JP3170490U - Heater panel type soldering equipment - Google Patents
Heater panel type soldering equipment Download PDFInfo
- Publication number
- JP3170490U JP3170490U JP2011000677U JP2011000677U JP3170490U JP 3170490 U JP3170490 U JP 3170490U JP 2011000677 U JP2011000677 U JP 2011000677U JP 2011000677 U JP2011000677 U JP 2011000677U JP 3170490 U JP3170490 U JP 3170490U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- heater panel
- heater
- heat
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【課題】熱での特性変化やプラスチック等の熱変形する部品の半田付け作業で、半田付けの箇所のみの加熱で、複数の半田付けを一度に半田付けが可能な半田付け装置を提供する。【解決手段】ワークの複数の半田付を、同時に半田付けを行うため、ワークの複数の半田付け箇所とヒーターパネルが接触させるため、板状または凹凸を設けた形状に加工したヒーターパネルを設け、ヒーターパネルの両端に電圧を印加する電極を設け、ヒーターパネルに固定支持するプレートを設け、プレートにワークの半田付け箇所に向けた冷却エアーノズルを設けた構造とする。ヒーターパネルに電圧を印加することでヒーターパネルが加熱し、接触しているワークの半田付け箇所を同時に加熱し半田付けを行い、半田溶解後に印加している電圧を切りプレートに設けられた冷却エアーノズルにて溶解後の半田を冷却する。【選択図】図４There is provided a soldering apparatus capable of soldering a plurality of solders at a time by heating only a soldering part in a soldering operation of a heat-deformed component such as a change in characteristics due to heat or plastic. In order to perform soldering simultaneously on a plurality of solders of a workpiece, a heater panel processed into a plate shape or an uneven shape is provided in order to bring a plurality of soldering portions of the workpiece into contact with the heater panel, An electrode for applying a voltage is provided at both ends of the heater panel, a plate that is fixedly supported on the heater panel is provided, and a cooling air nozzle is provided on the plate toward the soldering portion of the workpiece. The heater panel is heated by applying a voltage to the heater panel, and the soldering part of the workpiece that is in contact is heated at the same time to perform soldering. Cool the melted solder with a nozzle. [Selection] Figure 4
Description
本考案は、ヒーターパネル型半田付け装置の構造に関するものである。 The present invention relates to the structure of a heater panel type soldering apparatus.
従来の電子機器の半田付けは、プリント基板の半田付け箇所にペースト状のクリーム半田を塗布し、その上に電子部品を乗せ、電子部品が乗ったプリント基板全体をリフロー炉に投入し、電子部品を含めた全体を加熱し、クリーム半田を一挙に溶解し半田付けしていた。
その部品の中で、熱で特性が変化してしまう部品、熱で変形する部品は、リフロー炉には投入できないため、リフロー後に半田コテを用いて、部品の半田付け面のみを加熱し一ヶ所ずつ半田付けを行う方法が用いられてきた。In conventional soldering of electronic equipment, paste-like cream solder is applied to the soldering location of the printed circuit board, the electronic component is placed on it, the entire printed circuit board on which the electronic component is placed is placed in a reflow furnace, and the electronic component is placed. The whole was heated, and the cream solder was melted at once and soldered.
Of these parts, parts whose characteristics change due to heat and parts that deform due to heat cannot be put into the reflow furnace. Therefore, after reflow, only the soldering surface of the part is heated using a soldering iron. A method of performing soldering one by one has been used.
リフロー炉に投入できない、熱により特性が変化する部品、プラスチック等を用いた熱により変形する部品の半田付けは、リフロー後に半田コテを用いて一ヶ所ずつ半田付けを行っており生産性が悪い課題があった。
半田コテは、コテ先部と電気ヒーター部にて構成され、電気ヒーター部の発熱をコテ先部へ熱伝導する間接加熱方式を用いて加熱を行う構造であり、コテ先部の温度は、電気ヒーター部が加熱後に、徐々にコテ先部に熱伝導されるため、半田コテに電源を投入後、コテ先が半田溶解温度に達するまでの時間を必要とする課題が有った。
コテ先部は常時大気にて冷却されているため、電気ヒーター部に常時通電し加熱状態を保つ必要があり、温度保持のために常時エネルギーを消費しエネルギー効率が悪い課題が有った。Soldering parts that cannot be put into the reflow furnace and whose characteristics change due to heat, or parts that are deformed by heat using plastic, etc., are soldered one by one using a soldering iron after reflow, resulting in poor productivity was there.
