

Hereinafter, the manual setup change of the board transfer section of the XY table (4) when the model is changed (for example, the size of the board (1) is changed) will be described with reference to FIG. The operator presses the operation key (129) in a state where the substrate (1) to be processed is located at the position of the substrate positioning mechanism of the substrate transport unit. Then, the pulse motor (103) is driven by a command from the CPU (133), and the movable chute (89) is moved in a desired direction. For example, when the substrate (1) to be handled this time is narrower than the preceding substrate (1), the movable chute (89) is moved in a direction in which the distance between the fixed block (87) and the slide block (90) is reduced. Then, as described above, C that receives a signal indicating that the substrate positioning sensor (101) has passed light is received.
The PU (133) is moved by a fixed distance to move the compression spring (10).
In step (0), a command is issued to the pulse motor (103) so that the slide block (90) positions the substrate with an appropriate pressing force, and the pulse motor (103) is driven. Then, the drive of the pulse motor (103) is stopped. Thus, the setup change of the substrate transport unit is completed. The CPU (133) receiving the signal of the sensor (101) changes the pulse motor (103).
Therefore, even if the operator keeps pushing the operation key (129), the motor (103) is not driven and the desired interval is set between the fixed block (87) and the slide block (90). Also, the sensor (101)
Is set to detect a predetermined distance before the point where the slide block (90) reaches the desired interval, and is not a detection critical point at the point where the pulse motor (103) stops. The effect of making the detection unstable due to vibration or the like can be eliminated. Also,
The drive of the pulse motor (103) can be set at either high speed or low speed. For example, if the width adjustment distance is long, high speed can be set, and if fine adjustment is required, low speed can be set.

[0081]

As described above, according to the present invention, even if the nozzle can be separated into the nozzle body and the nozzle tip, heat is sufficiently transmitted to the nozzle tip and the coating agent at the tip is maintained at an appropriate temperature. Can be.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a nozzle fixing mechanism.

FIG. 2 is a diagram showing a vertical mechanism of a nozzle.

FIG. 3 is a view showing a buffer mechanism of a nozzle.

FIG. 4 is a view showing a buffer mechanism of a nozzle.

FIG. 5 is a view showing a buffer mechanism of a nozzle.

FIG. 6 is a front view of a coating apparatus.

FIG. 7 is a view showing a nozzle fixing mechanism.

FIG. 8 is a diagram showing a nozzle fixing mechanism.

FIG. 9 is an exploded view of a nozzle.

FIG. 10 is a view as viewed in the direction of the arrow A in FIG.

FIG. 11 is a view as viewed in the direction of the arrow B in FIG. 9;

FIG. 12 is a view showing a copper tube for heat radiation.

FIG. 13 is a front view of the substrate transport unit.

FIG. 14 is a side view of the substrate transport unit.

FIG. 15 is a plan view of a substrate transport unit.

FIG. 16 is a side view of the substrate transport unit.

FIG. 17 is a plan view of a substrate transport unit.

FIG. 18 is a side view of the substrate transport unit.

FIG. 19 is a plan view of a substrate transport unit.

FIG. 20 is a circuit diagram illustrating a configuration of a coating apparatus.

FIG. 21 shows NC data relating to a coating operation.

FIG. 22 shows NC data relating to a coating operation.

FIG. 23 shows NC data related to a coating operation.

FIG. 24 shows NC data relating to a coating operation.

FIG. 25 is a flowchart related to a substrate positioning operation.

FIG. 26 is a flowchart relating to a substrate positioning operation.

FIG. 27 is a flowchart relating to a substrate positioning operation.

FIG. 28 is a flowchart relating to a substrate positioning operation.

[Explanation of symbols]

 (1) Printed circuit board (4) XY table (6) Nozzle (7) Syringe (8) Rotor gear (9) Nozzle holder (14) Compression spring (19) Nozzle fixing pin (24) Compression spring (27) Nozzle vertical arm ( 32) CCD camera (35) Vertical arm (36) Vertical motor (41) Slide claw receiver (42) Slide claw (45) Compression spring (46) Taper section (47) Taper section (52) Air cylinder (55) Claw return Block (56) Contact part (57) Contact part (63) Nozzle body (64) Nozzle tip (65) Fitting part (66) Fitting groove (71) Cap nut (76) Heater (78) For heat dissipation Copper tube (79) Air tube (80) Syringe cap (84) Supply conveyor (85) Discharge conveyor (87) Fixing block (88) Fixing Mute (89) movable chute (90) slide block (94) compression spring (95) fulcrum bearing (96) shading plate fulcrum (97) shading plate (100) compression spring (101) board positioning sensor (103) pulse motor (133) CPU

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-1-56165 (JP, A) JP-A-1-135561 (JP, A) JP-A-62-296863 (JP, A) JP-A-4- 171887 (JP, A) JP-A-2-184366 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B05C 5/00-5/04 H05K 3/34

Claims (1)

(57) [Claims] An application device for applying an application agent in a syringe through a nozzle provided at a lower portion of the syringe on a printed circuit board. A nozzle holder for fixing the nozzle to an up-and-down mechanism, wherein the nozzle is detachably attached to a nozzle body at a nozzle tip, and the nozzle holder holds the nozzle body in a wrapping manner and is attached to the nozzle tip. A coating device, wherein a heater for maintaining a coating agent in a nozzle at an appropriate temperature is buried therein.