JP3157254U - 360 degree illumination light emitting diode illumination device - Google Patents
360 degree illumination light emitting diode illumination device Download PDFInfo
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- JP3157254U JP3157254U JP2009008372U JP2009008372U JP3157254U JP 3157254 U JP3157254 U JP 3157254U JP 2009008372 U JP2009008372 U JP 2009008372U JP 2009008372 U JP2009008372 U JP 2009008372U JP 3157254 U JP3157254 U JP 3157254U
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Abstract
【課題】３６０度照明円形発光ダイオード照明装置の構造を提供する。【解決手段】銅基板１０、複数枚の発光ダイオードチップ１２及び可撓性印刷回路層１６からなり、前記銅基板の表面に銀を電気めっきし、発光ダイオードチップを該銅基板の側縁に設置し、前記可撓性印刷回路層を銅基板の側縁に配置して前記発光ダイオードチップと電気的に接続して発光ダイオードチップの作動を制御する。銅基板外周側縁に配置した複数の発光ダイオードチップにより周囲３６０度照明の照明範囲を確保するだけでなく、銀メッキした銅基板による熱伝導、放熱作用を向上し、発光ダイオードチップの耐用時間を延長する。【選択図】図１A structure of a 360-degree illuminated circular light-emitting diode illuminating device is provided. A copper substrate, a plurality of light emitting diode chips, and a flexible printed circuit layer are formed. The surface of the copper substrate is electroplated with silver, and the light emitting diode chip is placed on the side edge of the copper substrate. The flexible printed circuit layer is disposed on the side edge of the copper substrate and electrically connected to the light emitting diode chip to control the operation of the light emitting diode chip. In addition to securing the illumination range of 360-degree illumination by multiple light-emitting diode chips arranged on the outer peripheral edge of the copper substrate, the heat conduction and heat dissipation action by the silver-plated copper substrate is improved, and the lifetime of the light-emitting diode chip is increased. Extend. [Selection] Figure 1
Description
本考案は、発光ダイオードの照明装置に関し、特に照明範囲が３６０度に及び、最良の熱伝導及び放熱効果を具有し、生産コストが比較的低い３６０度円形の発光ダイオード照明装置の構造に関する。 The present invention relates to a lighting device for a light emitting diode, and more particularly to a structure of a 360 ° circular light emitting diode lighting device having an illumination range of 360 degrees, the best heat conduction and heat dissipation effect, and a relatively low production cost.
公知構造の発光ダイオード照明装置は、最良の照明範囲及び強度に達するよう、通常複数個の発光ダイオードチップを同じ平面に配列する。このようなフラット構造では、発光ダイオードチップを作動すると、１８０度照明の照明範囲を得ることができる。 In a light emitting diode illuminating device having a known structure, a plurality of light emitting diode chips are usually arranged on the same plane so as to reach the best illumination range and intensity. In such a flat structure, when the light emitting diode chip is operated, an illumination range of 180 degrees illumination can be obtained.
１８０度照明の照明範囲に制限されるため、実際使用する際、前述の発光ダイオード照明装置がもたらす照明効果が尚完璧なものではない。照明範囲を拡大するため、二つのフラットタイプの発光ダイオード照明装置を合体して使用し、照明範囲を３６０度に限りなく近いものに広げた。 Since it is limited to the illumination range of 180 degree illumination, in actual use, the illumination effect provided by the above-described light emitting diode illumination device is not yet perfect. In order to expand the illumination range, two flat type light-emitting diode illuminating devices were combined and used, and the illumination range was expanded to as close as possible to 360 degrees.
しかし、二つのフラットタイプの発光ダイオード照明装置を合併して使用すると、尚も幾つかの欠点が挙げられる。 However, when two flat type light emitting diode lighting devices are used in combination, there are still some drawbacks.
二つのフラットタイプ発光ダイオード照明装置を合体すると、照明の死角が小さいながらも存在し、確実に３６０度照明の照明範囲を得ることができない上、このような組立方法ではコストが高すぎる。組立する際に高度な技術が必要であるだけでなく、複雑で難易度が高く、製作時間も比較的長くなる。また、組み立てた後の完成品の良品率がやや低いことなどを鑑みて、本考案では３６０度照明の発光ダイオード照明装置を案出した。 When two flat type light emitting diode illuminating devices are combined, they exist even though the blind spot of the illumination is small, and it is impossible to reliably obtain an illumination range of 360 degree illumination, and such an assembling method is too expensive. Not only does it require advanced techniques for assembly, it is complicated and difficult, and the production time is relatively long. In view of the fact that the percentage of non-defective products after assembly is slightly low, the present invention has devised a 360-degree illumination LED illuminating device.
