JP2002033518A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device the manufacturing process of which can be simplified. SOLUTION: This light emitting device is provided with a light emitting element, a package, and a land section which is positioned on the top face of the package and connected to the light emitting element. The device is also provided with a back terminal which is positioned on the back of the package and used for outside connection and a light-transmissive resin sealing the light emitting element. The land section and back terminal are electrically connected to each other through the package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a light emitting device.

[0002]

2. Description of the Related Art As a conventional light emitting device, for example, there has been a light emitting device as disclosed in Japanese Patent Application Laid-Open No. 1-288383. FIG.
In (A), (B) and (C), reference numeral 1 denotes a reflective case (package) made of a thermoplastic resin having plating property, and a concave portion 2 is formed on the surface thereof.

The portions indicated by reference numerals 3, 4, and 5 are Cu / Ni
/ Ag plating is applied, and the platings 3, 4, and 5 are connected to electrode plating terminals 6 and 7 through through holes.

In the plating land 3, a light emitting diode chip 8 as a light emitting element is fixed by an Ag paste 9 and connected to the plating land 4 by an Au wire 11.

The underlayer thermoplastic resin is exposed between the plating lands 3 and 4 with a width of about 0.3 mm. This part is a three-dimensional insulating pattern.

The concave portion 2 of the reflective case 1 is sealed with a transparent epoxy resin 12 for protecting the light emitting diode and improving light extraction efficiency.

In use, when a current of several tens of mA is applied to the electrode plating terminals 6 to 7, the light emitting diode chip 8 emits light and operates as a visible light emitting lamp.

[0008]

In the conventional light emitting device, the electrical connection between the light emitting diode chip 8 and the plating terminals 6 and 7 for the back electrode is made by three-dimensional wiring formed on the surface of the reflection case 1. This is performed through the plating layers 3, 4, and 5. In order to form the three-dimensional wirings by plating, the plating layers 3, 4, and 5 are plated over the entire surface, then masked with a resist at a required pattern formation portion, and subjected to a photolithography process.
Either a method of removing unnecessary portions by sequentially passing through the etching process, that is, removing plating of portions that become insulating lines, or a method of applying only a pattern forming portion to a state where plating can be performed by applying a catalyst or the like. It is common to take or. However, in order to form a pattern three-dimensionally in any of the methods, masking must be performed three-dimensionally, and advanced technology is required.

In view of the above problems, an object of the present invention is to provide a light emitting device that can simplify a manufacturing process.

[0010]

A light emitting device according to the present invention comprises a light emitting element, a package, and a land located on the top surface of the package and connected to an electrode of the light emitting element.
In a light emitting device comprising: a back surface terminal used for external connection located on the back surface of the package; and a light-transmitting resin that seals the light emitting element, an electrical connection between the land portion and the back surface terminal. Is achieved in a package, thereby achieving the above object.

A light emitting device according to the present invention is used for a light emitting element, a package, a land portion located on the upper surface of the package and connected to an electrode of the light emitting element, and a land portion located on a back surface of the package for external connection. In the light emitting device, the package includes an insulating resin body, an upper surface of which forms the land portion, and a back surface of the light emitting device includes the rear surface terminal. The above-described object is achieved by providing a metal member that is exposed and embedded in the insulating resin body.

A light emitting device according to the present invention is used for a light emitting element, a package, a land portion located on an upper surface of the package and connected to an electrode of the light emitting element, and an external position located on a back surface of the package. In the light emitting device, the package includes an insulating resin body, an upper surface of which forms the land portion, and a back surface of the light emitting device includes the rear surface terminal. The above object is achieved because the light emitting element and the back surface terminal are electrically connected by the metal member.

In the light emitting device according to the present invention, in any one of the above light emitting devices, the package includes a plurality of metal members provided with a land portion and a back surface terminal, and at least one of the plurality of land portions is provided with a bonding wire. The above object is achieved by being connected to the light-emitting element via

In the light emitting device according to the present invention, the above object is achieved by at least a metal member having a land portion connected to the light emitting element by a bonding wire is exposed and embedded in the package.

