JP3190575B2 - Chip arrangement device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip arraying apparatus which is applied to a process of processing semiconductor chips such as LEDs and ICs and which can be adjusted and set to a chip interval required for die bonding.

[0002]

2. Description of the Related Art Generally, in a semiconductor chip processing step, a chip is die-bonded after a wafer is divided into chips, and a predetermined chip interval is required for die-bond pickup. Therefore, the chip interval is increased by using a chip arrangement device.

FIG. 11 is a diagram for explaining the operation of a conventional chip arrangement device. The semiconductor chips 101 are adhesively arranged on a sheet 102. The sheet 102 around the chip 101 is fixed with a fixing jig 103, and the cylinder 104 is brought into contact with the sheet 102 below the chip 101 from below, and the sheet 102 is stretched while being raised. Thus, the chip interval is expanded to a predetermined value by the elongation of the sheet 102.

[0004]

However, this device has the following problems. The sheet 102 in the peripheral portion of the cylinder 104 is easy to stretch, but the sheet 102 in the center portion is difficult to stretch due to frictional resistance of the cylinder surface, etc., so that the enlargement ratio is not uniform between the central portion and the peripheral portion of the sheet. is there. Due to a problem in sheet characteristics (difference in tensile stress between the longitudinal direction and the lateral direction of the sheet), the enlargement ratio is not uniform. For this reason, in the prior art, since the arrangement of the chips after expansion is in a distorted state, there is a problem that chips are easily left behind when picking up chips at the time of die bonding of chips.

Therefore, conventionally, once one cycle of die bonding is performed, a portion where remnants are remarkable is partially picked up again to minimize remnants. However, this technique has a production problem in that the number of die bonding steps is increased, and an invalid chip is eventually generated due to some leftovers.

An object of the present invention is to provide a chip arrangement apparatus which can rearrange chips at uniform intervals and improve production efficiency.

[0007]

According to a first aspect of the present invention, there is provided a first sheet in which semiconductor chips are arranged and adhered on one surface, and a second sheet in which an adhesive surface is opposed to the semiconductor chip arrangement surface of the first sheet. And a linear blade for pressing the semiconductor chip from the back surface of the semiconductor chip arrangement surface of the first sheet and transferring the semiconductor chip to the second sheet. Then, the semiconductor chips are transferred while shifting the positions of the first sheet and the second sheet in the parallel direction so as to have a predetermined chip interval.

According to a second aspect of the present invention, in the chip arranging apparatus according to the first aspect, the semiconductor chip to be transferred is moved to the position of the blade by sending out the first sheet on one hand and winding it on the other. A sheet feeding mechanism, and a moving table on which the second sheet is mounted and moved, wherein the position of the first sheet and the second sheet in the parallel direction is shifted by movement of the sheet feeding mechanism and the moving table. I do.

According to a third aspect of the present invention, there is provided the chip arranging apparatus according to the first aspect, wherein the first sheet is fixed and the sheet fixing and moving mechanism is capable of moving in parallel with the second sheet; Equipped with a moving table mounted and moved,
The position of the first sheet and the position of the second sheet in the parallel direction are shifted by adjusting the moving speed of the sheet fixed moving mechanism and the moving speed of the moving table.

According to a fourth aspect of the present invention, in the chip arrangement device according to the first aspect, a sheet fixing mechanism for fixing the first sheet, a moving table on which the second sheet is mounted and moved, and the blade And a blade moving mechanism for moving in a direction parallel to the second sheet to the position of the semiconductor chip to be transferred.

According to a fifth aspect of the present invention, there is provided the chip arrangement device according to the first, second, third or fourth aspect, wherein the adhesive surface of the second sheet has a stronger adhesive force than the adhesive surface of the first sheet. It is characterized by.

According to a sixth aspect of the present invention, there is provided the chip arrangement device according to the first, second, third or fourth aspect, wherein the first sheet is
It is characterized by using a material having a small elongation.

According to a seventh aspect of the present invention, there is provided the chip arrangement device according to the first, second, third or fourth aspect, wherein a material having high slipperiness is used for a tip portion of the blade.

According to an eighth aspect of the present invention, in the chip arrangement device according to any one of the second to third aspects, the second sheet and the moving table are made of a transparent material, and the moving table is mounted on the second sheet. An imaging means for imaging from the opposite side of the surface is provided, and the position of the semiconductor chip to be transferred is confirmed by the imaging means.

According to a ninth aspect of the present invention, in the chip arrangement device according to the second, third or fourth aspect, the moving table is provided with a suction mechanism for vacuum-sucking the second sheet. .

