JP3182756B2 - Method for producing thermoplastic resin composition - Google Patents
Method for producing thermoplastic resin compositionInfo
- Publication number
- JP3182756B2 JP3182756B2 JP02687789A JP2687789A JP3182756B2 JP 3182756 B2 JP3182756 B2 JP 3182756B2 JP 02687789 A JP02687789 A JP 02687789A JP 2687789 A JP2687789 A JP 2687789A JP 3182756 B2 JP3182756 B2 JP 3182756B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- resin composition
- weight
- thermoplastic resin
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 19
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 30
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 27
- 239000000945 filler Substances 0.000 claims description 23
- 229920001169 thermoplastic Polymers 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000004973 liquid crystal related substance Substances 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 12
- 229920000412 polyarylene Polymers 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 229920001283 Polyalkylene terephthalate Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims 1
- -1 2-chlorophenoxy Chemical group 0.000 description 30
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 18
- 239000003365 glass fiber Substances 0.000 description 17
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 12
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 12
- 238000006068 polycondensation reaction Methods 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- GDBUZIKSJGRBJP-UHFFFAOYSA-N 4-acetoxy benzoic acid Chemical compound CC(=O)OC1=CC=C(C(O)=O)C=C1 GDBUZIKSJGRBJP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- RQMBBMQDXFZFCC-UHFFFAOYSA-N [4-(4-acetyloxyphenyl)phenyl] acetate Chemical group C1=CC(OC(=O)C)=CC=C1C1=CC=C(OC(C)=O)C=C1 RQMBBMQDXFZFCC-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- AKOGNYJNGMLDOA-UHFFFAOYSA-N (4-acetyloxyphenyl) acetate Chemical compound CC(=O)OC1=CC=C(OC(C)=O)C=C1 AKOGNYJNGMLDOA-UHFFFAOYSA-N 0.000 description 2
- CYTCTRAEJYIZRX-UHFFFAOYSA-N (9a-hydroxy-3,5a-dimethyl-9-methylidene-2-oxo-3,3a,4,5,6,7,8,9b-octahydrobenzo[g][1]benzofuran-6-yl) acetate Chemical compound C1CC2(C)C(OC(C)=O)CCC(=C)C2(O)C2C1C(C)C(=O)O2 CYTCTRAEJYIZRX-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- QGNLHMKIGMZKJX-UHFFFAOYSA-N 3-chloro-4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(Cl)=C1 QGNLHMKIGMZKJX-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical compound OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachloro-phenol Natural products OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 1
- SJJCQDRGABAVBB-UHFFFAOYSA-N 1-hydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC=C21 SJJCQDRGABAVBB-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 1
- DNUYOWCKBJFOGS-UHFFFAOYSA-N 2-[[10-(2,2-dicarboxyethyl)anthracen-9-yl]methyl]propanedioic acid Chemical compound C1=CC=C2C(CC(C(=O)O)C(O)=O)=C(C=CC=C3)C3=C(CC(C(O)=O)C(O)=O)C2=C1 DNUYOWCKBJFOGS-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- YATIYDNBFHEOFA-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-ol Chemical compound CO[Si](OC)(OC)CCCO YATIYDNBFHEOFA-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- LPADJMFUBXMZNL-UHFFFAOYSA-N 4-hydroxy-3-phenylbenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(C=2C=CC=CC=2)=C1 LPADJMFUBXMZNL-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920012196 Polyoxymethylene Copolymer Polymers 0.000 description 1
- 229920009382 Polyoxymethylene Homopolymer Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- LGZXVUPUMFEWEJ-UHFFFAOYSA-N acetic acid;2-tert-butylbenzene-1,4-diol Chemical compound CC(O)=O.CC(O)=O.CC(C)(C)C1=CC(O)=CC=C1O LGZXVUPUMFEWEJ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229960004050 aminobenzoic acid Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- IJFXRHURBJZNAO-UHFFFAOYSA-N meta--hydroxybenzoic acid Natural products OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- AJMJSPWGPLXRSJ-UHFFFAOYSA-N silyl but-3-enoate Chemical compound [SiH3]OC(=O)CC=C AJMJSPWGPLXRSJ-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-M terephthalate(1-) Chemical compound OC(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は優れた表面特性および機械的性質を有する成
形品を与え得る熱可塑性樹脂組成物の製造方法に関する
ものである。Description: TECHNICAL FIELD The present invention relates to a method for producing a thermoplastic resin composition capable of providing a molded article having excellent surface properties and mechanical properties.
近年プラスチックの高性能化に対する要求がますます
高まり、種々の新規性能を有するポリマが数多く開発さ
れ、市場に供されているが、中でも分子鎖の平行な配列
を特徴とする光学異方性の液晶ポリマが優れた流動性と
機械的性質を有する点で注目されている。しかしなが
ら、この液晶ポリマは異方性が大きいという問題が存在
する。また、液晶ポリマの異方性を改良するためにタル
クやガラス繊維などの充填剤を添加することが知られて
いる。また、熱可塑性ポリマに液晶ポリマをブレンドし
て流動性や機械的物性を向上させることも知られている
(特開昭56−115357)。In recent years, the demand for higher performance of plastics has been increasing, and many polymers having various new properties have been developed and marketed. Among them, optically anisotropic liquid crystals characterized by parallel arrangement of molecular chains Attention has been paid to polymers having excellent fluidity and mechanical properties. However, this liquid crystal polymer has a problem that the anisotropy is large. It is also known to add a filler such as talc or glass fiber in order to improve the anisotropy of the liquid crystal polymer. It is also known that a liquid crystal polymer is blended with a thermoplastic polymer to improve fluidity and mechanical properties (JP-A-56-115357).
しかしながら液晶ポリマにこれらの充填剤を添加して
も必ずしも異方性の程度は満足できるレベルとは言えな
かつた。そこでこの異方性の程度を更に減少させるため
の研究を行い熱可塑性ポリマを充填剤と同時に添加すれ
ばよいことを見い出した。しかしながらこれら二種のポ
リマと充填剤を特開昭56−115357号公報の実施例4のよ
うに同時に混合すると液晶ポリマの量が多い時には機械
的物性が大きく低下することがわかつた。However, even if these fillers are added to the liquid crystal polymer, the degree of anisotropy is not always at a satisfactory level. In order to further reduce the degree of this anisotropy, a study has been made and it has been found that a thermoplastic polymer may be added simultaneously with the filler. However, when these two polymers and the filler were mixed simultaneously as in Example 4 of JP-A-56-115357, it was found that when the amount of the liquid crystal polymer was large, the mechanical properties were greatly reduced.
従つて本発明は機械的物性に優れしかも異方性の少な
い熱可塑性樹脂組成物を製造することを課題とする。Accordingly, an object of the present invention is to produce a thermoplastic resin composition having excellent mechanical properties and low anisotropy.
本発明者らは上記課題を解決すべく鋭意検討した結
果、本発明に到達した。The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have reached the present invention.
すなわち本発明は下記構造単位(I)、(II)および
(III)から選ばれた構造単位を有する、液晶ポリエス
テルおよび液晶ポリエステルアミドから選択される液晶
ポリマ(A)50〜99重量%と熱可塑性ポリマー(B)50
〜1重量%からなる樹脂組成物100重量部に対して充填
剤(C)を1〜200重量部含有せしめた熱可塑性樹脂組
成物の製造において、上記熱可塑性ポリマー(B)と充
填剤(C)を予めバンバりーミキサー、ゴムロール機、
ニーダー、単軸もしくは二軸押出機を用いて溶融混練し
た後に上記液晶ポリマ(A)を溶融混合することを特徴
とする熱可塑性樹脂組成物の製造方法に関するものであ
る。That is, the present invention relates to a liquid crystal polymer (A) having a structural unit selected from the following structural units (I), (II) and (III): Polymer (B) 50
In the production of a thermoplastic resin composition in which the filler (C) is contained in an amount of 1 to 200 parts by weight with respect to 100 parts by weight of the resin composition of 1 to 1% by weight, the thermoplastic polymer (B) and the filler (C) are used. A) Bambury mixer, rubber roll machine,
The present invention relates to a method for producing a thermoplastic resin composition, which comprises melt-kneading using a kneader, a single-screw or twin-screw extruder, and then melt-mixing the liquid crystal polymer (A).