In the light emitting device according to the present invention, in any one of the above light emitting devices, the light emitting element has an electrode formed only on one surface thereof, and the electrode is connected to the land via a conductive bump. The above object is achieved by being done.

A light emitting device according to the present invention is used for a light emitting element, a package, a plurality of lands located on a top surface of the package and connected to electrodes of the light emitting element, and an external connection located on a back surface of the package. A plurality of back terminals, and a light-transmitting resin for sealing the light-emitting element, in a light-emitting device, the light-emitting element, a surface on which a plurality of electrodes are juxtaposed, facing the surface, With a surface on which light is emitted, and the plurality of electrodes are fixed across the plurality of lands, and the plurality of lands and the plurality of back terminals are electrically connected, Achieve the above objectives.

The light-emitting device according to the present invention achieves the above object by providing any one of the light-emitting devices described above, wherein the light-emitting element mounting surface of the package is rectangular.

According to the present invention, as shown in FIG. 1, a first land 27 on which a light emitting element 22 is mounted
A second land portion 31 connected to the light emitting element 22 via a bonding wire 29 is formed, and back terminals 28 and 32 for external connection are formed on the back of the package 21.
The light emitting element 22 is mounted on the first land 27, and the light emitting element 22 and the second land 31 are
9, the light emitting element 22 and the bonding wire 29 are resin-sealed with a translucent resin 23.
7, a first conductive resin body 24 having a back surface serving as a first back terminal 28 and a high conductive material having an upper surface serving as a second land portion 31 and a back surface serving as a second back terminal 32. A second conductive resin body 25, and an insulating resin body 26 interposed between the conductive resin bodies 24, 25;
The 4, 25 and the insulating resin body 26 may be integrally formed (two-color molding) at the time of molding.

According to the present invention, as shown in FIGS. 2A to 2C, in the above-described light emitting device,
1 is formed, the first land portion 27 and the second land portion 31 are arranged on the bottom surface of the concave portion 41, and after the light emitting element 22 is mounted and connected, the inside of the concave portion 41 is formed on the translucent resin 23. May be resin-sealed.

In the present invention, a metal film 33 for connection may be formed on the first land portion 27, the second land portion 31, and the back terminals 28 and 32.

According to the present invention, as shown in FIG. 3, a first land 27 on which a light emitting element 22 is mounted is provided on an upper surface of a package 21.
A second land portion 31 connected to the light emitting element 22 via a bonding wire 29 is formed, and back terminals 28 and 32 for external connection are formed on the back of the package 21.
The light emitting element 22 is mounted on the first land 27, and the light emitting element 22 and the second land 31 are
9, the light emitting element 22 and the bonding wire 29 are resin-sealed with a translucent resin 23.
7 and a second resin body 24 having a back surface as a first back surface terminal 28 and a second land portion 31 on the top surface and a second back surface terminal 32 formed on the back surface. 25
And an insulating resin body 26 interposed between the two resin bodies 24, 25. The resin bodies 24, 25, 26 are integrally formed at the time of molding, and a bonding wire is formed on the second resin body 25. The metal member 45 for connecting to the semiconductor device 29 may be exposed and embedded.

