JP3171991U - Lighting equipment for promoting plant growth - Google Patents

Abstract

A lighting apparatus for promoting plant growth is provided. A plant growth promoting lighting system comprising a substrate unit, a light emitting unit, a current limiting unit, and a control unit. The substrate unit 1 includes a substrate body 10, and the light emitting unit 2, the current limiting unit 3, and the control unit 4 are provided on the substrate body 10. The light emitting unit 2 includes light emitting modules 2A, 2B, 2C each having a plurality of light emitting diode chips 20A, 20B, 20C electrically connected to the substrate body 10. The current limiting unit 3 includes current control chips 30A, 30B, and 30C that are electrically connected to the light emitting modules 2A, 2B, and 2C, respectively. The control unit 4 includes PWM control modules 40A, 40B, and 40C that are electrically connected to the current limiting chips 30A, 30B, and 30C, respectively. [Selection] Figure 10

Description

  The present invention relates to a lighting equipment, and more particularly to a lighting equipment for promoting the growth of plants.

  Lighting equipment used in daily life, such as fluorescent lamps and tungsten lamps, and lighting equipment that are gradually being accepted by consumers at present, have been widely used in daily life. However, at present, there have not been many proposals for lighting equipment having a structure suitable for promoting the growth of plants. In addition, this type of lamp or light bulb has drawbacks such that light deterioration is likely to occur, high heat is easily generated, life is short, cracking is difficult, and recycling is difficult.

  Therefore, there is a demand for lighting equipment suitable for promoting the growth of plants. Further, there is a demand for a sealing structure when a light emitting diode is used as a light emitter.

  The present invention provides lighting equipment (lighting equipment for promoting plant growth) for promoting the growth of plants. The plant growth promoting lighting equipment includes a substrate unit, a light emitting unit, a current limiting unit, and a control unit. The substrate unit includes a substrate body, and the light emitting unit, the current limiting unit, and the control unit are provided on the substrate body. The light emitting unit includes a plurality of first light emitting modules having a plurality of first light emitting diode chips electrically connected to the substrate body, and a second having a plurality of second light emitting diode chips electrically connected to the substrate body. And a third light emitting module having a plurality of third light emitting diode chips electrically connected to the substrate body. The current limiting unit includes a first current control chip electrically connected to the first light emitting module, a second current limiting chip electrically connected to the second light emitting module, and a third light emitting module. A third current limiting chip is included that is electrically connected. The control unit includes a first PWM control module electrically connected to the first current limit chip, a second PWM control module electrically connected to the second current limit chip, and a third current limit A third PWM control module electrically connected to the chip is included.

  In the lighting equipment according to the present invention, the first PWM control module controls a plurality of first light emitting diode chips at a predetermined pulse frequency, and the second PWM control module controls a plurality of second light emission at a predetermined pulse frequency. The diode chip is controlled, and the third PWM control module is configured to control the plurality of third light emitting diode chips at a predetermined pulse frequency. Thereby, the growth of a plant can be promoted.

It is a top view of a first embodiment of the present invention. It is II-II sectional drawing of FIG. It is a functional block diagram of a first embodiment of the present invention. FIG. 3 is a plan view of a part of a plurality of spare pads according to the first embodiment of the present invention. It is a functional block diagram of 2nd embodiment of this invention. It is a functional block diagram of 3rd embodiment of this invention. It is a functional block diagram of 4th embodiment of this invention. It is a top view of 5th embodiment of this invention. It is IX-IX sectional drawing of FIG. It is a top view of 6th embodiment of this invention. It is XI-XI sectional drawing of FIG.

1. 1st embodiment As shown in FIGS. 1-4, the plant growth promotion lighting installation which concerns on 1st embodiment of this invention is the board | substrate unit 1, the light emission unit 2, the current limiting unit 3, and control. A unit 4, a side frame unit 5, and a sealing unit 6 are provided.

  As shown in FIGS. 1 and 2, the substrate unit 1 includes a substrate body 10. The substrate body 10 is provided on a first chip placement area 10A provided on the upper surface of the substrate body 10, a second chip placement area 10B provided on the upper surface of the substrate body 10, and an upper surface of the substrate body 10. And a third chip placement region 10C. As shown in FIG. 2, the board body 10 includes a circuit board 100, a heat radiation layer 101 provided on the bottom of the circuit board 100, a plurality of conductive pads 102 provided on the upper surface of the circuit board 100, and the circuit board 100. A structure having an insulating layer 103 provided on the upper surface may be employed. Alternatively, the plurality of conductive pads 102 may be exposed from the insulating layer 103.

