JP3211896U - Metal substrate with LED chip - Google Patents

Abstract

An object of the present invention is to provide a metal substrate with an LED chip having a structure in which the workability of an assembly department such as a subsequent manufacturer is improved and the work load is reduced. An LED metal substrate P having an adjustment plating layer 3 having high luminance and high heat dissipation on both upper and lower surfaces of a core material 1 and an LED chip Q mounted thereon, the metal substrate comprising: Then, an adhesive plating layer 12 of metal plating that becomes an adhesive by melting is formed on the adjustment plating layer, and an adhesion sputtered film 17 is formed on the LED chip by a sputtering apparatus via the epitaxial layer 13 corresponding to the adhesive plating layer. Then, the adhesive plating layer and the adhesive sputtered film are fused to form an adhesive layer 19 by melting between the adjustment plating layer and the epitaxial layer. [Selection] Figure 1

Description

  Since this device is cut out and used for each LED chip in the same manner as a silicon wafer or the like, it relates to a metal substrate for LED, also called a metal wafer, and a metal with an LED chip formed by bonding an LED chip to this. Regarding the substrate.

  In the past, the applicants of the present application have been a core material in which Mo is sandwiched between Cu and Cu while striving for research and development using a plating method for the purpose of an LED metal substrate characterized by high brightness and high heat dissipation. Thus, a metal substrate having both sides of which adjustment plating such as altitude is applied has been manufactured and provided (Patent Document 1). In this specification, this core material is referred to as “DMD”.

  A metal substrate whose core material is DMD is provided to a manufacturer and used extensively. Subsequent manufacturers have finally assembled an LED through a delicate process of assembling an LED chip by bonding. Next, a conventional example will be described together with general circumstances of the industry where the plating department and the assembly department exist independently.

FIG. 2 shows a conventional example, where AuSn is used as the adhesive, and the bonding modes will be described in order.
Stage (a) The plating department and the assembling department are independent, and the plating company (plating department), such as the present applicant, manufactures the metal substrate Pa for LED, which is then used as the LED assembly manufacturer (assembling department). Ship. As shown in the figure, the LED metal substrate Pa has Ni or Ni—Pt alloy base platings 32 and 32 formed on both surfaces of the core material 31, and Au adjustment plating layers 33 and 33 are formed thereon. It was in a state that has been. In other words, this was shipped as a product to an assembly manufacturer without attaching an adhesive on Au.

  The assembly maker prepared the LED chip Qa with the epitaxial layer (epi layer) 35 on the joint surface. However, it is a general company that does not have a plating facility for applying an adhesive (AuSn) or is not familiar with the technology even if it has it. Although the sputtering apparatus is proficient in the regular use, it is impossible to apply plating to the LED chip because it is not a specialist.

Stage (b) Since the assembly department is proficient in sputtering, when the metal substrate Pa is transported, the assembly manufacturer selects AuSn as the adhesive and uses the sputtering device to form the metal substrate Pa. Adhesive sputtered films 37 and 38 of AuSn were formed on the upper surface adjustment plating layer 33 and the shrimp layer 35 of the LED chip Qa. In this case, the stapper films 37 and 38 are both the LED chip and the metal substrate Pa, and this takes a very long time in total.

Stage (c) In the assembly manufacturer, when the sputtered adhesive films 37 and 38 are sputtered as described above, both the sputtered adhesive films are joined and integrally fused. Thus, an AuSn adhesive layer 39 in which both of the adhesive sputtered films are integrated was formed.

JP 2012-109288 A

  Sputtering is a method of applying a film to a substance. Unlike plating, etc., it is a work that uses a sputtering phenomenon in a vacuum without using chemicals, so it takes time and is not suitable for mass production. However, the actual situation is that the shrimp layer must use this method. On the other hand, forming a plating layer on the metal substrate P cannot be formed from technology, equipment, or the like.

  In addition, the plating manufacturer has traditionally left the LED chip to the assembly manufacturer, so the assembly manufacturer has formed a sputtered adhesive film on both the metal substrate and the LED chip by a time-consuming sputtering process. This would put an excessive burden on the assembly manufacturer.

  In view of the above situation, this device is capable of providing a metal substrate in a form suitable for the purpose of reducing the burden on the assembly department of the subsequent manufacturer, etc. Therefore, an object of the present invention is to provide a metal substrate with an LED chip having a structure in which the workability of the subsequent assembly department is improved and the work load is reduced.

  In order to solve the above-described problems, the present invention is directed to a metal substrate for an LED having an adjustment plating layer such as hardness that has high brightness and high heat dissipation on both upper and lower surfaces of a core material, and an LED mounted thereon. The metal substrate is formed with an adhesive plating layer of metal plating that becomes an adhesive by melting on the adjustment plating layer on the adjustment plating layer, and the LED chip is sputtered via an epitaxial layer corresponding to the adhesion plating layer. An LED chip comprising: an adhesive sputtered film formed by melting the adhesive plated layer and the adhesive sputtered film, and an adhesive layer formed by melting is formed between the adjustment plated layer and the epitaxial layer. Provided metal substrate.