According to the present invention, as shown in FIGS.
The first land portion 27 connected to the first electrode 46 of the light emitting element 22 and the second land portion 31 connected to the second electrode 47 of the light emitting element 22 are formed on the upper surface of the package 2.
1, the back surface terminals 28 and 32 for external connection are formed, the light emitting element 22 is mounted on the first land portion 27,
In a light emitting device in which the light emitting element 22 and the second land portion 31 are connected by a bonding wire 29 and the light emitting element 22 and the bonding wire 29 are resin-sealed with a translucent resin 23, the package 21 has an upper surface. A first conductive resin body 24 having a first land portion 27 and a back surface serving as a first back terminal 28;
And a second conductive resin body 25 having a back surface serving as a second back terminal 32 and a highly conductive second conductive resin body 25, and an insulating resin body 26 interposed between the conductive resin bodies 24, 25. The resin bodies 24 and 25 and the insulating resin body 26 are integrally formed at the time of molding, and both the first electrode 46 and the second electrode 47 are provided in parallel on the back surface of the light emitting element 22.
The land portions 27 and 31 may be connected to one of the electrodes 46 and 47 and the land portions 27 and 31 via a conductive bump 57 formed in advance.

The present invention relates to a first conductive resin body 24 having a first land portion 27 on the upper surface and a first back terminal 28 on the back surface, and a second land portion 31 on the upper surface and a back surface. The package 21 is formed by integrally molding a highly conductive second conductive resin body 25 having a second back surface terminal 32 and an insulating resin body 26 interposed therebetween. A light emitting element 22 is provided on the upper surface of
6 is connected to the first land 27 and the second electrode 47 is mounted so as to be connected to the second land 31, and the periphery of the light emitting element 22 is resin-sealed with the translucent resin 23. Good.

Hereinafter, the operation of the present invention will be described.

As described above, the highly conductive first conductive resin body 24 whose upper surface is the first land portion 27 and whose back surface is the first back surface terminal 28, and whose second upper surface is the second land portion 31, Is a second conductive resin body 25 having a second back surface terminal 32 and an insulating resin body 26 interposed therebetween.
For example, the package 21 is formed by integrally molding (two-color molding) with the first electrode 46 of the light emitting element 22 connected to the first land 27 on the upper surface of the package 21. The two electrodes 47 are mounted so as to be connected to the second land portion 31, and the periphery of the light emitting element 22 is resin-sealed with the translucent resin 23.

Then, in order to secure the electrical connection between the light emitting element 22 on the upper surface and the back terminals 28 and 32 on the rear surface, it is not necessary to provide three-dimensional wiring on the surface of a through hole or the like of the package as in the prior art. Is simplified and simplified.

As described above, the electrical conduction between the light emitting element 22 on the upper surface and the back terminals 28 and 32 on the rear surface is performed by the metal member 45 only by inserting and molding the metal member 45 at the time of molding the package 21. Can be. Then,
The bonding wire can be easily attached (bonding property) without applying metal plating or the like to the bonding land portion 31.

As described above, since the light emitting element 22 and the lands 27 and 31 are connected using the conductive bumps 57,
The connection using a bonding wire or the like becomes unnecessary, and the occurrence of defects such as wire breakage is eliminated, and the reliability of the product is improved.

[0029]

(First Embodiment) FIG. 1 is a sectional view showing a light emitting device according to a first embodiment of the present invention. In the light emitting device of this embodiment, the light emitting element 22 is mounted and connected on the upper surface of the resin substrate 21 as a package.
Light emitting element 22 for the purpose of protecting
Is sealed with a translucent resin 23.

The resin substrate 21 includes a first conductive resin body 24 made of a highly conductive resin and a second conductive resin body 25
And an insulating resin body 26 interposed between the conductive resin bodies 24 and 25 are integrally formed (two-color molding) at the time of molding.

The first conductive resin body 24 and the second conductive resin body 25 are made by mixing a conductive material such as metal powder or carbon into a resin to have conductivity, or a material such as polypyrrole resin or polyaniline. The resin material itself has conductivity. The resistivity of the conductive resin bodies 24 and 25 is 1 Ω in consideration of the driving current of the light emitting element 22 and the like.
-Cm or less is desirable.

The upper surface of the first conductive resin body 24 has a first land (mounting land) 27 on which the light emitting element 22 is mounted.
It is said. The back surface of the first conductive resin body 24 serves as a first back terminal 28 for external connection.