(式中のXは二価の芳香族残基をY、Zは二価の芳香族
または脂肪族、弛緩族残基を表し、RはOまたはNHを示
す。 (In the formula, X represents a divalent aromatic residue, Y represents a divalent aromatic or aliphatic or relaxed residue, and R represents O or NH.
また、上記構造単位(II)と(III)は実質的に等モ
ルである。The structural units (II) and (III) are substantially equimolar.
また、更に好ましい手段として、本発明は上記液晶ポ
リマ(A)が下記構造単位(I′)〜(IV′)からなり
熱変形温度が150〜280℃の液晶ポリエステルであること
を特徴とする上記熱可塑性樹脂組成物の製造方法および
上記熱可塑性ポリマ(B)がポリアミド、ポリカーボネ
ート、ポリアリーレンオキサイド、ポリアルキレンテレ
フタレート、ポリアリレンスルフィド、ポリエーテルエ
ーテルケトンから選ばれた一種以上であることを特徴と
する上記熱可塑性樹脂組成物の製造方法に関するもので
ある。Further, as a further preferred means, the present invention is characterized in that the liquid crystal polymer (A) is a liquid crystal polyester having the following structural units (I ') to (IV') and a heat deformation temperature of 150 to 280 ° C. The method for producing a thermoplastic resin composition, and wherein the thermoplastic polymer (B) is at least one selected from polyamide, polycarbonate, polyarylene oxide, polyalkylene terephthalate, polyarylene sulfide, and polyetheretherketone. The present invention relates to a method for producing the above thermoplastic resin composition.
から選ばれた一種以上の基を示し、構造単位(IV′)の
カルボニル基は互いにパラあるいはメタ位の関係にあ
り、その50モル%以上がパラ位である。 And the carbonyl groups of the structural unit (IV ′) are in a para or meta position with each other, and 50 mol% or more of the carbonyl groups are in the para position.
また、上記構造単位(II′)および(III′)の合計
と(IV′)は実質的に等モルである。) 構造単位(I)を構成する芳香族ヒドロキシカルボン
酸の好ましい例としては、p−ヒドロキシ安息香酸、m
−ヒドロキシ安息香酸、3−クロロ−4−ヒドロキシ安
息香酸、3−フェニル−4−ヒドロキシ安息香酸、6−
ヒドロキシ−2−ナフトエ酸などが挙げられる。The sum of the structural units (II ') and (III') and (IV ') are substantially equimolar. Preferable examples of the aromatic hydroxycarboxylic acid constituting the structural unit (I) include p-hydroxybenzoic acid and m
-Hydroxybenzoic acid, 3-chloro-4-hydroxybenzoic acid, 3-phenyl-4-hydroxybenzoic acid, 6-
And hydroxy-2-naphthoic acid.
構造単位(II)を構成するジヒドロキシ化合物または
4−アミノ−1−ヒドロキシ化合物の好ましい例として
は4,4′−ジヒドロキシビフェニル、4,4′−ジヒドロキ
シジフェニルエーテル、2,6−ジヒドロキシナフタレ
ン、2,7−ジヒドロキシナフタレン、ハイドロキノン、
メチルハイドロキノン、クロロハイドロキノン、フェニ
ルハイドロキノン、エチレングリコール、1,4−ブタン
ジオールまたはp−アミノフェノールなどが挙げられ
る。Preferred examples of the dihydroxy compound or 4-amino-1-hydroxy compound constituting the structural unit (II) include 4,4'-dihydroxybiphenyl, 4,4'-dihydroxydiphenyl ether, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene. -Dihydroxynaphthalene, hydroquinone,
Examples include methylhydroquinone, chlorohydroquinone, phenylhydroquinone, ethylene glycol, 1,4-butanediol, and p-aminophenol.
構造単位(III)を構成するジカルボン酸の好ましい
例としては、テレフタル酸、イソフタル酸、1,2−ビス
(フェノキシ)エタン−4,4′−ジカルボン酸、1,2−ビ
ス(2−クロロフェノキシ)エタン−4,4′−ジカルボ
ン酸、2,6−ナフタレンジカルボン酸、4,4′−ジフェニ
ルエーテルジカルボン酸、1,4−シクロヘキサンジカル
ボン酸などが挙げられる。Preferred examples of the dicarboxylic acid constituting the structural unit (III) include terephthalic acid, isophthalic acid, 1,2-bis (phenoxy) ethane-4,4'-dicarboxylic acid, and 1,2-bis (2-chlorophenoxy) ) Ethane-4,4'-dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 1,4-cyclohexanedicarboxylic acid and the like.
また、構造単位(II)と(III)は実質的に等モルで
ある。The structural units (II) and (III) are substantially equimolar.
一方、本発明における好ましい液晶ポリマ(A)の上
記構造単位(I′)は、p−ヒドロキシ安息香酸から生
成した構造単位を、上記構造単位(II′)は4,4′−ジ
ヒドロキシビフェニルから生成した構造単位を、上記構
造単位(III′)はハイドロキノン、t−ブチルハイド
ロキノン、フェニルハイドロキノン、2,6−ジヒドロキ
シナフタレン、エチレングリコールから選ばれた一種以
上のジヒドロキシ化合物から生成した構造単位を、構造
単位(IV′)はテレフタル酸および/またはイソフタル
酸から生成した構造単位を各々示す。On the other hand, in the preferred liquid crystal polymer (A) of the present invention, the structural unit (I ′) is a structural unit formed from p-hydroxybenzoic acid, and the structural unit (II ′) is formed from 4,4′-dihydroxybiphenyl. The structural unit (III ′) is a structural unit formed from one or more dihydroxy compounds selected from hydroquinone, t-butylhydroquinone, phenylhydroquinone, 2,6-dihydroxynaphthalene, and ethylene glycol. (IV ') represents a structural unit formed from terephthalic acid and / or isophthalic acid.
本発明の好ましい液晶ポリマ(A)は上記構造単位
(I′)、(II′)、(III′)および(IV′)からな
る液晶ポリエステルである。The preferred liquid crystal polymer (A) of the present invention is a liquid crystal polyester comprising the above structural units (I '), (II'), (III ') and (IV').
上記構造単位(I′)、(II′)、(III′)および
(IV′)の共重合量は任意である。しかし、流動性の点
から次の共重合量であることが好ましい。すなわち、上
記構造単位(I′)は(I′)、(II′)および(II
I′)の合計に対して40〜90モル%であることが好まし
く、60〜75モル%であることが特に好ましい。また、上
記構造単位(II′)/(III′)のモル比は9/1〜1/9が
好ましく、上記構造単位(III′)において−X−が−C
H2CH2−の場合は上記構造単位(III′)が(I′)、
(II′)および(III′)の合計に対して23〜5モル%
であることが特に好ましく−X−が−CH2CH2−以外の場
合は7.5/2.5〜4/6が特に好ましい。The copolymerization amount of the structural units (I '), (II'), (III ') and (IV') is arbitrary. However, the following copolymerization amount is preferred from the viewpoint of fluidity. That is, the structural units (I ′) are represented by (I ′), (II ′) and (II)
It is preferably from 40 to 90 mol%, particularly preferably from 60 to 75 mol%, based on the total of I '). The molar ratio of the structural unit (II ') / (III') is preferably from 9/1 to 1/9, and in the structural unit (III '), -X- is -C.
In the case of H 2 CH 2 —, the structural unit (III ′) is (I ′),
23 to 5 mol% based on the sum of (II ') and (III')
It is particularly preferred -X- is -CH 2 CH 2 in - otherwise particularly preferably 7.5 / 2.5 to 4/6.
