CN109994411A - Wafer transfer device and wafer transfer method - Google Patents
Wafer transfer device and wafer transfer method Download PDFInfo
- Publication number
- CN109994411A CN109994411A CN201910294298.4A CN201910294298A CN109994411A CN 109994411 A CN109994411 A CN 109994411A CN 201910294298 A CN201910294298 A CN 201910294298A CN 109994411 A CN109994411 A CN 109994411A
- Authority
- CN
- China
- Prior art keywords
- wafer
- substrate
- disks
- moving assembly
- mobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 239000000126 substance Substances 0.000 claims abstract description 16
- 230000000007 visual effect Effects 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 14
- 235000012431 wafers Nutrition 0.000 description 212
- 241000196324 Embryophyta Species 0.000 description 22
- 238000010586 diagram Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 240000007643 Phytolacca americana Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafer transfer devices and wafer transfer method, by first movement mechanism, so that substrate is moved to the first predeterminated position；Again by the second mobile mechanism, so that wafer disks are moved to the second predeterminated position, at this point, wafer disks are correspondingly arranged with substrate, that is, the plant crystalline substance position on the wafer and substrate in wafer disks is correspondingly arranged；Then, by ejecting mechanism, so that the wafer in wafer disks is directly ejected to substrate.In this way, wafer is directly transferred on substrate by this wafer transfer device from wafer disks, intermediate transfer link is eliminated, greatly improves wafer transfer efficiency.Simultaneously, this wafer transfer device is in wafer transfer process, pass through first movement mechanism and the second mobile mechanism, adjust the corresponding position of wafer disks and substrate, so that wafer is accurately positioned on the plant crystalline substance position of substrate, without going positioning to plant brilliant position again after picking up wafer by transfer arm, in this way, greatly improving the transfer precision of wafer.
Description
Technical field
The present invention relates to semiconductor processing technology fields, more particularly to a kind of wafer transfer device and wafer transfer side
Method.
Background technique
In semiconducter process, need for wafer to be transferred on substrate from wafer disks.Traditional branch mode is usual
Using transfer arm, wafer is drawn from wafer disks, is then transferred on substrate.However, with the quick hair of semicon industry
Exhibition, semiconductor product is gradually intended to Highgrade integration, this requirement for wafer size is then the smaller the better, for example, mini
LED and Micro LED.Since wafer size becomes small, traditional transfer method is difficult wafer accurately and efficiently
It is assembled on target position.
Summary of the invention
Based on this, it is necessary to provide a kind of wafer transfer device and wafer transfer method, can effectively and accurately shift crystalline substance
Circle.
Its technical solution is as follows:
A kind of wafer transfer device, comprising: first movement mechanism, the first movement mechanism are used for installation base plate, and institute
First movement mechanism is stated for moving substrate；Second mobile mechanism, second mobile mechanism are used to install wafer disks, and described
Second mobile mechanism is correspondingly arranged for being moved to the wafer disks with the substrate；And ejecting mechanism, the ejecting mechanism
For ejecting the wafer in the wafer disks to the substrate.
Above-mentioned wafer transfer device, by first movement mechanism, so that substrate is moved to the first predeterminated position；Pass through again
Second mobile mechanism, so that wafer disks are moved to the second predeterminated position, at this point, wafer disks are correspondingly arranged with substrate, that is, wafer disks
On wafer and substrate on plant crystalline substance position be correspondingly arranged；Then, by ejecting mechanism, so that the wafer in wafer disks directly pushes up
Out on substrate.In this way, wafer is directly transferred on substrate by this wafer transfer device from wafer disks, intermediate transfer is eliminated
Link greatly improves wafer transfer efficiency.Meanwhile this wafer transfer device passes through first movement in wafer transfer process
Mechanism and the second mobile mechanism adjust the corresponding position of wafer disks and substrate, so that wafer is accurately positioned in the plant of substrate
On brilliant position, without going positioning to plant brilliant position again after picking up wafer by transfer arm, in this way, greatly improving the transfer of wafer
Precision.
Wafer transfer device further includes visual mechanisms in one of the embodiments, and the visual mechanisms are used for described
Substrate and the wafer disks carry out capture, and export the location information of the substrate Yu the wafer disks respectively.
The ejecting mechanism includes the first actuator, mounting base and top, the top dress in one of the embodiments,
It is located in the mounting base, the output end of the mounting base and first actuator is sequentially connected, and first actuator is used
In driving the top that the wafer is transferred on the substrate.
The ejecting mechanism further includes guide rail and slides with the guide rail is slidably matched first in one of the embodiments,
Moving part, the mounting base are installed on first sliding part.
