JP3167782B2 - High-speed solder plating equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-speed solder plating apparatus for electronic parts, and more particularly to, for example, an IC (Integrated Circuit).
The present invention relates to a technique which is effective when applied to a high-speed solder plating apparatus for an electronic component that performs high-speed solder plating on an electronic component such as a lead frame for uit).

[0002]

2. Description of the Related Art As a high-speed solder plating apparatus for electronic parts of this kind, for example, there is the following apparatus.

That is, this high-speed solder plating apparatus for electronic components uses a rack system, in which a large number of IC lead frames are hooked on the racks, immersed in a plating solution for each rack, and the IC lead frames are plated with solder. I was

[0004]

However, in the structure of the above-mentioned high-speed solder plating apparatus for electronic parts, it is sometimes necessary to install a sub-tank outside the plating tank. In this case, the apparatus becomes large and the piping structure becomes large. There was a problem that was complicated.

[0005] Further, since the plating process is a batch process, there is a problem that the composition and thickness of the plating film vary, making it difficult to control.

In addition, since the electrode contacts of the cathode electrode are exposed in a rack system, a solder plating layer adheres and grows on the electrode contacts, and peeling of the adhered and grown solder plating layer and replacement of the electrode contacts are troublesome. There was a problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-speed solder plating apparatus for electronic components which can reduce the size of the apparatus and simplify the piping structure.

Another object of the present invention is to provide a high-speed solder plating apparatus for electronic parts which can easily control the composition and thickness of a plating film, and can achieve uniformity and high speed.

It is another object of the present invention to provide a high-speed solder plating apparatus for electronic parts which can improve the sealing property and reliability of electrode contacts and extend the life of the contacts.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

[0012]

[0013]

That is, the high-speed plating apparatus for electronic parts of the present invention includes a cathode electrode chuck provided at the tip of a cathode electrode and chucking the electronic parts with a contact tip, and a chuck opening / closing unit for opening and closing the cathode electrode chuck. It is a structure which was made.

Further, in this case, it is possible to adopt a structure in which a shielding plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component.

[0016]

[0017]

[0018]

[0019]

[0020]

[0021]

The structure provided with the cathode electrode chuck provided at the tip of the cathode electrode and chucking the electronic component with the contact tip, and the chuck opening / closing unit for opening and closing the cathode electrode chuck provides a sealing property and a reliable electrode contact. The contact life can be prolonged by improving the contactability, and the peeling of the plating layer of the electrode contact and the replacement of the electrode contact, which have conventionally been problems, can be eliminated.

Further, in this case, since the shielding plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component, the composition and thickness uniformity of the plating film can be further improved. it can.

[0023]

FIG. 1 is a sectional view showing a high-speed solder plating apparatus for electronic parts according to one embodiment of the present invention. FIG. 2 shows a plating jig unit and a cathode electrode chuck used in the high-speed solder plating apparatus of FIG. FIG. 3 is a plan view, and FIG.
FIG. 3 is a sectional view taken along line I.

The high-speed solder plating apparatus for electronic parts in this embodiment is applied to a high-speed solder plating apparatus for an IC lead frame 1 and has a plating tank 2. The plating tank 2 is stored in a storage tank 3, and the storage tank 3 is configured to receive and store a plating solution overflowing from an opening of the plating tank 2.

The plating solution stored in the storage tank 3 is circulated and supplied to the plating tank 2 again.

That is, a drain valve 5 is connected to the bottom of the storage tank 3 via a filter 4, and a valve 7, a circulating pump 8, a flow sensor 9, a three-way valve 10 and a check valve 6 are sequentially connected to the drain valve 5. The check valve 6 is connected to the bottom of the plating tank 2.

The flow rate sensor 9 has a function of detecting the flow rate of the circulating plating solution and digitally displaying the flow rate. The circulating pump 8 controls the number of rotations of the motor so that the flow rate becomes a preset flow rate. In addition, feedback control is performed to control the circulating supply amount of the plating solution.