また構造単位(II′)および(III′)の合計と(I
V′)は実質的に等モルである。The sum of structural units (II ') and (III') and (I
V ') is substantially equimolar.
本発明におけるサーモトロピック液晶ポリマ(A)
は、熱変形温度が150〜280℃であることが好ましく、19
0〜270℃が特に好ましい。Thermotropic liquid crystal polymer (A) in the present invention
Has a heat deformation temperature of preferably 150 to 280 ° C., and 19
0-270 ° C is particularly preferred.
熱変形温度が150℃未満では耐熱性の向上効果が不充
分であり、280℃を越えると配合時に熱可塑性ポリマが
熱分解したり、得られた樹脂組成物の成形温度が高くな
るという問題が発生する。When the heat distortion temperature is less than 150 ° C, the effect of improving heat resistance is insufficient. appear.
ここで熱変形温度はASTM D648に基づき、1/8″厚の
試験片を18.6kg/cm2の応力で測定した値である。Here, the heat distortion temperature is a value obtained by measuring a 1/8 ″ thick test piece at a stress of 18.6 kg / cm 2 based on ASTM D648.
本発明における液晶ポリマ(A)の製造方法は、特に
制限がなく、公知のポリエステルの重縮合法に準じて製
造できる。The method for producing the liquid crystal polymer (A) in the present invention is not particularly limited, and it can be produced according to a known polyester polycondensation method.
例えば、上記構造単位(III′)で、−X−が−CH2CH
2−以外の場合は(1)〜(4)、−X−が−CH2CH2−
の場合は(5)の製造方法が好ましく挙げられる。For example, in the above structural units (III '), -X- is -CH 2 CH
2 - Otherwise (1) ~ (4), - 2 X- is -CH CH 2 -
In the case of (1), the production method (5) is preferably mentioned.
(1) p−アセトキシ安息香酸、4,4′−ジアセトキ
シビフェニル、パラアセトキシベンゼンなどの芳香族ジ
ヒドロキシ化合物のジアシル化物とテレフタル酸などの
芳香族ジカルボン酸から脱酢酸重縮合反応によつて製造
する方法。(1) It is produced from a diacylated aromatic dihydroxy compound such as p-acetoxybenzoic acid, 4,4'-diacetoxybiphenyl, paraacetoxybenzene and an aromatic dicarboxylic acid such as terephthalic acid by a deacetic acid polycondensation reaction. Method.
(2) p−ヒドロキシ安息香酸、4,4′−ジヒドロキ
シビフェニル、ハイドロキノンなどの芳香族ジヒドロキ
シ化合物、テレフタル酸などの芳香族ジカルボン酸に無
水酢酸を反応させて、フェノール性水酸基をアシル化し
た後、脱酢酸重縮合反応によって製造する方法。(2) After reacting acetic anhydride with an aromatic dihydroxy compound such as p-hydroxybenzoic acid, 4,4'-dihydroxybiphenyl, or hydroquinone, or an aromatic dicarboxylic acid such as terephthalic acid to acylate a phenolic hydroxyl group, A method of producing by a deacetic acid polycondensation reaction
(3) p−ヒドロキシ安息香酸のフェニルエステル、
4,4′−ジヒドロキシビフェニル、ハイドロキノンなど
の芳香族ジヒドロキシ化合物とテレフタル酸などの芳香
族ジカルボン酸のジフェニルエステルから脱フェノール
重縮合反応により製造する方法。(3) phenyl ester of p-hydroxybenzoic acid,
A method of producing from an aromatic dihydroxy compound such as 4,4'-dihydroxybiphenyl or hydroquinone and a diphenyl ester of an aromatic dicarboxylic acid such as terephthalic acid by a phenol removal polycondensation reaction.
(4) p−ヒドロキシ安息香酸およびテレフタル酸な
どの芳香族ジカルボン酸に所望量のジフェニルカーボネ
ートを反応させてそれぞれジフェニルエステルとした
後、4,4′−ジヒドロキシビフェニル、ハイドロキノン
などの芳香族ジヒドロキシ化合物を加え、脱フェノール
重縮合反応により製造する方法。(4) An aromatic dicarboxylic acid such as p-hydroxybenzoic acid and terephthalic acid is reacted with a desired amount of diphenyl carbonate to form a diphenyl ester, and then an aromatic dihydroxy compound such as 4,4'-dihydroxybiphenyl and hydroquinone is added. In addition, a method of producing by a dephenol polycondensation reaction.
(5) ポリエチレンテレフタレートの存在下で(1)
または(2)の方法で製造する方法。(5) In the presence of polyethylene terephthalate (1)
Or a method of manufacturing by the method of (2).
重縮合反応に使用する触媒としては、酢酸第一錫、テ
トラブチルチタネート、酢酸カリウム、三酸化アンチモ
ン、マグネシウム、酢酸ナトリウムなどの金属化合物が
代表的であり、とりわけ脱フェノール重縮合の際に有効
である。Typical catalysts used for the polycondensation reaction include stannous acetate, tetrabutyl titanate, potassium acetate, antimony trioxide, magnesium, and metal compounds such as sodium acetate, and are particularly effective for dephenol polycondensation. is there.
本発明の液晶ポリマ(A)は、ペンタフルオロフェノ
ール中で固有粘度を測定することが可能なものもあり、
その際には0.1g/dlの濃度で60℃で測定した値で0.5以上
が好ましく、特に1.0〜15.0が好ましい。Some liquid crystal polymers (A) of the present invention can measure intrinsic viscosity in pentafluorophenol,
In this case, a value measured at 60 ° C. at a concentration of 0.1 g / dl is preferably 0.5 or more, particularly preferably 1.0 to 15.0.
また、本発明の液晶ポリマの溶融粘度は10〜20,000ポ
イズが好ましく、特に20〜10,000ポイズがより好まし
い。Further, the melt viscosity of the liquid crystal polymer of the present invention is preferably from 10 to 20,000 poise, and more preferably from 20 to 10,000 poise.
なお、この溶融粘度は(液晶開始温度+40℃)でずり
速度1,000(1/秒)の条件下で高化式フローテスターに
よつて測定した値である。The melt viscosity is a value measured by a Koka type flow tester under the condition of (liquid crystal onset temperature + 40 ° C.) and a shear rate of 1,000 (1 / second).
なお、本発明の好ましい液晶ポリマを重縮合する際に
は上記(I′)、(II′)、(III′)および(IV′)
を構成する成分以外に、4,4′−ジフェニルジカルボン
酸、3,3′−ジフェニルジカルボン酸、3,4′−ジフェニ
ルジカルボン酸、2,2′−ジフェニルジカルボン酸、1,2
−ビス(フエノキシ)エタン−4,4′−ジカルボン酸、
1,2−ビス(2−クロルフェノキシ)エタン−4,4′−ジ
カルボン酸などの芳香族ジカルボン酸、ヘキサヒドロテ
レフタル酸などの脂環式ジカルボン酸、レゾルシン、ク
ロルハイドロキノン、メチルハイドロキノン、2,7−ジ
ヒドロキシナフタレン、ビスフェノールA、ビスフェノ
ールSなどの芳香族ジヒドロキシ化合物、m−オキシ安
息香酸、2,6−オキシナフトエ酸などの芳香族オキシカ
ルボン酸およびp−アミノフェノール、p−アミノ安息
香酸などを本発明の目的を損なわない程度の少割合の範
囲でさらに共重合せしめることができる。In the polycondensation of the preferred liquid crystal polymer of the present invention, the above (I '), (II'), (III ') and (IV')
Other than the components constituting 4,4'-diphenyldicarboxylic acid, 3,3'-diphenyldicarboxylic acid, 3,4'-diphenyldicarboxylic acid, 2,2'-diphenyldicarboxylic acid, 1,2
-Bis (phenoxy) ethane-4,4'-dicarboxylic acid,
Aromatic dicarboxylic acids such as 1,2-bis (2-chlorophenoxy) ethane-4,4'-dicarboxylic acid, alicyclic dicarboxylic acids such as hexahydroterephthalic acid, resorcinol, chlorohydroquinone, methylhydroquinone, 2,7 -Aromatic dihydroxy compounds such as dihydroxynaphthalene, bisphenol A and bisphenol S; aromatic oxycarboxylic acids such as m-oxybenzoic acid and 2,6-oxynaphthoic acid; and p-aminophenol and p-aminobenzoic acid. Copolymerization can be further performed in a small proportion that does not impair the object of the invention.
