CN113451179B - Huge transfer equipment for tiny electronic components - Google Patents
Huge transfer equipment for tiny electronic components Download PDFInfo
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- CN113451179B CN113451179B CN202110732032.0A CN202110732032A CN113451179B CN 113451179 B CN113451179 B CN 113451179B CN 202110732032 A CN202110732032 A CN 202110732032A CN 113451179 B CN113451179 B CN 113451179B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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Abstract
The invention discloses a huge amount transfer device for tiny electronic components, which comprises a mounting frame, a first mounting seat, a second mounting seat, a source disc mechanism, a target disc mechanism, a positioning mechanism and a puncture head mechanism, wherein the first mounting seat and the second mounting seat are respectively and oppositely mounted on the mounting frame, the source disc mechanism is mounted on the first mounting seat, the positioning mechanism and the puncture head mechanism are both mounted on the second mounting seat, the positioning mechanism and the puncture head mechanism are both positioned above the source disc mechanism, and the target disc mechanism is positioned below the source disc mechanism. The huge transfer equipment for the tiny electronic components effectively improves the transfer efficiency and the transfer accuracy of the tiny electronic components, can realize the rapid transfer of the tiny electronic components, is favorable for realizing the industrialization of huge transfer of the tiny electronic components, and solves the problems of low transfer efficiency and poor transfer accuracy of the existing transfer equipment for the tiny LED chips or the MiniLED chips.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to massive transfer equipment for tiny electronic components.
Background
The MiniLED (small-pitch light emitting diode) refers to an LED product with a chip size of 100 μm to 200 μm, and the micro LED (micro light emitting diode) refers to an LED with a chip size of 100 μm or less, which are important development directions of next generation display technologies, and compared with the OLED, the micro LED and the MiniLED have a higher dynamic range, a better contrast ratio, a wider range, and a longer life span than the OLED, so that the micro LED/MiniLED industry gradually becomes a hot spot of the whole display industry. However, the biggest difficulty in realizing mass production of micro led/MiniLED is: because the chip is small and the screen area is large, the mass production of the MicroLED/MiniLED is difficult to realize by using the traditional production processes such as electrostatic adsorption, laser transfer, flexible transfer, fluid transfer and the like at present, and the problems of low transfer efficiency and poor transfer precision exist.
Disclosure of Invention
The invention aims to provide huge transfer equipment of tiny electronic components, which effectively improves the transfer efficiency and the transfer accuracy of the tiny electronic components, can realize the quick transfer of the tiny electronic components, is beneficial to realizing the industrialization of the huge transfer of the tiny electronic components and solves the problems of low transfer efficiency and poor transfer accuracy of the existing transfer equipment of micro LED chips or MiniLED chips.
In order to achieve the purpose, the invention adopts the following technical scheme:
a huge transfer device for micro electronic components comprises a mounting frame, a first mounting seat, a second mounting seat, a source disc mechanism, a target disc mechanism, a positioning mechanism and a puncture head mechanism, wherein the first mounting seat and the second mounting seat are respectively and oppositely mounted on the mounting frame;
the source disc mechanism is used for placing a transfer film loaded with tiny electronic components; the positioning mechanism is used for positioning the position of the tiny electronic component on the transfer film and the position of the puncture head mechanism; the pricking head mechanism is used for transferring the tiny electronic components on the transfer film to the target disc mechanism in a pricking mode; the target disc mechanism is used for bearing the transferred tiny electronic components;
the micro electronic component is a micro LED chip or a MiniLED chip.
Further, the source disc mechanism comprises a first sliding seat and a sliding platform, the first sliding seat is arranged below the first mounting seat in a front-back sliding mode, the sliding platform is arranged below the first sliding seat in a left-right sliding mode, the target disc mechanism is located below the sliding platform, a clamping piece is arranged at one end, far away from the first mounting seat, of the sliding platform and used for clamping a wafer ring, and the wafer ring is provided with the transfer film.