In the present invention, the first sheet and the second sheet
Since the semiconductor chip is transferred while shifting the position of the sheet in the parallel direction, the chip interval after transfer can be adjusted and set by adjusting the position. As described above, since the chip interval is set to a predetermined value by transferring, the chips are uniformly spaced without being affected by the mechanical problem of the apparatus or the unevenness of the elongation of the sheet as in the related art. Can be rearranged.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing a first embodiment of a chip arrangement device according to the present invention. This chip arrangement apparatus includes a sheet feeding mechanism 12 including two rollers for winding and stretching a first sheet 11, and a chip rearrangement for mounting a second sheet 13 on a glass table 14 so as to face the first sheet 11. The mechanism 15 includes a blade 17 for transferring the chip 16 of the first sheet 11 to the second sheet 13. Here, the first sheet 11 is
For example, a polyester material having a small elongation is used, and the second sheet 13 is made of, for example, UV,
Use a sheet. The tip of the blade 17 is made of a material having good slipperiness, such as Teflon, for example, and moves only in the vertical direction but does not move in the horizontal direction. Sheet feed mechanism 12
Has a configuration in which the first sheet 11 is moved by sending out the first sheet 11 from one roller and winding it up with the other roller. Both rollers are movable in the axial direction of the rollers (the direction perpendicular to the plane of FIG. 1). Chips 16 are adhesively arranged on the lower surface of the first sheet 11.

Next, the operation of the chip arrangement device will be described. FIG. 2 shows a chip 16 attached on the first sheet 11. The chips 16 are rearranged on the second sheet 13 by using a chip arranging device, as shown in FIG.

First, the first sheet 1 is supplied to the sheet feeding mechanism 12.
1 is set, and the second sheet 13 is set on the glass table 14 of the chip rearrangement mechanism 15. The first sheet 11 is moved rightward by the sheet feeding mechanism 12, and the blade 17 is moved.
The chip 16 is positioned below the. Lower blade 17 and
The chip 16 is stamped on the adhesive surface of the second sheet 13.
Since the adhesive force of the second sheet 13 is stronger than the adhesive force of the first sheet 11, the chips 16 are transferred from the first sheet 11 to the second sheet 13.

Next, the glass table 14 is moved rightward by a predetermined chip interval. At the same time, the first sheet 11 is moved rightward by the sheet feeding mechanism 12 and the next chip 16 is moved.
Is positioned below the blade 17. In this way, the chips 16 are transferred to the second sheet 13 one by one in sequence. When the transfer of one row is completed, the sheet feeding mechanism 12 rewinds the first sheet 11 and moves the rollers in the axial direction to transfer the chips 16 of the next row. By transferring the chips 16 in all rows in this manner, chip rearrangement is performed at regular intervals in the horizontal direction as shown in FIG.

The second sheet 13 with the chip interval expanded in the horizontal direction is set as the above-mentioned first sheet in the sheet feeding mechanism 12, and is set in a state where the chip is rotated 90 degrees so that the vertical direction of the chip is enlarged. Then, the same operation as described above is performed, and the vertical enlargement is completed as shown in FIG.

In this manner, the semiconductor chip is moved to the position of the blade by the sheet feeding mechanism, the moving table is moved by the chip interval, transferred, and the chips can be easily rearranged. By adjusting the transfer position, the chip spacing after transfer can be adjusted, so that chips can be re-inserted at precise intervals without being affected by mechanical problems of the device or uneven sheet elongation as in the past. Can be arranged.

FIG. 5 is a configuration diagram showing a second embodiment of the chip arrangement device according to the present invention. This chip arrangement device includes a sheet fixing and moving mechanism 22 including two rollers around which both ends of the first sheet 11 are wound. The sheet fixing and moving mechanism 22 fixes the first sheet in a state where the first sheet is stretched between the two rollers, and can move in parallel with the glass table 14 in the axial direction of the rollers and the direction perpendicular thereto.

The first sheet 11 is moved by the sheet fixing and moving mechanism 22 (moving speed a), and the second sheet 13 is moved by the chip rearrangement mechanism 15 (moving speed b). Here, it is assumed that a <b when the chip interval is enlarged and a> b when the chip interval is reduced. By adjusting the numerical values of a and b in this way, the magnification of the enlargement (reduction) of the chip interval is adjusted. As described above, after transferring the chips 16 for each row, the second sheet 13 is set as the first sheet on the sheet fixed moving mechanism 22 in a state rotated by 90 degrees, and the chip transfer is performed.

In this embodiment, since the first sheet 11 is moved while both ends are fixed, a tensile stress is less applied than in the first embodiment, and the chip arrangement on the first sheet is less likely to be disturbed. Therefore, even in the chip arrangement after the transfer, the arrangement can be performed at a more uniform chip interval.