本発明の樹脂組成物においては、ポリアミド、ポリオ
キシメチレン、ポリカーボネート、ポリアリレンオキサ
イド、ポリアルキレンテレフタレート、ポリアリレンス
ルフィド、ポリスルホン、ポリエーテルスルホン、非晶
性ポリアリレート、ポリエーテルエーテルケトンなどか
ら選ばれた一種以上の熱可塑性ポリマ(B)が必須成分
である。In the resin composition of the present invention, selected from polyamide, polyoxymethylene, polycarbonate, polyarylene oxide, polyalkylene terephthalate, polyarylene sulfide, polysulfone, polyethersulfone, amorphous polyarylate, polyetheretherketone, and the like. One or more thermoplastic polymers (B) are essential components.
熱可塑性ポリマ(B)の好ましい具体例としては下記
のものが挙げられる。Preferred specific examples of the thermoplastic polymer (B) include the following.
ポリアミドとしては、ナイロン6、ナイロン46、ナイ
ロン66、ナイロン610、ナイロン11、ナイロン12などお
よびこれらの共重合体などが挙げられる。ポリオキシメ
チレンとしては、ポリオキシメチレンホモポリマおよび
主鎖の大部分がオキシメチレン連鎖よりなるコポリマが
挙げられる。ポリカーボネートとしては、ビス(4−ヒ
ドロキシフェニル)、ビス(3,5−ジアルキル−4−ヒ
ドロキシフェニル)またはビス(3,5−ジハロ−4−ヒ
ドロキシフェニル)置換を含有する炭化水素誘導体をベ
ースとするポリカーボネートが好ましく、2,2−ビス
(4−ヒドロキシフェニル)プロパン(ビスフェノール
A)をベースとするポリカーボネートが特に好ましい。Examples of the polyamide include nylon 6, nylon 46, nylon 66, nylon 610, nylon 11, nylon 12, and the like, and copolymers thereof. Polyoxymethylene includes polyoxymethylene homopolymers and copolymers in which the main chain is largely composed of oxymethylene chains. Polycarbonates are based on hydrocarbon derivatives containing bis (4-hydroxyphenyl), bis (3,5-dialkyl-4-hydroxyphenyl) or bis (3,5-dihalo-4-hydroxyphenyl) substitution Polycarbonates are preferred, and polycarbonates based on 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) are particularly preferred.
ポリアリレンオキサイドとしては、ポリ(2,6−ジメ
チル−1,4−フェニレン)エーテル、2,6−ジメチルフェ
ノール/2,3,6−トリメチルフェノール共重合体、2,6−
ジメチルフェノール/2,3,6−トリエチルフェノール共重
合体などが挙げられる。Examples of polyarylene oxide include poly (2,6-dimethyl-1,4-phenylene) ether, 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-
And dimethylphenol / 2,3,6-triethylphenol copolymer.
ポリアリレンオキサイドにはポリスチレン、耐衝撃ポ
リスチレンなどのスチレン系樹脂を添加することができ
る。Styrene-based resins such as polystyrene and high-impact polystyrene can be added to polyarylene oxide.
ポリアルキレンテレフタレートとしては、ポリエチレ
ンテレフタレート、ポリブチレンテレフタレートなどが
挙げられる。Examples of the polyalkylene terephthalate include polyethylene terephthalate and polybutylene terephthalate.
ポリアリレンスルフィドとしては、ポリパラフェニレ
ンスルフィドなどが挙げられる。Examples of polyarylene sulfide include polyparaphenylene sulfide.
ポリスルホンとしては構造式 で表わされるものなどが挙げられる。Structural formula as polysulfone And the like.
ポリエーテルスルホンとしては構造式 で表わされるものなどが挙げられる。Structural formula as polyether sulfone And the like.
非晶性ポリアリレートとしては、構造式 で表わされるものなどが挙げられる。The amorphous polyarylate has the structural formula And the like.
ポリエーテルエーテルケトンとしては、構造式、 で表わされるものなどが挙げられる。As polyetheretherketone, the structural formula, And the like.
これらのうちポリアミド、ポリカーボネート、ポリア
リレンオキシド、ポリアルキレンテレフタレート、ポリ
アリレンスルフィド、ポリエーテルエーテルケトンが好
ましい。Of these, polyamide, polycarbonate, polyarylene oxide, polyalkylene terephthalate, polyarylene sulfide, and polyetheretherketone are preferred.
本発明における充填剤(C)は特に限定されるもので
はなく、公知のものが使用できる。例えばガラス繊維、
炭素繊維、ケイ酸カルシウム(ワラステナイト)、リン
酸カルシウム、硫酸カルシウム、炭酸カルシウム、炭酸
マグネシウム、硫酸バリウム、酸化チタン、酸化アルミ
ニウム、酸化マグネシウム、酸化亜鉛、酸化ケイ素、酸
化鉄、酸化ジルコニウム、三酸化アンチモン、二酸化モ
リブデン、二硫化モリブデン、マイカ、セリサイト、タ
ルク、カリオン、クレー、長石、蛭石、シリカ、ガラス
粉末、カーボンブラック、グラファイト、樹脂粉末、エ
ボナイト粉末などが好ましく使用できる。The filler (C) in the present invention is not particularly limited, and a known filler can be used. For example, glass fiber,
Carbon fiber, calcium silicate (warastenite), calcium phosphate, calcium sulfate, calcium carbonate, magnesium carbonate, barium sulfate, titanium oxide, aluminum oxide, magnesium oxide, zinc oxide, silicon oxide, iron oxide, zirconium oxide, antimony trioxide, Molybdenum dioxide, molybdenum disulfide, mica, sericite, talc, carion, clay, feldspar, vermiculite, silica, glass powder, carbon black, graphite, resin powder, ebonite powder and the like can be preferably used.
また、充填剤(C)にはその表面をカップリング剤、
例えばγ−(2−アミノエチル)アミノプロピルトリメ
トキシシラン、γ−グリシドキシプロピルトリメトキシ
シラン、γ−メルカプトプロピルトリメトキシシラン、
メチルトリメトキシシラン、γ−アニリノプロピルトリ
メトキシシラン、ヒドロキシプロピルトリメトキシシラ
ン、γ−ウレイドプロピルトリエトキシシラン、ビニル
アセトキシシランなどのシランカップリング剤、また、
イソプロピルトリスイソステアロイルチタネート、イソ
プロピルトリス(ジオクチルパイロホスフェート)チタ
ネート、イソプロピルトリ(N−アミノエチル−アミノ
エチル)チタネート、テトラオクチルビス(ジトリデシ
ルホスファイト)チタネート、ビス(ジオクチルパイロ
ホスフェート)エチレンチタネート、イソプロピルトリ
デシルベンゼンスルホニルチタネート、イソプロピルト
リ(ジオクチルホスフェート)チタネートなどのチタネ
ート系カップリング剤、また、アセトアルコキシアルミ
ニウムジイソプロピレートなどのアルミニウム系カップ
リング剤およびジルコアルミネート系カップリング剤な
どでカップリング処理して用いることが、液晶ポリマ樹
脂組成物の耐熱性と機械的性質が向上するため好まし
い。The surface of the filler (C) is a coupling agent,
For example, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane,
Methyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, hydroxypropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, silane coupling agent such as vinylacetoxysilane,
Isopropyl tris isostearoyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tri (N-aminoethyl-aminoethyl) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, bis (dioctyl pyrophosphate) ethylene titanate, isopropyl tris Coupling treatment with a titanate coupling agent such as decylbenzenesulfonyl titanate or isopropyl tri (dioctyl phosphate) titanate, or an aluminum coupling agent such as acetoalkoxyaluminum diisopropylate or a zircoaluminate coupling agent It is preferable to use it because the heat resistance and mechanical properties of the liquid crystal polymer resin composition are improved.