  As shown in FIGS. 1 and 2, the light emitting unit 2 includes a first light emitting module 2A that emits light having a first wavelength, a second light emitting module 2B that emits light having a second wavelength, And a third light emitting module 2C that emits light having a wavelength of 3 and a predetermined color temperature. The first light emitting module 2 </ b> A includes a plurality of first light emitting diode chips 20 </ b> A that are provided on the first chip installation region 10 </ b> A and are electrically connected to the substrate body 10. The second light emitting module 2 </ b> B includes a plurality of second light emitting diode chips 20 </ b> B that are provided on the second chip installation region 10 </ b> B and are electrically connected to the substrate body 10. The third light emitting module 2 </ b> C includes a plurality of third light emitting diode chips 20 </ b> C that are provided on the third chip installation region 10 </ b> C and are electrically connected to the substrate body 10. In the present embodiment, the same number of first light emitting diode chips 20A, second light emitting diode chips 20B, and third light emitting diode chips 20C are provided. For example, each first light emitting diode chip 20A may be a red light emitting diode die, and each second light emitting diode chip 20B and each third light emitting diode chip 20C emit blue light. It may be a diode die. Each first light emitting diode chip 20A, each second light emitting diode chip 20B, and each third light emitting diode chip 20C are electrically connected to the substrate body 10 by wire bonding.

  As shown in FIGS. 1 to 3, the current limiting unit 3 is provided on the substrate body 10, and is electrically connected to the first light emitting module 2 </ b> A, and the substrate body 10. And the second current limiting chip 30B electrically connected to the second light emitting module 2B and the substrate main body 10 and electrically connected to the third light emitting module 2C. And a third current limiting chip 30C. For example, the first current limiting chip 30A, the second current limiting chip 30B, and the third current limiting chip 30C are electrically connected to the substrate body 10 by a wire bonding method. The first current limiting chip 30 </ b> A may be surrounded by a surrounding sealing paste (paste for surrounding the periphery) 31 and covered with the sealing paste 32. The second current limiting chip 30 </ b> B may be surrounded by the surrounding sealing paste 31 and covered with the sealing paste 32. The third current limiting chip 30 </ b> C may be surrounded by the surrounding sealing paste 31 and covered with the sealing paste 32. Any sealing paste 32 may be an opaque paste. As shown in FIG. 3, when the current limiting unit 3 is electrically connected between the constant voltage power supply S and the light emitting unit 2, the current limiting unit 3 is connected between the constant voltage power supply S and the light emitting unit 2. It functions as a unit that controls current. Therefore, the light emitting unit 2 can receive a stable current supply from the constant voltage power supply S.

  As shown in FIGS. 1 to 3, the control unit 4 is provided on the substrate body 10 and is electrically connected to the first current limiting chip 30A. The first PWM (Pulse Width Modulation) control module 40A. A second PWM control module 40B provided on the substrate body 10 and electrically connected to the second current limiting chip 30B, and a third current limiting chip 30C provided on the substrate body 10. And a third PWM control module 40C electrically connected to. For example, when the control unit 4 is electrically connected between the constant voltage power supply S and the current limiting unit 3 as shown in FIG. 3, the first PWM control module 40A has a predetermined pulse frequency (for example, 50 Hz, 60Hz,..., 120Hz, 120Hz or more), and the second PWM control module 40B controls the plurality of second light emitting diode chips 20B at a predetermined pulse frequency. The third PWM control module 40C can control the plurality of third light emitting diode chips 20C at a predetermined pulse frequency.