FIG. 6 is a block diagram showing a third embodiment of the chip arrangement device according to the present invention. This chip arrangement device includes a sheet fixing mechanism 32 composed of two rollers wound around both ends of the first sheet 11, and a blade moving mechanism (not shown) capable of moving the blade 17 in parallel with the glass table.
The sheet fixing mechanism 32 is fixed in a state where the first sheet is stretched between the two rollers and does not move. Other parts are the same as in the first embodiment.

After setting the first sheet 11 and the second sheet 13, the blade 17 is moved to the position of the semiconductor chip by the blade moving mechanism, lowered, and the chip 16 is transferred from the first sheet 11 to the second sheet 13. . The second sheet is moved by the chip rearrangement mechanism 15 so as to have a desired chip interval. By repeating this operation, the chips 16 can be sequentially arranged at desired chip intervals.

Since the structure of the blade moving mechanism only requires the movement of the blade 17, it is simpler and less expensive than the structure in which two rollers are moved like the above-mentioned sheet feeding mechanism 12 and sheet fixing moving mechanism 22. Has the advantage that

FIG. 7 is a block diagram showing a fourth embodiment of the chip arrangement device according to the present invention. In the first embodiment, a CCD camera 18 as an image pickup device is provided below the glass table 14 at a chip stamping position. The glass table 14 is a transparent material, and if the second sheet 13 is transparent, the position of the chip 16 transferred to the second sheet can be confirmed. For this reason, accurate chip alignment becomes possible, and rearrangement can be performed at an accurate chip interval.

FIG. 8 is a block diagram showing a fifth embodiment of the chip arrangement device according to the present invention. This chip arrangement apparatus is characterized in that a suction mechanism is provided on a glass table 14 on which a second sheet 13 is placed in the fourth embodiment. In the suction mechanism, suction grooves 19 are formed on the surface of the glass table 14, and vacuum holes are provided in several places of the grooves 19. Air is sucked out from the vacuum hole by a vacuum pump. When the second sheet 13 is mounted on the glass table 14 and air is sucked out from the vacuum holes, the second sheet 13
Are fixed by suction in the suction groove 19, and are hardly displaced.

Using the chip arrangement device of the fourth embodiment,
Specific measurement results of the chip interval are shown below. Before enlargement, the enlargement ratio is 0% (that is, the chips are in contact with each other)
The sheet A was enlarged so as to have an enlargement ratio of 50% (the chip interval was half of one side of the chip size). Specific conditions are as follows: a: 1 mm / sec b: 2 mm / sec Chip size: 300 μm square First sheet: adhesive strength 50 g / 25 mm Second sheet: adhesive strength 400 g / 25 mm, UV sheet Set chip interval: 150 μm.

FIG. 9 shows the measurement results when the enlargement is performed under these conditions. According to this result, after the final enlargement is completed (after both vertical and horizontal enlargement), the average and the variation of the chip spacing in the plane are as follows: Average of the chip spacing: 150.8 μm Variation of the chip spacing: 150 μm + 3% ~ -1
% Met.

On the other hand, according to an apparatus using the conventional technique (stretching a sheet on which chips are arranged), FIG.
As in the case of 0, the average and the variation of the chip spacing in the plane are as follows: Average of the chip spacing: 148.2 μm Variation of the chip spacing: 150 μm + 8% to −1
1%.

As a result, in the present invention, it can be said that the variation in the chip interval can be reduced to about 1/5 as compared with the conventional technique.

[0035]

According to the first to ninth aspects of the present invention, the semiconductor chip is transferred while shifting the position of the first sheet and the second sheet in the parallel direction, so that the chip after transfer is adjusted by adjusting the position. The spacing can be adjusted, and the chips can be rearranged at a precise spacing without being affected by the mechanical problems of the apparatus or the non-uniformity of the elongation of the sheet as in the related art. There is an effect that die bonding is not left behind due to distortion of the chip arrangement, and efficient production can be performed.

In addition to the above effects, there are the following effects. According to the invention of claim 2, there is provided a sheet feeding mechanism for moving the first sheet, and a moving table for mounting and moving the second sheet, and the semiconductor chip is moved to the position of the blade by the sheet feeding mechanism. Since the table is moved and moved by the chip interval, the chips can be easily rearranged.

According to the third aspect of the present invention, the first sheet fixing and moving mechanism is configured to move in parallel while the both ends of the first sheet are fixed, so that the first sheet is less likely to be subjected to tensile stress. The chip arrangement on one sheet is unlikely to be uneven. As a result, also in the transfer to the second sheet,
Rearrangement can be performed at a more uniform chip interval.

According to the fourth aspect of the present invention, since the blade is moved by the blade moving mechanism, the structure can be simplified as compared with other methods of moving the sheet, and an inexpensive apparatus can be provided. Can be.

