JP3164018B2 - Replacement method of wafer prober and test board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer prober for electrically connecting electrodes (tester pins) of a tester for measuring electrical characteristics of a chip formed on a semiconductor wafer and electrodes (pads) on the chip. More particularly, the present invention relates to a wafer prober equipped with a test head.

[0002]

2. Description of the Related Art A wafer prober measures the electrical characteristics of each chip in a semiconductor wafer, and electrically connects electrodes of a tester and electrodes of the chip through a probe card for discriminating between a good product and a defective product. A device that automatically transports a wafer from a wafer carrier in which a wafer is stored, automatically measures (electrically connects) each chip, and automatically collects the wafer in the wafer carrier after the measurement. Nowadays, the automation is advanced to the point that it has a function of automatically exchanging probe cards, a function of connecting to a network, downloading product data, and uploading measurement data, thereby improving workability.

By the way, in recent years, high performance semiconductor chips have been developed.
Along with the high integration, small-quantity multi-product production is increasing in production. For this reason, the number of operations performed by the worker has increased significantly. For example, when measuring a wafer of a different type B after measuring a wafer of the type A, the operator must exchange a probe card corresponding to the type B with a test board depending on the type.

When a trouble such as a high contact resistance between a tester and a wafer occurs, it is often the case that the test board is replaced, detached, and the test head is opened and closed repeatedly. A conventional test board replacement operation will be described in detail with reference to the drawings. 8 to 11 show a configuration of a conventional wafer prober as disclosed in, for example, JP-A-62-263647.
The wafer prober includes, for example, a test head 1, a main stage 2, a loader stage 3, and a test head opening / closing mechanism 4. FIG. 8A is a front view of a main part of the wafer prober, FIG. 8B is a top view of a main part of the wafer prober, and FIG. 9 is an explanatory view of the internal structure of the wafer prober.

Since the test head 1 of such a conventional wafer prober is always closed (at the time of measurement), when replacing the test board 8, first (1) the test head 1 is opened, and (2) the test board is The test board 8 is exchanged (that is, for example, fixing release → exchange → re-fixing. One-touch method is mainly used for fixing and releasing the test board 8). next,
(3) The work of closing the test head 1 is required. In order to reduce the work of replacing the test board 8, in Japanese Patent Application Laid-Open No. 62-263647, the board 8 (test board 8, contact board 8
a, the probe card 10a, and the connection ring 9 are integrated into a single unit).

This will be described with reference to FIGS. 10 and 11. FIG. 10A is a plan view of a main part of the wafer prober, FIG. 10B is a front view of a main part of the wafer prober, and FIG. It is principal part plane explanatory drawing. The wafer prober has the following mechanism.

That is, the main stage 2, the loader stage 3 of the wafer prober, the storage room 18 (including the board storage shelf), the board 16 (the test board 8, the contact board 8a, the pogo pin board, the probe card 10a), the housing (the connection ring) 9), clamp metal fittings (including the connection ring fixing jig 10), gripping / conveying means 17 (elevating motor 17a, elevating screw 17b, elevating rail 17)
c, slide motor 17d, slide screw 1
7e, slide rail 17f, board fork 17g
), The test head 1, the head plate 6, the rotation control motor 19 of the test head, and the controller 20. The wafer 12 is mounted on the loader stage 3 of the wafer prober while being stored in the wafer carrier 15.

As described above, the test board replacement operation in the above-described conventional wafer prober is performed by first (1) moving the test head 1 by the rotation control motor 19 of the test head as shown in FIG. Then, rotate to the left.
(2) The currently mounted board 16 is removed from the upper surface of the released wafer prober by the gripping / transporting means 17 and stored in the storage chamber 18.

Next, (3) a new test board 16 corresponding to the type to be switched is transferred from the storage chamber 18 to the head plate 6 by the gripping transfer means 17. (4) Thereafter, the test head 1 is rotated rightward by the rotation control motor 19 of the test head, as shown in FIG. 10B, and connected to the head plate 6 to be in a closed state.

(5) After the replacement of the test board is completed, the loader stage 3 of the wafer prober is
Transports the wafer 12 stored in the wafer carrier 15 to the main stage 2 of the wafer prober, and starts measurement. However, in this conventional example, since the test head 1 is rotated to perform the opening / closing operation, a pogo pin (for example, a contact pin having a spring) or a guide (a pin or the like) for positioning the test head 1 and the head plate 6 has been damaged. In addition, since the test head is also heavy, artificial work involves danger.

