JP3195720B2 - Multicolor LED element, LED display device using the multicolor LED element, and method of manufacturing multicolor LED element - Google Patents

Multicolor LED element, LED display device using the multicolor LED element, and method of manufacturing multicolor LED element

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Publication number
JP3195720B2
JP3195720B2 JP31633294A JP31633294A JP3195720B2 JP 3195720 B2 JP3195720 B2 JP 3195720B2 JP 31633294 A JP31633294 A JP 31633294A JP 31633294 A JP31633294 A JP 31633294A JP 3195720 B2 JP3195720 B2 JP 3195720B2
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Japan
Prior art keywords
semiconductor layer
led
led element
conductive resin
multicolor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP31633294A
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Japanese (ja)
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JPH08172219A (en
Inventor
昌一 鴨下
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シャープ株式会社
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Publication of JPH08172219A publication Critical patent/JPH08172219A/en
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756Stacked arrangements of devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multicolor LED element capable of emitting different colors and an LE using the multicolor LED element.
The present invention relates to a D display device and a method for manufacturing the multicolor LED element.

[0002]

2. Description of the Related Art An example of a conventional multicolor LED device capable of emitting different colors is shown in FIG. This multicolor LED element 40 has n
It has a type semiconductor layer 41 and a p-type semiconductor layer 42 laminated on the n-type semiconductor layer 41. p-type semiconductor layer 42
Has a thin layered portion cut out by dicing or the like, and a thick layered portion.
The n-type semiconductor layer 43 is laminated thinly. A metal electrode 44 is provided on the n-type semiconductor layer 43, and the metal electrode 4 is also provided on a thin layer portion of the p-type semiconductor layer 42.
5 are provided. Further, a metal electrode 46 is also provided on the n-type semiconductor layer 41 on which the p-type semiconductor layer 42 is laminated.

[0003] The multicolor LED element 40 having such a configuration is as follows.
Light of a predetermined color is emitted from the junction between the n-type semiconductor layer 41 and the thin layer portion of the p-type semiconductor layer 42 between the metal electrodes 46 and 45, and the p-type semiconductor between the metal electrodes 46 and 44. Light of different colors is emitted from the junction surface between the layer 42 and the thin n-type semiconductor layer 43.

As described above, the multicolor L in which the n-type semiconductor layer 41, the p-type semiconductor layer 42, and the n-type semiconductor layer 43 are laminated.
The ED element 40 requires complicated processes, such as the need to laminate three semiconductor layers at the crystal level, and the necessity of reducing the thickness of a part of the p-type semiconductor layer 42. There is a problem that it is not easy and the production cost is high. For this reason, at present, it is not used in a dot matrix type LED display device that emits different colors.

At present, for example, a dot matrix type LED display device that emits light of two colors, red light and green light, includes a red LED element that emits red light and a green LE that emits green light.
It is configured using a D element. In the red LED element and the green LED element, the p-type semiconductor layer and the n-type semiconductor layer are stacked and joined, and the p-type semiconductor layer and the n-type semiconductor layer are sandwiched between a pair of electrodes. ing.

FIG. 9 shows such a red LED element and a green LED.
FIG. 2 is a plan view of a dot matrix type LED display device using an ED element. In the LED display device 50, a large number of metal common wirings 52 arranged in parallel are provided on the surface of an insulating substrate 51, and each common wiring 52 is provided in a direction orthogonal to each common wiring 52. A large number of extended wire bonding electrode portions 52a are provided. Each common wiring 52 is provided on the surface of the insulating substrate 51.
Wire bonding electrode sections 52
The island-shaped element mounting electrode portions 53a are respectively arranged close to “a”.

The element mounting electrode portions 53a are arranged in a matrix parallel and perpendicular to the common wirings 52. On the back surface of the insulating substrate 51, a number of metal signal wirings 53 orthogonal to the respective common wirings 52 are provided.
Each of the signal wirings 53 is formed of one of the element mounting electrode portions 53a arranged in a row along the signal wiring 53 on the surface of the insulating substrate 51.
Are electrically connected to each other via through holes.