According to the fifth aspect of the present invention, since a material having a small elongation is used for the first sheet, it is difficult for the chip interval of the first sheet to become non-uniform due to the elongation of the sheet. The chip arrangement becomes uniform by the transfer.

According to the sixth aspect of the present invention, since the second sheet having a higher adhesive strength than the first sheet is used, the transfer of the chip from the first sheet to the second sheet is facilitated, and the transfer cannot be performed. It is possible to prevent chips from being left on the first sheet.

According to the seventh aspect of the present invention, since a slippery material is used for the tip of the blade, the frictional force between the blade and the first sheet can be reduced, the tensile stress on the first sheet can be reduced, and the uniformity can be obtained. The chip arrangement can be done.

According to the eighth aspect of the present invention, since the position of the chip is optically confirmed before the transfer with the image pickup device, the chip can be transferred from the first sheet to the second sheet at a precise chip interval. .

According to the ninth aspect of the present invention, since the moving table is provided with the suction mechanism, the second sheet is less likely to be displaced, and the chips can be arranged at a precise chip interval.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of a chip arrangement device according to the present invention.

FIG. 2 is an explanatory diagram showing a chip arrangement stuck on a first sheet.

FIG. 3 is an explanatory view showing chip rearrangement transferred onto a second sheet while expanding the chip interval only in the horizontal direction.

FIG. 4 is an explanatory diagram showing chip rearrangement in which chip intervals in the vertical direction are enlarged.

FIG. 5 is a configuration diagram showing a second embodiment of the chip arrangement device according to the present invention.

FIG. 6 is a configuration diagram showing a third embodiment of the chip arrangement device according to the present invention.

FIG. 7 is a configuration diagram showing a fourth embodiment of the chip arrangement device according to the present invention.

FIG. 8 is a configuration diagram showing a fifth embodiment of the chip arrangement device according to the present invention.

FIG. 9 is an explanatory diagram showing measurement results when chips are rearranged by the chip arrangement device of the fourth embodiment.

FIG. 10 is an explanatory diagram showing measurement results when chips are rearranged by a conventional chip arrangement device.

FIG. 11 is a configuration diagram showing a conventional chip arrangement device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 1st sheet 12 Sheet feed mechanism 13 2nd sheet 14 Glass table 15 Chip rearrangement mechanism 16 Chip 17 Blade

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/50 H01L 21/301 H01L 21/52 H01L 21/60

Claims (9)

(57) [Claims] 1. A first sheet on which semiconductor chips are arranged and adhered on one surface, a second sheet on which an adhesive surface is opposed to a semiconductor chip arrangement surface of the first sheet, and a semiconductor chip arrangement surface of the first sheet A linear blade for pressing the semiconductor chip from the back surface thereof and transferring the semiconductor chip to the second sheet, wherein the positions of the first sheet and the second sheet in the parallel direction are shifted so as to have a predetermined chip interval. A chip array device for transferring the semiconductor chip while transferring the semiconductor chip. 2. A sheet feeding mechanism for moving the semiconductor chip to be transferred to the position of the blade by sending out the first sheet on the one hand and winding it on the other hand, and a moving table for mounting and moving the second sheet. And a first sheet feeding mechanism and a moving table that move the first table.
2. The chip arrangement device according to claim 1, wherein the positions of the sheet and the second sheet in the parallel direction are shifted. 3. A sheet fixing and moving mechanism comprising: a sheet fixing and moving mechanism that fixes the first sheet and can move in parallel with the second sheet; and a moving table that mounts and moves the second sheet. 2. The chip arrangement device according to claim 1, wherein the positions of the first sheet and the second sheet in the parallel direction are shifted by adjusting a moving speed of the moving table and a moving speed of the moving table. 3. 4. A sheet fixing mechanism for fixing the first sheet, a moving table on which the second sheet is mounted and moved, and a semiconductor chip for transferring the blade in a direction parallel to the second sheet. The chip arrangement device according to claim 1, further comprising a blade moving mechanism for moving the blade to a position. 5. The chip arrangement device according to claim 1, wherein the adhesive surface of the second sheet has a stronger adhesive force than the adhesive surface of the first sheet. 6. The chip arrangement device according to claim 1, wherein the first sheet is made of a material having a small elongation. 7. The chip arrangement device according to claim 1, wherein a material having a high slip property is used for a tip portion of said blade. 8. The semiconductor device wherein the second sheet and the moving table are made of a transparent material, and an image pickup unit is provided for picking up an image from a side of the moving table opposite to the second sheet mounting surface, and the semiconductor transferred by the image pickup unit. 5. The chip arrangement device according to claim 2, wherein the position of the chip is confirmed. 9. The chip arrangement device according to claim 2, wherein the moving table is provided with a suction mechanism for vacuum-sucking the second sheet.