The board 16 includes a test board 8, a pogo pin board 8a, a probe card 10a, and a connection ring 9.
The test board 8 and the probe card 10a cannot be replaced independently, and the pogo pin board 8a and the connection ring 9 are required according to the number of types, so that the cost is large. In addition, connection ring (9)
However, it cannot be applied to the type having an integral structure with the head plate 6.

Another problem is that a large number of test boards having various combinations must be prepared.

[0013]

That is, in such a conventional wafer prober, when a test board is replaced, the first problem is opening and closing of the test head.
In recent years, the number of switching has increased due to the increase in high-mix low-volume production,
Sometimes more than a dozen times a day. Generally, the test head is heavy, and 100 kg to 200 kg is mainly used due to the effects of increasing the number of pins and increasing the speed. For this reason, the opening / closing operation is very dangerous, and there is a strong sense of oppression to the worker.

Further, since the main flow of the opening / closing mechanism is of a revolving type, the positioning pins and pogo pins on the upper surface of the prober are damaged, and there is a problem that electrical conduction between the semiconductor wafer and the tester becomes impossible. Therefore, it is necessary to eliminate the test head opening / closing operation when the test board is automatically replaced. However, in the above-mentioned Japanese Patent Application Laid-Open No. 62-263647, it is necessary to open the test head, and since the operation of opening and closing the test head is manually performed, the above problem cannot be solved. Also, probe card and board (including test board, pogo pin board, connection ring)
Since it is necessary to be integrated, for example, when replacing only the probe card, when replacing only the test board,
Flexible response is not possible.

Further, in a tester of a type in which a board (connection ring) is fixed to a prober head plate, automatic replacement becomes impossible, and the tester is limited to a specific model or type of tester. In addition, since the probe card and the board have an integrated structure, a pogo pin board, a connection ring, and the like are required according to the number of types, so that the cost is large.

Accordingly, an object of the present invention is to improve the above-mentioned disadvantages of the prior art, to enable replacement of a test board without opening / closing a heavy test head, and to provide an electric connection between the test head and a wafer prober. It is an object of the present invention to provide a wafer prober which suppresses damage to pogo pins which are electrically connected, positioning guides for mechanical connection, etc., reduces a mental burden on an operator, and is compatible with automation.

[0017]

The present invention employs the following basic technical structure to achieve the above object. That is, as a first aspect of the present invention, there is provided a wafer prober used for measuring electrical characteristics of a semiconductor element formed on a semiconductor wafer,
Freely test board removably to reclosable testing heads provided on the wafer prober is connected, the Te
The strike board operates in conjunction with the test board attaching / detaching mechanism.
The test fixture is held by a fixture that changes position.
When the test board is in the closed state, the test board is
Move the test board away from the test head or
A test board attachment / detachment mechanism to abut the head
And when the test head is in the closed state, the test board is separated from the test head, and in a state separated from the test head, a surface parallel to a joint surface with the test head. Or, it is a wafer prober configured to be slidable along a surface similar to the wafer prober. As a second aspect, the wafer prober is used to measure the electrical characteristics of a semiconductor element formed on a semiconductor wafer. A wafer prober, wherein the test board is detachably connected to an openable / closable test head provided on the wafer prober via an appropriate test board attaching / detaching mechanism; A step of driving the test board attaching / detaching mechanism at a stage where the test board is in a closed state to separate the test board from the test head; Further driving the contact board attaching / detaching mechanism to engage and hold the test board with the test board guide, sliding the test board along the test board guide, and disposing the test board on the side of the wafer prober body. Removing the test board to the outside of the wafer prober by a test board replacing means provided at a position corresponding to the test board guide, and inserting another test board into the test board guide. This is a test board replacement method in a wafer prober.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The method for replacing a wafer prober and a test board according to the present invention solves the above-mentioned problems. Specifically, the replacement of the test board can be performed without opening and closing the test head. By connecting the connection ring between the test board and the probe card to a connection ring fixing jig having a driving unit driven by a cylinder or a motor, the test board, the probe card and the connection ring are integrally configured. The test board (performance board) is lowered when the test board (performance board) is replaced, and the test board and the connection ring are separated from each other. With an integral structure, which is attached to a connection ring fixing jig having a cylinder or motor drive unit The connection ring fixing jig is lowered when the test board (performance board) is replaced, and the connection ring fixing jig is separated from the test board and the connection ring portion fixed to the test board. The test board including the ring part can be inserted and removed, and it can be adapted to automation.