A red L is provided on each element mounting electrode 53a.
ED element 55 and p-type semiconductor layer of green LED element 56 and n
One of a pair of electrodes sandwiching the mold semiconductor layer is die-bonded with a conductive adhesive 57. Red LED
The elements 55 and the green LED elements 56 are alternately arranged in the horizontal direction.

The other electrode of each of the red LED element 55 and the green LED element 56 is wire-bonded to a wire bonding electrode portion 52a of the adjacent common wiring 52 by a metal wire 58 such as Au and is electrically connected. Have been.

In such a dot matrix type LED display device, a large number of red LED elements 55 and a green LE
D element 56 is die-bonded on each element mounting electrode portion 53a, and each red LED element 55 and green L
The ED element 56 and each element mounting electrode 52a must be wire-bonded with the metal wire 58, and there is a problem that the mounting work is extremely troublesome. In order to make the red LED element 55 and the green LED element 56 mutually insulated, the insulating substrate 51
It is necessary to dispose them at appropriate intervals on the upper surface, and further, a space for wire-bonding each of the red LED element 55 and the green LED element 56 to the wire bonding electrode part 52a, and further, a wire bonding electrode part Since a space for arranging the 52a itself is required, there is a limit in arranging the red LED elements 55 and the green LED elements 56 at a high density to increase the definition of the LED display device.

In order to increase the definition of an LED display device, a red or green single-color LED element as shown in FIG. 10 has been developed. In the red LED element 60a or the green LED element 60b, the p-type semiconductor layer 61 and the n-type semiconductor layer 62 are pn-joined, and the p-type semiconductor layer 61 and the n-type semiconductor layer 62 are respectively thermoset. 64 and 65 made of conductive paste are provided, respectively. p-type semiconductor layer 61 and n-type semiconductor layer 62
Is protected by a thermosetting resin 66.

The red LED element 60a and the green LED element 60b having such a configuration constitute a dot matrix type LED display device 70 shown in FIG. The LED display device 70 includes an element mounting electrode portion 72a of a common wiring 72 provided on a surface of an insulating substrate 71, and an island-shaped element mounting electrode portion disposed close to the element mounting electrode portion 72a. The red LED element 60 is provided between the
a and one of the green LED elements 60b is mounted so as to be alternately arranged in the horizontal direction. The island-shaped element mounting electrode portions 73a are provided on the back surface of the insulating substrate 71.
It is electrically connected via a through hole to a signal wiring 73 arranged orthogonally to the common wiring 72.

In this case, as shown in FIG.
Each pn junction surface of the D element 60a and the green LED element 60b is perpendicular to the insulating substrate 71,
For example, the p-side electrode 64 is connected to the element mounting electrode portion 72a.
The n-side electrode 65 is mounted on the element by the paste-like conductive adhesive 74 or by soldering, while being bonded in a conductive state by the paste-like conductive adhesive 74 or by soldering. Is bonded in a conductive state to the electrode part 73a.

The red LED element 60a and the green LED
Dot matrix type LED using ED element 60b
FIG. 13 shows a display device and another example. In this LED display device, a large number of common wirings 82 are arranged on the surface of an insulating substrate 81 in parallel with each other.
Device mounting electrode portion 82a protruding so as to approach each other
Are provided at appropriate intervals in the longitudinal direction. Further, between each pair of common wirings 82, each element mounting electrode portion 8 extending from each of the common wirings 82.
In the vicinity of 2a, island-shaped element mounting electrode portions 83a are arranged in a line. Each element mounting electrode section 83a is electrically connected to a signal wiring (not shown) provided on the back surface of the insulating substrate 81 in a state orthogonal to each common wiring 82 through a through hole 83b.

A red LED element 60a and a green LED element 60b are provided between each element mounting electrode 83a and each element mounting electrode 82a extending from the pair of common wirings 82.
And are respectively implemented. Red LED element 60
a and the green LED element 60b, for example, the p-side electrode 64 so that the respective pn junction surfaces are in a vertical state.
Is electrically conductively bonded to the element mounting electrode portion 82a by a paste-like conductive resin adhesive, and the n-side electrode 65 is bonded to the element mounting electrode portion 83a by the paste-like conductive resin adhesive. Are bonded in a conductive state.