The upper surface of the second conductive resin body 25 is a second land portion (connection land portion) 31 connected to the light emitting element 22 via a bonding wire 29 of Au or the like.
The back surface of the second conductive resin body 25 serves as a second back terminal 32 for external connection.

The land portions 27 and 31 and the back terminals 28 and 32 are provided with Ni / Au as a metal film.
Plating 33 is applied. The Ni / Au plating 33 is used as a soldering pad when mounting on another mounting substrate.

The insulating resin body 26 is made of a functional polymer material (engineering plastic) having good workability and solder heat resistance, such as liquid crystal polymer and polyether sulfone.

The resin substrate 21 is collectively formed on a multi-cavity substrate, and after mounting and sealing the light emitting element 22 as described later, the resin substrate 21 is divided into individual units using a scribe method or a dicing method.

The light emitting element 22 includes the first land 2
7, and is connected to the second land portion 31 via a bonding wire 29.

As the translucent resin 23, for example, a transparent epoxy resin is used.

The light emitting device having the above structure is manufactured as follows.

First, the resin substrate 21 is collectively formed on a multi-cavity substrate.

At this time, first, the first conductive resin body 24 and the second conductive resin body 25, that is, a portion to be an electric circuit are formed using a high conductive resin (primary forming).

Next, the insulating resin body 26 is molded using this portion as the insert side (secondary molding), and the resin substrate 21 is integrally formed. At this time, the land portions 27, 31 on the upper surface of the conductive resin bodies 24, 25 and the back terminals 28, 32 on the back surface.
Are exposed on each side.

Thereafter, Ni / Au plating 33 is applied to the lands 27 and 31 and the back terminals 28 and 32.

Then, the light emitting element 22 is connected to the first land portion 27.
Is fixed to the second land portion 31 via a bonding wire 29.

After that, the periphery of the light emitting element 22 and the bonding wire 29 is sealed with a light transmitting resin 23.

Thereafter, the resin substrate 21 is divided into individual units by using a scribe technique or a dicing technique, and the light emitting device is completed.

In the light emitting device manufactured in the above steps, the light emitting element 22 and the back terminals 28 and 32 can be electrically connected via the respective conductive resin bodies 24. Then, in order to secure electrical connection between each land portion (plated land) for connecting the light emitting element 22 and the back surface terminal (plated terminal for electrode) as in the related art, the through-hole of the resin substrate (reflection case) is formed. There is no need to provide a three-dimensional wiring through a hole or the like. Therefore, the manufacturing process is simplified and simplified.

Further, since through holes are not required, molding is easy and the shape of the mold can be simplified. Therefore, the mold cost is reduced.

Further, since the wiring of the circuit wiring is not required, the whole size becomes compact.

(Second Embodiment) FIGS. 2A and 2B are views showing a light emitting device according to a second embodiment of the present invention, wherein FIG. 2A is a top view, FIG. 2B is a sectional view, and FIG. . In FIG. 2, reference numeral 21 denotes a resin substrate serving as a package,
1 is formed.

The resin substrate 21 is composed of a bottom portion 42 forming the bottom wall of the concave portion 41 and a peripheral portion 43 forming the side wall of the concave portion 41.

The bottom portion 42 is formed in the same manner as in the first embodiment.
The first conductive resin body 24, the second conductive resin body 25, and the insulating resin body 26 interposed between the conductive resin bodies 24, 25 are integrally formed (two-color molding) at the time of die molding. Become.

The peripheral portion 43 is formed of an insulating resin. The peripheral portion 43 is formed integrally with the bottom surface portion 42 by a two-color molding method at the time of die molding.

Ni / Au plating 33 is applied to the lands 27 and 31 on the upper surface of the conductive resin bodies 24 and 25 and the back terminals 28 and 32 on the back.

Then, the light emitting element 22 includes the first land 2
7 is fixed by an Ag paste 44, and the upper electrode of the light emitting element 22 and the second land 31 are connected by a bonding wire 29 such as Au.