The first actuator is voice coil motor in one of the embodiments,.
The first movement mechanism includes first movement component, the second moving assembly and dress in one of the embodiments,
The first load-bearing part being located on second moving assembly, second moving assembly are installed on the first movement component,
The first movement component drives second moving assembly to move along a first direction, and second moving assembly drives first
Load-bearing part is moved along second direction, and the first direction intersects setting with the second direction, and first load-bearing part is used for
The substrate is installed.
Second mobile mechanism includes third moving assembly, the 4th moving assembly and dress in one of the embodiments,
The second load-bearing part being located on the 4th moving assembly, the 4th moving assembly are installed on the third moving assembly,
The third moving assembly drives the 4th moving assembly to move along third direction, and the 4th moving assembly drives second
Load-bearing part is moved along fourth direction, and the third direction intersects setting with the fourth direction, and second load-bearing part is used for
The wafer disks are installed.
The first direction is arranged in parallel with the fourth direction in one of the embodiments, the second direction with
The third direction is arranged in parallel.
The first direction is arranged in parallel with the third direction in one of the embodiments, the second direction with
The fourth direction is arranged in parallel.
First movement component includes the second actuator and the second sliding part in one of the embodiments, and described second is sliding
The output end of moving part and second actuator is sequentially connected, and second moving assembly is installed on second sliding part.
A kind of wafer transfer method, includes the following steps: moving substrate, and the substrate is located at the first predeterminated position；It moves
The wafer disks are located at the second predeterminated position by dynamic wafer disks, and by the plant on the wafer and the substrate in the wafer disks
Brilliant position is correspondingly arranged with top；The mobile top, by the top from the wafer disks backwards to the side of the wafer
It will be on the wafer top to the brilliant position of corresponding plant at face.
Substrate is located at the first predeterminated position by above-mentioned wafer transfer method, moving substrate；Wafer disks are moved again, it will be brilliant
Disk is located at the second predeterminated position, at this point, wafer disks are correspondingly arranged with substrate, that is, the plant on wafer and substrate in wafer disks
Brilliant position is correspondingly arranged；Then, by top, the wafer in wafer disks is directly ejected to substrate.In this way, this wafer shifts
Wafer is directly transferred on substrate by method from wafer disks, eliminates intermediate transfer link, greatly improves wafer transfer effect
Rate.Meanwhile this wafer transfer method is in wafer transfer process, by adjusting the corresponding position of wafer disks and substrate, so that brilliant
Circle is accurately positioned on the plant crystalline substance position of substrate, without going positioning to plant brilliant position again after picking up wafer by transfer arm, in this way,
Greatly improve the transfer precision of wafer.
The step in one of the embodiments, further include: the top is detached from the wafer by the mobile top
Panel surface；The substrate and the wafer disks are moved respectively, it will be on the next wafer and the substrate in the wafer disks
The brilliant position of next plant is correspondingly arranged with the top；The mobile top, by the wafer top to the brilliant position of corresponding plant
On.
The spacing between second predeterminated position and first predeterminated position is in one of the embodiments,
0.1mm~2mm.
Detailed description of the invention
Fig. 1 is wafer transfer device structural schematic diagram described in one embodiment of the invention；
Fig. 2 is ejecting mechanism schematic diagram described in one embodiment of the invention；
Fig. 3 is structure enlargement diagram at Fig. 2 centre circle A；
Fig. 4 is that first movement mechanism described in one embodiment of the invention and the second mobile mechanism cooperate schematic diagram；
Fig. 5 is wafer transfer process schematic diagram described in one embodiment of the invention；
Fig. 6 is wafer transfer method flow chart described in one embodiment of the invention；
Fig. 7 is wafer transfer method flow chart described in another embodiment of the present invention.
Description of symbols:
100, wafer transfer device, 110, first movement mechanism, 111, first movement component, the 1111, second actuator,
1112, the second sliding part, the 112, second moving assembly, 1121, third actuator, the 113, first load-bearing part, 120, second is mobile
Mechanism, 121, third moving assembly, 1211, fourth drive member, 1212, third sliding part, the 122, the 4th moving assembly, 1221,
5th actuator, the 123, second load-bearing part, 130, ejecting mechanism, the 131, first actuator, 132, mounting base, 133, top,
1331, ejection face, 1332, pyramidal structure, 134, guide rail, the 135, first sliding part, 136, grating sensing component, 137, bracket,
138, attachment base, 139, fixture, 140, visual mechanisms, 150, limit switch, 160, drag chain, 200, substrate, 300, wafer disks,
310, blue film, 320, wafer.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only to solve
The present invention is released, and the scope of protection of the present invention is not limited.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
Heretofore described " first ", " second " do not represent specific quantity and sequence, are only used for the differentiation of title.