It is further explained that the positioning mechanism comprises two positioning assemblies, two positioning assemblies are arranged at the left end of the second mounting seat, each positioning assembly comprises a positioning block, a first sliding block, a second sliding block and a first positioning machine, the positioning block is arranged at the left end of the second mounting seat, the first sliding block is arranged at the left side of the positioning block in a vertically sliding mode, the second sliding block is arranged at the left side of the first sliding block in a front-back sliding mode, the first positioning machines are arranged on the second sliding blocks, and the first positioning machines are used for positioning the positions of the micro electronic components on the transfer film.
Furthermore, the puncture head mechanism comprises a fixed seat, a voice coil motor, a puncture head arm and a puncture needle, wherein the voice coil motor is arranged in the fixed seat, the puncture head arm is connected with a rotor end of the voice coil motor, the puncture needle is arranged at one end of the puncture head arm far away from the voice coil motor, a needle head of the puncture needle faces the transfer membrane, and the puncture needle is positioned above the transfer membrane;
the voice coil motor drives the puncture needle arm to swing up and down so as to drive the puncture needle to do downward puncture movement of the tiny electronic components on the transfer film and upwards lift movement away from the transfer film.
Furthermore, a second sliding seat is arranged below the second installation seat, the second sliding seat is arranged below the second installation seat in a front-back sliding manner, and the fixed seat is arranged below the second sliding seat in a left-right moving manner.
Furthermore, the positioning mechanism further includes a second positioning camera, the second positioning camera is mounted at the left end of the second sliding seat, the second positioning camera is located at the left side of the fixing seat, the second positioning camera is located between the two first positioning cameras, the second positioning camera is located above the sliding platform, and the second positioning camera is used for positioning the position of the puncture needle.
Further, the target disc mechanism comprises a mounting table, a target disc and at least one top suction assembly, the mounting table is provided with a groove, the target disc is arranged in the groove in a sliding mode, the target disc is located below the sliding platform, the top suction assembly is arranged on the mounting table, and the top suction assembly is used for absorbing and tensioning the transfer film.
Further, the top suction assembly includes a moving plate, a mounting plate, a moving block, a bracket and a top suction disc, the moving plate 531 is disposed above the mounting table in a left-right sliding manner, the mounting plate is disposed above the moving plate in a front-back sliding manner, the moving block is disposed on one side of the mounting plate close to the sliding platform in a up-down sliding manner, one end of the bracket is mounted on the moving block, the other end of the bracket extends toward the middle of the sliding platform, the top suction disc is disposed at one end of the bracket far away from the moving block, the top suction disc is disposed above the transfer film, and a hollow hole is disposed inside the top suction disc.
Further, the two top suction assemblies are arranged on the front side and the rear side of the mounting table in the groove respectively and oppositely.
Further, the left side and the front side of the first mounting seat are both provided with a heat radiation fan, and the right side and the front side of the second mounting seat are both provided with a heat radiation fan.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. through setting the pricking head mechanism, the pricking head mechanism is positioned above the source disc mechanism, the target disc mechanism is positioned below the source disc mechanism, the tiny electronic components on the transfer film can be transferred to the target disc mechanism through the pricking head mechanism in a pricking way, and the tiny electronic components are transferred through the pricking way, so that the transferring precision is ensured, in addition, through setting the positioning mechanism, the positioning mechanism can position the positions of the tiny electronic components on the transfer film and the pricking head mechanism, so that the transferring precision of the tiny electronic components is effectively improved, the huge transferring equipment of the tiny electronic components effectively improves the transferring efficiency and the transferring precision of the tiny electronic components, can realize the quick transferring of the tiny electronic components, and is beneficial to realizing the industrialization of huge transferring of the tiny electronic components, the problems of low transfer efficiency and poor transfer precision of the existing micro electronic component transfer equipment are solved;
2. by arranging the second positioning camera, the second positioning camera can precisely position the pricking pin, so that the positions of the pricking pin and the micro electronic component to be transferred are corrected, and the transfer precision of transferring the micro electronic component on the transfer film to the target disc mechanism by the pricking head mechanism through pricking is further improved;
3. the target disc is arranged in the groove in a sliding mode, so that the position of the target disc can be conveniently adjusted, the target disc can be aligned with the wafer ring clamped by the clamping piece, in addition, the top suction assembly can tension the transfer film, and the accurate alignment and needling actions of the pricking head mechanism are facilitated after the tensioning, so that the transfer precision of the tiny electronic component is effectively improved;
4. by arranging the top suction assembly, the hollow hole of the top suction disc is a working area of the top suction disc, the pricking pin is positioned above the hollow hole when the tiny electronic components on the transfer film are pricked and transferred to the target disc mechanism, when the top suction disc moves downwards, the tiny electronic components in a small range can be tensioned on the transfer film, and accurate alignment and pricking actions of the pricking pin can be conveniently carried out after tensioning;
5. through all install radiator fan in the left side and the front side of first mount pad, and radiator fan is all installed to the right side and the front side of second mount pad, can supply source dish mechanism, positioning mechanism and thorn head mechanism dispel the heat, have guaranteed the operation effect of equipment.