The soldering iron is composed of a soldering tip and an electric heater, and is heated using an indirect heating method that conducts heat from the electric heater to the soldering tip. After the heater part is heated, heat conduction is gradually performed to the tip part of the iron, so there is a problem that it takes time for the iron point to reach the solder melting temperature after the power is turned on to the soldering iron.
Since the tip of the iron is constantly cooled in the atmosphere, it is necessary to always energize the electric heater to maintain the heating state, and there is a problem that energy is constantly consumed to maintain the temperature and energy efficiency is poor.
請求項目１での本考案は、ワークの複数の半田付箇所を、同時に半田付けを行うため、複数の半田付け箇所とヒーターの発熱部が接触する形状のヒーターパネルを設け、ヒーターパネルに発熱のために用いる電圧を印加する為の電極を設け、半田溶解後に冷却用エアーの供給機能を備えた構造のヒーターパネル型半田付け装置である。
この手段の場合、ヒーターパネルが、半田付け箇所にのみ接触し半田付けを行うため熱により特性変化が発生する部品やプラスチック等の熱変形が発生しない。
さらに、半田完了直後に加熱された半田端子からプラスチック等への熱伝導でプラスチックが変形する可能性の有るばあい、エアーノズルから冷却用のエアーをワークに噴射し、冷却をおこない変形を防止する。
複数の半田付けを行う端子が同時にヒーターパネルに接触する構造にすることで、同時に複数箇所の半田付けが可能である。
半田コテのコテ先部の間接加熱方式と異なり、半田箇所と接触するヒーターパネル自体が発熱する直熱式のため瞬時に発熱するため、半田コテのように熱伝導時間を待つ必要が無く、また、常時加熱状態の維持が不要となる。
そのため、半田付け実施時のみ電圧を印加することが可能で省エネルギーでの利用が可能となる。
以下、添付図１を用いて説明する。添付図面１は、円形のヒーターパネルの例である。
ワークの半田付け箇所に接触する金属で作成したヒーターパネル▲３▼を設け、ヒーターパネルの中央部を空洞とし、空洞部分より冷却用エアーがワークに噴射できる構造とし、ヒーターパネルには電流を流すヒーター電極▲４▼を設け、ヒーター電極にはヒーター電線▲６▼を接続し、ヒーター電線に電圧を印加することでヒーターを加熱する構造とする。
エアー通過口の穴の空いた絶縁プレート▲２▼を設け、穴の部分には、エアーノズル▲５▼を設け、エアーノズル部とヒーターパネルの空洞部を一致させる構造とする。
冷却エアー導入口の穴を設けたベースプレートを設け、絶縁プレートのエアー通過口とベースプレートの冷却エアー吹き出し口を一致させた構造とし、ベースプレートから導入された冷却用エアーは、ベースプレートを通過し、絶縁プレートのエアー通過口を通過し、絶縁プレートのエアーノズルから噴射されたエアーは、ヒーターパネルの空洞部分を通過し、ワークに導かれる構造を特徴とする半田付け装置。The present invention according to
In the case of this means, the heater panel contacts only the soldering portion and performs soldering, so that heat deformation of parts or plastics whose characteristics change due to heat does not occur.
Furthermore, if there is a possibility that the plastic will be deformed due to heat conduction from the heated solder terminal to the plastic etc. immediately after the soldering is completed, cooling air is sprayed from the air nozzle onto the workpiece to prevent deformation. .
By adopting a structure in which a plurality of terminals to be soldered are in contact with the heater panel at the same time, a plurality of locations can be soldered simultaneously.
Unlike the indirect heating method of the tip of the soldering iron, the heater panel itself that comes into contact with the solder location generates heat instantaneously because it generates heat, so there is no need to wait for the heat conduction time like a soldering iron. Therefore, it is not necessary to maintain a constantly heated state.
Therefore, it is possible to apply a voltage only at the time of performing soldering, and it is possible to use it with energy saving.