本考案の第１の目的は、一枚の銅基板の縁に複数枚の発光ダイオードチップを設置することで、全ての発光ダイオードチップが異なる角度で照射し、確実に３６０度照明の照明範囲を確保する３６０度照明の発光ダイオードの照明装置を提供することにある。
本考案の第２の目的は、銅基板の表面に銀の電気めっきをすることにより、最良の熱伝導及び放熱効果を得るだけでなく、発光ダイオードチップの照明寿命を延ばすと同時に、低い製造コストで製作できる３６０度照明の発光ダイオードの照明装置を提供することにある。
The first object of the present invention is to install a plurality of light emitting diode chips on the edge of a single copper substrate, so that all the light emitting diode chips irradiate at different angles, and reliably provide a 360 degree illumination range. An object of the present invention is to provide a lighting device for a light emitting diode with 360 degree illumination.
The second object of the present invention is not only to obtain the best heat conduction and heat dissipation effect by electroplating silver on the surface of the copper substrate, but also to increase the illumination life of the light emitting diode chip and at the same time lower the manufacturing cost. It is providing the light-emitting diode illuminating device of 360 degree illumination which can be manufactured by.
前記課題を解決するために、本考案は３６０度照明の円形発光ダイオード照明装置の構造を提供する。銅基板、複数枚の発光ダイオードチップ及び可撓性印刷回路層により構成する。前記銅基板の表面に銀を電気めっきし、発光ダイオードチップをそれぞれ該銅基板の側縁に設置する。前記可撓性印刷回路層は銅基板の側縁に敷き、発光ダイオードチップと電気的に接続することで、発光ダイオードチップの作動をコントロールする。本考案は上記の設置により、３６０度照明の照明範囲を確保するだけでなく、効果的且つ迅速に熱伝導及び放熱効果があり、発光ダイオードチップの照明寿命を延ばすことができる。 In order to solve the above-mentioned problems, the present invention provides a structure of a circular light-emitting diode illuminating device with 360 degree illumination. It is composed of a copper substrate, a plurality of light emitting diode chips, and a flexible printed circuit layer. Silver is electroplated on the surface of the copper substrate, and light emitting diode chips are respectively installed on the side edges of the copper substrate. The flexible printed circuit layer is placed on the side edge of the copper substrate and electrically connected to the light emitting diode chip to control the operation of the light emitting diode chip. The present invention not only secures an illumination range of 360-degree illumination, but also effectively and quickly heats and dissipates heat, thereby extending the illumination life of the light-emitting diode chip.
本実施例では、前記３６０度照明の発光ダイオード照明装置の銅基板の最良形態は八角形とし、発光ダイオードチップをそれぞれ銅基板の側縁の４つの点に設置する。 In this embodiment, the best form of the copper substrate of the 360 degree illumination light emitting diode illuminating device is an octagon, and the light emitting diode chips are respectively installed at four points on the side edge of the copper substrate.
本考案は八角形の銅基板の表面に銀を電気めっきし、周りに４つの発光ダイオードチップを設置することで、３６０度照明の照明範囲を確保し、最良の光反射を得るだけでなく、照明効果を上げ、製造コストを下げることができる。 In the present invention, the surface of an octagonal copper substrate is electroplated with silver, and by installing four light emitting diode chips around it, the illumination range of 360 degree illumination is ensured and not only the best light reflection is obtained, The lighting effect can be increased and the manufacturing cost can be reduced.
本考案の構造などを明確に示すために図に沿って詳細な説明を行う。
本考案の３６０度照明発光ダイオード照明装置は、銅基板と複数枚の発光ダイオードチップ及び可撓性印刷回路層からなる。前述発光ダイオードチップを銅基板の側縁に設置し、前述の可撓性印刷回路層を前記銅基板の側縁に敷く。
Detailed description will be made with reference to the drawings in order to clearly show the structure of the present invention.