The entire interior of the concave portion 41 is sealed with a light transmitting resin 23 such as a transparent epoxy resin for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.

According to this embodiment, the same effects as those of the first embodiment can be obtained.

(Third Embodiment) In FIG. 3, reference numeral 21 denotes a resin substrate as a package, and a concave portion 41 is formed on the upper surface thereof.

The resin substrate 21 is composed of a bottom portion 42 forming the bottom wall of the concave portion 41 and a peripheral portion 43 forming the side wall of the concave portion 41.

The bottom portion 42 is formed in the same manner as in the first embodiment.
The first conductive resin body 24, the second conductive resin body 25, and the insulating resin body 26 interposed between the conductive resin bodies 24, 25 are integrally formed (two-color molding) at the time of die molding. Become.

The peripheral portion 43 is formed of an insulating resin. The peripheral portion 43 is formed integrally with the bottom surface portion 42 by a two-color molding method at the time of die molding.

A metal lead pin 45 (metal member) is embedded in the second conductive resin body 25 at the time of molding, and plays a role of a bonding pad at the time of wire bonding.

Each back terminal 2 on the back of the resin substrate 21
8, 32 are provided with Ni / Au plating 33 for external connection.

The light emitting element 22 is connected to the first land 2
7 is fixed with an Ag paste, and the upper electrode of the light emitting element 22 and the metal lead pin 45 are connected by a bonding wire 29 such as Au.

The entire interior of the concave portion 41 is sealed with a light-transmitting resin 23 such as a transparent epoxy resin for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.

When the light emitting device is formed as described above, electrical conduction is achieved by the metal lead pins 45. Therefore,
In the present embodiment, each of the back terminals 28 on the back of the resin substrate 21,
Although Ni / Au plating 33 for external connection is applied to 32, it is also possible to connect an Au wire directly to the case without forming any metal film in the concave portion 41. (Fourth Embodiment) FIG. 4 is a sectional view of a light emitting device of a fourth embodiment, and FIG. 5 is a structural view of a light emitting device of the fourth embodiment. In FIG. 4, reference numeral 21 denotes a resin substrate as a package, on which a light emitting element 22 is mounted.

The resin substrate 21 includes a bottom surface portion 42 forming the bottom wall of the concave portion 41 and an insulating peripheral portion 43 forming the side wall of the concave portion 41.

The bottom surface portion 42 has an upper surface formed of the first land portion 2.
7, a first conductive resin body 24 having a back surface serving as a first back terminal 28 and a high conductive material having an upper surface serving as a second land portion 31 and a back surface serving as a second back terminal 32. It comprises a second conductive resin body 25 and an insulating resin body 26 interposed between the two conductive resin bodies 24, 25. These are integrally formed at the time of die molding, similarly to the first to third embodiments.

The light emitting device 22 of this embodiment is different from that of FIG.
A face-down type such as described above is used. That is, the light emitting element 22 has a P electrode 4 as a first electrode.
6 and the N-electrode 47 as the second electrode are arranged side by side on the back surface of the light emitting element 22, and are configured so that light is emitted from the upper surface of the light emitting element 22.

Here, in FIG. 5, reference numeral 48 denotes both PN electrodes 46,
A void for enhancing the dielectric strength between 47, 49 is Si
O2 film, 51 is p + -GaAs layer, 52 is n-GaAs
Layer, 53 is an n-GaAlAs layer, 54 is p-GaAlA
s active layer, 55 is a p-GaAlAs layer, 56 is p-Ga
This is an AlAs layer.

The PN electrodes 4 of the light emitting element 22
6, 47 are both land portions 27, 31 of the resin substrate 21;
It is fixed so as to straddle. As this fixing method,
For example, the conductive bumps 57 are formed in advance on the electrodes 46 and 47 of the light emitting element 22 with Au or solder, and are connected to and mounted on the lands 27 and 31 by heat or ultrasonic pressure bonding.