  As shown in FIGS. 1 and 2, the side frame unit 5 includes a first surrounding side frame paste 50A formed on the upper surface of the substrate body 10 so as to surround the plurality of first light emitting diode chips 20A, The second surrounding side frame paste 50B formed on the upper surface of the substrate body 10 so as to surround the plurality of second light emitting diode chips 20B, and the substrate body 10 so as to surround the plurality of third light emitting diode chips 20C. 3rd surrounding side frame paste 50C formed in the upper surface of the. The first surrounding side frame paste 50A surrounds the plurality of first light emitting diode chips 20A, thereby forming a first paste position restriction space 500A (see FIG. 2) corresponding to the first chip installation region 10A. Form. The second surrounding side frame paste 50B surrounds the plurality of second light emitting diode chips 20B, thereby forming a second paste position restriction space 500B corresponding to the second chip installation region 10B. The third surrounding side frame paste 50C surrounds the plurality of third light emitting diode chips 20C, thereby forming a third paste position restriction space 500C corresponding to the third chip placement region 10C. The first surrounding side frame paste 50A, the second surrounding side frame paste 50B, and the third surrounding side frame paste 50C are spaced apart from each other by a predetermined distance. The first paste position restriction space 500A, the second paste position restriction space 500B, and the third paste position restriction space 500C are also spaced apart from each other by a predetermined distance.

  As an embodiment, the manufacturing method of the first surrounding side frame paste 50A, the second surrounding side frame paste 50B, or the third surrounding side frame paste 50C includes at least the following steps. (1) First, a liquid paste (not shown) is applied to the upper surface of the substrate body 10 so as to surround a predetermined shape. The liquid paste can be applied in an arbitrary shape so as to form, for example, a circle, an ellipse, a rectangle (including a square and a rectangle), a rhombus, a parallelogram, and the like. The thixotropic index of the liquid paste can be in the range of 4 to 6, the pressure for applying the liquid paste on the upper surface of the substrate body 10 can be in the range of 350 kPa to 450 kPa, and the substrate body The speed at which the liquid paste is applied to the upper surface of 10 can be in the range of 5 mm / s to 15 mm / s. Since the starting point and the ending point at which the liquid paste is applied to the upper surface of the substrate body 10 are substantially at the same position, the intersection between the starting point and the ending point is formed as a protruding part 5000 whose appearance slightly protrudes (FIG. 1). See). (2) Next, the first surrounding side frame paste 50A is formed by solidifying the liquid paste. The liquid paste can be cured by baking. The baking temperature can be in the range of 120 ° C. to 140 ° C., and the baking time can be in the range of 20 minutes to 40 minutes. Thereby, the upper surface of the first surrounding side frame paste 50A has an arc shape (see FIG. 2). The angle θ of the arcuate cut line T of the first surrounding side frame paste 50A with respect to the upper surface of the substrate body 10 can be in the range of 40 ° to 50 °. The height H of the top surface (surface including the apex) of one surrounding side frame paste 50A can be in the range of 0.3 mm to 0.7 mm, and the width of the bottom of the first surrounding side frame paste 50A D can be in the range of 1.5 mm to 3 mm. The thixo index of the first surrounding side frame paste 50A can be in the range of 4 to 6, and the first surrounding side frame paste 50A is a white thermosetting side paste containing an inorganic additive. There may be.

  As shown in FIGS. 1 and 2, the sealing unit 6 is filled in the first paste position restriction space 500 </ b> A so as to cover and seal the plurality of first light emitting diode chips 20 </ b> A. A sealing paste 60A, a second sealing paste 60B that covers and seals the plurality of second light emitting diode chips 20B by being filled in the second paste position restriction space 500B, and a third And a third sealing paste 60C that covers and seals the plurality of third light emitting diode chips 20C by being filled in the paste position restriction space 500C. The first sealing paste 60A is surrounded by the first surrounding side frame paste 50A, and the second sealing paste 60B is surrounded by the second surrounding side frame paste 50B. The paste 60C is surrounded by the third surrounding side frame paste 50C.

  For example, the first sealing paste 60A may be a transparent paste, and the wavelength of light emitted from the first light emitting module 2A (for example, using a plurality of red light emitting diode dies) (first wavelength). Can be in the range of 600 nm to 700 nm. The second sealing paste 60B may be a transparent paste, and the wavelength (second wavelength) of light emitted by the second light emitting module 2B (for example, using a plurality of blue light emitting diode dies) is 400 nm. It can be in the range of ˜500 nm. The third sealing paste 60C may be a fluorescent paste, and the wavelength (third wavelength) of light emitted by the third light emitting module 2C (for example, using a plurality of blue light emitting diode dies) is The color temperature can be in the range of 400 nm to 700 nm, and the color temperature can be in the range of 2700K to 10000K. However, the specific configuration of the sealing unit 6 used in the present invention is not limited to these.