Incidentally, the test head opening / closing operation of the wafer prober in the present invention is configured so as to be able to open / close as usual for test head maintenance and connection ring part maintenance. Further, with respect to probe card replacement, for example, Japanese Patent Laid-Open No.
The automatic exchange means as proposed in Japanese Patent Application Laid-Open No. 1-10738 can be used, and the method of fixing the test board to the test head is not particularly specified. It is desirable to use a test board fixing system which is not artificial and is a one-touch system.

That is, as a more specific example of the configuration of the wafer prober according to the present invention, a test board detachably connected to the test head of the wafer prober and a probe contacting the semiconductor element are provided. A test member comprising a probe card having a probe ring and a connecting ring portion which is located between the probe card and the two and is connected to each other is attached. When the test board is replaced, the test board is connected to the test head. The test board is configured so as to be able to slide along a plane parallel to a joint surface with the test head or a plane similar thereto when the test board is separated from the test head. Wafer prober.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of a wafer prober according to the present invention will be described below in detail with reference to the drawings. 1 to 4
FIG. 3 is a view for explaining a configuration of a specific example of a wafer prober according to the present invention. In the figure, a wafer prober 30 used for measuring electrical characteristics of semiconductor elements formed on a semiconductor wafer 12 is shown. The test board 8 is detachably connected to the openable and closable test head 1 provided in the wafer prober 30. When the test head 1 is in the closed state, the test board 8 is connected to the test head 1. In a state separated from the test head 1 and separated from the test head 1, the test head 1 can be slid along a plane parallel to a joint surface with the test head 1 or a plane similar thereto. A wafer prober 30 is shown.

That is, in the present invention, the operation of opening and closing the heavy test head 1 as in the conventional method is avoided, and the test head 1 is kept closed.
The test board 8 in use is removed, and a test board 8 which is separately required is similarly inserted to a necessary place in the wafer prober while the test head 1 of the wafer prober 30 is closed. It is configured to be moved.

That is, the wafer prober 3 according to the present invention.
When the test head 1 is in the closed state, the test board 8 is moved away from the test head 1 or the test board 8 functions to contact the test head 1 with the test head 1. The board attaching / detaching mechanism 11 is provided inside the wafer prober 30.

In the wafer prober 30 of the present invention, the test board 8 may be replaced independently, but as will be described later, a connection ring portion and a probe card are integrated. It can be exchanged in the form. More specifically, such a test board replacement method is shown in FIGS.

That is, as shown in the figure, when the test board 8 is replaced, the test board 8 is moved downward from the test head 1 when the test head 1 is in the closed state. After the test board 8 is separated from the test head 1, the test head 8 is moved downward from the position where the test board 8 is lowered, as shown in FIG.
Is moved in parallel with the plane formed by the lower surface of the wafer prober 30 and taken out of the wafer prober 30 from the side surface thereof.

When another test board 8 is inserted and set, an operation reverse to the above-described operation is performed, so that
A new test board 8 can be abutted and fixed to the test head 1. Further, in the present invention, the test board 8 is configured such that its position is lowered or raised by an appropriate test board attaching / detaching mechanism 11, and the test board attaching / detaching mechanism is, for example, a motor. Alternatively, the test board 8 is constituted by a cylinder or the like.
To directly change the position of the test board, and may be held by a fixing jig 10 whose position changes in conjunction with the test board attaching / detaching mechanism 11. Is also good.

The test board 8 used in the present invention is, as an example, as shown in FIGS. 3A to 4, a surface opposite to the surface facing the test head 1. ,
A probe card 10a having a probe in contact with the semiconductor wafer element 12 to be inspected is connected to the connection ring 9
Are joined together through In this case, the test board 8 is held by the fixture 10 via the probe card 10a and the connection ring 9.

In such a configuration, FIGS. 3A and 3
As is clear from (B), the fixing jig 9 is desirably configured to hold the entire probe card 10a and a part of the connection ring portion 9. In the above-described wafer prober 30 according to the present invention, the test board 8
The configuration and operation of the case where the connection ring 9 and the probe card 10a have an integral structure will be described in more detail below.

FIG. 1A is a front view of a main part of a wafer prober, FIG. 1B is a side view of a main part, FIG. 2 is a top view of a main part, FIGS. 3A and 3B. ), FIGS. 4 and 5 (A),
FIG. 5B and FIG. 6 are explanatory views of the internal structure and operation of the wafer prober 30. In the figure, 1 is a test head, 2 is a main stage of a wafer prober, 3
, A loader stage of the wafer prober 30; and 4, a test head opening / closing mechanism of the wafer prober 30. FIG. 7 is an operation flowchart when the test board is replaced.