In this embodiment, as in the other embodiments, the entire interior of the recess 41 is sealed with the transparent epoxy resin 23 for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.

As described above, when the face-down type top emission type light emitting element is used as the light emitting element 22, the electrode is not present on the upper surface which is the light output surface. Is improved.

The present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

For example, in the third embodiment, the metal lead pins 45 are embedded in the second resin body 25 made of a highly conductive resin, but the material of the second resin body 25 does not necessarily require high conductivity. Therefore, an insulating resin similar to the insulating resin body 26 may be used instead. In this case, since the insulating resin body 26 and the second resin body 25 do not need to be formed in two colors, they may be formed simultaneously at the manufacturing stage.

In each of the above embodiments, each land 2
Although Ni / Au is used as the material of the metal film 33 applied to the backside terminals 28 and 32 and the backside terminals 28 and 32, for example, Al, C
u, Ag or the like may be used.

Further, for example, in the first embodiment, after forming the first conductive resin body 24 and the second conductive resin body 25, the insulating resin body 26 is integrally formed by the two-color molding method. After the formation of 26, the first conductive resin body 24 and the second conductive resin body 25 may be integrally formed by a two-color molding method.

[0078]

As is apparent from the above description, according to the present invention, a light emitting element is mounted on a package in which a conductive resin body and an insulating resin body are molded in two colors, for example, and the light emitting element on the upper surface and the light emitting element on the back surface are mounted. Since the electrical connection with the back terminal is performed by the conductive resin body, it is not necessary to provide a three-dimensional wiring such as a through hole as in the conventional example. Therefore, work steps such as a masking step can be omitted, and the manufacturing work can be simplified.

Further, since no through hole is required, molding is easy and the shape of the mold can be simplified. Therefore, the mold cost is reduced.

Further, since the wiring of the circuit wiring is not required, the whole size becomes compact.

According to the present invention, the electrical conduction between the light emitting element on the upper surface and the terminal on the rear surface is performed by the conductive resin body using the metal member, so that the electrode inside the concave portion is unnecessary, and the process can be further simplified. It is possible.

According to the present invention, since a face-down type top emission type light emitting element is used as the light emitting element, the electrode on the upper surface, which is the light output surface, can be omitted. There is an excellent effect that the efficiency is improved.

According to the present invention, the land portion is formed by a package or an insulating resin body constituting the package and a metal member provided inside the insulating resin body and having an upper surface serving as a land portion and a back surface serving as a back terminal. Since the light emitting element and the back surface terminal are electrically connected to each other, the wiring of the light emitting element, which has been conventionally required, through the through hole on the side surface of the package for establishing conduction with the back surface terminal for external connection. Becomes unnecessary, and the size of the entire light emitting device becomes compact.

Further, since it is not necessary to form a through-hole, a plating layer is formed at a through-hole portion generated in a process such as dicing or scribing when a multi-piece substrate-like light emitting device is divided into individual light emitting devices. There is no occurrence of peeling or poor conduction between the land portion and the back terminal portion due to defective formation of the through hole, and the production yield and reliability are improved.

Further, since the conduction between the light emitting element and the back surface terminal is performed by the package itself, when the light emitting device is mounted on a printed circuit board or the like, the influence of the reaction between the back surface terminal and the solder and the corrosion of the back surface terminal are affected by the light emitting element itself. And a highly reliable light emitting device can be realized.

According to the present invention, since a face-down type top emission type light emitting element is used as the light emitting element, it is possible to form a land portion having an area substantially equal in size to the area of the back surface of the light emitting element. Since the conduction from the land portion to the back surface terminal can be performed at the shortest distance, the size of the light emitting device can be made very compact to a size substantially equal to the size of the light emitting element.

Further, since the step of connecting the bonding wire to the package is not required, the back terminal peeling, package cracking, and land portion caused by mechanical distortion introduced into the package in the step of connecting the bonding wire are eliminated. Can be prevented, electrical conduction between the light emitting element and the back surface terminal can be ensured, and the yield and reliability can be improved.