Drawings
The drawings are further illustrative of the invention and the content of the drawings does not constitute any limitation of the invention.
Fig. 1 is a schematic perspective view of a bulk transfer apparatus for small electronic components according to an embodiment of the present invention;
fig. 2 is a schematic front view of a bulk transfer apparatus for small electronic components according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a source tray mechanism of a bulk transfer apparatus for minute electronic components according to an embodiment of the present invention;
fig. 4 is a schematic view of the mounting structure of the source tray mechanism, the positioning mechanism and the pricking head mechanism of the bulk transfer apparatus for minute electronic components according to the embodiment of the present invention;
fig. 5 is a schematic structural diagram of a pricking mechanism of a bulk transferring apparatus for minute electronic components according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a pricking mechanism of a bulk transferring apparatus for minute electronic components according to an embodiment of the present invention;
fig. 7 is a schematic structural view of a target tray mechanism of the bulk transfer apparatus for minute electronic components according to the embodiment of the present invention;
fig. 8 is a side view of a target tray mechanism of the bulk transfer apparatus for minute electronic components according to the embodiment of the present invention;
fig. 9 is a schematic perspective view of a bulk transfer apparatus for minute electronic components according to another embodiment of the present invention;
fig. 10 is a schematic top view of a bulk transfer apparatus for small electronic components according to another embodiment of the present invention;
fig. 11 is a schematic side view of a mass transfer apparatus for small electronic components according to another embodiment of the present invention;
in the drawings: 1-mounting frame, 11-wafer ring, 12-transfer film, 13-beam, 14-supporting seat, 2-first mounting seat, 21-first guide rail, 22-cooling fan, 3-second mounting seat, 31-second sliding seat, 311-sixth guide rail, 32-fifth guide rail, 41-first sliding seat, 411-second guide rail, 42-sliding platform, 421-clamping piece, 51-mounting table, 511-groove, 512-seventh guide rail, 52-target disc, 53-top suction component, 531-moving plate, 536-eighth guide rail, 532-mounting plate, 537-ninth guide rail, 533-moving block, 534-bracket, 535-top suction disc, 5351-hollowed-out hole, 61-positioning component, 611-positioning block, 615-third guide rail, 612-first slide block, 616-fourth guide rail, 613-second slide block, 614-first positioning camera, 62-second positioning camera, 71-fixed seat, 72-voice coil motor, 73-puncture head arm, 74-puncture needle, 75-shrapnel and 76-encoder.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "inside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 and 2, a mass transfer apparatus for a tiny electronic component includes a mounting frame 1, a first mounting base 2, a second mounting base 3, a source disc mechanism, a target disc mechanism, a positioning mechanism and a puncture head mechanism, wherein the first mounting base 2 and the second mounting base 3 are respectively and oppositely mounted on the mounting frame 1, the source disc mechanism is mounted on the first mounting base 2, the positioning mechanism and the puncture head mechanism are both mounted on the second mounting base 3, the positioning mechanism and the puncture head mechanism are both located above the source disc mechanism, and the target disc mechanism is located below the source disc mechanism;
the source disc mechanism is used for placing a transfer film 12 loaded with tiny electronic components; the positioning mechanism is used for positioning the positions of the tiny electronic components on the transfer film 12 and the position of the pricking head mechanism; the pricking head mechanism is used for transferring the tiny electronic components on the transfer film 12 to the target disc mechanism in a pricking mode; the target disc mechanism is used for bearing the transferred tiny electronic components;
the micro electronic component is a micro LED chip or a MiniLED chip.