The test head 1 is fixed by a test head fixing jig 5 and a test head opening / closing mechanism 4
During measurement (normal time), it is fixed by a positioning guide and a test head clamper 7 provided on a head plate 6 on the main stage 2. The test head 1 is mounted with a test board 8 (including a contact board 8a) and is electrically connected via pogo pins (for example, contact pins having a spring).

The wafer prober 30 is electrically connected to the main body of the wafer prober via pogo pins attached to the connection ring 9. On the other hand, the main stage 2 of the wafer prober 30
Is used to move the head plate 6, the connection ring 9, the probe card 10a, the connection ring fixing jig 10 (including the probe card holder 10b, the probe card clamper 10c, etc.) and the connection ring fixing jig 10 up and down. A vertical drive unit 11 is disposed at an upper portion, and a chuck 13 for holding the semiconductor wafer 12 by vacuum and a stage (not shown) for driving the chuck 13 in XYZθ are connected and disposed therein.

The main stage 2 has a door 14 for taking in and out the test board 8, and the head plate 6 has a guide 16 for taking out the test board 8.
(Such as a slider). The loader stage 3 is provided with a wafer carrier 1 for storing a semiconductor wafer 12.
5 is mounted, and the semiconductor wafer 12 is controlled by an appropriate controller (not shown) provided in the wafer prober 30.
Is automatically conveyed to the chuck 13 of the main stage 2.

Further, the test head opening / closing mechanism 4 is mechanically connected to the test head 1 via a test head fixing jig 5, and is opened and closed by a suitable driving means, for example, a cylinder or a motor. I do. On the other hand, the connection ring 9 is fixed by a positioning guide of a fixing jig 10 for the connection ring, a bolt, or the like.

That is, the connection ring fixing jig 10 is mechanically connected to the vertical drive unit 11, can be driven vertically by a cylinder, a motor, or the like, and can be fixed to the semiconductor wafer 12 in parallel. For example, when measuring the type A semiconductor wafer 12 and then measuring the type B semiconductor wafer 12, it is necessary to replace the test board 8 and the probe card 10a with those corresponding to the type B.

A specific example of the replacement operation of the test board 8 will be described with reference to a flowchart shown in FIG. First, when switching from the type A to the type B, the operator first obtains a type parameter corresponding to the type B from a predetermined information source via a predetermined control means in step (1) after the start.

At this stage, as shown in FIG. 3A, the fixing jig 10 is at the first position, and the test board 8 is integrated with the connection ring 9 and the probe card 10a. It is joined to the test head 1. Next, the process proceeds to step (2), in which the test board 8 is replaced according to the parameters. The replacement operation is performed by first pressing the test board replacement SW provided on the wafer prober 30 in step (2). An exchange start signal is transmitted to a controller (not shown) of the wafer prober 30, and the state of each sensor is detected to determine whether or not the exchange is possible. Therefore, when it is determined that the replacement work is not necessary, the normal measurement work is continued, and when the determination is replaceable, the process proceeds to step (3), and the test head 1 or the The signal is transmitted to the control unit of the tester, the test board clamp of the test head 1 is reset and removed, and the test board 8 is in a free state. Next, in step (4), the chuck 13 is retracted to a position that does not hinder the replacement operation.

In this specific example, it is retracted below the figure. Next, the process proceeds to step (5), and FIG.
As shown in (2), the connection ring fixing jig 10 is lowered by the vertical drive unit 11 to a position where the test board 8 and the connection ring 9 are separated from each other. That is, the fixing jig 10 is displaced to the second position. At this stage, the connection ring 9 and the probe card 10a are connected to the fixing jig 10
When the test board 8 is moved down to the second position while continuing to move down to the step (6), the test board 8 is provided in the middle of the displacement process of the fixing jig 10. The test board guide 16 is engaged and held.

The test board guide 16 is a high-precision guide provided on the head plate 6. The test board 8 is discharged to the outside of the wafer prober 30 along the guide, or a new test board 8 is provided. Is externally inserted and moved to a position where it is joined to the test head 1. Further, in step (7), the lowering operation of the fixing jig 10 is continued, and the fixing jig 10 is
As shown in (3), when the test board 8 comes to the third position, the test board 8 is engaged with the test board guide 16 while being integrated with the connection ring portion and the probe card. The fixing jig 10 reaches a third position where the fixing jig continues to descend.

While the above steps are being executed, each step is executed while detecting a necessary state for each step and checking for the occurrence of an abnormal state. For example, whether the test board 8 is on the high-precision test board guide 16 of the head plate 6 or a predetermined position where the fixing jig 10 does not interfere with the test board 8 integrated with the connection ring 9 The sensor is transmitted to a controller of the wafer prober, and if necessary, an alarm is generated or the operation of the process is stopped.