  As shown in FIG. 4, the substrate unit 1 has a plurality of positive electrode pads P provided on the upper surface of the substrate body 10 and a plurality of negative electrode pads N provided on the upper surface of the substrate body 10. Each first light emitting diode chip 20 </ b> A has a positive electrode 201 and a negative electrode 202. The positive electrode 201 of each first light emitting diode chip 20A corresponds to at least two positive electrode pads P among the plurality of positive electrode pads P described above, and the negative electrode 202 of each first light emitting diode chip 20A corresponds to the above-described positive electrode pad P. It corresponds to at least two negative electrode pads N among the plurality of negative electrode pads N. Each second light emitting diode chip 20 </ b> B has a positive electrode 201 and a negative electrode 202. The positive electrode 201 of each second light emitting diode chip 20B corresponds to at least two positive electrode pads P among the plurality of positive electrode pads P described above, and the negative electrode 202 of each second light emitting diode chip 20B corresponds to the above-described positive electrode pad P. It corresponds to at least two negative electrode pads N among the plurality of negative electrode pads N. Each third light emitting diode chip 20 </ b> C has a positive electrode 201 and a negative electrode 202. The positive electrode 201 of each third light emitting diode chip 20C corresponds to at least two positive electrode pads P among the plurality of positive electrode pads P described above, and the negative electrode 202 of each third light emitting diode chip 20C corresponds to the above-described positive electrode pad P. It corresponds to at least two negative electrode pads N among the plurality of negative electrode pads N.

  As shown in FIG. 4, the positive electrode 201 of each first light emitting diode chip 20A is electrically connected to one positive electrode pad P of at least two corresponding positive electrode pads P described above by wire bonding. Alternatively, the negative electrode 202 of each first light emitting diode chip 20A may be electrically connected to one negative electrode pad N of at least two corresponding negative electrode pads N by wire bonding. The positive electrode 201 of each second light emitting diode chip 20B may be electrically connected to one positive electrode pad P of at least two corresponding positive electrode pads P described above in a wire bonding method. The negative electrode 202 of the light emitting diode chip 20B may be electrically connected to one negative electrode pad N of at least two corresponding negative electrode pads N described above by wire bonding. The positive electrode 201 of each third light emitting diode chip 20C may be electrically connected to one positive electrode pad P of at least two corresponding positive electrode pads P described above by a wire bonding method. The negative electrode 202 of the light emitting diode chip 20C may be electrically connected to one negative electrode pad N of the corresponding at least two negative electrode pads N by wire bonding.

  In the lighting equipment exemplified in this embodiment, the first PWM control module 40A controls the plurality of first light emitting diode chips 20A at a predetermined pulse frequency, and the plurality of second PWM control modules has a predetermined pulse frequency. The second light emitting diode chip 20B is controlled, and the third PWM control module is configured to control the plurality of third light emitting diode chips 20C at a predetermined pulse frequency. Thereby, the luminance of each light emitting diode chip 20A, 20B, 20C can be appropriately controlled by adjusting the duty ratio. As a result, plant growth can be promoted.

2. Second Embodiment FIG. 5 shows a lighting facility for promoting plant growth according to a second embodiment of the present invention. Comparing FIG. 5 and FIG. 3, the greatest difference between the second embodiment of the present invention and the first embodiment is that a bridge rectifier unit 7 including at least one bridge rectifier 70 is provided. . That is, the plant growth promoting lighting equipment according to the present embodiment includes the first bridge rectifier 70A provided on the substrate body 10 and electrically connected to the first current limiting chip 30A, and the substrate body 10 above. And a second bridge rectifier 70B electrically connected to the second current limiting chip 30B and a third bridge rectifier 70B provided on the substrate body 10 and electrically connected to the third current limiting chip 30C. A bridge rectifier unit 7 including a bridge rectifier 70C is further provided. At this time, the control unit 4 is electrically connected between the bridge rectifier unit 7 and the current limiting unit 3. The bridge rectifier unit 7 converts the AC power source A into a DC power source, and the current limiting unit 3 can limit the amount of DC current supplied to the light emitting unit 2. Therefore, the light emitting unit 2 can be supplied with a stable direct current. Also in the plant growth promoting lighting equipment according to the present embodiment, it is possible to promote the growth of plants as in the first embodiment.