In one embodiment, referring to FIG. 1, a kind of wafer transfer device 100, including first movement mechanism 110, second
Mobile mechanism 120 and ejecting mechanism 130.First movement mechanism 110 is used for installation base plate 200, and first movement mechanism 110 is used for
Moving substrate 200.Second mobile mechanism 120 is for installing wafer disks 300, and the second mobile mechanism 120 is used for wafer disks 300
It is moved to and is correspondingly arranged with substrate 200.Ejecting mechanism 130 is used for the ejection of wafer 320 in wafer disks 300 to substrate 200.
Above-mentioned wafer transfer device 100, by first movement mechanism 110, so that substrate 200 is moved to the first default position
It sets；Again by the second mobile mechanism 120, so that wafer disks 300 are moved to the second predeterminated position, at this point, wafer disks 300 and substrate
200 are correspondingly arranged, that is, the wafer 320 in wafer disks 300 is correspondingly arranged with the plant crystalline substance position on substrate 200；Then, pass through top
Mechanism 130 out, so that the wafer 320 in wafer disks 300 is directly ejected to substrate 200.In this way, this wafer transfer device 100
Wafer 320 is directly transferred on substrate 200 from wafer disks 300, intermediate transfer link is eliminated, greatly improves wafer
320 transfer efficiencies.Meanwhile this wafer transfer device 100 passes through first movement mechanism 110 and in 320 transfer process of wafer
Two mobile mechanisms 120 adjust the corresponding position of wafer disks 300 and substrate 200, so that wafer 320 is accurately positioned in substrate
On 200 plant crystalline substance position, without going positioning to plant brilliant position again after picking up wafer 320 by transfer arm, in this way, greatly improving
The transfer precision of wafer 320.Wherein, the wafer disks 300 of the present embodiment and substrate 200, which are correspondingly arranged, is interpreted as wafer disks 300
On wafer 320 and the plant crystalline substance position on substrate 200 it is just corresponding, in this way, being accurately transferred on substrate 200 convenient for wafer 320.
Optionally, the spacing between the first predeterminated position and the second predeterminated position is 0.1mm~2mm, that is, after being correspondingly arranged
Substrate 200 and wafer disks 300 after being correspondingly arranged between spacing be 0.1mm~2mm, in this way, making the base after being correspondingly arranged
Plate 200 and wafer disks 300 keep relatively short distance, shorten the transfer distance of wafer 320, so that wafer 320 is accurately transferred to substrate
On 200, wafer 320 is avoided to shift in long range transfer process and lead to not accurately shift.Meanwhile it being also beneficial to mention
The transfer efficiency of high wafer 320.
Specifically, the spacing between the first predeterminated position and the second predeterminated position is 2mm.The present embodiment is by the first default position
It sets and is designed as 2mm with the second predeterminated position, it is intended that not only contribute to improve the transfer precision and efficiency of wafer 320, and
And it also effectively avoids causing the wafer 320 after transfer to be adsorbed on crystalline substance again because the first predeterminated position and the second predeterminated position are excessively close
On disk 300.
Further, wafer transfer device 100 further includes visual mechanisms 140.Visual mechanisms 140 be used for substrate 200 with
Wafer disks 300 carry out capture, and the location information of output substrate 200 and wafer disks 300 respectively.In this way, passing through visual mechanisms
140, the location information of substrate 200 Yu wafer disks 300 is accurately positioned out, will pass through first movement mechanism 110 and the second movement
Substrate 200 and wafer disks 300 are moved to required position by mechanism 120.
Optionally, visual mechanisms 140 may be provided on ejecting mechanism 130, may also be arranged on ejecting mechanism 130.Work as view
Feel that mechanism 140 is arranged when on ejecting mechanism 130, the ejection end of the camera shooting end alignment ejecting mechanism 130 of visual mechanisms 140, such as
This, enables visual mechanisms 140 to be more convenient, accurately acts at the ejection end of ejecting mechanism 130 on wafer 320.