[0016]

As described above, even when the red LED element 60a and the green LED element 60b mounted so that the pn junction surface is perpendicular to the insulating substrates 71 and 81 are used. When the red LED element 60a and the green LED element 60b are disposed close to each other on the insulating substrates 71 and 81, both the LED elements 60a and 60b
Because there is a risk of contact and leakage,
D elements 60a and 60b need to be arranged at an appropriate distance from each other. As a result, the red LED element 60a
There is a limit in arranging the green LED elements 60b at a high density, and it is not possible to increase the definition of the dot matrix type LED display device.

An object of the present invention is to solve such a problem, and an object of the present invention is to make it possible to easily increase the definition of a dot matrix type LED display device and to improve the productivity of the LED display device. An object of the present invention is to provide a multicolor LED element and a method of manufacturing the same. It is another object of the present invention to provide an LED display device which is excellent in production efficiency and has high definition.

[0018]

According to the present invention, there is provided a multicolor LED element comprising: a monochromatic LED chip for monochromatic emission in which a p-side semiconductor layer and an n-side semiconductor layer are joined; a p-side semiconductor layer and an n-side semiconductor layer; Are bonded. A single-color LED chip having an emission color different from that of the single-color LED chip and semiconductor layers having the same polarity of the two-color LED chips are electrically connected to each other by conductive resin bonding.
A common electrode formed by bonding with an adhesive, and a semiconductor layer different from the semiconductor layer of each single-color LED chip bonded by the common electrode are provided respectively,
And a pair of end face electrodes made of a conductive resin adhesive, whereby the above object is achieved.

[0019]

According to the LED display device of the present invention, the common electrode and each end surface electrode of such a multicolor LED element are formed by a pn junction.
In a state of mounting in a direction perpendicular to the substrate, by adhering a conductive state by a conductive resin adhesive to the metal wiring provided on the substrate, a matrix on implementation plurality of multicolor LED devices on a substrate It is characterized by having been done.

In this case, the conductive resin adhesive may be an anisotropic conductive resin adhesive.

When the common electrode and each end face electrode of the multicolor LED element are made of a metal brazing material, the common electrode and each end face electrode are formed on a metal wiring provided in a matrix on the substrate. A plurality of multicolor LED elements are mounted in a matrix by bonding in a conductive state with a metal brazing material having a lower melting point than the metal brazing material.

The method for manufacturing a multicolor LED element of the present invention is characterized in that
A pair of single-color LEDs in which the side semiconductor layer and the n-side semiconductor layer are respectively joined and each emits a different emission color
Bonding a wafer with a conductive resin adhesive or a metal brazing material so that semiconductor layers of the same polarity are electrically bonded to each other; and bonding the semiconductor layers bonded to each other of the single-color LED wafers to each other. Comprises a step of applying a conductive resin adhesive or a metal brazing material to each of the different semiconductor layers, and a step of full dicing a pair of monochromatic LED wafers bonded to each other. Thus, the above object is achieved.

[0024]

[Action] multicolored LED element of the present invention, p-side semiconductor layer and the n
Two semiconductor light emitting devices having different luminescent colors and having a pn junction with the side semiconductor layer.
Color LED chips.
The entire layer end surfaces of the polar semiconductor layers are bonded and united by a conductive resin adhesive or a metal brazing material, and the conductive resin adhesive or the metal brazing material becomes a common electrode. I have. The other semiconductor layer of each single-color LED element is provided with an end face electrode made of a conductive resin adhesive or a metal brazing material, and a voltage is applied between each end face electrode and the common electrode. Thereby, light of different colors is emitted from the pn junction surface of each single color LED element.

According to the LED display device of the present invention, each end face electrode and common electrode of such a multicolor LED element are bonded to a metal wiring provided on an insulating substrate in a conductive state by a conductive adhesive or a metal brazing material. The single-color LED chips in each multi-color LED element are in close contact with each other.