本発明で用いるガラス繊維の好ましい具体例として
は、通常の強化樹脂用の直径5〜15μmのチョップドス
トランド、ロービングタイプのガラス繊維が挙げられ
る。Preferred specific examples of the glass fiber used in the present invention include a chopped strand having a diameter of 5 to 15 μm and a roving type glass fiber for a general reinforcing resin.
取扱性、成形品の表面光沢性付与などの点から1〜6m
m長のチョップドストランドが特に好ましく用いられ
る。1 to 6 m from the viewpoint of handling properties and imparting surface gloss of molded products
An m-length chopped strand is particularly preferably used.
ガラス繊維はシラン系、チタン系など通常のカップリ
ング剤処理を施してあるものが好ましく用いられ、エポ
キシ樹脂、酢酸ビニルなどの通常の収束剤により処理さ
れていてもよい。The glass fiber which has been subjected to a normal coupling agent treatment such as a silane-based or titanium-based glass is preferably used, and may be treated with a usual sizing agent such as an epoxy resin or vinyl acetate.
本発明における液晶ポリマ(A)の配合量は50〜99重
量%、好ましくは55〜95重量%であり、熱可塑性ポリマ
ー(B)の配合量は50〜1重量%、好ましくは45〜5重
量%である。(A)の配合量が50重量%より少ないと本
発明の効果が少なく機械物性も低く好ましくない。また
99重量%より多いと本発明の効果がない。充填剤(C)
の配合量はこの樹脂組成物100重量部に対して1〜200重
量部であり、好ましくは5〜150重量部である。The compounding amount of the liquid crystal polymer (A) in the present invention is 50 to 99% by weight, preferably 55 to 95% by weight, and the compounding amount of the thermoplastic polymer (B) is 50 to 1% by weight, preferably 45 to 5% by weight. %. If the amount of (A) is less than 50% by weight, the effects of the present invention are small and the mechanical properties are low, which is not preferable. Also
If it is more than 99% by weight, the effect of the present invention is not obtained. Filler (C)
Is from 1 to 200 parts by weight, preferably from 5 to 150 parts by weight, based on 100 parts by weight of the resin composition.
この熱可塑性樹脂組成物の製造において熱可塑性ポリ
マ(B)と液晶性ポリマ(A)を溶融混合する前に熱可
塑性樹脂(B)と充填剤を予め溶融混合することが必須
であり、熱可塑性ポリマー(B)と液晶性ポリマ(A)
および充填剤を同時に溶融混練すると充填剤の表面を液
晶性ポリエステルが被覆したり充填剤のカップリング剤
を破壊するためか、充填剤を添加しても機械的性質がそ
れ程向上しなかつたり、低下することもある。これに対
して熱可塑性ポリマに予め充填剤を溶融混合しておけば
充填剤は熱可塑性ポリマで被覆されているため液晶性ポ
リマ(A)と溶融混練しても充填剤(C)のカップリン
グ剤を破壊することもなく機械的特性が大きく向上する
ことがわかる。なお液晶ポリマ(A)の方も予め充填剤
(C)で別に溶融混練しておいても熱可塑性ポリマ
(B)と充填剤(C)の補強効果により、これらのもの
を同時に溶融混練するよりは表面光沢や耐熱性が良好で
ある。In the production of this thermoplastic resin composition, it is essential to melt-mix the thermoplastic resin (B) and the filler before melt-mixing the thermoplastic polymer (B) and the liquid crystalline polymer (A). Polymer (B) and liquid crystalline polymer (A)
If the filler and the filler are melt-kneaded at the same time, the liquid crystal polyester may coat the filler surface or break the coupling agent of the filler, or the mechanical properties will not improve or decrease even if the filler is added. Sometimes. On the other hand, if the filler is melt-mixed in advance with the thermoplastic polymer, the filler is covered with the thermoplastic polymer, so even if the liquid crystal polymer (A) is melt-kneaded, the filler (C) is coupled. It can be seen that the mechanical properties are greatly improved without destroying the agent. Even if the liquid crystal polymer (A) is separately melt-kneaded with the filler (C) in advance, the reinforcing effect of the thermoplastic polymer (B) and the filler (C) makes it difficult to melt and knead these at the same time. Has good surface gloss and heat resistance.
本発明の組成物には、本発明の目的を損なわない程度
の範囲で、酸化防止剤および熱安定剤(たとえばヒンダ
ードフェノール、ヒドロキノン、ホスファイト類および
これらの置換体など)、紫外線吸収剤(たとえばレゾル
シノール、サリシレート、ベンゾトリアゾール、ベンゾ
フェノンなど)、滑剤および離型剤(モンタン酸および
その塩、そのエステル、そのハーフエステル、ステアリ
ルアルコール、ステアラミドおよびポリエチレンワック
スなど)、染料(たとえばニトロシンなど)および顔料
(たとえば硫化カドミウム、フタロシアニン、カーボン
ブラックなど)を含む着色剤、難燃剤、可塑剤、帯電防
止剤、強化剤などの通常の添加剤や他の熱可塑性樹脂を
添加して、所定の特性を付与することができる。The composition of the present invention contains an antioxidant and a heat stabilizer (for example, hindered phenol, hydroquinone, phosphites and substituted products thereof) and an ultraviolet absorber (to the extent that the object of the present invention is not impaired). For example, resorcinol, salicylate, benzotriazole, benzophenone, etc.), lubricants and release agents (such as montanic acid and its salts, esters, half esters thereof, stearyl alcohol, stearamide, and polyethylene wax), dyes (for example, nitrosine) and pigments (for example, nitrosine). For example, a colorant containing cadmium sulfide, phthalocyanine, carbon black, etc.), a usual additive such as a flame retardant, a plasticizer, an antistatic agent, a reinforcing agent, or another thermoplastic resin is added to impart a predetermined property. be able to.
本発明の熱可塑性樹脂組成物の溶融混練には公知の方
法を用いることができる。たとえば、バンバリーミキサ
ー、ゴムロール機、ニーダー、単軸もしくは二軸押出機
などを用い、200〜400℃の温度で溶融混練して組成物と
することができる。A known method can be used for melt-kneading the thermoplastic resin composition of the present invention. For example, the composition can be melt-kneaded at a temperature of 200 to 400 ° C. using a Banbury mixer, a rubber roll machine, a kneader, a single-screw or twin-screw extruder, and the like to obtain a composition.
以下、実施例により本発明を詳述する。 Hereinafter, the present invention will be described in detail with reference to examples.
参考例1 p−ヒドロキシ安息香酸466重量部、4,4′−ジヒドロ
キシビフェニル84重量部、無水酢酸480重量部、テレフ
タル酸75重量部および固有粘度が約0.6dl/gのポリエチ
レンテレフタレート130重量部を攪拌翼、留出管を備え
た反応容器に仕込み、次の条件で脱酢酸重縮合を行つ
た。Reference Example 1 466 parts by weight of p-hydroxybenzoic acid, 84 parts by weight of 4,4'-dihydroxybiphenyl, 480 parts by weight of acetic anhydride, 75 parts by weight of terephthalic acid and 130 parts by weight of polyethylene terephthalate having an intrinsic viscosity of about 0.6 dl / g The reaction vessel was equipped with a stirring blade and a distillation tube, and subjected to deacetic acid polycondensation under the following conditions.