Next, proceeding to step (8), the test board 8 is moved along the test board guide 16 from the test board guide 16 of the head plate 6 by using an appropriate discharging means (not shown). The board 8 is discharged out of the wafer prober 30. 1 (A) and 1
As shown in (B), an opening is provided on one side of the wafer prober 30, and an appropriate door 14 is provided in the opening.
When the test board 8 is ejected, the door 14
Can be opened, and the test board 8 can be taken out therefrom by using the test board taking out / inserting means 17 composed of an appropriate robot or the like.

Alternatively, the test board 8 is moved from the door 14 to the front of the main stage 2 by a slider, a lead screw, or the like (which can be artificially pulled out) attached to a high-precision test board guide 16 provided on the head plate 6. The test board 8 may be taken out by a worker, an automatic take-out device, or the like.

Incidentally, whether or not the door 14 for taking the test boat 8 in and out may be completely opened may be detected by an associated sensor. Next, when inserting the test board 8 integrally configured with the probe card 10a and the connection ring portion 9 corresponding to the type B, in the latter half of the step (8), the operator and the automatic insertion device 17 etc. The test board 8 is set at a predetermined position on the front of the main stage 2. The set test board 8 is inserted through the door 14 to a position where it can be connected to the test head 1 by, for example, a slider and a lead screw attached to a high-precision test board guide 16 provided on the head plate 6. You.

Next, proceeding to step (9), the test board 8 inserted along the test board guide 16 to the predetermined position is arranged in the state shown in FIG. 4, and then the connection ring fixing jig 10 is From the third position in FIG. 4, the ascent / descent drive unit 11 mechanically connected is raised toward the above-mentioned second position. Then, step (1)
0), the fixing jig 10 is joined to the connection ring 9 and the probe card 10a integrated with the test board 8, and a positioning guide provided on the connection ring 9 and the fixing jig 10 Guides are engaged.

Next, in step (11), as the ascending movement of the drive unit 11 is continued, the fixing jig 1
0 also rises with the test board 8 fixed to the connection ring 9 while holding the connection ring 9 and the probe card 10a. In step (12),
The fixing jig 10 reaches the first position and is connected to an appropriate guide provided on the test head 1.

Whether the test board 8 and the test head 1 are correctly connected is detected by an appropriate sensor provided on the test head 1, and the test board 8 is correctly clamped to the test head 1. Is confirmed, the door 14 for inserting and removing the test board 8 is closed to complete the replacement work of the test board 8. That is, in the above specific example of the present invention, the test board guide 16 for engaging and holding the test board 8 is provided in the middle of the process of displacing the fixing jig 10. One.

As is apparent from the above description, the wafer prober 30 according to the present invention, when the fixing jig 10 is at the first position shown in FIG. 8 is the connection ring 9 and the probe card 10a
When the fixing jig 10 is at the second position shown in FIG. 3B, the connection ring 9 and the probe card 1 are joined together.
0a is held by the fixing jig 10, and the test board 8 is engaged and held by a test board guide 16 provided in the middle of the displacement process of the fixing jig 10. When the fixing jig 10 is at the third position shown in FIG. 4, the fixing jig 10 is configured so as to be separated from the connection ring 9 and the probe card 10a. .

Next, the wafer prober 30 according to the present invention will be described.
As another specific example, the basic configuration and test board 8
The basic system of the replacement method is the same as that of the above-described specific example.
5A and FIG. 5B and FIG. 6 will be described with reference to FIGS. 5A, 5B, and 6. FIG.

That is, the test board replacement method of this embodiment is basically the same as the flowchart of FIG. 7 described above, and therefore only different points will be described below. First,
In this specific example, the test board 8 and the connection ring 9 are joined via an appropriate detachable mechanism (not shown). Therefore, FIG. 5A showing a state in which the test board 8 and the connection ring portion 9 are joined is the same as the state in FIG. 3A.

First, when switching from the type A to the type B, the operator first starts the type B in the step (1).
Is obtained from a predetermined information source via a predetermined control means. At this stage, FIG.
As shown in FIG. 7, the fixing jig 10 is at the first position, and the test board 8 is joined to the test head 1 in a state where the test board 8 is integrated with the connection ring 9 and the probe card 10a.