When bonding the common electrode of each multicolor LED element and each end face electrode to the metal wiring of the insulating substrate, an anisotropic conductive resin adhesive is applied on the insulating substrate to form the multicolor LED.
By pressing the common electrode and each end face electrode of the element onto the metal wiring of the insulating substrate, only the anisotropic conductive resin adhesive portion located between the common electrode and each end face electrode and the metal wiring becomes conductive.

Further, in the method for manufacturing a multicolor LED element of the present invention, a pair of single-color LED wafers having different emission colors are bonded to each other with a conductive adhesive or a metal brazing material.
A large number of multicolor LED elements are manufactured by applying a conductive adhesive or a metal brazing material to the surface of each single-color LED wafer and then performing full dicing.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a side view showing an example of the multicolor LED element of the present invention. The multicolor LED element 10 includes, for example, a red LED chip 11 that emits red light and a red LE
It has a light emitting color different from the light emitting color of the D chip, for example, a green LED chip 13 that emits green light. Red LE
The D chip 11 includes an n-type semiconductor layer 11 a and a p-type semiconductor layer 1.
1b, the n-type semiconductor layer 11a and the p-type semiconductor layer 11b are provided with metal electrodes 11c and 11d made of Au, Al, or the like, respectively. Type semiconductor layer 1
Metal electrodes 13c and 13d made of Au, Al or the like are provided on the 3a and the p-type semiconductor layer 13b, respectively. The red LED chip 11 and the green LED chip 13 are connected to the n-type semiconductor layers 11a and 13a.
The whole of the layer end faces is bonded in a conductive state by a common electrode 12 made of a conductive resin adhesive.

The p-type semiconductor layer 11 of the red LED chip 11
b, an end face electrode 14 formed of a conductive resin adhesive is provided, and the p-type semiconductor layer 13b of the other single-color LED chip 13 is also provided with an end face electrode formed of the conductive resin adhesive. 15 are provided.

The common electrode 1 of the multicolor LED element 10
3. The thickness of each of the end face electrodes 14 and 15 is 50 in consideration of the positional accuracy at the time of mounting and the stress difference between the semiconductor layer and each electrode layer.
About 100 μm is preferable.

FIG. 2 is a perspective view of a wafer body used for manufacturing the multicolor LED element 10 having such a configuration. The wafer body 20 has an n-type semiconductor layer 21a and a p-type semiconductor layer 21b stacked on each other to form an n-type semiconductor layer 21a and a p-type semiconductor layer 21a.
A red LED in which metal electrodes made of Au, Al, or the like are partially provided on the mold semiconductor layer 21b, respectively.
Wafer 21, n-type semiconductor layer 23a and p-type semiconductor layer 2
3b and a green LED wafer 23 in which metal electrodes made of Au, Al, or the like are partially provided on the n-type semiconductor layer 21a and the p-type semiconductor layer 21b, respectively. The n-type semiconductor layers 21 a and 23 a of the red LED wafer 21 and the green LED wafer 23 are bonded to each other by a conductive resin adhesive layer 22. And p of red LED wafer 21
A conductive resin adhesive layer 24 is laminated on the mold semiconductor layer 21b, and a conductive resin adhesive layer 25 is laminated on the p-type semiconductor layer 23b of the other green LED wafer 23.

Such a wafer body 20 has a red LED
By bonding and curing the n-type semiconductor layer 21a of the wafer 21 and the n-type semiconductor layer 23a of the green LED wafer 23 with a paste-like thermosetting conductive resin adhesive, a conductive resin as a common electrode is formed. An adhesive layer 22 is formed, and the p-type semiconductor layer 21b of the red LED wafer 21 and the p-type semiconductor layer 2 of the green LED wafer 23
By applying a paste-like thermosetting conductive resin adhesive to 3b and curing the same, conductive adhesive layers 24 and 25 as end face electrodes are respectively formed.

After the wafer body 20 is formed, full dicing is performed to obtain a number of multicolor LEDs shown in FIG.
The device 10 is obtained.

