JP3162347B2 - Matrix substrate for matrix type display device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix substrate for a matrix type display device used for a liquid crystal television or the like.

[0002]

2. Description of the Related Art In a matrix type display device, a display material such as liquid crystal is usually sandwiched between two opposing substrates, and at least one of the substrates is provided with pixel electrodes made of a transparent conductive film arranged in a matrix. A switching element such as a transistor is provided for each pixel electrode so that a voltage is selectively applied to these pixel electrodes. Such a matrix type display device is roughly divided into
A matrix substrate manufacturing process for providing pixel electrodes and switching elements on one substrate, and a panel manufacturing process for manufacturing a matrix display panel by sandwiching a display material such as liquid crystal between the matrix substrate and the other counter substrate, It is manufactured through a peripheral mounting step of connecting an external circuit for driving the matrix display panel.

FIG. 5 shows, for example, Japanese Patent Application Laid-Open No. 58-116573.
FIG. 1 is a configuration diagram of a matrix substrate manufactured in a matrix substrate manufacturing process shown in Japanese Patent Application Laid-Open Publication No. H10-207, in which 1 denotes the entire matrix substrate, 2 denotes an insulating substrate, 3 denotes an insulating substrate, A plurality of row electrode lines 4 are formed so as to form an array, and a plurality of column electrode lines 5 are formed so as to intersect the row electrode lines 3 via an insulating film. A plurality of switching elements 6 connected to the electrode lines 3 and the column electrode lines 4 are connection terminals for supplying a drive signal from the outside, and are provided at one of ends of the row electrode lines 3 and the column electrode lines 4. Reference numeral 7 denotes an outer conductor provided on the outer periphery of the row electrode line 3 and the column electrode line 4, and both ends of all the electrode lines 3 and 4 are connected.

The matrix substrate 1 manufactured and manufactured as described above is supplied to a panel manufacturing process together with a separately manufactured counter substrate. In the panel manufacturing process, first, the surface of the matrix substrate 1 is rubbed, and this surface is subjected to an orientation treatment. At this time, static electricity is generated by rubbing, and this static electricity causes a problem of destruction of the switching element 5 or deterioration of characteristics. However, the matrix substrate 1 is provided with a means for preventing the above problem, and the insulating substrate 2
All of the row electrode lines 3 and the column electrode lines 4 are connected to the outer conductor 7 provided on the outer periphery of the substrate to form a short circuit state, so that the inside of the matrix substrate 1 is always kept at the same potential when exposed to static electricity. The destruction of the switching element 5 or the characteristic deterioration are prevented.

The rubbed matrix substrate 1 is opposed to the separately rubbed counter substrate in parallel,
A liquid crystal is sealed between the two to assemble, and a matrix display panel is completed. Thereafter, the matrix display panel cuts off the outer conductor 7 of the matrix substrate 1, which is a component of the matrix display panel, to make all the ends of the row electrode lines 3 and the column electrode lines 4 open, and to connect between the connection terminal 6 and the other end. Measure continuity and inspect for disconnection or short circuit. Based on the inspection result, the non-defective product is supplied to a peripheral mounting process, and an external circuit for driving the matrix display panel is connected to the connection terminal 6, thereby completing a matrix display device.

[0006]

In the matrix substrate of the above-mentioned conventional matrix type display device, all the row electrode lines 3 and the column electrode lines 4 are electrically connected at both ends via the outer conductor 7. Row electrode line 3 or column electrode line 4
However, even if the wire was broken in the middle, the wire could not be detected due to electrical continuity, and the wire could not be found until the outer conductor 7 was cut off in the panel manufacturing process.
For this reason, even a broken matrix substrate is supplied to the panel manufacturing process, which makes it difficult to reduce the manufacturing cost. In order to solve this problem, as shown in FIG. 6, for example, the configuration of the matrix substrate 1 may be such that only one end of the row electrode line 3 and the column electrode line 4 is connected to the outer conductor 7 and the other end is open. However, in this case, the switching element 5 near the other end that has been opened due to the electrostatic discharge during the panel manufacturing process is broken or the characteristics are deteriorated. This problem of destruction or characteristic deterioration will be described using an equivalent circuit.

FIG. 7 is an equivalent circuit focusing on one of the row electrode lines 3 shown in FIG. In the figure, 31 is the resistance per pixel of the row electrode line 3 of about 3Ω, 41 is the resistance of one pixel of the column electrode line 4 of about 4Ω, and 51 is 1 of the outer conductor 7.
The resistance per pixel is about 0.1Ω, and 8 is a capacitance formed at the intersection of the row electrode line 3 and the column electrode line 4 and the switching element 5.
0.1p is the combined capacitance of the parasitic capacitance existing between the electrodes
About F, 6a is a terminal at the open end of the row electrode line 3, and 5a is a switching element located at a distance closest to the terminal 6a at the open end.