In one embodiment, Fig. 2 and Fig. 5 are please referred to, ejecting mechanism 130 includes the first actuator 131, mounting base 132
And top 133.Top 133 is installed in mounting base 132.The transmission connection of the output end of mounting base 132 and the first actuator 131,
First actuator 131 is for driving top 133 that wafer 320 is transferred to substrate 200.It follows that working as substrate 200 and wafer
When disk 300 is moved to required position, start the first actuator 131, it is mobile to drive mounting base 132, and drives top 133 to wafer
Disk 300 is moved, at this point, top 133 is against on wafer 320 on the one side of wafer 320 from wafer disks 300；With
Wafer 320 is gradually lifted off wafer disks 300 by the operation of the first actuator 131, top 133, and rapidly shifts wafer 320 in base
On plate 200, in this way, efficiently accomplishing the transfer tasks of wafer 320.The present embodiment is made by the first actuator 131 and top 133
It obtains wafer 320 fast and accurately to shift on substrate 200, greatly improves the transfer efficiency of wafer 320 and the transfer of wafer 320
Precision.Wherein, the first actuator 131 can be hydraulic cylinder, cylinder, electric cylinders, motor or other driving equipments.
Further, ejecting mechanism 130 further includes guide rail 134 and the first sliding part 135 being slidably matched with guide rail 134.
Mounting base 132 is installed on the first sliding part 135.In this way, by the first sliding part 135 and guide rail 134, so that top 133 is moved
It is dynamic more stable, so that top 133 is conducive to more accurately by the transfer of wafer 320 on the plant crystalline substance position of substrate 200
Improve the transfer precision of wafer 320.Specifically in the present embodiment, ejecting mechanism 130 further includes bracket 137 and is installed in bracket
Attachment base 138 on 137, guide rail 134 and the first actuator 131 are arranged on attachment base 138.Meanwhile on attachment base 138 also
Equipped with grating sensing component 136, by grating sensing component 136, the moving distance of top 133 is accurately measured.
In one embodiment, Fig. 2, Fig. 3 and Fig. 5 are please referred to, top 133 includes ejection face 1331, and ejection face 1331 is used
In being bonded setting with 320 surface of wafer.In this way, when top 133 is withstood on wafer 320, due to the ejection face 1331 of top 133
It is bonded setting with 320 surface of wafer, therefore, increases the contact surface between top 133 and wafer 320, avoids in transfer process,
The marking is left on 320 surface of wafer.Simultaneously as ejection face 1331 is bonded setting with 320 surface of wafer, therefore, shifting
Cheng Zhong, 320 surface stress of wafer is more uniform, so that wafer 320 is in steady state always in transfer process, so that
Wafer 320 is more stable, accurately shifts on substrate 200.Specifically in the present embodiment, the 133 tapered knot in one end is come directly towards
Structure 1332 is arranged, in this way, top 133 is made to be easy to poke the blue film 310 in wafer disks 300, it can will be brilliant to come directly towards 133
On 320 top to substrate 200 of circle.
In one embodiment, ejecting mechanism 130 further includes fixture 139, and top 133 is installed in installation by fixture 139
On seat 132.In this way, by fixture 139, stable holding top 133, so that top 133 more accurately acts on wafer 320.
Meanwhile by the fixture 139, the dismounting of top 133 is also greatly facilitated, is conducive to the assembling for improving wafer transfer device 100
Efficiency.
Further, top 133 is multiple, and multiple 133 intervals of top are installed on fixture 139.It was shifted in wafer 320
Cheng Zhong, the spacing between pre-adjusted top 133 and top 133, enables multiple tops 133 to correspond to wafer disks simultaneously
Multiple wafers 320 on 300.In this way, multiple tops 133 are simultaneously by multiple wafers 320 top to base when the first actuator 131 of starting
On plate 200, in this way, greatly improving the transfer efficiency of wafer 320.
In one embodiment, the first actuator 131 is voice coil motor.When the first actuator 131 is voice coil motor, the
One actuator 131 can accurately control the output pressure for acting on ejecting mechanism 130, so as to ejecting mechanism 130 can effectively by
Wafer 320 ejects wafer disks 300, and shifts on substrate 200, meanwhile, ejecting mechanism 130 can be also accurately controlled by wafer
320 are pressed in the output pressure on substrate 200, and ejecting mechanism 130 is avoided to crush wafer 320 in substrate due to output pressure is excessive
On 200.Meanwhile the first actuator 131 is designed as voice coil motor, by incuding the curent change of voice coil motor, accurate judgement
Top 133 acts in wafer disks 300 or on substrate 200 out.