According to the present invention, the package can be easily formed into a large number of light emitting devices by forming the light emitting device into a substrate shape and then dividing the package into individual rectangular packages using a simple method such as dicing or scribing. It becomes possible to obtain a device.

In addition, the surface mounting to other components can be easily performed, and since the back terminals for mounting are formed in a very compact size close to the size of the light emitting element, design flexibility is improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a light emitting device according to a first embodiment of the present invention.

FIGS. 2A and 2B are diagrams showing a light emitting device according to a second embodiment of the present invention, wherein FIG. 2A is a plan view, FIG. 2B is a sectional view, and FIG.

FIG. 3 is a sectional view showing a light emitting device according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a light emitting device according to a fourth embodiment of the present invention.

FIG. 5 is a structural view of a light emitting element used in a light emitting device according to a fourth embodiment of the present invention.

6A and 6B are views showing a conventional light emitting device, wherein FIG. 6A is a plan view, FIG. 6B is a side view, and FIG.

[Explanation of symbols]

 21 Package 22 Light Emitting Element 23 Translucent Resin 24 First Conductive Resin Body 25 Second Conductive Resin Body 26 Insulating Resin Body 27 First Land 28 First Back Terminal 29 Bonding Wire 31 Second Land 32 Second Back Terminal 33 Metal film 41 Depression 45 Metal member 46 First electrode 47 Second electrode 57 Conductive bump

Claims (8)

[Claims] A light-emitting element, a package, a land portion located on an upper surface of the package and connected to an electrode of the light-emitting element, and a back surface terminal located on a back surface of the package and used for external connection; A light-emitting device comprising: a light-transmitting resin that seals the light-emitting element; wherein the land portion and the back surface terminal are electrically connected by a package. 2. A light emitting element, a package, a land portion located on an upper surface of the package and connected to an electrode of the light emitting device, and a back surface terminal located on a back surface of the package and used for external connection, In a light-emitting device, comprising: a light-transmitting resin that seals the light-emitting element; wherein the package is an insulating resin body, and a metal member whose upper surface forms the land portion and whose back surface forms the back surface terminal; A light-emitting device, comprising: the metal member being exposed and embedded in the insulating resin body. 3. A light emitting device, a package, a land portion located on the top surface of the package and connected to an electrode of the light emitting device, and a back surface terminal located on the back surface of the package and used for external connection; In a light-emitting device, comprising: a light-transmitting resin that seals the light-emitting element; wherein the package is an insulating resin body, and a metal member whose upper surface forms the land portion and whose back surface forms the back surface terminal; A light-emitting device, comprising: the metal member configured to electrically connect the light-emitting element to the back surface terminal. 4. The package according to claim 1, wherein the package includes a plurality of metal members each having a land portion and a back surface terminal, and at least one of the plurality of land portions is connected to the light emitting element via a bonding wire. The light emitting device according to claim 1, wherein: 5. The light emitting device according to claim 4, wherein a metal member having at least a land portion connected to the light emitting element with a bonding wire is exposed and embedded in the package. 6. The light emitting device according to claim 1, wherein an electrode is formed only on one surface of the light emitting device, and the electrode and the land are connected via a conductive bump. The light emitting device according to any one of the above. 7. A light emitting element, a package, a plurality of lands located on an upper surface of the package and connected to electrodes of the light emitting element, and a plurality of back terminals located on the back of the package and used for external connection. And a light-transmitting resin that seals the light-emitting element. In the light-emitting device, the light-emitting element emits light so as to face a surface on which a plurality of electrodes are arranged in parallel and the surface. Wherein the plurality of electrodes are fixed across the plurality of lands, and the plurality of lands and the plurality of back terminals are electrically connected. 8. The light emitting device according to claim 1, wherein the light emitting element mounting surface of the package is rectangular.