まず、窒素ガス雰囲気下に250〜300℃で2.5時間反応
させた後、300℃で0.2mmHgに減圧し、さらに3.25時間反
応させ重縮合を完結させたところ、ほぼ理論量の酢酸が
留出し、下記の理論構造式を有する樹脂(a)を得た。First, after reacting at 250 to 300 ° C for 2.5 hours under a nitrogen gas atmosphere, the pressure was reduced to 0.2 mmHg at 300 ° C, and the reaction was further completed for 3.25 hours to complete the polycondensation. A resin (a) having the following theoretical structural formula was obtained.
また、このポリエステルを偏光顕微鏡の試料台にの
せ、昇温して、光学異方性の確認を行つた結果、液晶開
始温度は264℃であり、良好な光学異方性を示した。こ
のポリエステルの対数粘度(0.1g/dlの濃度でペンタフ
ルオロフェノール中、60℃で測定)は1.25であつた。 Further, the polyester was placed on a sample stage of a polarizing microscope and heated to check the optical anisotropy. As a result, the liquid crystal onset temperature was 264 ° C., indicating good optical anisotropy. The logarithmic viscosity of the polyester (measured in pentafluorophenol at 60 ° C. at a concentration of 0.1 g / dl) was 1.25.
参考例2 p−アセトキシ安息香酸519重量部、4,4′−ジアセト
キシビフェニル184重量部、t−ブチルハイドロキノン
ジアセテート85重量部、ハイドロキノンジアセテート1
9.4重量部およびテレフタル酸186重量部を攪拌翼、留出
管を備えた反応容器に仕込み、窒素ガス雰囲気下に250
〜340℃で3.0時間反応させた後、350℃に昇温後1.5mmHg
に系内を減圧し、さらに1.0時間加熱し、重縮合反応を
行い下記の理論構造式を有する樹脂(b)を得た。Reference Example 2 519 parts by weight of p-acetoxybenzoic acid, 184 parts by weight of 4,4'-diacetoxybiphenyl, 85 parts by weight of t-butyl hydroquinone diacetate, hydroquinone diacetate 1
9.4 parts by weight and 186 parts by weight of terephthalic acid were charged into a reaction vessel equipped with a stirring blade and a distillation
After reacting at ~ 340 ° C for 3.0 hours, the temperature is raised to 350 ° C and then 1.5mmHg
The system was further decompressed and further heated for 1.0 hour to carry out a polycondensation reaction to obtain a resin (b) having the following theoretical structural formula.
また、このポリエステルを偏光顕微鏡の試料台にの
せ、昇温して光学異方性の確認を行つたところ、液晶開
始温度は307℃であり、良好な光学異方性を示した。こ
のポリエステルの対数粘度(参考例1と同一の条件で測
定)は4.3であつた。 The polyester was placed on a sample stage of a polarizing microscope, and the temperature was raised to confirm the optical anisotropy. As a result, the liquid crystal onset temperature was 307 ° C., indicating good optical anisotropy. The logarithmic viscosity of the polyester (measured under the same conditions as in Reference Example 1) was 4.3.
参考例3 p−アセトキシ安息香酸541重量部、4,4′−ジアセト
キシビフェニル184重量部、ハイドロキノンジアセテー
ト62重量部およびテレフタル酸124重量部、イソフタル
酸42重量部を攪拌翼、留出管を備えた反応容器に仕込
み、窒素ガス雰囲気下に250〜360℃で3時間反応させた
後、1mmHgに減圧し、さらに1時間加熱し、重縮合を完
結させ、下記の理論構造式を有する樹脂(c)を得た。Reference Example 3 541 parts by weight of p-acetoxybenzoic acid, 184 parts by weight of 4,4'-diacetoxybiphenyl, 62 parts by weight of hydroquinone diacetate, 124 parts by weight of terephthalic acid, and 42 parts by weight of isophthalic acid were stirred with a stirring blade and a distillation tube. After the reaction was carried out at 250 to 360 ° C. for 3 hours under a nitrogen gas atmosphere, the pressure was reduced to 1 mmHg, and the mixture was further heated for 1 hour to complete the polycondensation. c) was obtained.
実施例1 対数粘度が0.65のポリエチレンテレフタレート(東レ
社製品)45重量部(B)とガラス繊維(C)55重量部
(3mm長、10μmチョップドストランド)をドライブレ
ンドした後280℃に設定した40mm単軸押出機で溶融混合
しガラス繊維55%含有補強ポリエチレンテレフタレート
を得た。 Example 1 A dry blend of 45 parts by weight (B) of polyethylene terephthalate having a logarithmic viscosity of 0.65 (manufactured by Toray Industries, Ltd.) and 55 parts by weight of glass fiber (C) (3 mm length, 10 μm chopped strand) was used, and then a 40 mm unit set at 280 ° C. The mixture was melt-mixed with a screw extruder to obtain reinforced polyethylene terephthalate containing 55% of glass fiber.
このガラス繊維補強ポリエチレンテレフタレート
〔(B)+(C)〕100重量部と参考例1の液晶ポリマ
(a)〔(A)〕100重量部((A)/(B)=69/31,
(C)/〔(A)+(B)〕=38/100)をドライブレン
ドした後、住友ネスタール射出成形機プロマット40/25
(住友重機械工業(株)製)に供し、シリンダー温度29
0℃、金型温度120℃の条件で1/8″厚×1/2″幅の5″長
のテストピース、1/8″厚のASTM NO1ダンベルおよび70
×70×2mm厚の角板を成形した。曲げ強度は1/8″厚×1/
2″幅×5″長のテストピースを用い東洋ボールドウイ
ン社製テンシロンUTM−200でひずみ速度1mm/分、スパン
間距離50mmの条件で、測定を行った。そしてASTM D638
に従ってASTM No.1ダンベルの引張強度の測定を行つ
た。100 parts by weight of this glass fiber reinforced polyethylene terephthalate [(B) + (C)] and 100 parts by weight of the liquid crystal polymer (a) [(A)] of Reference Example 1 ((A) / (B) = 69/31,
(C) / [(A) + (B)] = 38/100), and then Sumitomo Nestal injection molding machine Promat 40/25.
(Sumitomo Heavy Industries, Ltd.), cylinder temperature 29
1/8 "thick x 1/2" wide 5 "long test piece, 1/8" thick ASTM NO1 dumbbell and 70 at 0 ° C, mold temperature 120 ° C
A square plate of × 70 × 2 mm thickness was formed. Flexural strength is 1/8 "thickness x 1
Using a test piece of 2 "width x 5" length, the measurement was performed using a Tensilon UTM-200 manufactured by Toyo Baldwin Co., Ltd. under the conditions of a strain rate of 1 mm / min and a distance between spans of 50 mm. And ASTM D638
The tensile strength of ASTM No. 1 dumbbell was measured in accordance with the above.
角板は流動方向、直角方向に14mm幅に切り出し東洋ボ
ールドウィン社製テンシロンUTM−200を用いてひずみ速
度1mm/分、スパン間距離40mmの条件で曲げ弾性率の測定
を行い異方性の評価を行つた。その結果曲げ強度は2150
kg/cm2、引張強度は1770kg/cm2であつた。そして角板の
流動方向と直角方向の曲げ弾性率を測定したところそれ
ぞれ13.8×104kg/cm2、7.3×104kg/cm2であり、その比
は1.9と比較的異方性の小さいことがわかつた。また、
成形品の表面光沢も良好であつた。The square plate was cut out to a width of 14 mm in the flow direction and the right angle direction, using a Toyo Baldwin Tensilon UTM-200, measuring the flexural modulus under the conditions of a strain rate of 1 mm / min and a span distance of 40 mm to evaluate the anisotropy. I went. The resulting bending strength is 2150
kg / cm 2, the tensile strength was found to be 1770kg / cm 2. And the bending elastic modulus in the direction perpendicular to the flow direction of the square plate was measured to be 13.8 × 10 4 kg / cm 2 and 7.3 × 10 4 kg / cm 2 , respectively, and the ratio was 1.9, which is relatively small. I can tell you. Also,
The surface gloss of the molded product was also good.