In one embodiment, Fig. 1 and Fig. 4 are please referred to, first movement mechanism 110 includes first movement component 111, second
Moving assembly 112 and the first load-bearing part 113 being installed on the second moving assembly 112.Second moving assembly 112 is installed in first
On moving assembly 111, first movement component 111 drives the second moving assembly 112 to move along a first direction, the second moving assembly
112 drive the first load-bearing part 113 to move along second direction, and first direction intersects setting, the first load-bearing part 113 with second direction
For installation base plate 200.It follows that by first movement component 111 and the second moving assembly 112, so that being arranged first
Substrate 200 on load-bearing part 113 can be moved with second direction along a first direction, so that substrate 200 can be quasi-
Really, it is moved easily to required position.Specifically in the present embodiment, first direction is vertical setting with second direction, in this way, making
The position adjustment for obtaining substrate 200 becomes more convenient.Specifically in the present embodiment, the first load-bearing part 113 is multiple, multiple first
Load-bearing part 113 is arranged at intervals on the second moving assembly 112, in this way, making when the wafer 320 for completing a upper substrate 200 shifts
When industry, front substrate 200 is moved to by required position by the second moving assembly 112, in this way, avoiding the need for repeatedly replacing substrate
200 and cause 320 transfer efficiency of wafer reduction.Wherein, the first direction and second direction of the present embodiment in order to facilitate understanding, with
For Fig. 4, first direction and second direction are respectively S in Fig. 41With S2The direction of expression.
Further, the second mobile mechanism 120 includes third moving assembly 121, the 4th moving assembly 122 and is installed in the
The second load-bearing part 123 on four moving assemblies 122.4th moving assembly 122 is installed on third moving assembly 121.Third is moved
Dynamic component 121 drives the 4th moving assembly 122 to move along third direction.4th moving assembly 122 drives the second load-bearing part 123
It is moved along fourth direction.Third direction intersects setting with fourth direction.Second load-bearing part 123 is for installing wafer disks 300.By
This is it is found that pass through third when substrate 200 is moved to required position by first movement component 111 and the second moving assembly 112
Moving assembly 121 and the 4th moving assembly 122 enable the wafer disks 300 being arranged on the second load-bearing part 123 along third
Direction is moved with fourth direction so that wafer disks 300 can it is accurate, be moved easily to required position.Specifically exist
In the present embodiment, the second load-bearing part 123 be it is multiple, multiple second load-bearing parts 123 are arranged at intervals on the 4th moving assembly 122,
In this way, when completing 320 transfer tasks of wafer of upper wafer disks 300, by the 4th moving assembly 122 by current wafer disk
300 are moved to required position, in this way, avoiding the need for repeatedly replacing wafer disks 300 and leading to the reduction of 320 transfer efficiency of wafer.Its
In, the third direction and fourth direction of the present embodiment in order to facilitate understanding, by taking Fig. 4 as an example, third direction and fourth direction are distinguished
For S in Fig. 43With S4The direction of expression.
Further, first direction is arranged in parallel with fourth direction, and second direction is arranged in parallel with third direction.Thus
It is found that the first movement component 111 of the present embodiment is arranged in parallel with the 4th moving assembly 122, the second moving assembly 112 and third
Moving assembly 121 is arranged in parallel.In this way, need to only synchronize driving first movement component when needing to shift next wafer 320
111 and the 4th moving assembly 122 or the second moving assembly 112 and third moving assembly 121, it can be by next wafer 320
With just corresponding 133 setting of top of next transferring position, the position tune of substrate 200 Yu wafer disks 300 is greatly facilitated in this way
It is whole.Specifically in the present embodiment, first direction is vertical setting with second direction, third direction with fourth direction is perpendicular sets
It sets, it follows that first movement component 111 is vertical setting with the second moving assembly 112, third moving assembly 121 and the 4th
Moving assembly 122 is vertical setting.Wherein, the present embodiment be arranged in parallel be understood to include it is absolute parallel setting with it is approximate put down
Row setting, the angle of intersection of less parallel setting are 0 °~10 °.
In another embodiment, first direction is arranged in parallel with third direction.Second direction is parallel with fourth direction to be set
It sets.It follows that the first movement component 111 of the present embodiment is arranged in parallel with third moving assembly 121, the second moving assembly
112 and the 4th moving assembly 122 (specific structure is not shown) is arranged in parallel.In this way, when needing to shift next wafer 320
When, it need to only synchronize driving first movement component 111 and third moving assembly 121 or the second moving assembly 112 and the 4th is mobile
Component 122, can be by next wafer 320 and just corresponding 133 setting of top of next transferring position.Meanwhile it holding when first
Holder 113 be it is multiple, the second load-bearing part 123 be it is multiple when, set since the second actuator 1111 is parallel with fourth drive member 1211
It sets, therefore, in 320 transfer process of wafer, can guarantee that multiple wafer disks 300 are set with multiple substrates 200 one-to-one correspondence simultaneously
It sets, in this way, greatly improving the transfer efficiency of wafer 320.Wherein, being arranged in parallel for the present embodiment is understood to include absolute put down
Row setting is arranged with less parallel, and the angle of intersection of less parallel setting is 0 °~10 °.