The invention can transfer the tiny electronic components on the transfer film 12 to the target disc mechanism by needling through the pricking head mechanism by arranging the pricking head mechanism, the target disc mechanism is arranged below the source disc mechanism, the tiny electronic components can be transferred by the pricking head mechanism to the target disc mechanism in a needling manner, the tiny electronic components are transferred in a needling manner, the transfer precision is ensured, in addition, the positioning mechanism can position the positions of the tiny electronic components on the transfer film 12 and the position of the pricking head mechanism through arranging the positioning mechanism, so the transfer precision of the tiny electronic components is effectively improved, the huge transfer equipment of the tiny electronic components effectively improves the transfer efficiency and the transfer precision of the tiny electronic components, can realize the quick transfer of the tiny electronic components, and is beneficial to realizing the industrialization of huge transfer of the tiny electronic components, the problems of low transfer efficiency and poor transfer precision of the existing micro LED chip or MiniLED chip transfer equipment are solved.
Specifically, the mounting bracket 1 includes a beam 13 and two supporting seats 14, two the supporting seats 14 are parallel to each other, the beam 13 is connected two between the top of the supporting seats 14, the first mounting seat 2 and the second mounting seat 3 are respectively and relatively installed in the bottom of the beam 13, so that the mounting stability of the source disc mechanism, the positioning mechanism and the puncture head mechanism is stronger.
Further, as shown in fig. 3, the source disk mechanism includes a first sliding seat 41 and a sliding platform 42, the first sliding seat 41 is disposed below the first mounting seat 2 in a front-back sliding manner, the sliding platform 42 is disposed below the first sliding seat 41 in a left-right sliding manner, the target disk mechanism is located below the sliding platform 42, a clamping member 421 is disposed at one end of the sliding platform 42, which is far away from the first mounting seat 2, the clamping member 421 is configured to clamp the wafer ring 11, and the wafer ring 11 is provided with the transfer film 12.
Specifically, a first guide rail 21 is arranged at the right end of the first mounting seat 2, the first guide rail 21 is arranged along the front-back direction, the first sliding seat 41 is mounted on the first guide rail 21 in a front-back sliding manner, the first sliding seat 41 is provided with a first driving device, and the first driving device drives the first sliding seat 41 to move along the first guide rail 21 in a front-back sliding manner, so as to drive the sliding platform 42 to move forwards or backwards;
the bottom surface of the first sliding seat 41 is provided with a second guide rail 411, the second guide rail 411 is arranged along the left-right direction, the sliding platform 42 is installed on the second guide rail 411 in a left-right sliding manner, the sliding platform 42 is provided with a second driving device, and the second driving device drives the sliding platform 42 to move left and right along the second guide rail 411, so that the sliding platform 42 can move back and forth or left and right to change the position of the wafer ring 11, and micro electronic components on the transfer film 12 can be conveniently transferred to different positions of the target disc mechanism.
Specifically, the wafer ring 11 is provided with the transfer film 12, a micro led chip or a MiniLED chip is attached to the transfer film 12, and the transfer film 12 is a transparent film.
More specifically, as shown in fig. 4, the positioning mechanism includes two positioning assemblies 61, the two positioning assemblies 61 are disposed at the left end of the second mounting base 3, the positioning assembly 61 includes a positioning block 611, a first slider 612, a second slider 613 and a first positioning camera 614, the positioning block 611 is disposed at the left end of the second mounting base 3, the first slider 612 is disposed at the left side of the positioning block 611 in a vertically sliding manner, the second slider 613 is disposed at the left side of the first slider 612 in a front-back sliding manner, the first positioning camera 614 is mounted on the second slider 613, and the first positioning camera 614 is used for positioning the position of the micro electronic component on the transfer film 12.