The operations from step (1) to step (6) in FIG. 7 are the same as those in the above specific example. That is, in this specific example, the connection ring fixing jig 10 is moved down by the vertical drive unit 11 to a position where the test board 8 and the connection ring 9 are separated from each other, and is displaced to the second position. Is the same as

That is, at this stage, the connection ring 9 and the probe card 10a are lowered to the second position together with the test board 8 while being held by the fixing jig 10, as shown in FIG. As shown in FIG. 3B, the test board 8 can be engaged and held by the test board guide 16 provided in the middle of the displacement process of the fixing jig 10.
Same as (B).

The difference between the above two examples is seen at the time when the process proceeds to step (7). That is, as shown in FIG. 6, in step (7), the fixing jig 10 When the lowering operation is continued and the fixing jig 10 comes to the third position as shown in FIG.
Is engaged and held by the test board guide 16, but the connection ring portion and the probe card are separated from the test board 8 and held by the fixture 10, and It continues descending and reaches the third position.

In step (8), therefore, only the test board 8 is replaced. When the test board 8 corresponding to another type B is to be inserted, the probe card 10a corresponding to the type B is inserted in the latter half of the step (8) by the worker and the automatic insertion device 1a.
7, the test board 8 is set at a predetermined position in front of the main stage 2. Test board 8 set
The test head 1 is driven by a slider and a lead screw attached to a high-precision test board guide 16 provided on the head plate 6 via the door 14 described above.
Inserted to a position where it can be connected to.

Next, proceeding to step (9), the test board 8 inserted along the test board guide 16 to the predetermined position is arranged in the state shown in FIG. 6, and then the probe card 10a and the connection ring 9 The connection ring fixing jig 10 holding the above moves upward from the third position in FIG. 6 to the above-described second position by the elevation of the mechanically connected upper and lower drive unit 11.

Thereafter, in step (10), the connection ring portion 9 and the test board 8 held by the fixing jig 10 are brought into contact with and joined to each other via an appropriate positioning guide. Subsequent steps are the same as in the above-described specific example. That is, as described above, when the fixing jig 10 is at the first position, the wafer prober 30 in this specific example allows the test board 8 to be connected to the connection ring 9 and the probe card 10a. When the fixing jig 10 is in the second position, the connection ring 9 and the probe card 10 are joined together to the test head 1 in an integrated state.
a is held by the fixing jig 10, the test board 8 is engaged and held by a test board guide 16 provided in the middle of the displacement process of the fixing jig 10. When the fixing jig 10 is at the third position,
The connection ring portion 9 is separated from the test board 8, and the fixing jig 10 is configured to hold the connection ring portion 9 and the probe card 10a. .

The wafer prober 30 according to the present invention.
Is a wafer prober used to measure the electrical characteristics of semiconductor chips formed on the semiconductor wafer 12. A test board mounted on a test head of an inspection device for determining whether the chips are good or defective based on the electrical characteristics. The connection ring 9 between the probe card 10a and the probe card 10a is vertically movable by being attached to a connection ring fixing jig 10 having a drive unit.
Is lowered to separate the test board 8 and the connection ring portion 9 so that the test board can be inserted and removed.

Further, in the present invention, the connection ring joined to the test board is vertically movable by being attached to a connection ring fixing jig 10 having a driving portion, and the connection ring fixing jig 10 is used when the test board is replaced. Descend,
The connection ring fixing jig 10 and the connection ring portion 9 attached to the test board may be separated so that the test board 8 can be inserted and removed.

As described above, the method for replacing a test board according to the present invention includes, for example, a wafer prober used for measuring the electrical characteristics of a semiconductor element formed on a semiconductor wafer. At a stage where the test head is in a closed state in a wafer prober in which the test board is detachably connected to an openable and closable test head provided on the wafer prober via an appropriate test board attaching / detaching mechanism. (1) driving the test board attaching / detaching mechanism to separate the test board from the test head; and (2) further driving the test board attaching / detaching mechanism to engage the test board with the test board guide. (3) sliding the test board along the test board guide; and (4) holding the wafer board. The test board is taken out of the wafer prober by a test board replacing means provided at a position corresponding to the test board guide on the side of the server body, and another test board is inserted into the test board guide. Steps.

Further, in the present invention, a step of inserting the test board into the test board guide and disposing the test board at a predetermined position in the wafer prober body, and driving the test board attaching / detaching mechanism, Bringing the test board attaching / detaching mechanism into contact with the test board locked by the test board guide; further driving the test board attaching / detaching mechanism to separate the test board from the test board guide; It is also desirable that the method comprises a step of bonding to the substrate.