In one embodiment, first movement component 111 includes the second actuator 1111 and the second sliding part 1112.Second
The transmission connection of the output end of sliding part 1112 and the second actuator 1111.Second moving assembly 112 is installed in the second sliding part
On 1112.In this way, by the second actuator 1111 and the second sliding part 1112, so that the second moving assembly 112 is along first party
To more stable movement.Specifically in the present embodiment, the second moving assembly 112 includes third actuator 1121 and third sliding part
1212.The output end of third sliding part 1212 and third actuator 1121 is sequentially connected.It is sliding that first load-bearing part 113 is installed in third
On moving part 1212.Meanwhile first movement component 111 and the second moving assembly 112 include limit switch 150 and drag chain 160, are led to
Limit switch 150 is crossed, the moving range of the second moving assembly 112 and the first load-bearing part 113 can be accurately controlled.Pass through drag chain
160, so that cable obtains effective protection, it effectively prevent cable in moving process by pinch off.Wherein, the second actuator 1111 with
Third actuator 1121 can be hydraulic cylinder, cylinder, electric cylinders, motor or other driving equipments.
In one embodiment, third moving assembly 121 includes fourth drive member 1211 and the 4th sliding part.4th sliding
Part and the output end of fourth drive member 1211 are sequentially connected.4th moving assembly 122 is installed on the 4th sliding part.In this way, logical
Fourth drive member 1211 and the 4th sliding part are crossed, so that the 4th moving assembly 122 is moved along third direction is more stable.Specifically
In the present embodiment, the 4th moving assembly 122 includes the 5th actuator 1221 and the 5th sliding part.5th sliding part and the 5th drives
The output end of moving part 1221 is sequentially connected.Second load-bearing part 123 is installed on the 5th sliding part.Meanwhile third moving assembly 121
The 4th can be accurately controlled by limit switch 150 including limit switch 150 and drag chain 160 with the 4th moving assembly 122
The moving range of moving assembly 122 and the second load-bearing part 123.By drag chain 160, so that cable obtains effective protection, it is effectively anti-
Only cable is in moving process by pinch off.Wherein, fourth drive member 1211 and the 5th actuator 1221 can be hydraulic cylinder, gas
Cylinder, electric cylinders, motor or other driving equipments.
In one embodiment, Fig. 1, Fig. 5 and Fig. 6 are please referred to, a kind of wafer transfer method includes the following steps:
S10: substrate 200 is located at the first predeterminated position by moving substrate 200；
S20: wafer disks 300 are located at the second predeterminated position by mobile wafer disks 300, and by the wafer in wafer disks 300
320 are correspondingly arranged with top 133 with the plant crystalline substance position on substrate 200；
S30: wafer 320 is pushed up top 133 from wafer disks 300 by mobile top 133 from the one side of wafer 320
To the brilliant position of corresponding plant.
Substrate 200 is located at the first predeterminated position by above-mentioned wafer transfer method, moving substrate 200；Wafer disks are moved again
300, wafer disks 300 are located at the second predeterminated position, at this point, wafer disks 300 are correspondingly arranged with substrate 200, that is, wafer disks 300
On wafer 320 be correspondingly arranged with the plant crystalline substance position on substrate 200；Then, by top 133, by the wafer in wafer disks 300
320 directly eject to substrate 200.In this way, wafer 320 is directly transferred to base from wafer disks 300 by this wafer transfer method
On plate 200, intermediate transfer link is eliminated, greatly improves 320 transfer efficiency of wafer.Meanwhile this wafer transfer method is in crystalline substance
In 320 transfer processes of circle, by adjusting the corresponding position of wafer disks 300 and substrate 200, so that wafer 320 is accurately positioned in base
On the plant crystalline substance position of plate 200, without going positioning to plant brilliant position again after picking up wafer 320 by transfer arm, in this way, being greatly improved
The transfer precision of wafer 320.
Further, referring to FIG. 7, step further include: top 133 is detached from 300 surface of wafer disks by mobile top 133
S40；Moving substrate 200 and wafer disks 300 respectively, by wafer disks 300 next wafer 320 with it is next on substrate 200
The brilliant position of a plant is correspondingly arranged S50 with top 133；Mobile top 133, will be on the top of wafer 320 to the brilliant position of corresponding plant
S60.In this way, the wafer 320 in wafer disks 300 is made all to obtain quick, accurate transfer.