3. Third Embodiment FIG. 6 shows a plant growth promoting lighting facility according to a third embodiment of the present invention. 6 and 3, the greatest difference between the third embodiment of the present invention and the first embodiment is that it includes a bridge rectifier unit 7 including at least one bridge rectifier 70. . Further, when FIG. 6 is compared with FIG. 5, the greatest difference between the third embodiment of the present invention and the second embodiment lies in the specific configuration of the bridge rectifier unit 7. That is, the plant growth promoting lighting equipment according to the present embodiment further includes a bridge rectifier unit 7 including one bridge rectifier 70 provided on the substrate body 10. At this time, the one bridge rectifier 70 is electrically connected to all of the first current limiting chip 30A, the second current limiting chip 30B, and the third current limiting chip 30C at the same time. Are electrically connected between the bridge rectifier unit 7 and the current limiting unit 3. Two or more bridge rectifiers 70 may be electrically connected to all of the first current limiting chip 30A, the second current limiting chip 30B, and the third current limiting chip 30C at the same time. good. Also in the plant growth promoting lighting facility according to the present embodiment, it is possible to promote the growth of plants as in the above embodiments.

4). Fourth Embodiment FIG. 7 shows a plant growth promoting lighting facility according to a fourth embodiment of the present invention. When FIG. 7 is compared with FIG. 5 or FIG. 6, the greatest difference between the fourth embodiment of the present invention and the second embodiment or the third embodiment does not include the bridge rectifier unit 7. In the point. That is, in the plant growth promoting lighting equipment according to the present embodiment, each of the first light emitting diode chips 20A, each of the second light emitting diode chips 20B, and each of the third light emitting diode chips 20C are all AC light emitting diodes. If it is (AC LED), the bridge rectifier unit 7 can be omitted. Also in the plant growth promoting lighting facility according to the present embodiment, it is possible to promote the growth of plants as in the above embodiments.

5). Fifth Embodiment FIGS. 8 and 9 show a plant growth promoting lighting facility according to a fifth embodiment of the present invention. 8 and FIG. 1 and FIG. 9 and FIG. 2 are compared, the biggest difference between the fifth embodiment of the present invention and the first embodiment is the specific of the side frame unit 5. There is a serious arrangement relationship. That is, in the plant growth promoting lighting equipment according to the present embodiment, the first surrounding side frame paste 50A, the second surrounding side frame paste 50B, and the third surrounding side frame paste 50C are in contact with each other in order. Arranged side by side. That is, the first surrounding side frame paste 50A and the second surrounding side frame paste 50B are arranged in contact with each other along a predetermined direction, and further the second surrounding side frame paste 50B and the third surrounding type. The side frame paste 50C is disposed in contact with the side frame paste 50C. Note that the first paste position restriction space 500A, the second paste position restriction space 500B, and the third paste position restriction space 500C are spaced apart from each other by a predetermined distance. Also in the plant growth promoting lighting facility according to the present embodiment, it is possible to promote the growth of plants as in the above embodiments.

6). Sixth Embodiment FIGS. 10 and 11 show a plant growth promoting lighting facility according to a sixth embodiment of the present invention. Comparing FIG. 10 with FIG. 1 and comparing FIG. 11 with FIG. 2, the biggest difference between the sixth embodiment of the present invention and the first embodiment is the specific of the light emitting unit 2. There is an arrangement relationship. That is, in the plant growth promoting lighting equipment according to the present embodiment, the first chip installation area 10A, the second chip installation area 10B, and the third chip installation area 10C are described from the center toward the radially outer side. Are arranged concentrically in this order. Accordingly, the first light emitting module 2A, the second light emitting module 2B, and the third light emitting module 2C are also concentrically arranged in the order described from the center toward the radially outer side. Note that, as in the illustrated example, the number of second light emitting diode chips 20B may be larger than the number of first light emitting diode chips 20A. Further, the number of the third light emitting diode chips 20C may be larger than the number of the second light emitting diode chips 20B.