FIG. 3 is a plan view showing an example of a dot matrix type LED display device using the multicolor LED element 10 of the present invention. The dot matrix type LED display device 30 has a large number of metal common wirings 32 arranged in parallel on the surface of an insulating substrate 31. Each of the common wirings 32 is provided with a large number of element mounting common electrode portions 32a extending in a direction orthogonal to the respective common wirings 32 at equal intervals. In addition, each common electrode 32a for mounting each element in each common wiring 32
Are sandwiched between a pair of island-shaped element mounting electrodes 33a.

Each element electrode section 33a is connected to each common wiring 3
2 are arranged in one row in a state perpendicular to the direction. Insulating substrate 3
A large number of metal signal wires 33 orthogonal to the common wires 32 are provided on the back surface of the device 1 so as to extend along the element electrode portions 33a arranged in one row. Each signal wiring 33
Each of the device mounting electrode portions 33a in a row is electrically connected to each other via through holes.

One multicolor LED element 10 is mounted on each element mounting common electrode section 32a and a pair of element mounting electrode sections 33a sandwiching each element mounting common electrode section 32a.

FIG. 4 is a sectional view showing a mounting state of each multicolor LED element 10 in the dot matrix type LED display device 30 shown in FIG. The multicolor LED element 10 is red
Color LED chip 11 and green LED chip 13
In a state where the n-junction is placed vertically on the insulating substrate 31 , the common electrode 12 is attached to the mounting common electric station 32 a connected to the common wiring 32, and the thermosetting curable paste is formed. Each of the electrode portions 14 and 15 is bonded to each of the mounting electrode portions 33 a connected to the signal wiring 33 by a conductive resin adhesive 34 in a conductive state. Each is adhered in a conductive state by the adhesive 34.

In such a dot matrix type LED display device 30, the common wiring 32 and the signal wiring 33 are respectively wired on the insulating substrate 31, and the mounting common electrode portions 32a and the mounting electrode portions 33a are formed. Once formed, a paste-like conductive resin adhesive 34 is applied on each of the mounting common electrode portions 32a and the mounting electrode portions 33a by screen printing or the like. Then, one multicolor LED element 10 is mounted on each of the pair of mounting common electrode portions 33a and the mounting common electrode portion 32a therebetween. Thereafter, the multi-color LED elements 10 are mounted by thermosetting the conductive resin adhesive 34.

In such a dot matrix LED display device, the mounting common electrode portion 32a on which each multicolor LED element 10 is mounted and the pair of mounting electrode portions 33a are electrically separated from each other by a space. It is in a state that has been
If necessary, as shown in FIG. 5, the space may be filled with an insulating resin adhesive 35 to surely prevent leakage near the pn junction surface of each LED element 10. Good. In this case, by using a photocurable resin as the insulating resin adhesive 35, each multicolor LED
Red LED chip 11 and green LE in element 10
The pn junction of the D chip 13 may be protected.

FIG. 6 is a sectional view of a portion of the dot matrix type LED display device 30 according to another embodiment, on which the multicolor LED element 10 is mounted. In this embodiment, the mounting common electrode portion 32a of the common wiring 32 and each mounting electrode portion 33
A portion of the surface of the insulating substrate 31 between them is cut to form a concave portion 31a, and an anisotropic conductive resin adhesive is applied over the entire surface of the insulating substrate 31. Therefore, the anisotropic conductive resin adhesive 36 is also filled in the concave portion 31 a on the surface of the insulating substrate 31, and presses the multicolor LED element 10 to cause the common electrode 12 of the LED element 10 to move. Thermocompression bonding to the mounting common electrode portion 32a is carried out via an anisotropic conductive resin adhesive, and each electrode 13 and 14 of the LED element 10 is connected to each mounting electrode portion 33a via an anisotropic conductive resin adhesive 36. Thermocompression bonding.

Thus, although the anisotropic conductive resin adhesive 36 in each concave portion 31a between the mounting common electrode portion 32a and each mounting electrode portion 33a maintains an insulating state, Between the common electrode 12 of the device 10 and the common electrode portion 32a for mounting;
Anisotropic conductive resin adhesive 36 between and 15 and each mounting electrode portion 33a is brought into a conductive state by thermocompression bonding, and becomes common electrode 12 of multicolor LED element 10 and mounting common electrode portion 32a, Each of the end electrodes 14 and 15 of the multicolor LED element 10 and each of the mounting electrode portions 33 a are electrically connected by an anisotropic conductive adhesive 36.