Hereinafter, description will be given with reference to FIG. The attached
A heater panel (3) made of metal that contacts the soldered part of the workpiece is provided, the center of the heater panel is a cavity, and cooling air is sprayed from the cavity to the workpiece, and current flows through the heater panel. A heater electrode (4) is provided, a heater wire (6) is connected to the heater electrode, and a voltage is applied to the heater wire to heat the heater.
An insulating plate (2) with a hole in the air passage opening is provided, and an air nozzle (5) is provided in the hole so that the air nozzle and the cavity of the heater panel are aligned.
A base plate with a hole for the cooling air inlet is provided, and the air passing port of the insulating plate and the cooling air blowout port of the base plate are made to coincide with each other. The soldering apparatus characterized by the structure in which the air that has passed through the air passage opening and is jetted from the air nozzle of the insulating plate passes through the hollow portion of the heater panel and is guided to the workpiece.
本考案では、熱での特性変化やプラスチック等の熱変形する部品の半田付け作業で、半田付けの箇所のみの加熱で、複数の半田付けを一度に半田付けが可能で、半田付け作業の効率化が図れ、半田付けを行う時のみ電圧を加えるため、省エネルギーでの利用が可能となり製造のコストダウンを図ることができる。 In the present invention, it is possible to solder several parts at a time by heating only the soldering part in the soldering work of heat-deformable parts such as changes in characteristics due to heat and plastics, and the efficiency of the soldering work Since the voltage is applied only when soldering is performed, it can be used with energy saving and the manufacturing cost can be reduced.
ヒーターパネルとワークのクリーム半田が塗布された半田付け箇所が接触し熱伝導が可能な形状とし、ヒーターパネルの発熱により半田を溶解し半田付けを行う。ヒーターパネルは金属で作成し数Ｖの低電圧で数Ａ〜数十Ａの大電流を流し、ヒーターパネル自体が直接発熱する構造とする。
以下、添付図２のヒーターパネル及びヒーター電極部の例を用いて説明する。ヒーターパネル部には、両端のヒーター電極から電圧から電圧を印加し、ヒーターパネルへ電圧を印加しヒーターパネルを発熱させる構造とする。ヒーターパネルの発熱部に電流を集中させるため、ヒーターパネルの発熱部以外はスリットを入れる等を行い絶縁した構造とする。
板状のヒーターパネルの場合、発熱部の幅や厚みを減らし電気抵抗を増加させる構造や、発熱部に電気抵抗の高い材料を用いる。
添付図３は、冷却用エアーの導入経路を示した例の図面である。
半田付け直後に熱変形が発生するプラスチック部品や、半田付け直後に冷却が必要な部品等の場合、図１の構造の各部品に対して、図３のエアーの通路を設けエアーにて冷却を行う。The heater panel and the soldered portion where the cream solder of the workpiece is applied come into contact with each other to form a heat conducting shape, and the solder is melted and soldered by the heat generated by the heater panel. The heater panel is made of metal and has a structure in which a large current of several A to several tens of A flows at a low voltage of several volts and the heater panel itself generates heat directly.
Hereinafter, the heater panel and the heater electrode part of FIG. The heater panel is configured to apply a voltage from a voltage from the heater electrodes at both ends and apply the voltage to the heater panel to cause the heater panel to generate heat. In order to concentrate the current on the heat generating part of the heater panel, the part other than the heat generating part of the heater panel is insulated by making a slit or the like.
In the case of a plate-shaped heater panel, a structure in which the width and thickness of the heat generating portion are reduced to increase the electric resistance, or a material having a high electric resistance is used for the heat generating portion.
Attached FIG. 3 is a drawing of an example showing a cooling air introduction path.
In the case of plastic parts that undergo thermal deformation immediately after soldering, or parts that require cooling immediately after soldering, etc., air passages in FIG. Do.
以下、添付図４を用いて一実施例を説明する。添付図４は、小型モーターの半田端子にバリスタの半田付けを行う一例である。
円形のバリスタの形状に合わせた円形のヒーターパネルにて、ヒーターパネルの上にバリスタをのせ、その上にクリーム半田が塗布された端子を持ったモーターのローターをのせ、ヒーターパネルに電圧を印加するとヒーターパネルが発熱し、熱がバリスタに熱伝導が行われ、その熱でモーターのローターに実装されているクリーム半田の塗布された端子のクリーム半田が溶解し、バリスタとモーターのローターの端子が半田付けされる実施例である。Hereinafter, an embodiment will be described with reference to FIG. FIG. 4 is an example in which a varistor is soldered to a solder terminal of a small motor.