  In the present embodiment, the first surrounding side frame paste 50A, the second surrounding side frame paste 50B, and the third surrounding side frame paste 50C are also concentric in the order described from the center toward the radially outer side. Placed in. That is, the first surrounding side frame paste 50A is annularly arranged, the second surrounding side frame paste 50B surrounds the first surrounding side frame paste 50A, and the third surrounding side frame paste 50C is the first surrounding side frame paste 50C. 2 surrounding side frame paste 50B is surrounded. The plurality of first light emitting diode chips 20A described above are surrounded by the first surrounding side frame paste 50A, and the plurality of second light emitting diode chips 20B described above are combined with the first surrounding side frame paste 50A and the first surrounding side frame paste 50A. The plurality of third light emitting diode chips 20C described above are located between the second surrounding side frame paste 50B and the third surrounding side frame paste 50C. . Also, the first sealing paste 60A is surrounded by the first surrounding side frame paste 50A, and the second sealing paste 60B is the first surrounding side frame paste 50A and the second surrounding side frame paste. The third sealing paste 60C is between the second surrounding side frame paste 50B and the third surrounding side frame paste 50C. Also in the plant growth promoting lighting facility according to the present embodiment, it is possible to promote the growth of plants as in the above embodiments.

  The configurations described in the above embodiments are merely preferred examples of the present invention, and do not limit the technical scope of the present invention. Accordingly, any equivalent changes and additions made based on the description in the present specification and the drawings are included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Substrate unit 10 Substrate body 10A 1st chip installation area 10B 2nd chip installation area 10C 3rd chip installation area 2 Light emitting unit 201 Positive electrode 202 Negative electrode 2A 1st light emitting module 20A 1st light emitting diode chip 2B 2nd Light emitting module 20B second light emitting diode chip 2C third light emitting module 20C third light emitting diode chip 3 current limiting unit 30A first current limiting chip 30B second current limiting chip 30C third current limiting chip 4 control Unit 40A First PWM control module 40B Second PWM control module 40C Third PWM control module 5 Side frame unit 50A First enclosed side frame paste 500A First paste position restriction space 50B Second enclosed side Frame pace 500B Second paste position restriction space 50C Third surrounding side frame paste 500C Third paste position restriction space 6 Sealing unit 60A First sealing paste 60B Second sealing paste 60C Third sealing Stop paste 7 Bridge rectifier unit 70 Bridge rectifier 70A First bridge rectifier 70B Second bridge rectifier 70C Third bridge rectifier P Positive electrode pad N Negative electrode pad

Claims (15)