As described above, the simple operation of applying the anisotropic conductive resin adhesive to the entire insulating substrate 31, mounting each multi-color LED element 10, and pressing the same, allows the red LED of the multi-color LED element 10 to be pressed. Chip 11 and green LED chip 13
And the multicolor LED element 10
Is mounted on the insulating substrate 31.

In each of the above embodiments, the common electrode 12 in the multicolor LED element 10, the end electrodes 14 and 1
Although 5 is made of a conductive resin adhesive, a metal brazing material may be used. In this case, as shown in FIG. 7, the red LED chip 11 and the green LED chip 13 have metal electrodes 11c and 13c made of a metal such as Au or Al even over the entire surface of the n-type semiconductor layers 11a and 13a. Au and Al are provided over the entire surface of the p-type semiconductor layers 13a and 13b.
Electrodes 11d and 13 made of metal such as
d is provided.

When the common electrode 12 of the multicolor LED element 10 and the end electrodes 14 and 15 are made of a metal brazing material, the mounting common electrode portion 32a and the common electrode 12 of the dot matrix LED display device 30 are used. Each mounting electrode portion 33a and each end face electrode 14 and 15 are electrically conductive by the metal brazing material 39 having a lower melting point than the metal brazing material forming the common electrode 12 and each end face electrode 14 and 15 of the multicolor LED element 10. Glued in state. By using the low-melting metal brazing material 39 as described above, when mounting the multicolor LED element 10 on the insulating substrate 31, each multicolor LED substrate 10
There is no possibility that the common electrode 12 and the end electrodes 14 and 15 made of the metallic brazing material are melted.

In such a multicolor LED element 10, each single-color LED wafer provided with a metal electrode over the entire surface is bonded to each other with a metal brazing material, and the exposed surface of each single-color LED wafer is By applying full dicing after applying the metal brazing material,
Produced in large quantities.

In the above embodiment, the multicolor LED element 1
0 is a red LED chip 11 and a green LED chip 1
3 has been described as a cathode common type in which the n-type semiconductor layers 11a and 13a are adhered to each other and these are used as the common electrode side. However, the present invention is not limited thereto, and the p-type semiconductor layers 11b and An anode common type may be used in which the common electrodes 13b are bonded to each other to form a common electrode.

The multicolor LED element 10 emits two colors, red and green, but may emit other two different colors. A single color LED chip may be used to emit three or more colors.

[0049]

As described above, since the multicolor LED element of the present invention integrates the pn junction monochromatic light emitting LED chips of different luminescent colors by bonding, the luminescent color is controlled by the crystal structure of the semiconductor. It can be manufactured much more easily than in the case of multicoloring, and can be easily mounted on a substrate.

The LED display device of the present invention uses a multicolor LED element in which a pair of single-color LED chips are integrated as described above. Efficiency is significantly improved. In addition, since the pair of single-color LED chips is integrated, a space is allowed on the insulating substrate, and high definition can be achieved. When mounting each multicolor LED element on an insulating substrate, it is not necessary to use a noble metal material such as an Au wire, so that the cost is significantly reduced. further,
Since the pair of single-color LED chips are adhered by the common electrode, it is easy to mix colors of light emitted from the single-color LED chips, and the color of full-color display becomes vivid.

According to the method of manufacturing a multicolor LED element of the present invention, a pair of single-color LED wafers is bonded with a conductive resin adhesive or a metal brazing material, and a conductive resin adhesive or metal is attached to the surface of each single-color LED wafer. By a simple operation of applying the brazing material and then performing full dicing, mass production can be achieved, and the production cost is significantly reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a multicolor LED element of the present invention.

FIG. 2 is a perspective view of a wafer body used when manufacturing the multicolor LED element.

FIG. 3 is a plan view of a dot matrix type LED display device using the multicolor LED element.

FIG. 4 is a cross-sectional view showing an example of a mounting state of a multicolor LED element in the LED display device.