Specifically, the positioning block 611 is provided with a third guide rail 615, the third guide rail 615 is arranged in the up-down direction, the first slider 612 is slidably mounted on the third guide rail 615, the first slider 612 is provided with a third driving device, and the third driving device drives the first slider 612 to slide up and down along the third guide rail 615, so as to drive the first positioning camera 614 to move up and down;
the first slider 612 is provided with a fourth guide rail 616, the fourth guide rail 616 is arranged along the front-back direction, the second slider 613 is slidably mounted on the fourth guide rail 616, the second slider 613 is provided with a fourth driving device, and the fourth driving device drives the second slider 613 to slide back and forth along the fourth guide rail 616, so as to drive the first positioning camera 614 to move back and forth;
the first positioning camera 614 can adjust the position of the tiny electronic component on the transfer film 12, so as to effectively improve the transfer accuracy of the tiny electronic component.
Further, as shown in fig. 5 and 6, the puncture head mechanism includes a fixed seat 71, a voice coil motor 72, a puncture head arm 73 and a puncture needle 74, the voice coil motor 72 is installed in the fixed seat 71, the puncture head arm 73 is connected to a mover end of the voice coil motor 72, the puncture needle 74 is installed at an end of the puncture head arm 73 away from the voice coil motor 72, a needle of the puncture needle 74 is disposed toward the transfer film 12, and the puncture needle 74 is located above the transfer film 12;
the voice coil motor 72 drives the lancet arm 73 to swing up and down, so as to drive the lancet 74 to move downward for puncturing the tiny electronic components on the transfer film 12 and to move upward and away from the transfer film 12.
Specifically, in this embodiment, the lancet arm 73 is mechanically connected to the voice coil motor 72 through a spring plate 75, the lancet arm 73 is fixed to the spring plate 75, the lancet arm 73 can rotate along the spring plate 75, and the voice coil motor 72 drives the lancet arm 73 to rotate around a circular point of a stroke of the spring plate 75 as a rotation center, so as to drive the lancet 74 to rotate and swing at a high speed in an up-down direction, and when the lancet 74 moves downward, the tiny electronic component on the transfer film 12 is punctured, so that the tiny electronic component on the transfer film 12 is transferred to the target disk mechanism, thereby effectively improving the transfer efficiency of the tiny electronic component. The motion period of the pricking pin 74 is 20 ms-50 ms, and the acceleration of the pricking head mechanism can reach 200-300 m/s2The efficiency of the needles 74 in transferring the tiny electronic components on the transfer film 12 to the target disk mechanism is effectively improved.
Preferably, the voice coil motor 72 is a Halbach voice coil motor, which can increase the binding force and the smooth section, and improve the stability of the movement of the bayonet arm 73.
Preferably, an encoder 76 is further disposed on the elastic sheet 75, the encoder 76 is a grating rotary encoder, the encoder 76 has a reading head and a grating ruler, and the encoder 76 is configured to detect a rotation speed of the bayonet arm 73.
Further, as shown in fig. 4, a second sliding seat 31 is disposed below the second mounting seat 3, the second sliding seat 31 is disposed below the second mounting seat 3 in a front-back sliding manner, and the fixing seat 71 is disposed below the second sliding seat 31 in a left-right moving manner.
Specifically, a fifth guide rail 32 is arranged at the bottom of the second mounting seat 3, the second sliding seat 31 is slidably mounted on the fifth guide rail 32, the fifth guide rail 32 is arranged along the front-back direction, the second mounting seat 3 is provided with a fifth driving device, and the fifth driving device drives the second sliding seat 31 to make front-back sliding movement along the fifth guide rail 32;
the bottom surface of the second sliding seat 31 is provided with a sixth guide rail 311, the fixed seat 71 is slidably mounted on the sixth guide rail 311, the sixth guide rail 311 is arranged along the left-right direction, the fixed seat 71 is provided with a sixth driving device, and the sixth driving device drives the fixed seat 71 to move along the sixth guide rail 311 in a left-right sliding manner.
Through the second sliding seat 31 along the fifth guide rail 32, and the fixed seat 71 along the sixth guide rail 311, the second sliding seat slides back and forth, so that the pricking head mechanism can slide back and forth and slide left and right, and through the movement of the pricking head mechanism, the micro electronic components at different positions on the transfer film 12 can be transferred to the target disk mechanism.