According to the present invention, the test head 1 at the time of product type change
The damage of the pogo pin and the positioning guide due to the opening and closing of can be reduced as follows. For example, in the case of product change per day = 10 times, test head 1 daily inspection (test head 1 must be opened and closed) = 1 time In the conventional method, test head 1 opening and closing times = 11 times, pogo pin breakage = 5 times In the method of the present invention, the number of times of opening / closing of the test head = 1, the number of pogo pin breaks = 0.5 / month, and the replacement of the positioning guide = 1 time / month. 10, which is a significant improvement.

[0061]

As described above, according to the present invention, when replacing the test board 8 in a wafer prober for measuring the electrical characteristics of the semiconductor wafer 12, the test can be performed without opening and closing the test head 1. Opening and closing operations can be minimized, such as during maintenance. Therefore, breakage of the pogo pins and the positioning guide between the test head 1 and the head plate 6 can be suppressed. Further, the mental burden on the operator performing the opening / closing operation can be minimized.

Further, a test board 8, a connection ring 9,
By making the probe cards 10a independent from each other, the test board 8 and the probe card 10a can be replaced independently, so that it is possible to flexibly cope with multi-product production, and the test board 8 and the probe can be provided without a plurality of connection rings 9. Since the card 10a can be exchanged, no extra cost is required.

[Brief description of the drawings]

FIG. 1A is a front view of a main part of a wafer prober of the present invention, and FIG. 1B is a side view of the main part.

FIG. 2 is an explanatory top view of a main part of a wafer prober according to the present invention.

FIGS. 3A and 3B are diagrams illustrating the internal structure of a wafer prober and an operation when a test head is replaced in one embodiment of the present invention.

FIG. 4 is an explanatory diagram showing an internal structure of a wafer prober and an operation when a test head is replaced in one embodiment of the present invention.

5 (A) and 5 (B) are diagrams illustrating the internal structure of a wafer prober and an operation when a test head is replaced in another embodiment of the present invention.

FIG. 6 is an explanatory view showing an internal structure of a wafer prober and an operation when a test head is replaced in another embodiment of the present invention.

FIG. 7 is an operation flowchart when a test board is replaced in the present invention.

FIG. 8A is a front view of a main part of a conventional general wafer prober, and FIG. 8B is a top view of a main part of the conventional wafer prober.

FIG. 9 is an explanatory view of the internal structure of a conventional wafer prober.

FIG. 10A is an explanatory plan view of an essential part showing an example of a test board exchange mechanism in a conventional wafer prober, and FIG. 10B is an explanatory front view of the essential part.

FIG. 11 is an explanatory plan view of a main part showing a state in which a board in a conventional wafer prober is replaced via a gripping / transporting means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Test head 2 ... Wafer prober main stage 3 ... Wafer prober loader stage 4 ... Test head opening / closing mechanism 5 ... Test head fixing jig 6 ... Head plate 7 ... Test head clamper 8 ... Test board 9 ... Connection ring 10 ... Fixing jig 10a Probe card 10b Probe card holder 10c Probe card clamper 11 Vertical drive unit 12 Semiconductor wafer 13 Chuck 14 Door 15 Wafer carrier 16 Test board guide 17 Gripping and transporting means 17a Lifting / lowering Motor 17b: Lifting screw 17c: Lifting rail 17d: Sliding motor 17e: Sliding screw 17f: Sliding rail 17g: Board fork 18: Storage chamber 19: Test head rotation control motor 20: Controller

Claims (20)