FIG. 5 is a cross-sectional view showing another example of a mounting state of a multicolor LED element in the LED display device.

FIG. 6 is a cross-sectional view showing still another example of a mounting state of a multicolor LED element in the LED display device.

FIG. 7 is a cross-sectional view showing still another example of a mounting state of a multicolor LED element in the LED display device.

FIG. 8 is a sectional view showing an example of a conventional multicolor LED element.

FIG. 9 is a plan view showing an example of a conventional dot matrix type LED display device.

FIG. 10 is a cross-sectional view illustrating an example of a conventional single-color LED element.

FIG. 11 is a plan view showing an example of a dot matrix type LED display device using the single-color LED element.

FIG. 12 is a cross-sectional view of a mounted state of a single-color LED element in the LED display device.

FIG. 13 is a plan view showing another example of a dot matrix type LED display device using a single-color LED element.

[Explanation of symbols]

 Reference Signs List 10 multicolor LED element 11 red LED chip 11a n-type semiconductor layer 11b p-type semiconductor layer 11c metal electrode 11d metal electrode 12 common electrode 13 green LED chip 13a n-type semiconductor layer 13b p-type semiconductor layer 13c metal electrode 13d metal electrode 14 end face Electrode 15 End face electrode 20 Wafer body 21 Red LED wafer 22 Conductive resin adhesive layer 23 Green LED wafer 24 Conductive resin adhesive layer 25 Conductive resin adhesive layer 30 Dot matrix LED display device 31 Insulating substrate 32 Common wiring 32a Mounting Common electrode section 33 signal wiring 33a mounting electrode section 34 conductive resin adhesive layer 35 insulating resin adhesive layer 36 anisotropic conductive resin adhesive

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 7 , DB name) H01L 33/00

Claims (5)

(57) [Claims]
1. A monochromatic LED chip in which a p-side semiconductor layer and an n-side semiconductor layer are joined to each other, and a p-side semiconductor layer and an n-side semiconductor layer are joined to each other, which are different from the monochromatic LED chip. a monochromatic LED chips of the light emitting colors, the semiconductor layer between the same polarity in both monochromatic LED chip, the layer
By bonding the entire end surface with a conductive resin adhesive,
And a pair of end surface electrodes provided on a semiconductor layer different from the semiconductor layer of each monochromatic LED chip bonded by the common electrode, respectively, and formed of a conductive resin adhesive. A multicolor LED element.
2. The multi-color LED element according to claim 1, wherein the common electrode and each end face electrode are arranged such that a pn junction is perpendicular to the substrate.
While it placed on the counter, by adhering a conductive state by electrically <br/> conductive resin adhesive to the metal wiring provided on the substrate, a matrix on implementation plurality of multicolor LED devices on a substrate An LED display device, comprising:
3. The LED display device according to claim 2 , wherein the conductive resin adhesive is an anisotropic conductive resin adhesive.
4. The multicolor LED device according to claim 1,
The common electrode and each end face electrode are electrically conductive resin bonded.
Agent is constituted by a metallic brazing material instead of the common electrode and the edge electrode, the metal wiring provided in a matrix on a substrate, the common electrode and each end face of the <br/> multicolor LED element By bonding in a conductive state by a metal brazing material having a lower melting point than the metal brazing material constituting the electrode,
An LED display device comprising a plurality of multicolor LED elements mounted in a matrix.
5. A p-side semiconductor layer and an n-side semiconductor layer are joined to each other, and a pair of single-color LED wafers having different emission colors are electrically bonded to each other with semiconductor layers of the same polarity. As described above, a step of bonding with a conductive resin adhesive or a metal brazing material, and a step of bonding a conductive resin adhesive or a metal brazing material to each semiconductor layer different from the mutually bonded semiconductor layers of each monochromatic LED wafer. A method of manufacturing a multicolor LED element, comprising: applying a material, and full dicing a pair of single-color LED wafers bonded to each other.
JP31633294A 1994-12-20 1994-12-20 Multicolor LED element, LED display device using the multicolor LED element, and method of manufacturing multicolor LED element Expired - Fee Related JP3195720B2 (en)

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