A substrate unit including a substrate body having a first chip installation area, a second chip installation area, and a third chip installation area provided on the upper surface;
A first light emitting module for emitting light having a first wavelength, having a plurality of first light emitting diode chips provided on the first chip installation region and electrically connected to the substrate body And a plurality of second light emitting diode chips provided on the second chip installation region and electrically connected to the substrate body, and a second for emitting light having a second wavelength A light emitting module; a plurality of third light emitting diode chips which are provided on the third chip placement region and electrically connected to the substrate body; and have a third wavelength and a predetermined color temperature. A light emitting unit comprising: a third light emitting module for emitting light;
A first current limiting chip provided on the substrate body and electrically connected to the first light emitting module; and a first current limiting chip provided on the substrate body and electrically connected to the second light emitting module. A current limiting unit comprising: a second current limiting chip; and a third current limiting chip provided on the substrate body and electrically connected to the third light emitting module;
A first PWM control module provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A second PWM control module, and a third PWM control module provided on the substrate body and electrically connected to the third current limiting chip;
A first surrounding side frame formed on an upper surface of the substrate body so as to surround the plurality of first light emitting diode chips, and forming a first paste position restriction space corresponding to the first chip placement region. A second enclosure that is formed on the upper surface of the substrate body so as to surround the paste and the plurality of second light emitting diode chips, and forms a second paste position restriction space corresponding to the second chip placement region. And a third paste position restriction space corresponding to the third chip installation region, which is formed on the upper surface of the substrate body so as to surround the plurality of third light emitting diode chips. A side frame unit including three sieving side frame pastes;
A first sealing paste for filling a plurality of the first light emitting diode chips filled in the first paste position restriction space surrounded by the first surrounding side frame paste; A second sealing paste for filling a plurality of second light emitting diode chips filled in the second paste position restriction space surrounded by a second surrounding side frame paste; A third sealing paste that fills the inside of the third paste position restriction space surrounded by three surrounding side frame pastes and seals the plurality of third light emitting diode chips. Stop unit,
Lighting equipment for promoting plant growth. The first surrounding side frame paste, the second surrounding side frame paste, and the third surrounding side frame paste are arranged so as to be separated from each other by a predetermined distance or in contact with each other in order. And
The first paste position restriction space, the second paste position restriction space, and the third paste position restriction space are arranged so as to be separated from each other by a predetermined distance,
The first wavelength is in the range of 600 nm to 700 nm, the second wavelength is in the range of 400 nm to 500 nm, the third wavelength is in the range of 400 nm to 700 nm, and the color temperature is 2700K to 10,000K. The lighting equipment for promoting plant growth according to claim 1 in the range. The substrate unit has a plurality of positive electrode pads and a plurality of negative electrode pads provided on the upper surface of the substrate body,
Each of the first light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the first light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the first light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the second light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the second light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the second light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the third light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the third light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the third light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
The positive electrode of each first light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each first light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each second light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each second light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each third light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each third light emitting diode chip is the at least two negative electrode pads. The lighting equipment for promoting plant growth according to claim 1 or 2, wherein the lighting equipment is electrically connected to one of the negative electrode pads. A bridge rectifier unit including at least one bridge rectifier provided on the substrate body;
The at least one bridge rectifier is electrically connected to all of the first current limiting chip, the second current limiting chip, and the third current limiting chip;
The said control unit is the plant growth promotion lighting installation as described in any one of Claim 1 to 3 electrically connected between the said bridge | bridging rectifier unit and the said current limiting unit. A first bridge rectifier provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A bridge rectifier unit comprising: a second bridge rectifier, and a third bridge rectifier provided on the substrate body and electrically connected to the third current limiting chip;
The said control unit is the plant growth promotion lighting installation as described in any one of Claim 1 to 3 electrically connected between the said bridge | bridging rectifier unit and the said current limiting unit. A substrate unit including a substrate body having a first chip installation area, a second chip installation area, and a third chip installation area provided on the upper surface;
A first light emitting module for emitting light having a first wavelength, having a plurality of first light emitting diode chips provided on the first chip installation region and electrically connected to the substrate body And a plurality of second light emitting diode chips provided on the second chip installation region and electrically connected to the substrate body, and a second for emitting light having a second wavelength A light emitting module; a plurality of third light emitting diode chips which are provided on the third chip placement region and electrically connected to the substrate body; and have a third wavelength and a predetermined color temperature. A light emitting unit comprising: a third light emitting module for emitting light;
A first current limiting chip provided on the substrate body and electrically connected to the first light emitting module; and a first current limiting chip provided on the substrate body and electrically connected to the second light emitting module. A current limiting unit comprising: a second current limiting chip; and a third current limiting chip provided on the substrate body and electrically connected to the third light emitting module;
A first PWM control module provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A second PWM control module, and a third PWM control module provided on the substrate body and electrically connected to the third current limiting chip;
A first surrounding side frame formed on an upper surface of the substrate body so as to surround the plurality of first light emitting diode chips, and forming a first paste position restriction space corresponding to the first chip placement region. A second enclosure that is formed on the upper surface of the substrate body so as to surround the paste and the plurality of second light emitting diode chips, and forms a second paste position restriction space corresponding to the second chip placement region. And a third paste position restriction space corresponding to the third chip installation region, which is formed on the upper surface of the substrate body so as to surround the plurality of third light emitting diode chips. A side frame unit including three sieving side frame pastes;