More specifically, the positioning mechanism further includes a second positioning camera 62, the second positioning camera 62 is mounted at the left end of the second sliding seat 31, the second positioning camera 62 is located at the left side of the fixed seat 71, the second positioning camera 62 is located between the two first positioning cameras 614, the second positioning camera 62 is located above the sliding platform 42, and the second positioning camera 62 is used for positioning the position of the puncture needle 74.
By arranging the second positioning camera 62, the second positioning camera 62 can precisely position the position of the pricking pin 74, so as to correct the positions of the pricking pin 74 and the tiny electronic components to be transferred, and further improve the transfer precision of the pricking head mechanism for transferring the tiny electronic components on the transfer film 12 to the target disc mechanism through pricking.
Further, as shown in fig. 7 and 8, the target disk mechanism includes a mounting table 51, a target disk 52 and at least one top suction assembly 53, the mounting table 51 is provided with a groove 511, the target disk 52 is slidably disposed in the groove 511, the target disk 52 is located below the sliding platform 42, the top suction assembly 53 is mounted on the mounting table 51, and the top suction assembly 53 is used for sucking and tensioning the transfer film 12.
Specifically, the target disc 52 is arranged in the groove 511 in a left-right sliding and front-back sliding manner through the guide rail, the position of the target disc 52 can be conveniently adjusted by arranging the target disc 52 in the groove 511 in a sliding manner, so that the target disc 52 can be aligned with the wafer ring 11 clamped by the clamping piece 421, in addition, the jacking assembly 53 can tension the transfer film 12, and after the tension, the accurate alignment and needling action of the pricking head mechanism is facilitated, so that the transfer precision of the tiny electronic component is effectively improved.
More specifically, the top suction assembly 53 includes a moving plate 531, a mounting plate 532, a moving block 533, a bracket 534, and a top suction plate 535, the moving plate 531 is disposed above the mounting table 51 in a left-right sliding manner, the mounting plate 532 is disposed above the moving plate 531 in a front-back sliding manner, the moving block 533 is disposed on one side of the mounting plate 532 close to the sliding platform 42 in a up-down sliding manner, one end of the bracket 534 is mounted on the moving block 533, the other end of the bracket 534 extends toward the middle of the sliding platform 42, the top suction plate 535 is disposed at one end of the bracket 534 far away from the moving block 533, the top suction plate 535 is disposed above the transfer film 12, and a hollow hole 5351 is disposed inside the top suction plate 535.
Specifically, a seventh guide rail 512 is disposed on the surface of the mounting table 51, the seventh guide rail 512 is disposed along the left-right direction, the moving plate 531 is mounted on the seventh guide rail 512 in a left-right sliding manner, the mounting table 51 is provided with a seventh driving device, and the seventh driving device drives the moving plate 531 to move along the seventh guide rail 512 in a left-right sliding manner;
the surface of the moving plate 531 is provided with an eighth guide rail 536, the mounting plate 532 is slidably mounted on the eighth guide rail 536, the eighth guide rail 536 is arranged along the front-back direction, the moving plate 531 is provided with an eighth driving device, and the eighth driving device drives the mounting plate 532 to move back and forth along the eighth guide rail 536;
a ninth guide rail 537 is arranged on one side of the mounting plate 532 facing the sliding platform 42, the moving block 533 is slidably mounted on the ninth guide rail 537, the ninth guide rail 537 is arranged along the up-down direction, the mounting plate 532 is provided with a ninth driving device, and the ninth driving device drives the moving block 533 to slide up and down along the ninth guide rail 537;
it should be noted that the shape of the hollow-out hole 5351 is a plurality of shapes such as a circle, a rectangle, an ellipse, a pentagon or a hexagon, and the top suction cup 535 can move left and right, back and forth, and up and down above the transfer film 12, so as to tension the transfer film 12.
To be more specific, by providing the top suction assembly 53, the hollow hole 5351 of the top suction cup 535 is a working area of the top suction cup 535, and the spike 74 is located above the hollow hole 5351 when the spike transfers the tiny electronic components on the transfer film 12 to the target disk mechanism, so that when the top suction cup 535 moves downwards, a small range of tiny electronic components can be tensioned on the transfer film 12, and after tensioning, the spike 74 can perform accurate alignment and needling actions.