When a voltage is applied to the heater panel by placing a varistor on the heater panel and placing a motor rotor with terminals coated with cream solder on it, using a circular heater panel that matches the shape of the circular varistor. The heater panel generates heat, heat is conducted to the varistor, and the solder of the solder solder coated terminal that is mounted on the motor rotor melts, and the varistor and the motor rotor terminal are soldered. It is an example attached.
半田付けは、電子機器には欠かせない部品の実装方法であるが、一挙にリフリー炉で半田付けが行えない後付け部品の半田付けが、一ヶ所ずつ半田コテで行っていたため 生産性が悪い課題と、半田コテは大気で冷却されるため常時通電していなければならなく、エネルギー効率が悪い課題が有った。
本考案のヒーターパネル型半田付け装置は、ヒーターパネルが瞬時に直接発熱するため常時通電する必要は無く、パネルの形状であるため、ヒーターパネルとの接触点すべての半田付けが同時に可能となる。Soldering is a component mounting method that is indispensable for electronic equipment. However, it is difficult to perform soldering of post-installation parts that cannot be soldered in a refree oven at a time. Since the soldering iron is cooled in the atmosphere, it must be energized at all times, which has a problem of poor energy efficiency.
The heater panel type soldering device of the present invention does not need to be energized at all times because the heater panel generates heat directly instantaneously, and because of the shape of the panel, it is possible to solder all contact points with the heater panel at the same time.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011000677U JP3170490U (en) | 2011-01-24 | 2011-01-24 | Heater panel type soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011000677U JP3170490U (en) | 2011-01-24 | 2011-01-24 | Heater panel type soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3170490U true JP3170490U (en) | 2011-09-22 |
Family
ID=54880942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011000677U Expired - Fee Related JP3170490U (en) | 2011-01-24 | 2011-01-24 | Heater panel type soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3170490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016004846A (en) * | 2014-06-14 | 2016-01-12 | 株式会社アンド | Soldering device |
-
2011
- 2011-01-24 JP JP2011000677U patent/JP3170490U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016004846A (en) * | 2014-06-14 | 2016-01-12 | 株式会社アンド | Soldering device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106475649A (en) | A kind of laser tin soldering machine | |
| JP3170490U (en) | Heater panel type soldering equipment | |
| JPH03198975A (en) | Soldering method | |
| JP5487142B2 (en) | Heat tool and thermocompression bonding equipment | |
| CN103071876B (en) | A kind of welded encapsulation method and apparatus | |
| JP2010253503A (en) | Heater chip and joining apparatus | |
| JP2009160617A (en) | Heater tip and joining device | |
| CN111128790A (en) | Micro-element processing device, welding method and display panel | |
| KR20170083430A (en) | Temperature controlled soldering iron | |
| JP2006315043A (en) | Reflow welding equipment | |
| JP2009021326A (en) | Soldering equipment | |
| JPWO2020250427A1 (en) | Circuit board and mounting method | |
| JP4890568B2 (en) | Electronic module manufacturing method and electronic module production line | |
| JP7128994B2 (en) | Electronic member removal method and device | |
| CN107717158A (en) | A kind of low voltage and high current melts tin point welding machine | |
| JP2015046436A (en) | Soldering device | |
| JP2018019000A (en) | Power semiconductor module | |
| CN203265906U (en) | Electrode assembly for vehicle metal halide lamp | |
| JP3062326U (en) | Thermocompression bonding equipment | |
| KR20200001373A (en) | Welding tip and welding apparatus with the same | |
| JPH08340177A (en) | Mounting device of electronic part | |
| CN107900475B (en) | Automatic tin soldering method for LED light-emitting lamp strip and LED light source module | |
| JP4537749B2 (en) | Reflow furnace and reflow soldering method | |
| JP2004017132A (en) | Soldering device | |
| JP2010283315A (en) | Soldering device, soldering method, and method for manufacturing soldered product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110629 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140831 Year of fee payment: 3 |
|
| LAPS | Cancellation because of no payment of annual fees |