(57) [Claims] 1. A wafer prober used for measuring electrical characteristics of a semiconductor element formed on a semiconductor wafer, wherein a test board is detachably attached to an openable and closable test head provided on the wafer prober. Connected, and the test board is connected to the test board attaching / detaching mechanism.
It is held by a fixture that moves and changes its position,
When the test head is in the closed state, the test board
The test head away from the test head, or
Test board attaching / detaching machine for contacting the test head with the test head
When the test head is in the closed state, the test board is separated from the test head, and in a state separated from the test head, the test board is parallel to the joint surface with the test head. A wafer prober characterized by being configured to be slidable along a flat surface or a surface similar thereto. 2. A test card having a probe in contact with the semiconductor wafer element to be inspected is connected to a surface of the test board opposite to a surface facing the test head via a connection ring. 2. The wafer prober according to claim 1 , wherein the wafer prober is used. 3. The wafer prober according to claim 2 , wherein said test board is held by said fixture via said probe card and said connection ring. 4. The test board is configured so that it can be inserted into or ejected from the wafer prober from the side of the wafer prober body when the test head is in the closed state. The wafer prober according to claim 2 or 3 , wherein: 5. The fixture, a wafer according to any one of claims 2 to 4, characterized in that it is configured so as to hold a part of the whole and the connecting ring portion of the probe card Prober. 6. In the course of the displacement of the fixing jig,
6. The wafer prober according to claim 2 , further comprising a test board guide for engaging and holding the test board. 7. When the fixing jig is at the first position, the test board is joined to the test head in a state of being integrated with the connection ring portion and the probe card. When the fixture is at the second position, the test board is provided in the middle of the displacement process of the fixture while the connection ring and the probe card are held by the fixture. When the fixing jig is in the third position, the fixing jig is separated from the fixed connection ring portion and the probe card. The wafer prober according to any one of claims 2 to 6 , wherein: 8. The wafer prober according to claim 2 , wherein the test board and the connection ring are joined via a detachable mechanism. 9. When the fixing jig is at the first position, the test board is joined to the test head in a state where the test board is integrated with the connection ring portion and the probe card. When the fixture is at the second position, the test board is provided in the middle of the displacement process of the fixture while the connection ring and the probe card are held by the fixture. When the fixing jig is at the third position, the connection ring portion is separated from the test board, and the fixing jig is attached to the test board guide. 9. The wafer prober according to claim 8 , wherein the wafer prober is configured to hold the fixed connection ring portion and the probe card. 10. The test board along the test board guide, the wafer prober according to any one of claims 1 to 9, characterized in that is configured so as to slide. 11. A predetermined test board is pulled out from the test board guide on a side surface of the wafer prober body corresponding to the test board guide, and a different test board is inserted into the test board guide. 11. The wafer prober according to claim 10, further comprising a test board replacement means for performing the test. 12. A wafer prober used for measuring electric characteristics of a semiconductor element formed on a semiconductor wafer, wherein a test head of an inspection device for judging good or bad of a chip based on the electric characteristics. The connection ring between the test board and the probe card mounted on the test board is attached to a fixture that is linked to the drive unit, and can be moved up and down. A wafer prober characterized in that a test board can be inserted and removed by separating the wafer probe. 13. A wafer prober used for measuring electric characteristics of a semiconductor element formed on a semiconductor wafer, wherein the wafer prober is mounted on a test head of an inspection device for judging whether a chip is good or defective based on the electric characteristics. The connection ring part joined to the test board can be moved up and down by attaching it to a fixing jig that is linked to the drive unit. When the test board is replaced, the fixing jig is lowered, and the connection jig and the connection ring part attached to the test board are attached. A wafer prober characterized in that a test board can be inserted and removed by separating the wafer probe. 14. A detector for detecting an abnormal operation of replacing a test board is disposed at a predetermined portion of the wafer prober, and an alarm means driven in response to a signal detected from the detector. claim, characterized in that the processing operation means corresponding to the abnormal operation is provided 12 or
14. The wafer prober according to item 13 . 15. A wafer prober used for measuring electrical characteristics of semiconductor elements formed on a semiconductor wafer, wherein a test board is attached to and detached from an openable test head provided on the wafer prober. In a wafer prober to which the test board is detachably connected via a mechanism, when the test head is in a closed state, the test board attaching / detaching mechanism is driven to attach the test board to the test head. A step of further driving the test board attachment / detachment mechanism to engage and hold the test board with a test board guide; a step of sliding the test board along the test board guide; and a step of the wafer prober A test board replacement provided at a position corresponding to the test board guide on the side of the main body Removing the test board to the outside of the wafer prober by a step, and inserting another test board into the test board guide. A method of replacing a test board in a wafer prober, the method comprising: . 16. A step of inserting the test board into the test board guide and disposing the test board at a predetermined position in the wafer prober main body. Contacting the test board attaching / detaching mechanism to the test board, further driving the test board attaching / detaching mechanism, separating the test board from the test board guide, and joining the test board to the test head. 16. The method for replacing a test board in a wafer prober according to claim 15, wherein the method comprises: 17. The test board attaching / detaching mechanism includes a fixing jig capable of displacing its position in response to driving of the test board attaching / detaching mechanism, and the test board is held by the fixing jig. Claims characterized by the following
15. The test board replacement method according to 15 or 16 . 18. The test board replacement method according to claim 17 , wherein the test board is held by the fixture via a probe card and a connection ring. 19. The test board, said probe card and conditions connected integral with the ring portion, claim, characterized in that the wafer prober is intended to be inserted with respect to discharged or wafer prober 18 Test board replacement method described. 20. The test board is the state that is separate from the probe card and the connecting ring portions, claim, characterized in that the wafer prober is intended to be inserted with respect to discharged or wafer prober 18 Test board replacement method described.