Next, in the above equivalent circuit, when the row electrode line 3 has 2,000 pixels per line, that is, when it corresponds to a matrix type display device having a display size of 10 inches, static electricity is applied to the terminal 6a at the open end. FIG. 8 shows the result of calculating the voltage applied between the electrodes of the switching element 5a due to the occurrence of the discharge. The figure shows the electrostatic discharge test standard (MIL-
100p according to the method specified in STD-883C).
Calculation is made for the case where the charge stored at the charging voltage of 1 KV in the capacity of F is discharged to the terminal 6a at the open end through the resistance of 1500Ω. It was found that the switching element 5a exceeded a threshold value of 50 V at which the characteristics deteriorated. As shown by these results, the problem of destruction of the switching element 5 or deterioration of characteristics due to electrostatic discharge cannot be solved only by connecting all ends of the row electrode lines 3 and the column electrode lines 4 to the outer conductor 7. As another solution, there has been proposed a method in which the outer conductor 7 is formed after the disconnection inspection to short-circuit both ends of all the row electrode lines 3 and the column electrode lines 4 and rubbing is performed in this state. It is not easy to short-circuit the electrode lines, and there is a possibility that the switching elements 5 on the row electrode lines 3 or the column electrode lines 4 which are not connected to the outer conductor 7 may be damaged by electrostatic discharge or deteriorate in characteristics. is there.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can be performed before a disconnection inspection of an electrode wire formed on an insulating substrate is shifted to a panel manufacturing process. The purpose of the present invention is to provide a matrix substrate for a matrix-type display device, which does not cause destruction of switching elements or deterioration of characteristics even when an electrostatic discharge occurs during a panel manufacturing process, thereby preventing a reduction in the yield of a matrix-type display device. Becomes

[0010]

A matrix substrate for a matrix type display device according to the present invention comprises an insulating substrate, a plurality of row electrode lines provided on the insulating substrate, and an insulating layer formed on the row electrode lines. A plurality of column electrode lines intersected via
A plurality of switching elements provided at the intersections of the row electrode lines and the column electrode lines, an outer conductor provided on the outer periphery of the row electrode lines and the column electrode lines, and the outer conductor is formed of the row electrode lines. While being connected to one end and one end of the column electrode wire, and the other end of these electrode wires, during the manufacturing process, when a discharge occurs between the outer conductor and the other end of the electrode wire, the voltage applied between the electrodes of the switching element
A gap is provided so that the peak is 50 V or less.
It is characterized by having.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a configuration diagram showing a matrix substrate for a matrix type display device according to a first embodiment of the present invention. In the figure, reference numeral 1 denotes the entire matrix substrate, 2 denotes an insulating substrate, 3 denotes a plurality of row electrode lines arranged in a row direction on the insulating substrate 2, and 4 denotes an intersection with the row electrode lines 3 via an insulating film. The column electrode lines 5 arranged at the intersections of the respective electrode lines 3 and 4 are provided, and a plurality of switching elements connected to the row electrode lines 3 and the column electrode lines 4 are provided with an external electric signal. Connection terminal to supply,
Reference numeral 7 denotes an outer conductor arranged on the outer periphery of all the electrode wires 3 and 4, and one end of all the row electrode lines 3 and the column electrode wires 4 is connected to the outer conductor 7. Reference numeral 9 denotes a terminal formed at the other end of the row electrode line 3 and the column electrode line 4 and is provided with a gap with the outer conductor 7.

In the matrix substrate configured as described above, when an electrostatic discharge occurs at the terminal 9, electric charges are injected not only into the terminal 9 but also into the outer conductor 7 provided with a gap from the terminal 9. No high voltage is applied between the electrodes of the switching element 5. In other words, when discharged to the terminal 9 via the resistor 1500Ω to 1KV charged in the capacitor of 100 pF, as shown in FIG. 4, the terminal on the outer peripheral conductor 7 9
Is provided through a gap such that the peak of the voltage applied between the electrodes of the switching element 5 becomes 50 V or less, so that the switching element 5 is not broken or the characteristics are deteriorated. Further, the electrical continuity between the terminal 9 and the outer conductor 7 is measured to check the disconnection of the row electrode line 3 and the column electrode line 4. In the present embodiment, a cut is formed in the outer conductor 7, and the terminal 9 is provided in the cut and the terminal 9 is brought close to the outer conductor 7, but the terminal 9 is discharged as described above. Sometimes, if the peak of the voltage applied between the electrodes of the switching element 5 is 50 V or less, the terminal 9 is simply parallel to the outer conductor 7 and narrower than the width of the outer conductor 7 as shown in FIG. The same effect can be obtained even if they are arranged close to each other so as to be provided via a gap.