More specifically, two of the jacking components 53 are provided, and the two jacking components 53 are respectively and oppositely arranged on the front side and the rear side of the mounting table 51 in the groove 511.
Through setting up two subassembly 53 is inhaled in the top, and two subassembly 53 is inhaled in the top set up respectively relatively set up in mount table 51 in both sides around recess 511 can cooperate the action of thorn head mechanism, work as thorn head mechanism and one of them subassembly 53 cooperation is inhaled in the top carries out the acupuncture action, and another one subassembly 53 is inhaled in the top can be right in advance the tensioning is carried out to transfer membrane 12, has effectively improved transfer efficiency.
Further, as shown in fig. 1 and 2, the heat dissipation fan 22 is installed on each of the left side and the front side of the first installation base 2, and the heat dissipation fan 22 is installed on each of the right side and the front side of the second installation base 3.
Through all install radiator fan 22 in the left side and the front side of first mount pad 2, and radiator fan 22 is all installed to the right side and the front side of second mount pad 3, can supply source dish mechanism, positioning mechanism and thorn head mechanism dispel the heat, have guaranteed the operation effect of equipment.
As shown in fig. 9 to 11, in another embodiment of the present invention, a second positioning camera 62, a pricking head mechanism and two positioning assemblies 61 may also be disposed on the first mounting base 2, four of the top-suction assemblies 53 are disposed on the mounting table 51, two of the top-suction assemblies 53 are in one group, and each group of the top-suction assemblies 53 is disposed on the left and right sides of the groove 511, respectively, so as to form a double-head four-ring layout, so as to improve the working efficiency of the mass transfer apparatus.
The working process of the huge transfer equipment of the tiny electronic components comprises the following steps:
fixing the wafer ring 11 of the transfer film 12 to be loaded with the micro led chip or MiniLED chip in the clamping member 421, and when performing the transfer operation, the pricking head mechanism will operate with respect to the two independent top suckers 535;
firstly, the top suction assembly 53 moves downwards, so that the top suction cups 535 absorb and press the transfer film 12 in the wafer ring 11 located below, and in the process, the first positioning camera 614 positions the corresponding tiny electronic components in the top suction cups 535;
after the positioning is finished, the pricking head mechanism moves back and forth, left and right, so that the pricking pin 74 is aligned with the tiny electronic component on the transfer film 12 below, and in the process, the pricking pin 74 is positioned by the second positioning camera 62;
after the positioning is completed, the voice coil motor 72 drives the lancet arm 73 to rotate at a high speed, so as to drive the lancet 74 to rotate at a high speed, and each time the lancet 74 moves downward, the tiny electronic components in the working area of the top suction cup 535 are punched on the target disc 52 located below the transfer film 12, thereby completing the transfer of the tiny electronic components.
In the working process, the whole process is controlled by a main control system, and when the pricking head mechanism performs a transferring action in the top suction cup 535 positioned at the front side, the tensioned top suction cup 535 positioned at the rear side performs a positioning action; when the pricking mechanism performs a transferring operation in the top chuck 535 located at the rear side, the top chuck 535 located at the front side performs a region changing, tensioning and positioning operation, and the operations are repeatedly circulated until the micro electronic components on the transfer film 12 are transferred, and then the wafer ring 11 is replaced with a new wafer ring.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (9)
1. A huge transfer device for micro electronic components is characterized by comprising a mounting frame, a first mounting seat, a second mounting seat, a source disc mechanism, a target disc mechanism, a positioning mechanism and a puncture head mechanism, wherein the first mounting seat and the second mounting seat are respectively and oppositely mounted on the mounting frame;
the source disc mechanism is used for placing a transfer film loaded with tiny electronic components; the positioning mechanism is used for positioning the position of the tiny electronic component on the transfer film and the position of the puncture head mechanism; the pricking head mechanism is used for transferring the tiny electronic components on the transfer film to the target disc mechanism in a pricking mode; the target disc mechanism is used for bearing the transferred tiny electronic components;
the micro electronic component is a micro LED chip or a MiniLED chip;
the positioning mechanism comprises two positioning components, the two positioning components are arranged at the left end of the second mounting seat, each positioning component comprises a positioning block, a first sliding block, a second sliding block and a first positioning camera, the positioning block is arranged at the left end of the second mounting seat, the first sliding block is arranged on the left side of the positioning block in a vertically sliding mode, the second sliding block is arranged on the left side of the first sliding block in a front-back sliding mode, the first positioning camera is arranged on the second sliding block, and the first positioning camera is used for positioning the position of a tiny electronic component on the transfer film;
the positioning mechanism further comprises a second positioning camera, the second positioning camera is positioned between the two first positioning cameras, and the second positioning camera is used for positioning the position of the puncture head mechanism.