In one embodiment, the spacing between the second predeterminated position and the first predeterminated position is 0.1mm~2mm.Thus
It is found that the spacing between substrate 200 after being correspondingly arranged and the wafer disks 300 after being correspondingly arranged is 0.1mm~2mm, in this way, making
Substrate 200 and wafer disks 300 after must being correspondingly arranged keep relatively short distance, shorten the transfer distance of wafer 320, so that wafer
320 are accurately transferred on substrate 200, avoid wafer 320 from shifting in long range transfer process and lead to not accurately turn
It moves.Meanwhile it being also beneficial to improve the transfer efficiency of wafer 320.Specifically in the present embodiment, the first predeterminated position and second is preset
Spacing between position is 2mm.First predeterminated position and the second predeterminated position are designed as 2mm by the present embodiment, it is intended that
It not only contributes to improve the transfer precision and efficiency of wafer 320, but also effectively avoids presetting because of the first predeterminated position and second
Position is excessively close and the wafer 320 after transfer is caused to be adsorbed in wafer disks 300 again.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of wafer transfer device characterized by comprising
First movement mechanism, the first movement mechanism is used for installation base plate, and the first movement mechanism is used for moving substrate；
Second mobile mechanism, second mobile mechanism is for installing wafer disks, and second mobile mechanism will be for will be described
Wafer disks are moved to be correspondingly arranged with the substrate；And
Ejecting mechanism, the ejecting mechanism is for ejecting the wafer in the wafer disks to the substrate.
2. wafer transfer device according to claim 1, which is characterized in that it further include visual mechanisms, the visual mechanisms
For carrying out capture to the substrate and the wafer disks, and the location information of the substrate Yu the wafer disks is exported respectively.
3. wafer transfer device according to claim 1, which is characterized in that the ejecting mechanism include the first actuator,
Mounting base and top, the top are installed in the mounting base, and the output end of the mounting base and first actuator passes
Dynamic connection, first actuator is for driving the top that the wafer is transferred to the substrate.
4. wafer transfer device according to claim 3, which is characterized in that the ejecting mechanism further include guide rail and with institute
The first sliding part that guide rail is slidably matched is stated, the mounting base is installed on first sliding part.
5. wafer transfer device according to claim 1, which is characterized in that the first movement mechanism includes first movement
Component, the second moving assembly and the first load-bearing part being installed on second moving assembly, the second moving assembly installing
On the first movement component, the first movement component drives second moving assembly to move along a first direction, institute
Stating the second moving assembly drives the first load-bearing part to move along second direction, and the first direction intersects with the second direction to be set
It sets, first load-bearing part is for installing the substrate.
6. wafer transfer device according to claim 5, which is characterized in that second mobile mechanism includes that third is mobile
Component, the 4th moving assembly and the second load-bearing part being installed on the 4th moving assembly, the 4th moving assembly installing
On the third moving assembly, the third moving assembly drives the 4th moving assembly to move along third direction, institute
Stating the 4th moving assembly drives the second load-bearing part to move along fourth direction, and the third direction intersects with the fourth direction to be set
It sets, second load-bearing part is for installing the wafer disks.
7. wafer transfer device according to claim 6, which is characterized in that the first direction and the fourth direction are flat
Row setting, the second direction are arranged in parallel with the third direction；Or the first direction is parallel with the third direction
Setting, the second direction are arranged in parallel with the fourth direction.
8. a kind of wafer transfer method, which comprises the steps of:
The substrate is located at the first predeterminated position by moving substrate；
The wafer disks are located at the second predeterminated position by mobile wafer disks, and by the wafer and the substrate in the wafer disks
On plant crystalline substance position be correspondingly arranged with top；
The mobile top, by the top from the wafer disks from the one side of the wafer by the wafer top to right
On the plant crystalline substance position answered.
9. wafer transfer method according to claim 8, which is characterized in that the step further include:
The top is detached from the wafer panel surface by the mobile top；
Move the substrate and the wafer disks respectively, by the wafer disks next wafer with it is next on the substrate
The brilliant position of a plant is correspondingly arranged with the top；
The mobile top, will be on the wafer top to the brilliant position of corresponding plant.