Embodiment 2 FIG. In the above embodiment, the terminal 9 is installed close to the outer conductor 7. In the present embodiment, the terminal 9 is installed on the outer conductor 7 via the insulating layer 10 as shown in FIG. The terminal 9 is arranged close to the outer conductor 7. In this case, the electrical continuity between the terminal 9 insulated by the insulating layer 10 and the outer conductor 7 is measured to check the disconnection of the row electrode line 3 and the column electrode line 4, and when an electrostatic discharge occurs at the terminal 9. The voltage applied between the electrodes of the switching element 5 can be sufficiently reduced by the capacitance formed by the insulating layer 10 between the terminal 9 and the outer conductor 7.

That is, also in this embodiment, 100 p
When the capacitor F is charged by 1 KV and discharged to the terminal 9 through the resistance of 1500Ω, the peak of the voltage applied between the electrodes of the switching element 5 becomes 50 as in the first embodiment.
Since the terminal 9 is provided so as to be equal to or lower than V, the switching element 5 does not break down or deteriorate its characteristics.

As described above, after the matrix substrate manufacturing process, the matrix substrate of the matrix type display device constructed as in the above-described embodiment is provided with the terminal 9 or the peripheral conductor 7 which is adjacent to the peripheral conductor 7 with a gap therebetween. Insulation is inspected by checking the continuity between the terminal 9 which is disposed adjacent to the terminal 9 via the insulating layer 10 and the other end of the electrode wire connected to this terminal. Supply to manufacturing process. When the matrix substrate supplied to the panel manufacturing process is exposed to static electricity, discharge is generated not only in the terminal 9 provided close to the outer conductor 7 but also in the outer conductor adjacent to the terminal. The voltage applied between the electrodes of the provided switching element is reduced . In particular, outside the terminal 9
Peripheral conductor 7, the peak of the voltage applied between the electrodes of the switching element when the discharge occurs is 50V or less
Since the switching elements are close to each other through such a gap, destruction of the switching elements or deterioration of characteristics can be prevented.

[0016]

According to the present invention, as described above, an inspection signal can be supplied to a terminal that is not in contact with the outer conductor to check for disconnection of the electrode wire. Even if an electrostatic discharge occurs at a terminal that is not connected, the voltage applied between the electrodes of the switching element is sufficiently relaxed, so that destruction of the switching element or deterioration of characteristics can be prevented.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a matrix substrate according to a first embodiment of the present invention.

FIG. 2 is a partial view showing another embodiment of the first embodiment of the present invention.

FIG. 3 is a configuration diagram illustrating a matrix substrate according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating a voltage characteristic applied to a switching element provided near a release-side terminal provided on a matrix substrate according to the first embodiment of the present invention;

FIG. 5 is a configuration diagram showing a conventional matrix substrate.

FIG. 6 is a configuration diagram showing another conventional matrix substrate.

7 is an equivalent circuit diagram of the matrix substrate shown in FIG.

8 is a characteristic diagram of a voltage applied to a switching element near an open-side terminal in FIG. 6;

[Explanation of symbols]

1 matrix substrate, 2 insulating substrates, 3 rows of electrode wires,
4 column electrode wires, 5 switching elements, 6 connection terminals,
7 outer conductor, 9 terminals, 10 insulating layers.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tatsuya Nakayama 8-1-1, Tsukaguchi-Honmachi, Amagasaki-shi Mitsubishi Electric Corporation Materials and Devices Laboratory (56) References JP-A-2-186326 (JP, A) Kaihei 1-252935 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02F 1/1368 G02F 1/1345 G09F 9/30 338

Claims (1)

(57) [Claims] An insulating substrate, a plurality of row electrode lines provided on the insulating substrate, a plurality of column electrode lines intersecting the row electrode lines via an insulating layer, A plurality of switching elements provided at the intersections of the electrode lines and the column electrode lines,
Outsides provided on the outer periphery of the row electrode lines and the column electrode lines
A peripheral conductor, the peripheral conductor being connected to one end of the row electrode line and one end of the column electrode line, and the other end of these electrode lines being connected to the peripheral conductor and the electrode during a manufacturing process. When a discharge occurs between the other end of the polar line and the peak of the voltage applied between the electrodes of the switching element is 50 V or less.
A matrix substrate for a matrix-type display device, wherein the matrix substrate is provided with a gap therebetween .