The 360 degree illumination light-emitting diode illuminating device of the present invention comprises a copper substrate, a plurality of light-emitting diode chips, and a flexible printed circuit layer. The light emitting diode chip is installed on the side edge of the copper substrate, and the flexible printed circuit layer is laid on the side edge of the copper substrate.
図１に示すのは本考案の第一実施例である。３６０度照明発光ダイオード照明装置１を構成するのは一枚の銅基板１０、４枚の発光ダイオードチップ１２、４つのカバー１４及び一つの可撓性印刷回路層１６である。
FIG. 1 shows a first embodiment of the present invention. The 360-degree illumination light-emitting diode
本実施例では前記銅基板１０は八角形とし、表面に銀の電気めっきを施すことで、最良の熱伝導及び放熱効果をもたらす。
In this embodiment, the
発光ダイオードチップを使用する際、熱が発生するのは避けられない。効果的に熱を完全に放熱させなければ、全体温度が高くなり、発光ダイオードチップの劣化による輝度の減衰をもたらし、使用寿命が短くなる。前記問題を解決し、発光ダイオードチップの寿命を延ばすため、金属を使用し、最良の熱伝導及び放熱効果を得る。 When using a light emitting diode chip, it is inevitable that heat is generated. If the heat is not effectively dissipated completely, the overall temperature is increased, the brightness is attenuated due to deterioration of the light emitting diode chip, and the service life is shortened. In order to solve the above problems and extend the life of the light emitting diode chip, metal is used to obtain the best heat conduction and heat dissipation effect.
本実施例では、銅及び銀を熱伝導及び放熱の材料として使用する。銅の熱伝導係数は３８０W/m.Kであり、熱伝導効果が良好且つ材料価格が妥当である。銀の熱伝導係数は４２９W/m.Kであり、熱伝導効果は銅より良いが、価格が高いのが欠点である。 In this embodiment, copper and silver are used as materials for heat conduction and heat dissipation. The heat conduction coefficient of copper is 380 W / m.K, and the heat conduction effect is good and the material price is reasonable. The thermal conductivity coefficient of silver is 429 W / m.K, and the thermal conductivity effect is better than copper, but the disadvantage is that it is expensive.
よって、本考案は銅基板による熱伝導及び放熱効果をメインとし、更に銀を表面に電気めっきすることで、銅と銀の間にある熱導電係数と同じ合金が生まれ、それによってコスト面及び熱伝導と放熱効果の両方に配慮することができる。 Therefore, the present invention is mainly based on the heat conduction and heat dissipation effect by the copper substrate, and further, by electroplating silver on the surface, an alloy having the same thermal conductivity coefficient between copper and silver is produced, thereby reducing the cost and heat. Both conduction and heat dissipation effects can be taken into account.
実施する際、銀の電気めっきを具有する銅基板の熱伝導係数は約４２０W/m.K前後であり、当該熱伝導及び放熱効果は銀に近いが、コストはかなり抑えることができる。また、銅基板に電気めっきする銀は、熱伝導と放熱効果を上げるほか、光を反射する作用を具有するため、効果的に光束密度を上げることができる。 When implemented, the copper substrate with silver electroplating has a thermal conductivity coefficient of about 420 W / m.K, and the thermal conduction and heat dissipation effect is similar to silver, but the cost can be significantly reduced. In addition, silver to be electroplated on the copper substrate has an effect of reflecting light in addition to improving heat conduction and heat dissipation, and therefore can effectively increase the light flux density.
このほか、前記銅基板１０は４つの角にそれぞれ納置部１０２を設け、発光ダイオードチップ１２を設置し、それぞれの発光ダイオードチップ１２の外側をそれぞれカバー１４で覆う。よって、全ての発光ダイオードチップ１２は異なる照明範囲を照射し、全体的に３６０度照明の照明範囲を確保し、効果的に照明死角を無くすことができる。
In addition, the
前記可撓性印刷回路層１６を前記銅基板１０の側縁に敷き、前記発光ダイオードチップ１２と電気接続することで、発光ダイオードチップ１２の作動をコントロールする。
The flexible printed
図２及び図３に示すのは本考案の第二実施例である。第一実施例と異なる部分は、銅基板１０'の構造のみである。図に示すように、銅基板１０'の中央に穴１０４を設ける。図３に示すように、数個の３６０照明発光ダイオード照明装置１'を棒体２に直列接続することで、異なる態様の照明装置を形成し、異なるニーズを満たすことができる。
2 and 3 show a second embodiment of the present invention. The only difference from the first embodiment is the structure of the copper substrate 10 '. As shown in the figure, a
本考案のメリットは下記の４点が挙げられる。
１、一枚の銅基板の側縁に数枚の発光ダイオードチップを設置すると、３６０度照明 の照明範囲を確保することができ、照明死角を効果的に減少することができる。
２、銅基板をメインとし、表面に銀を電気めっきすると、形成する合金は理想的な熱 伝導及び放熱効果を具有するだけでなく、効果的にコストを下げることができる 。
３、銅基板に銀を電気めっきすることで、最良の光反射を得ることができ、効果的に 光束密度を上げることができる。
４、銅基板に穴を設けることで、数個の３６０度円形発光ダイオード照明装置を直列 接続することができ、更に照明効果を上げる照明装置となる。
The merit of the present invention is as follows.