2. A mass transfer device for tiny electronic components, as claimed in claim 1, wherein said source disk mechanism comprises a first sliding seat and a sliding platform, said first sliding seat is disposed under said first mounting seat in a front-back sliding manner, said sliding platform is disposed under said first sliding seat in a left-right sliding manner, said target disk mechanism is disposed under said sliding platform, a clamping member is disposed at an end of said sliding platform far from said first mounting seat, said clamping member is used for clamping a wafer ring, and said wafer ring is provided with said transfer film.
3. A huge transfer device for tiny electronic components, as claimed in claim 2, wherein said pricking head mechanism comprises a fixing base, a voice coil motor, a pricking head arm and a pricking pin, said voice coil motor is mounted in said fixing base, said pricking head arm is connected with a mover end of said voice coil motor, said pricking pin is mounted at an end of said pricking head arm far from said voice coil motor, a needle head of said pricking pin is disposed towards said transfer film, and said pricking pin is located above said transfer film;
the voice coil motor drives the puncture needle arm to swing up and down so as to drive the puncture needle to do downward puncture movement of the tiny electronic components on the transfer film and upwards lift movement away from the transfer film.
4. The mass transfer apparatus for tiny electronic components, as claimed in claim 3, wherein a second sliding seat is provided under said second mounting seat, said second sliding seat is slidably provided under said second mounting seat back and forth, and said fixing seat is slidably provided under said second sliding seat in a left and right direction.
5. A mass transfer apparatus for tiny electronic components, as claimed in claim 4, wherein said second positioning camera is mounted at the left end of said second sliding seat, and said second positioning camera is located at the left side of said fixed seat, and said second positioning camera is located above said sliding platform, and said second positioning camera is used for positioning said lancet needle.
6. The mass transfer device for tiny electronic components, as claimed in claim 2, wherein said target tray mechanism comprises a mounting platform, a target tray and at least one top-suction assembly, said mounting platform is provided with a groove, said target tray is slidably disposed in said groove, said target tray is located below said sliding platform, said top-suction assembly is mounted on said mounting platform, said top-suction assembly is used for absorbing and tensioning said transfer film.
7. The huge transfer device of tiny electronic components according to claim 6, wherein said ejector component comprises a moving plate, a mounting plate, a moving block, a bracket and an ejector plate, said moving plate is slidably disposed above said mounting table from side to side, said mounting plate is slidably disposed above said moving plate from front to back, said moving block is slidably disposed on one side of said mounting plate close to said sliding platform from top to bottom, one end of said bracket is mounted on said moving block, the other end of said bracket extends toward the middle of said sliding platform, said ejector plate is disposed on one end of said bracket far away from said moving block, said ejector plate is located above said transfer film, and a hollow hole is disposed inside said ejector plate.
8. A mass transfer apparatus for minute electronic components as claimed in claim 7, wherein said two said pushing and sucking assemblies are provided, and said two said pushing and sucking assemblies are respectively oppositely provided on front and rear sides of said mounting table in said recess.
9. A mass transfer apparatus of minute electronic components as claimed in claim 1, wherein said first mounting base is provided with a heat radiation fan at both left side and front side thereof, and said second mounting base is provided with a heat radiation fan at both right side and front side thereof.
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| CN117116838B (en) * | 2023-08-08 | 2024-01-30 | 广东工业大学 | Array water jet spinned Mini-LED huge transfer device and method |
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| CN110444488B (en) * | 2018-05-03 | 2021-12-07 | 苏州艾科瑞思智能装备股份有限公司 | High-precision rapid chip taking and loading device and chip loading machine adopting same |
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