JP3179086U7 - - Google Patents

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Publication number
JP3179086U7
JP3179086U7 JP2012002117U JP2012002117U JP3179086U7 JP 3179086 U7 JP3179086 U7 JP 3179086U7 JP 2012002117 U JP2012002117 U JP 2012002117U JP 2012002117 U JP2012002117 U JP 2012002117U JP 3179086 U7 JP3179086 U7 JP 3179086U7
Authority
JP
Japan
Prior art keywords
fins
recessed
exchange system
heat exchange
manifold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2012002117U
Other languages
English (en)
Japanese (ja)
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JP3179086U (ja
Filing date
Publication date
Priority claimed from US13/401,618 external-priority patent/US9453691B2/en
Application filed filed Critical
Application granted granted Critical
Publication of JP3179086U publication Critical patent/JP3179086U/ja
Publication of JP3179086U7 publication Critical patent/JP3179086U7/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2012002117U 2011-07-27 2012-04-11 流体熱交換システム Expired - Lifetime JP3179086U (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161512379P 2011-07-27 2011-07-27
US61/512,379 2011-07-27
US13/401,618 2012-02-21
US13/401,618 US9453691B2 (en) 2007-08-09 2012-02-21 Fluid heat exchange systems

Publications (2)

Publication Number Publication Date
JP3179086U JP3179086U (ja) 2012-10-18
JP3179086U7 true JP3179086U7 (enrdf_load_stackoverflow) 2014-06-05

Family

ID=46705693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012002117U Expired - Lifetime JP3179086U (ja) 2011-07-27 2012-04-11 流体熱交換システム

Country Status (3)

Country Link
JP (1) JP3179086U (enrdf_load_stackoverflow)
DE (1) DE202012002974U1 (enrdf_load_stackoverflow)
TW (1) TWI606224B (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
JP6124742B2 (ja) 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
DE102018125375A1 (de) * 2018-10-14 2020-04-16 Han Xu Hardware Plastic Technological Co., Ltd. Wassergekühlte hocheffizienz-wärmeableitungsvorrichtung
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
DE102020207966A1 (de) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs
EP4150216A4 (en) 2020-05-11 2023-11-01 Coolit Systems, Inc. LIQUID PUMP UNITS AND ASSOCIATED SYSTEMS AND METHODS
US11725886B2 (en) * 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
TWI854755B (zh) * 2022-12-01 2024-09-01 台灣光罩股份有限公司 用以測試半導體元件之測試系統

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
JPH10173114A (ja) * 1996-12-13 1998-06-26 Hitachi Ltd マルチチップモジュールの冷却構造
JP4141613B2 (ja) * 2000-03-09 2008-08-27 富士通株式会社 密閉サイクル冷凍装置および密閉サイクル冷凍装置用乾式蒸発器
JP2003243581A (ja) * 2002-02-15 2003-08-29 Fujikura Ltd ヒートシンク
JP2007531991A (ja) * 2004-03-31 2007-11-08 ハイドロクール ピーティーワイ リミテッド 熱交換器
JP2005351600A (ja) * 2004-06-14 2005-12-22 Nikkei Nekko Kk アルミ製熱交換器及びそのスケール付着防止方法
JP2007180505A (ja) * 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd 電子部品の冷却装置
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
CN101400959B (zh) * 2006-03-16 2010-09-29 贝洱两合公司 用于汽车的热交换器
JP4797954B2 (ja) * 2006-11-30 2011-10-19 アイコム株式会社 放熱フィンの冷却構造
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
JP2011114206A (ja) * 2009-11-27 2011-06-09 Ryosan Co Ltd フィン一体型ヒートシンク

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