A first sealing paste surrounded by the first surrounding side frame paste and filled in the first paste position restriction space to seal a plurality of the first light emitting diode chips; Between the first surrounding side frame paste and the second surrounding side frame paste, the inside of the second paste position restriction space is filled to seal a plurality of the second light emitting diode chips. Between the second enclosing side frame paste and the third enclosing side frame paste, and filled in the third paste position restriction space. A third sealing paste for sealing the third light emitting diode chip, and a sealing unit,
Lighting equipment for promoting plant growth. The second surrounding side frame paste surrounds the first surrounding side frame paste, the third surrounding side frame paste surrounds the second surrounding side frame paste;
The plurality of second light emitting diode chips are between the first surrounding side frame paste and the second surrounding side frame paste, and the plurality of third light emitting diode chips are the second surrounding diode chips. Between the side wall paste and the third surrounding side frame paste,
The first wavelength is in the range of 600 nm to 700 nm, the second wavelength is in the range of 400 nm to 500 nm, the third wavelength is in the range of 400 nm to 700 nm, and the color temperature is 2700K to 10,000K. The lighting equipment for promoting plant growth according to claim 6 in the range. The substrate unit has a plurality of positive electrode pads and a plurality of negative electrode pads provided on the upper surface of the substrate body,
Each of the first light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the first light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the first light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the second light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the second light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the second light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the third light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the third light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the third light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
The positive electrode of each first light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each first light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each second light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each second light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each third light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each third light emitting diode chip is the at least two negative electrode pads. The plant growth promoting lighting equipment according to claim 6 or 7, wherein the lighting equipment is electrically connected to one negative electrode pad. A bridge rectifier unit including at least one bridge rectifier provided on the substrate body;
The at least one bridge rectifier is electrically connected to all of the first current limiting chip, the second current limiting chip, and the third current limiting chip;
9. The plant growth promoting lighting device according to claim 6, wherein the control unit is electrically connected between the bridge rectifier unit and the current limiting unit. 10. A first bridge rectifier provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A bridge rectifier unit comprising: a second bridge rectifier, and a third bridge rectifier provided on the substrate body and electrically connected to the third current limiting chip;
9. The plant growth promoting lighting device according to claim 6, wherein the control unit is electrically connected between the bridge rectifier unit and the current limiting unit. 10. A substrate unit including a substrate body having a first chip installation area, a second chip installation area, and a third chip installation area provided on the upper surface;
A first light emitting module for emitting light having a first wavelength, having a plurality of first light emitting diode chips provided on the first chip installation region and electrically connected to the substrate body And a plurality of second light emitting diode chips provided on the second chip installation region and electrically connected to the substrate body, and a second for emitting light having a second wavelength A light emitting module; a plurality of third light emitting diode chips which are provided on the third chip placement region and electrically connected to the substrate body; and have a third wavelength and a predetermined color temperature. A light emitting unit comprising: a third light emitting module for emitting light;
A first current limiting chip provided on the substrate body and electrically connected to the first light emitting module; and a first current limiting chip provided on the substrate body and electrically connected to the second light emitting module. A current limiting unit comprising: a second current limiting chip; and a third current limiting chip provided on the substrate body and electrically connected to the third light emitting module;
A first PWM control module provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A second PWM control module, and a third PWM control module provided on the substrate body and electrically connected to the third current limiting chip;
Lighting equipment for promoting plant growth.   The first wavelength is in the range of 600 nm to 700 nm, the second wavelength is in the range of 400 nm to 500 nm, the third wavelength is in the range of 400 nm to 700 nm, and the color temperature is 2700K to 10,000K. The lighting equipment for promoting plant growth according to claim 11 in the range. The substrate unit has a plurality of positive electrode pads and a plurality of negative electrode pads provided on the upper surface of the substrate body,
Each of the first light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the first light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the first light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the second light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the second light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the second light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
Each of the third light emitting diode chips has a positive electrode and a negative electrode, and the positive electrode of each of the third light emitting diode chips corresponds to at least two positive electrode pads of the plurality of positive electrode pads, The negative electrode of the third light emitting diode chip corresponds to at least two negative pads of the plurality of negative pads,
The positive electrode of each first light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each first light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each second light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each second light emitting diode chip is the at least two negative electrode pads. Electrically connected to the negative pad of one of the
The positive electrode of each third light emitting diode chip is electrically connected to one positive electrode pad of the at least two positive electrode pads, and the negative electrode of each third light emitting diode chip is the at least two negative electrode pads. The lighting equipment for plant growth promotion according to claim 11 or 12, which is electrically connected to one of the negative electrode pads. A bridge rectifier unit including at least one bridge rectifier provided on the substrate body;
The at least one bridge rectifier is electrically connected to all of the first current limiting chip, the second current limiting chip, and the third current limiting chip;
The lighting equipment for promoting plant growth according to any one of claims 11 to 13, wherein the control unit is electrically connected between the bridge rectifier unit and the current limiting unit. A first bridge rectifier provided on the substrate body and electrically connected to the first current limiting chip; and electrically connected to the second current limiting chip provided on the substrate body. A bridge rectifier unit comprising: a second bridge rectifier, and a third bridge rectifier provided on the substrate body and electrically connected to the third current limiting chip;
The lighting equipment for promoting plant growth according to any one of claims 11 to 13, wherein the control unit is electrically connected between the bridge rectifier unit and the current limiting unit.

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