The check valve 6 prevents the plating solution from flowing back in the plating tank 2, and a bypass circuit having the primary side of the check valve 6 as a start end and the storage tank 3 as an end end. The bypass circuit is provided and is always closed by a valve.

A liquid flow control board 11 is provided at the bottom of the plating tank 2.
Are provided in two stages to control the flow of the plating solution so that the circulated and supplied plating solution flows uniformly from below to above over the entire bottom area. That is, the liquid flow control board 1
As shown in FIG. 1, reference numeral 1 denotes a structure in which two stages of perforated boards for passing a plating solution are provided. Thereby, the liquid flow control board 11 can control the liquid flow of the plating solution in the plating tank 2 so as to be a uniform laminar flow from below to above.

A plating jig elevating unit 14 is disposed outside the plating tank 2. The plating jig elevating unit 14 has a function of elevating and lowering the plating jig unit 16 via the arm 15.

The plating jig unit 16 includes an arm 15
Each has an anode electrode support plate 17 mounted thereon, and this anode electrode support plate 17 supports an anode electrode 19 with an anode back 18. Beams 20 are arranged at equal intervals between the anode electrode support plates 17. .

The beam 20 has a frame support groove 21 at the center and shield plate support grooves 22 on both sides thereof. The frame support groove 21 supports the IC lead frame 1, and the shield plate support groove 22 supports the shield plate. 23 has a structure supported by fitting. The shielding plate 23 is a dedicated shielding plate conforming to the shape of the IC lead frame 1, and the composition and thickness of the plating film are made more uniform by the shielding plate 23.

Further, a cathode electrode chuck 24 is provided in the plating tank 2, and the cathode electrode chuck 24
This is a chuck method in which the shoulder of the C lead frame 1 is chucked by the contact chip 27.

That is, the cathode electrode 25 that moves up and down integrally with the arm 15 extends vertically at a predetermined interval,
It is covered with an insulator 26. A cathode electrode chuck 24 that is elastically biased inward is provided at a lower end portion of the cathode electrode 25. The cathode electrode chuck 24 includes a contact tip 27 that is provided so as to face each other and is exchangeable, and an outer peripheral surface of the contact tip 27. Is covered with an elastic seal 28, and the end surface of the elastic seal 28 protrudes slightly from the end surface of the contact tip 27.

A chuck opening / closing unit 30 is provided at the opening end of the plating tank 2 via a bracket 29. The chuck opening / closing unit 30 has an opening / closing claw 31. When the opening / closing claw 31 is closed, the cathode electrode chuck is closed. When the opening and closing claw 31 is opened by closing the opening and closing claw 31, the cathode electrode chuck 24 is opened by the opening movement of the opening and closing claw 31.

Reference numeral 12 denotes a transfer robot, and reference numeral 13 denotes a lead frame chuck elevating unit.

Next, the operation of this embodiment will be described.

When high-speed solder plating is performed on the IC lead frame 1, first, a plating solution is supplied to the gap between the IC lead frame 1 and the anode electrode 19 by a circulation pump 8 so that the plating solution flows upward and downward at a constant rate. It flows constantly at a speed and overflows from the opening of the plating tank 2.

Next, the IC lead frame 1 sent from the preprocessing step by the transfer robot 12 is set on the plating jig unit 16 by the lead frame chuck elevating unit 13.

The IC lead frame 1 in this set state
Then, the cathode electrode chuck 24 is closed to take an electrode contact.

Then, the plating jig unit 16 is lowered together with the IC lead frame 1 from the plating jig elevating unit 14 and immersed in a plating solution.

When the plating power supply is turned on, solder plating is started, and high-speed solder plating is performed on the IC lead frame 1.

After the elapse of the plating time, the soldered IC lead frame 1 is pulled out of the plating solution through a process reverse to that for setting the IC lead frame 1, and the process is shifted to a post-processing step.

As described above, the liquid flow is applied from below, and the liquid flow can be made uniform so that turbulence does not occur due to overflow from the opening of the plating tank 2.

Accordingly, it is possible to easily control the composition and thickness of the plating film, to achieve uniformity, and to improve the quality.