  Since the metal substrate with the LED chip is configured as described above, an adhesive plating layer can be easily applied to the metal substrate in a plating department in a plating process accompanying the manufacture of the metal substrate. In addition, by doing so, the assembly department (eg assembly manufacturer) needs to form an adhesion sputtered film as an adhesive on the metal substrate by the sputtering method when bonding the LED chip to the metal substrate that has been sent. Therefore, it is only necessary to form an adhesion sputtered film on the epitaxial layer of the LED chip. As a result of being released from the formation of the stapper film from the metal substrate, the working time is halved and assembly can be started.

  As described above, according to the present invention, the manufacturing department (plating department) of a company's metal substrate only needs to add an adhesive plating layer in the series of plating processes, and the equipment Since there is almost no burden in terms of work and capacity, and the burden of sputtering work can be halved to the assembly department of the next process, metal substrates can be provided as a product that can produce profits. If it is, there exists an outstanding effect that the distribution of the last LED board can be promoted by aiming at process shortening and cost reduction.

It is a figure for demonstrating this invention, Comprising: It is a flowchart explaining the joining procedure of the metal substrate and LED chip which are shown with a layer cross section. In addition, it is a layer sectional view in which the metal species is illustrated in the layer section. It is layer cross-sectional explanatory drawing of the prior art example which shows the flowchart of a different joining example in the joining procedure.

  In this device, in the metal substrate manufacturing department, an adhesive plating layer is formed by a plating facility, and in an assembly department, an adhesive sputtering film is formed by a sputtering device. In some cases, another kind of metal adhesive 19 may be produced. Specifically, the combination metal is the same for AuSn and Sn, Au and AuSn, and the combination metal is different for AuSn and In, Au and In, or the like.

The core material 1 of the metal substrate P is, for example, DMD or CuW, and is one of the following.
DMD: Composite material in which both surfaces of Mo core material are Cu, Cu plating or thin plate CuW: Composite material in which both surfaces of W core material are Cu, Cu plating or thin plate, or alloy of CuW

  FIG. 1 corresponds to FIG. 2 in the description of the conventional example described above, and will be described in stages (a), (b), and (c).

Stage (a) A plating company as a production department produces a metal substrate P by plating equipment. The metal substrate P is such that adjustment plating layers 3 and 3 such as hardness are formed on both surfaces of the core material 1 through the base platings 2 and 2. An AuSn adhesive plating layer 12 is formed on the upper surface of the core material 1. With this adhesive plating layer 12, the metal substrate P is shipped to a subsequent manufacturer.

  On the other hand, a subsequent manufacturer as an assembly department to which the metal substrate P is shipped prepares a Q with LED chip on which the epitaxial layer 13 is formed.

Stage (b) The assembly maker selects AuSn for AuSn in accordance with information informed of the contents of the metal substrate P by the plating maker in advance, and performs sputtering only on the LED chip Q, whereby the adhesive sputtered film 17 Is formed.

Stage (c) In joining (adhesion) at the assembly manufacturer, in order to attach the LED chip Q to the metal substrate P, the metal substrate P is fused with the adhesive plating layer 12 of the metal substrate P and the adhesive sputtered film 17 of the LED chip Q, Thus, the same AuSn adhesive layer 19 is formed in both cases.

  In the metal substrate P, In is formed as the adhesive plating layer 12, and in the LED chip Q, Au is formed as the adhesive sputtered film 17. Then, the adhesive layer 19 is formed as an AuIn alloy.

P Metal substrate Q LED chip 1 Core material 3 Adjustment plating layer 12 Adhesion plating layer 13 Epitaxial layer (epi layer)
17 Adhesive Sputtered Film 19 Adhesive Layer

Claims (3)

  It consists of a metal substrate for LED, which has an adjustment plating layer such as hardness that has high brightness and high heat dissipation on both upper and lower surfaces of the core material, and an LED chip mounted on the metal substrate. An adhesive plating layer of metal plating that becomes an adhesive by melting is formed on the LED chip, and an adhesive sputtering film is formed on the LED chip by a sputtering device through an epitaxial layer corresponding to the adhesion plating layer, A metal substrate with an LED chip, wherein the adhesive sputtered film is fused, and an adhesive layer is formed by melting between the adjustment plating layer and the epitaxial layer.   2. The metal substrate with LED chip according to claim 1, wherein the adhesion plating layer and the adhesion sputtering film are Au or AuSn, respectively. 2. The metal substrate with LED chip according to claim 1, wherein one of the adhesive plating layer and the adhesive sputtered film is Au or an alloy of AuSn, and the other is In.

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