JP3179086U7 - - Google Patents

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Publication number
JP3179086U7
JP3179086U7 JP2012002117U JP2012002117U JP3179086U7 JP 3179086 U7 JP3179086 U7 JP 3179086U7 JP 2012002117 U JP2012002117 U JP 2012002117U JP 2012002117 U JP2012002117 U JP 2012002117U JP 3179086 U7 JP3179086 U7 JP 3179086U7
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JP
Japan
Prior art keywords
fins
recessed
exchange system
heat exchange
manifold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2012002117U
Other languages
English (en)
Japanese (ja)
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JP3179086U (ja
Filing date
Publication date
Priority claimed from US13/401,618 external-priority patent/US9453691B2/en
Application filed filed Critical
Publication of JP3179086U publication Critical patent/JP3179086U/ja
Application granted granted Critical
Publication of JP3179086U7 publication Critical patent/JP3179086U7/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2012002117U 2011-07-27 2012-04-11 流体熱交換システム Expired - Lifetime JP3179086U (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161512379P 2011-07-27 2011-07-27
US61/512,379 2011-07-27
US13/401,618 US9453691B2 (en) 2007-08-09 2012-02-21 Fluid heat exchange systems
US13/401,618 2012-02-21

Publications (2)

Publication Number Publication Date
JP3179086U JP3179086U (ja) 2012-10-18
JP3179086U7 true JP3179086U7 (https=) 2014-06-05

Family

ID=46705693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012002117U Expired - Lifetime JP3179086U (ja) 2011-07-27 2012-04-11 流体熱交換システム

Country Status (3)

Country Link
JP (1) JP3179086U (https=)
DE (1) DE202012002974U1 (https=)
TW (1) TWI606224B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US8746330B2 (en) 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
JP6124742B2 (ja) 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
DE102018125375A1 (de) * 2018-10-14 2020-04-16 Han Xu Hardware Plastic Technological Co., Ltd. Wassergekühlte hocheffizienz-wärmeableitungsvorrichtung
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
DE102020207947A1 (de) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs und Herstellungsverfahren dafür
EP4150216A4 (en) 2020-05-11 2023-11-01 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) * 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
TWI854755B (zh) * 2022-12-01 2024-09-01 台灣光罩股份有限公司 用以測試半導體元件之測試系統

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
JPH10173114A (ja) * 1996-12-13 1998-06-26 Hitachi Ltd マルチチップモジュールの冷却構造
JP4141613B2 (ja) * 2000-03-09 2008-08-27 富士通株式会社 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器
JP2003243581A (ja) * 2002-02-15 2003-08-29 Fujikura Ltd ヒートシンク
JP2007531991A (ja) * 2004-03-31 2007-11-08 ハイドロクール ピーティーワイ リミテッド 熱交換器
JP2005351600A (ja) * 2004-06-14 2005-12-22 Nikkei Nekko Kk アルミ製熱交換器及びそのスケール付着防止方法
JP2007180505A (ja) * 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
WO2007104580A2 (de) * 2006-03-16 2007-09-20 Behr Gmbh & Co. Kg Wärmetauscher für ein kraftfahrzeug
JP4797954B2 (ja) * 2006-11-30 2011-10-19 アイコム株式会社 放熱フィンの冷却構造
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
JP2011114206A (ja) * 2009-11-27 2011-06-09 Ryosan Co Ltd フィン一体型ヒートシンク

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