比較例1 参考例1の液晶ポリマ(a)〔(A)〕69重量部と対
数粘度0.65(オルトクロロフェノール中0.5g/dl、25℃
で測定)のポリエチレンテレフタレート(B)31重量部
およびガラス繊維(C)38重量部(3mm長、10μmチョ
ップドストランド)(A)/(B)=69/31、(C)/
(A)+(B)=38/100をドライブレンドした後290℃
に設定した40mmφの単軸押出機で溶融混合し、得られた
チップを住友ネスタール射出成形機プロマット40/25
(住友重機械工業(株)製)に供しシリンダー温度290
℃、金型温度120℃の条件で1/8″厚×1/2″幅×5″長
のテストピース、1/8″厚のASTM No.1ダンベルおよび70
×70×2mm厚の角板を成形した。曲げ強度は1/8″厚×1/
2″幅×5″長のテストピースを用い東洋ボールドウィ
ン社製テンシロンUTM−200でひずみ速度1mm/分、スパ間
距離50mmの条件で測定を行つた。そしてASTM D638に従
ってASTM No.1ダンベルの引張強度の測定を行つた。Comparative Example 1 69 parts by weight of the liquid crystal polymer (a) [(A)] of Reference Example 1 and a logarithmic viscosity of 0.65 (0.5 g / dl in orthochlorophenol at 25 ° C.)
31 parts by weight of polyethylene terephthalate (B) and 38 parts by weight of glass fiber (C) (3 mm length, 10 μm chopped strand) (A) / (B) = 69/31, (C) /
(A) + (B) = 290 ° C after dry blending of 38/100
Melt-mixed with a 40 mmφ single screw extruder, and the resulting chips are Sumitomo Nestal injection molding machine Promat 40/25
(Sumitomo Heavy Industries, Ltd.) cylinder temperature 290
1/8 "thick x 1/2" wide x 5 "long test piece, 1/8" thick ASTM No.1 dumbbell and 70 ° C, mold temperature 120 ° C
A square plate of × 70 × 2 mm thickness was formed. Flexural strength is 1/8 "thickness x 1
The measurement was performed using a test piece 2 "wide x 5" long with a Tensilon UTM-200 manufactured by Toyo Baldwin Co., Ltd. under the conditions of a strain rate of 1 mm / min and a distance between spas of 50 mm. Then, the tensile strength of ASTM No. 1 dumbbell was measured according to ASTM D638.
角板は流動方向、直角方向に14mm幅に切り出し東洋ボ
ールドウィン社製テンシロンUTM−200を用いてひずみ速
度1mm/分、スパン間距離40mmの条件で曲げ弾性率の測定
を行い異方性の評価を行つた。The square plate was cut out to a width of 14 mm in the flow direction and the right angle direction, using a Toyo Baldwin Tensilon UTM-200, measuring the flexural modulus under the conditions of a strain rate of 1 mm / min and a span distance of 40 mm to evaluate the anisotropy. I went.
その結果曲げ強度は1,640kg/cm2、引張強度は1,230kg
/cm2であり本発明の実施例1よりも強度の低いことがわ
かつた。そして角板の流動方向と直角方向の曲げ弾性率
を測定したところそれぞれ13.4.×104kg/cm2、3.8×104
kg/cm2であり、その比は3.5であり本発明の実施例より
も異方性の大きいことがわかつた。As a result, the bending strength is 1,640 kg / cm 2 and the tensile strength is 1,230 kg
/ cm 2, which is lower than Example 1 of the present invention. When the flexural modulus in the flow direction and the direction perpendicular to the rectangular plate was measured, they were 13.4. × 10 4 kg / cm 2 and 3.8 × 10 4 , respectively.
kg / cm 2 , and the ratio was 3.5, indicating that the anisotropy was larger than in the examples of the present invention.
また、成形品の表面光沢を観察した所、ザラザラして
おり不良であつた。Further, when the surface gloss of the molded article was observed, it was rough and defective.
実施例2〜9 参考例1〜3の液晶ポリマ(a)〜(c)〔(A)〕
に第1表に示す予めガラス繊維(C′)で補強された熱
可塑性ポリマおよびガラス繊維(3mm長、10μmチョッ
プドストランド)(C)とを第1表に示す割合でドライ
ブレンドした後290〜360℃に設定した40mmφの単軸押出
機で溶融混合し得られたチップを住友ネスタール射出成
形機プロマット40/25に供しシリンダー温度290〜360
℃、金型温度80〜160℃の条件で実施例1と同様のテス
トピースを成形した。Examples 2 to 9 Liquid crystal polymers (a) to (c) of Reference Examples 1 to 3 [(A)]
Then, the thermoplastic polymer and glass fiber (3 mm length, 10 μm chopped strand) (C) previously reinforced with glass fiber (C ′) shown in Table 1 were dry-blended at the ratio shown in Table 1 and then 290 to 360. The chips obtained by melting and mixing with a 40 mmφ single screw extruder set to ° C. were subjected to Sumitomo Nestal injection molding machine Promat 40/25, and the cylinder temperature was 290 to 360.
A test piece similar to that of Example 1 was molded at a temperature of 80 ° C. and a mold temperature of 80 to 160 ° C.
得られたテストピースを実施例1と同様の条件で曲げ
強度、引張強度の測定を行つた結果を第1表に示す。ま
た成形品の表面光沢を観察した結果を併せて第1表に示
す。Table 1 shows the results of measuring the bending strength and the tensile strength of the obtained test piece under the same conditions as in Example 1. Table 1 also shows the results of observation of the surface gloss of the molded product.
比較例2〜9 参考例1〜3の液晶ポリマ(a)〜(c)〔(A)〕
と第1表に示す熱可塑性樹脂(B)およびガラス繊維
(C)(3mm長、10μmチョップドストランド)を第1
表に示す割合でドライブレンドした後290〜360℃に設定
した40mmφ単軸押出機で溶融混合し得られたチップを住
友プロマット射出成形機に供し、シリンダー温度290〜3
60℃、金型温度80〜160℃で比較例1と同様のテストピ
ースを成形した。Comparative Examples 2 to 9 Liquid Crystal Polymers of Reference Examples 1 to 3 (a) to (c) [(A)]
And the thermoplastic resin (B) and glass fiber (C) (3 mm long, 10 μm chopped strand) shown in Table 1
After dry blending at the ratios shown in the table, the chips obtained by melt mixing with a 40 mmφ single screw extruder set at 290 to 360 ° C. were subjected to a Sumitomo Promat injection molding machine, and a cylinder temperature of 290 to 3
A test piece similar to that of Comparative Example 1 was molded at a temperature of 60 ° C. and a mold temperature of 80 to 160 ° C.
得られたテストピースを比較例1と同様の条件で曲げ
強度、引張強度の測定を行つた結果を第1表に示す。ま
た成形品の表面光沢を観察した結果を併せて第1表に示
す。第1表から本発明の実施例2〜7に比して強度が低
く成形品の表面光沢も不良なことがわかる。The bending strength and tensile strength of the obtained test piece were measured under the same conditions as in Comparative Example 1, and the results are shown in Table 1. Table 1 also shows the results of observation of the surface gloss of the molded product. From Table 1, it can be seen that the strength is lower than that of Examples 2 to 7 of the present invention and the surface gloss of the molded product is also poor.
実施例10 参考例1の液晶ポリエステル(a)72.5重量部とガラ
ス繊維27.5重量部(3mm長,10μmチョップドストラン
ド)をドライブレンドした後300℃に設定した40mmφ単
軸押出機で溶融混合しガラス繊維補強液晶ポリマ
(a′)を得た。 Example 10 72.5 parts by weight of the liquid crystal polyester (a) of Reference Example 1 and 27.5 parts by weight of glass fiber (3 mm long, 10 μm chopped strand) were dry-blended and then melt-mixed with a 40 mmφ single screw extruder set at 300 ° C. A reinforced liquid crystal polymer (a ') was obtained.