Further, a plating tank 2, a storage tank 3 for accommodating the plating tank 2, receiving and storing the plating solution overflowing from the opening of the plating tank 2, and a plating tank 2 for storing the plating solution in the storage tank 3. And a circulating pump 8 for circulating and supplying to the apparatus, the size of the apparatus can be reduced and the piping structure can be simplified.

Further, the flow rate sensor 9 is provided on the secondary side of the circulation pump 8, and the number of rotations of the motor is controlled based on the detection signal of the flow rate sensor 9, so that the flow rate of the plating solution can be controlled. The flow rate of the plating solution can be easily set, the composition and thickness of the plating film can be made more uniform, and the quality can be further improved.

A structure provided with a cathode electrode chuck 24 provided at the tip of the cathode electrode 25 for chucking the IC lead frame 1 with the contact tip 27 and a chuck opening / closing unit 30 for opening and closing the cathode electrode chuck 24. As a result, it is possible to improve the sealing property and reliability of the electrode contact and extend the contact life, thereby making it unnecessary to remove the plating layer of the electrode contact and replace the electrode contact, which have conventionally been problems.

Further, since the structure is such that the shielding plate 23 corresponding to the shape of the cathode electrode and the IC lead frame is provided, the composition and thickness uniformity of the plating film can be further improved.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say, there is.

For example, in the above embodiment, the case of two rows has been described. However, the present invention is not limited to this, and the present invention can be applied to a case of multiple rows such as four rows and eight rows.

In the above description, the case where the invention made mainly by the present inventor is applied to a high-speed solder plating apparatus for an IC lead frame, which is a field of application, has been described. The present invention can also be applied to a high-speed solder plating apparatus for lead frame-shaped electronic components.

[0053]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

[0054]

[0055]

[0056]

[0057]

(1) A structure provided with a cathode electrode chuck provided at the tip of the cathode electrode for chucking an electronic component with a contact tip and a chuck opening / closing unit for opening and closing the cathode electrode chuck is provided. It is possible to improve the sealing property and the reliability, prolong the service life, and eliminate the necessity of peeling off the plating layer of the electrode contact and replacing the electrode contact, which have been problems in the past.

(2) In the case of the above (1), by providing a structure in which a shielding plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component, the uniformity of the composition and the thickness of the plating film is obtained. Can be further improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a high-speed solder plating apparatus for electronic components according to one embodiment of the present invention.

FIG. 2 is a plan view showing a plating jig unit and a cathode electrode chuck used in the high-speed solder plating apparatus of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame for IC 1a Package part 1b Lead part 2 Plating tank 3 Storage tank 4 Filter 5 Drain valve 6 Check valve 7 Valve 8 Circulation pump 9 Flow rate sensor 10 Three-way valve 11 Liquid flow control board 12 Transfer robot 13 Lead frame chuck elevating Unit 14 Plating jig elevating unit 15 Arm 16 Plating jig unit 17 Anode electrode support plate 18 Anode back 19 Anode electrode 20 Beam 21 Frame support groove 22 Shield plate support groove 23 Shield plate 24 Cathode electrode chuck 25 Cathode electrode 26 Insulator 27 Contact tip 28 Elastic seal body 29 Bracket 30 Chuck opening / closing unit 31 Opening / closing claw

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI H01L 23/48 H01L 23/48 23/50 23/50 D // H01R 43/16 H01R 43/16 (58) Fields surveyed ( Int.Cl. ⁷ , DB name) C23C 2/00-2/40 B23K 1/20 C25D 7 / 12,17 / 00 H01L 23 / 48,23 / 50

Claims (2)

(57) [Claims] 1. A high-speed soldering device for electronic components, comprising: a cathode electrode chuck provided at a tip of a cathode electrode for chucking an electronic component with a contact tip; and a chuck opening / closing unit for opening and closing the cathode electrode chuck. Plating equipment. 2. A high-speed solder plating apparatus for electronic components according to claim 1, characterized in that a shielding plate corresponding to the shape of the electronic component between the cathode electrode and the electronic component.