10. wafer transfer method according to claim 8 or claim 9, which is characterized in that second predeterminated position and described the
Spacing between one predeterminated position is 0.1mm~2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294298.4A CN109994411B (en) | 2019-04-12 | 2019-04-12 | Wafer transfer device and wafer transfer method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910294298.4A CN109994411B (en) | 2019-04-12 | 2019-04-12 | Wafer transfer device and wafer transfer method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109994411A true CN109994411A (en) | 2019-07-09 |
| CN109994411B CN109994411B (en) | 2024-05-24 |
Family
ID=67133415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910294298.4A Active CN109994411B (en) | 2019-04-12 | 2019-04-12 | Wafer transfer device and wafer transfer method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109994411B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451179A (en) * | 2021-06-29 | 2021-09-28 | 广东阿达智能装备有限公司 | Huge transfer equipment for tiny electronic components |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041471A (en) * | 2006-11-07 | 2008-05-13 | 삼성전자주식회사 | A die bonder |
| CN102024668A (en) * | 2009-09-10 | 2011-04-20 | 由田新技股份有限公司 | Combination of chip ejection device and image acquisition device |
| CN201812847U (en) * | 2010-07-13 | 2011-04-27 | 江门市新侨光电科技有限公司 | Wafer push solidifying release mechanism |
| KR20120018503A (en) * | 2010-08-23 | 2012-03-05 | 한미반도체 주식회사 | Method for setting position of picker head for semiconductor manufacturing device |
| CN107305916A (en) * | 2016-04-22 | 2017-10-31 | 中山市泓昌光电科技有限公司 | A kind of CSP encapsulation LED chip mounter and its processing technology |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| CN108493144A (en) * | 2018-05-28 | 2018-09-04 | 深圳源明杰科技股份有限公司 | Plate and wafer butt-joint equipment |
| CN209571395U (en) * | 2019-04-12 | 2019-11-01 | 广东阿达智能装备有限公司 | Wafer transfer device |
-
2019
- 2019-04-12 CN CN201910294298.4A patent/CN109994411B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080041471A (en) * | 2006-11-07 | 2008-05-13 | 삼성전자주식회사 | A die bonder |
| CN102024668A (en) * | 2009-09-10 | 2011-04-20 | 由田新技股份有限公司 | Combination of chip ejection device and image acquisition device |
| CN201812847U (en) * | 2010-07-13 | 2011-04-27 | 江门市新侨光电科技有限公司 | Wafer push solidifying release mechanism |
| KR20120018503A (en) * | 2010-08-23 | 2012-03-05 | 한미반도체 주식회사 | Method for setting position of picker head for semiconductor manufacturing device |
| CN107305916A (en) * | 2016-04-22 | 2017-10-31 | 中山市泓昌光电科技有限公司 | A kind of CSP encapsulation LED chip mounter and its processing technology |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| CN108493144A (en) * | 2018-05-28 | 2018-09-04 | 深圳源明杰科技股份有限公司 | Plate and wafer butt-joint equipment |
| CN209571395U (en) * | 2019-04-12 | 2019-11-01 | 广东阿达智能装备有限公司 | Wafer transfer device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451179A (en) * | 2021-06-29 | 2021-09-28 | 广东阿达智能装备有限公司 | Huge transfer equipment for tiny electronic components |
| CN113451179B (en) * | 2021-06-29 | 2022-03-01 | 广东阿达智能装备有限公司 | Huge transfer equipment for tiny electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109994411B (en) | 2024-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209571395U (en) | Wafer transfer device | |
| WO2020125201A1 (en) | Temperature-controlled adhesion type micro-led massive transfer method | |
| CN109994411A (en) | Wafer transfer device and wafer transfer method | |
| CN201163620Y (en) | Crystal boat converter capable of improving transfer flexibility | |
| CN110323162A (en) | A kind of flood tide transfer device and flood tide transfer method | |
| CN210956632U (en) | Transfer device of microelement | |
| CN203427046U (en) | Clamping device with self lock | |
| KR102149703B1 (en) | Variable width inspection apparatus according to size of display panel | |
| CN104752296B (en) | The positioner and reaction chamber of a kind of ejector pin mechanism | |
| KR20050084905A (en) | Tool exchange device and tool | |
| KR101328546B1 (en) | Mask stretching apparatus for manufaturing flat display pannel | |
| CN109407367B (en) | Piece printing device and method of surface light source | |
| CN213340329U (en) | Clamping carrying platform | |
| CN114447187A (en) | Chip transfer apparatus and chip transfer method | |
| CN115440642A (en) | Support plate bearing device suitable for crystal grain transfer | |
| CN110653737B (en) | Fixture positioning device for automatic micro-assembly application | |
| CN213004857U (en) | Dodging positioning mechanism and universal positioning equipment | |
| CN212083498U (en) | Wafer test bench | |
| CN100490623C (en) | Loading system and method for loading substrates with electrical components | |
| CN101842889A (en) | The device that is used for supporting workpiece | |
| KR102149698B1 (en) | Inspection apparatus capable of inspecting both sides of display panel | |
| CN107889043A (en) | Receiver processing automatic positioning equipment | |
| Li et al. | New method for mass transfer of MicroLED | |
| CN216928507U (en) | Transfer device | |
| CN216098581U (en) | Clamping fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |