JPH05295509A - High-speed solder plating device for electronic parts - Google Patents

Abstract

PURPOSE:To facilitate and uniformalize the control of the compsn. and thickness of a plating film by reducing the size of the high-speed solder plating device for electronic parts and simplifying the construction of its pipings. CONSTITUTION:The high-speed solder plating device for electronic parts is constituted to have a plating cell 2, a storage tank 3 which houses this plating cell 2 and receives and stores the plating liquid overflowing from the aperture of the plating cell 2, a circulating pump 8 which circulates and supplies the plating liquid in this storage tank 3 to the plating cell 2 and a liquid flow control board 11 which controls the flow of the plating liquid in the plating cell 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-speed solder plating apparatus for electronic parts, and more particularly to, for example, IC (Integrated Circulation).
The present invention relates to a technique effectively applied to a high-speed solder plating apparatus for electronic parts that applies high-speed solder plating to electronic parts such as uit) lead frames.

[0002]

2. Description of the Related Art As a high-speed solder plating apparatus for electronic components of this type, there is, for example, the one shown below.

That is, this high-speed solder plating apparatus for electronic parts uses a rack system, in which a large number of IC lead frames are hooked on a rack and immersed in a plating solution for each rack to perform solder plating on the IC lead frames. Was there.

[0004]

However, in the structure of the high-speed solder plating apparatus for electronic parts described above, it may be necessary to install a sub-tank outside the plating tank. In this case, the apparatus becomes large, and the piping structure is increased. There was a problem that it became complicated.

Further, since the plating process is a batch process, there is a problem in that the composition and thickness of the plating film vary, which makes control difficult.

Further, since the electrode contact of the cathode electrode is exposed by the rack method, the solder plating layer adheres and grows on the electrode contact, and it is troublesome to peel off the adhered and grown solder plating layer and replace the electrode contact. There was a problem.

An object of the present invention is to provide a high-speed solder plating apparatus for electronic parts, which is capable of downsizing the apparatus and simplifying the piping structure.

Another object of the present invention is to provide a high-speed solder plating apparatus for electronic parts, in which the composition and thickness of the plating film can be easily controlled, and uniformization and high speed can be achieved.

Another object of the present invention is to provide a high-speed solder plating apparatus for electronic parts, which can improve the sealing property and reliability of electrode contacts and prolong the contact life.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, a high-speed solder plating apparatus for electronic parts according to the present invention includes a plating tank, a storage tank for accommodating the plating tank, receiving and storing the plating solution overflowing from the opening of the plating tank, and a storage tank. And a circulation pump for circulatingly supplying the plating solution of No. 1 to the plating tank.

In this case, a liquid flow control board for controlling the liquid flow of the plating liquid is provided in the plating tank, and a flow rate sensor is provided in the secondary side flow path of the circulation pump, and the motor is driven based on the detection signal of the flow rate sensor. It is possible to have a structure in which the flow rate of the plating solution can be controlled by controlling the number of rotations of.

Further, in this case, the cathode electrode chuck provided at the tip of the cathode electrode for chucking the electronic component by the contact tip and the chuck opening / closing unit for opening / closing the cathode electrode chuck can be structured.

Further, in this case, it is possible to adopt a structure in which a shield plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component.

[0016]

When the high-speed solder plating of electronic parts is performed, the plating solution overflowing from the opening of the plating tank is received and stored in the storage tank, and the stored plating solution is circulated and supplied from the bottom to the plating tank. In the plating tank, the plating liquid is controlled by the liquid flow control board so as to form a laminar flow from the lower side to the upper side.

In this way, the liquid flow of the plating liquid is applied from below and overflowed from the opening of the plating tank so that turbulent flow is not generated and the liquid flow can be made uniform.

Therefore, it is possible to easily control the composition and thickness of the plating film, and to make uniform and speeding up.

Further, a plating tank, a storage tank for accommodating the plating tank, receiving and storing the plating solution overflowing from the opening of the plating tank, and circulating the plating solution in the storage tank to the plating tank. Since the structure is provided with the pump, it is possible to downsize the device and simplify the piping structure.

Further, in this case, a flow rate sensor is provided in the secondary side flow path of the circulation pump, and the rotation speed of the motor is controlled based on the detection signal of the flow rate sensor, so that the flow rate of the plating solution can be controlled. Therefore, the flow rate of the plating solution can be easily set, and the composition and thickness of the plating film can be made more uniform.
The quality can be further improved.

Further, in this case, since the structure is provided with a cathode electrode chuck provided at the tip of the cathode electrode for chucking an electronic component with a contact tip and a chuck opening / closing unit for opening / closing the cathode electrode chuck, the electrode contact It is possible to improve the sealing property and certainty of the contact to extend the contact life, and it is possible to eliminate the peeling of the plating layer of the electrode contact and the replacement of the electrode contact, which have conventionally been problems.

Further, in this case, since the shielding plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component, the composition and thickness uniformity of the plating film can be further improved. it can.

[0023]

1 is a sectional view showing a high-speed solder plating apparatus for electronic parts according to an embodiment of the present invention, and FIG. 2 shows a plating jig unit and a cathode electrode chuck used in the high-speed solder plating apparatus of FIG. Plan view, FIG. 3 is III-II of FIG.
It is a sectional view taken along line I.

The high-speed solder plating apparatus for electronic parts in this embodiment is applied to the high-speed solder plating apparatus for the IC lead frame 1 and has a plating tank 2. The plating tank 2 is housed in a storage tank 3, and the storage tank 3 has a structure for receiving and storing the plating solution overflowed from the opening of the plating tank 2.

The plating solution stored in the storage tank 3 is supplied to the plating tank 2 again.

That is, a drain valve 5 is connected to the bottom of the storage tank 3 via a filter 4, and a valve 7, a circulation pump 8, a flow sensor 9, a three-way valve 10 and a check valve 6 are sequentially connected to the drain valve 5. The check valve 6 is connected to the bottom of the plating tank 2.

The flow rate sensor 9 has a function of detecting and digitally displaying the flow rate of the plating solution circulated and supplied, and the circulation pump 8 controls the rotation speed of the motor so that the flow rate becomes a preset flow rate. The feedback control is for controlling the circulating supply amount of the plating solution.

The check valve 6 prevents the backflow of the plating solution in the plating tank 2, and has a bypass circuit having the primary side of the check valve 6 as the starting end and the storage tank 3 as the ending end. Provided, the bypass circuit is always closed with a valve.

A liquid flow control board 11 is provided at the bottom of the plating tank 2.
Is provided in two stages, and the liquid flow is controlled so that the plating solution circulated and supplied uniformly flows from the lower side to the upper side over the entire bottom portion.

A plating jig elevating unit 14 is arranged outside the plating tank 2, and the plating jig elevating unit 14 has a function of elevating the plating jig unit 16 via the arm 15.

The plating jig unit 16 includes an arm 15
An anode electrode support plate 17 is mounted on each of them, and this anode electrode support plate 17 supports an anode electrode 19 with an anode back 18, and beams 20 are arranged at equal intervals between both anode electrode support plates 17. ..

The beam 20 is provided with a frame support groove 21 at the center and shield plate support grooves 22 on both sides thereof. The IC lead frame 1 is supported in the frame support groove 21 and the shield plate support groove 22 is provided with a shield plate. 23 is a structure supported by fitting. The shield plate 23 is a dedicated shield plate that matches the shape of the IC lead frame 1, and the shield plate 23 is used to further uniformize the composition and thickness of the plating film.

Further, a cathode electrode chuck 24 is provided in the plating tank 2, and the cathode electrode chuck 24 is I
It is a chuck system in which the shoulder portion of the C lead frame 1 is chucked by the contact tip 27.

That is, the cathode electrode 25 that moves up and down together with the arm 15 extends vertically with a predetermined interval,
It is covered with an insulator 26. A cathode electrode chuck 24 that is elastically biased inward is provided at a lower end portion of the cathode electrode 25, and the cathode electrode chuck 24 includes contact tips 27 that are provided so as to be opposed to each other and are exchangeable, and an outer peripheral surface of the contact tip 27. Is covered with an elastic seal body 28, and the end face of this elastic seal body 28 is slightly projected from the end face of the contact tip 27.

A chuck opening / closing unit 30 is provided at the opening end of the plating tank 2 via a bracket 29. The chuck opening / closing unit 30 has an opening / closing claw 31. When the opening / closing claw 31 is closed, the cathode electrode chuck is closed. When the opening / closing claw 31 is opened by closing the opening 24 by elastic force, the opening / closing claw 31 is opened to open the cathode electrode chuck 24.

Reference numeral 12 is a transfer robot, and 13 is a lead frame chuck lifting unit.

Next, the operation of this embodiment will be described.

When high-speed solder plating is applied to the IC lead frame 1, first, the plating solution is circulated in a gap between the IC lead frame 1 and the anode electrode 19 by the circulation pump 8 from the lower side to the upper side and is constant. It is made to flow constantly at a speed so as to overflow from the opening of the plating tank 2.

Next, the IC lead frame 1 sent from the pretreatment process by the transfer robot 12 is set on the plating jig unit 16 by the lead frame chuck elevating unit 13.

The IC lead frame 1 in this set state
On the other hand, the cathode electrode chuck 24 is closed to take the electrode contact.

Then, the plating jig unit 16 is lowered together with the IC lead frame 1 from the plating jig elevating unit 14 and immersed in the plating solution.

When the plating power source is turned on, solder plating is started, and high speed solder plating is applied to the IC lead frame 1.

After the plating time is increased, the solder-plated IC lead frame 1 is pulled out of the plating solution through a process reverse to the case of setting the IC lead frame 1, and the post-treatment process is performed.

In this way, the liquid flow can be made uniform so as not to generate a turbulent flow due to an overflow from the opening of the plating tank 2 by applying the liquid flow from below.

Therefore, it is possible to easily control the composition and thickness of the plating film, achieve uniformity, and improve quality.

Further, the plating tank 2, a storage tank 3 for accommodating the plating tank 2 and receiving and storing the plating solution overflowing from the opening of the plating tank 2, and the plating solution in the storage tank 3 Since the structure is provided with the circulation pump 8 that circulates the liquid to the device, the device can be downsized and the piping structure can be simplified.

Since the flow rate sensor 9 is provided on the secondary side of the circulation pump 8 and the rotation speed of the motor is controlled based on the detection signal of the flow rate sensor 9, the flow rate of the plating solution can be controlled. The flow rate of the plating solution can be easily set, the composition and thickness of the plating film can be made more uniform, and the quality can be further improved.

Further, a structure provided with a cathode electrode chuck 24 provided at the tip of the cathode electrode 25 for chucking the IC lead frame 1 with the contact tip 27, and a chuck opening / closing unit 30 for opening / closing the cathode electrode chuck 24, Therefore, it is possible to improve the sealing property and certainty of the electrode contact to extend the contact life, and it is possible to eliminate the peeling of the plating layer of the electrode contact and the replacement of the electrode contact, which have been problems in the past.

Further, since the shield plate 23 corresponding to the shapes of the cathode electrode and the lead frame for IC is provided, the composition and thickness uniformity of the plating film can be further improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above embodiment, the case of two columns has been described, but the present invention is not limited to this and can be applied to the case of multiple columns such as four columns and eight columns.

In the above description, the case where the invention made by the present inventor is mainly applied to a high-speed solder plating apparatus for an IC lead frame, which is the field of use of the invention, is not limited to this, but other than the IC lead frame. It can also be applied to high-speed solder plating equipment for lead frame-shaped electronic components.

[0053]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). A plating tank and this plating tank are stored,
A storage tank that receives and stores the plating solution that overflows from the opening of the plating tank and a circulation pump that circulates the plating solution in the storage tank to the plating tank are provided. Can be simplified.

(2) The liquid flow control board for controlling the liquid flow of the plating solution is provided in the plating tank, so that the liquid flow can be made uniform so as not to generate turbulent flow.

(3) Due to the effect of (2) above, the composition and thickness of the plating film can be easily controlled and the plating film can be made uniform.

(4). Since the flow rate sensor is provided in the secondary side flow passage of the circulation pump and the rotation speed of the motor is controlled based on the detection signal of the flow rate sensor, the flow rate of the plating solution can be controlled. The flow rate of the plating solution can be easily set, the composition and thickness of the plating film can be made even more uniform, and the quality can be further improved.

(5). Since the structure is provided with a cathode electrode chuck provided at the tip of the cathode electrode for chucking an electronic component with a contact tip and a chuck opening / closing unit for opening / closing the cathode electrode chuck, It is possible to improve the sealing property and reliability, extend the life, and eliminate the peeling of the plating layer of the electrode contact and the replacement of the electrode contact, which have been problems in the past.

(6) In the case of the above (5), since the shield plate corresponding to the shape of the electronic component is provided between the cathode electrode and the electronic component, the composition and thickness uniformity of the plating film are It can be further improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a high-speed solder plating apparatus for electronic parts according to an embodiment of the present invention.

FIG. 2 is a plan view showing a plating jig unit and a cathode electrode chuck used in the high-speed solder plating apparatus of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

[Explanation of symbols]

 1 IC lead frame 1a Package part 1b Lead part 2 Plating tank 3 Storage tank 4 Filter 5 Drain valve 6 Check valve 7 Valve 8 Circulation pump 9 Flow sensor 10 Three-way valve 11 Liquid flow control board 12 Transfer robot 13 Lead frame chuck lift Unit 14 Plating jig elevating unit 15 Arm 16 Plating jig unit 17 Anode electrode supporting plate 18 Anode back 19 Anode electrode 20 Beam 21 Frame supporting groove 22 Shielding plate supporting groove 23 Shielding plate 24 Cathode electrode chuck 25 Cathode electrode 26 Insulator 27 Contact tip 28 Elastic seal body 29 Bracket 30 Chuck opening / closing unit 31 Opening / closing claw

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location H01L 23/48 23/50 D 9272-4M // H01R 43/16 6901-5E

Claims (4)

[Claims] 1. A plating tank, a storage tank that stores the plating tank, receives and stores the plating solution that overflows from the opening of the plating tank, and circulates the plating solution in the storage tank by circulating the plating solution to the plating tank. A high-speed solder plating device for electronic parts, which is equipped with a pump. 2. A liquid flow control board for controlling a liquid flow of a plating solution is provided in the plating tank, a flow rate sensor is provided in a secondary side flow path of the circulation pump, and a motor of the motor is detected based on a detection signal of the flow rate sensor. 2. The high-speed solder plating apparatus for electronic parts according to claim 1, wherein the number of revolutions is controlled so that the flow rate of the plating solution can be controlled. 3. A high-speed solder for electronic components, comprising: a cathode electrode chuck provided at the tip of a cathode electrode for chucking an electronic component with a contact tip; and a chuck opening / closing unit for opening / closing the cathode electrode chuck. Plating equipment. 4. The high-speed solder plating apparatus for electronic parts according to claim 3, wherein a shielding plate corresponding to the shape of the electronic parts is provided between the cathode electrode and the electronic parts.