1. If several light emitting diode chips are installed on the side edge of one copper substrate, the illumination range of 360 degree illumination can be secured, and the blind spot can be effectively reduced.
2. When a copper substrate is the main and silver is electroplated on the surface, the alloy to be formed not only has ideal heat conduction and heat dissipation effects, but also can effectively reduce the cost.
3. By electroplating silver on the copper substrate, the best light reflection can be obtained and the luminous flux density can be effectively increased.
4. By providing a hole in the copper substrate, several 360-degree circular light-emitting diode illuminating devices can be connected in series, resulting in an illuminating device that further increases the illumination effect.
本考案の３６０度円形発光ダイオード照明装置は、３６０度照明の角度照明の照明範囲を確保することができ、最良の熱伝導及び放熱効果が得られる。発光ダイオードチップの照明寿命を延ばすと同時に、低い製造コストで実現できる。 The 360-degree circular light-emitting diode illuminating device of the present invention can secure the illumination range of 360-degree angle illumination, and the best heat conduction and heat dissipation effect can be obtained. It can be realized at a low manufacturing cost while extending the illumination life of the light emitting diode chip.
上記の説明は本考案の実施例の説明であり、本技術に熟知する者が、本考案の範囲内にて行う変更や調整を行っても、本考案の重要な意義は失われず、本考案の範囲に含まれる。 The above explanation is an explanation of the embodiments of the present invention. Even if a person familiar with the present technology makes changes or adjustments within the scope of the present invention, the significance of the present invention is not lost. Included in the range.
１、１' ３６０度照明発光ダイオード照明装置
１０、１０' 銅基板
１０２ 納置部
１０４ 穴
１２ 発光ダイオードチップ
１４ カバー
１６ 可撓性印刷回路層
２ 棒体
DESCRIPTION OF
Claims (4)
銅基板の表面に銀を電気めっきし、
複数枚の発光ダイオードチップを該銅基板の外周側縁に設置し、及び、
可撓性印刷回路層は前記銅基板の側縁に配置して前記発光ダイオードチップと電気的に接続し、発光ダイオードチップの作動をコントロールすることを特徴とする３６０度照明発光ダイオード照明装置。 Consists of copper substrate, light emitting diode chip, flexible printed circuit layer,
Electroplating silver on the surface of the copper substrate,
Installing a plurality of light emitting diode chips on the outer peripheral side edge of the copper substrate; and
A 360 degree illumination light emitting diode illuminating apparatus, wherein a flexible printed circuit layer is disposed on a side edge of the copper substrate and electrically connected to the light emitting diode chip to control the operation of the light emitting diode chip.
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|---|---|---|---|
| JP2009008372U JP3157254U (en) | 2009-11-25 | 2009-11-25 | 360 degree illumination light emitting diode illumination device |
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| JP2009008372U JP3157254U (en) | 2009-11-25 | 2009-11-25 | 360 degree illumination light emitting diode illumination device |
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| JP3157254U true JP3157254U (en) | 2010-02-04 |
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| JP2009008372U Expired - Fee Related JP3157254U (en) | 2009-11-25 | 2009-11-25 | 360 degree illumination light emitting diode illumination device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012115274A1 (en) * | 2011-02-23 | 2012-08-30 | Sharp Kabushiki Kaisha | A lighting device and a lighting system |
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2009
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012115274A1 (en) * | 2011-02-23 | 2012-08-30 | Sharp Kabushiki Kaisha | A lighting device and a lighting system |
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