次に対数粘度が0.65のポリエチレンテレフタレート
(東レ社製品)72.5重量部とガラス繊維27.5重量部(3m
m長,10μmチョップドストランド)をドライブレンドし
た後、290℃に設定した40mmφ単軸押出機で溶融混合し
ガラス繊維補強ポリエチレンテレフタレート(ロ)を得
た。Next, 72.5 parts by weight of polyethylene terephthalate (product of Toray) with logarithmic viscosity of 0.65 and 27.5 parts by weight of glass fiber (3 m
m length, 10 μm chopped strand) was dry-blended and then melt-mixed with a 40 mmφ single screw extruder set at 290 ° C. to obtain glass fiber reinforced polyethylene terephthalate (b).
このガラス繊維補強液晶ポリマ(a′)69重量部とガ
ラス繊維補強ポリエチレンテレフタレート(ロ)31重量
部をドライブレンドした後、住友ネスタール射出成形機
プロマット40/25に供しシリンダー温度290℃、金型温度
120℃の条件で実施例1と同様のテストピース、角板を
成形した。After dry blending 69 parts by weight of this glass fiber reinforced liquid crystal polymer (a ') and 31 parts by weight of glass fiber reinforced polyethylene terephthalate (b), the mixture is supplied to a Sumitomo Nestal injection molding machine Promat 40/25, and the cylinder temperature is 290 ° C. temperature
Under the conditions of 120 ° C., the same test pieces and square plates as in Example 1 were formed.
得られたテストピースを実施例1と同様の条件で曲げ
強度、引張強度の測定を行つた結果曲げ強度は1,930kg/
cm2、引張強度は1,580kg/cm2であつた。The bending strength and the tensile strength of the obtained test piece were measured under the same conditions as in Example 1. As a result, the bending strength was 1,930 kg /.
cm 2 , and the tensile strength was 1,580 kg / cm 2 .
角板の流動方向と直角方向の曲げ弾性率は13.4×104k
g/cm2、6.5×104kg/cm2でありその比は2.1であつた。ま
た、成形品の表面光沢も良好であつた。The flexural modulus in the direction perpendicular to the flow direction of the square plate is 13.4 × 10 4 k
g / cm 2 , 6.5 × 10 4 kg / cm 2 and the ratio was 2.1. The surface gloss of the molded product was also good.
比較例1と比較して機械的性質が優れると同時に表面
光沢も優れている事がわかる。It can be seen that the mechanical properties are excellent and the surface gloss is also excellent as compared with Comparative Example 1.
本発明は、限定された構造式からなる特定の液晶ポリ
エステルに予め繊維補強された熱可塑性樹脂を添加する
ことにより優れた機械的性質および表面光沢の熱可塑性
樹脂が得られる。In the present invention, a thermoplastic resin having excellent mechanical properties and surface gloss can be obtained by adding a thermoplastic resin reinforced in advance to a specific liquid crystal polyester having a limited structural formula.
Claims (3)
I)から選ばれた構造単位を有する、液晶ポリエステル
および液晶ポリエステルアミドから選択される液晶ポリ
マ(A)50〜99重量%と熱可塑性ポリマー(B)50〜1
重量%からなる樹脂組成物100重量部に対して充填剤
(C)を1〜200重量部含有せしめた熱可塑性樹脂組成
物の製造において、上記熱可塑性ポリマー(B)と充填
剤(C)を予めバンバりーミキサー、ゴムロール機、ニ
ーダー、単軸もしくは二軸押出機を用いて溶融混練した
後に上記液晶ポリマ(A)を溶融混合することを特徴と
する熱可塑性樹脂組成物の製造方法。 (式中のXは二価の芳香族残基を、Y、Zは二価の芳香
族または脂肪族、脂環族残基を表し、RはOまたはNHを
示す。 また、上記構造単位(II)と(III)は実質的に等モル
である。)(1) The following structural units (I), (II) and (II)
50 to 99% by weight of a liquid crystal polymer (A) selected from a liquid crystal polyester and a liquid crystal polyesteramide having a structural unit selected from I) and 50 to 1% of a thermoplastic polymer (B)
In the production of a thermoplastic resin composition in which the filler (C) is contained in an amount of 1 to 200 parts by weight based on 100 parts by weight of the resin composition consisting of 100% by weight, the thermoplastic polymer (B) and the filler (C) are used. A method for producing a thermoplastic resin composition, which comprises melt-kneading in advance using a Banbury mixer, a rubber roll machine, a kneader, a single-screw or twin-screw extruder, and then melt-mixing the liquid crystal polymer (A). (X in the formula represents a divalent aromatic residue, Y and Z each represent a divalent aromatic, aliphatic, or alicyclic residue, and R represents O or NH. In addition, the above structural unit ( (II) and (III) are substantially equimolar.)
〜(IV′)からなり熱変形温度が150〜280℃の液晶ポリ
エステルであることを特徴とする請求項(1)記載の熱
可塑性樹脂組成物の製造方法。 (ただし式中のXは から選ばれた1種以上の基を示し、構造単位(IV′)の
カルボニル基は互いにパラあるいはメタ位の関係にあ
り、その50モル%以上がパラ位である。 また、上記構造単位(II′)および(III′)の合計と
(IV′)は実質的に等モルである。)2. The liquid crystal polymer (A) has the following structural unit (I ')
The method for producing a thermoplastic resin composition according to claim 1, wherein the thermoplastic resin composition is a liquid crystal polyester having a heat deformation temperature of 150 to 280 ° C. (However, X in the formula is And the carbonyl groups of the structural unit (IV ′) are in a para or meta position with respect to each other, and 50 mol% or more of the carbonyl groups are in the para position. The sum of the structural units (II ') and (III') and (IV ') are substantially equimolar. )
カーボネート、ポリアリーレンオキサイド、ポリアルキ
レンテレフタレート、ポリアリレンスルフィド、ポリエ
ーテルエーテルケトンから選ばれた一種以上であること
を特徴とする請求項(1)または(2)記載の熱可塑性
樹脂組成物の製造方法。3. The method according to claim 1, wherein the thermoplastic polymer (B) is at least one selected from the group consisting of polyamide, polycarbonate, polyarylene oxide, polyalkylene terephthalate, polyarylene sulfide, and polyetheretherketone. ) Or the method for producing the thermoplastic resin composition according to (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02687789A JP3182756B2 (en) | 1989-02-06 | 1989-02-06 | Method for producing thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02687789A JP3182756B2 (en) | 1989-02-06 | 1989-02-06 | Method for producing thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02206644A JPH02206644A (en) | 1990-08-16 |
JP3182756B2 true JP3182756B2 (en) | 2001-07-03 |
Family
ID=12205524
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JP02687789A Expired - Fee Related JP3182756B2 (en) | 1989-02-06 | 1989-02-06 | Method for producing thermoplastic resin composition |
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JP2003268241A (en) * | 2002-03-13 | 2003-09-25 | Toray Ind Inc | Liquid crystalline resin composition for molding and molded circuit board |
CN1187410C (en) * | 2002-09-13 | 2005-02-02 | 中国科学院化学研究所 | Composite material containing short fibre and thermotropic liquid crystal polymer |
KR101915731B1 (en) * | 2015-12-22 | 2018-11-06 | 포리프라스틱 가부시키가이샤 | Liquid crystalline resin composition and insert molding product |
KR102461065B1 (en) * | 2020-12-29 | 2022-11-01 | 세양폴리머주식회사 | Liquid crystal polyester resin composition and electronic component material containing the same |
CN114940833A (en) * | 2022-07-01 | 2022-08-26 | 宁夏清研高分子新材料有限公司 | High-strength LCP composite material and preparation method thereof |
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