JP3157109B2 - Method and apparatus for firing a substrate containing a film forming material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking method and apparatus for uniformly performing a heat treatment on a substrate including a film forming material.

[0002]

2. Description of the Related Art On a glass substrate represented by soda-lime glass or a ceramic substrate represented by alumina, a metal or inorganic material is melted by a glass bond component,
2. Description of the Related Art A substrate including a film forming material is known in which a film having a predetermined function is fixed by softening, melting, or sintering of the material itself. For example, an anode substrate of a fluorescent display tube, a substrate for a plasma display panel, a plasma switching substrate for a plasma addressed liquid crystal display, a substrate for a display device such as a substrate for a field emission display, a thick film wiring substrate, or a thermal printer head or image This is a substrate for an electronic device such as a sensor. Such a substrate for an electronic device is generally subjected to a heat treatment of about 500 to 650 (° C.) to anneal the substrate itself or to form a film of a functional material using a glass material as a binder. On the substrate, a heat treatment of, for example, about 500 to 900 (° C.) is performed to form a film of a functional material using a glass material as a binder or to form a film of a functional material using melting of an interface of the metal material itself. .

[0003]

However, in recent years,
The substrate including the film-forming material has a multi-layered and fine structure of a conductor, a resistor, and a dielectric formed on the surface thereof, and in particular, the display device substrate has a large display area. It is necessary to produce relatively large dimensions. Therefore, the display device substrate is required to form a fine pattern over a large dimension. In the electronic device substrate, the quality is ensured by reducing the pattern space given to the film for generating functions. Therefore, uniformity of the film is further required. However, the influence on the quality brought by the firing of the substrate becomes larger as the size becomes larger as described above, and the variation thereof becomes a constraint on the product design or contributes to lowering the product yield. Was. For example, a resistance layer has a large variation in resistance value, a dielectric layer has a large variation in a thickness dimension due to a variation in a withstand voltage and a non-uniform residual ratio, and a conductive layer has a large variation in conduction resistance and wire bonding properties and sputtering properties. It becomes.

[0004] Further, when there is a dimensional change due to expansion or contraction of the substrate material itself due to the heat treatment, it becomes difficult to perform pattern alignment for each firing performed after patterning of a film having a function. The uniformity of the layer quality and the consistency of the alignment between the patterns become more difficult as the patterns become finer or as the substrate becomes larger, and there is a disadvantage that the product yield decreases at an accelerated rate. For example, in the case of a plasma display substrate as a large display device having a size of 40 inches or more, there are the following factors that lower the yield. For example, the dimensional accuracy of each layer of the multilayer structure forming a large number of cells cannot be secured, the height and width of the barrier vary, the resistance of the resistive cell varies, and the dielectric layer has resistance. Variations in voltage and overall dimensional variations include deviations when forming a discharge cell by combining a front plate and a rear plate.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate including a film forming material capable of increasing the yield of the substrate including the film forming material by uniform heating in the substrate. And a baking method and apparatus.

The present inventor has conducted various studies to achieve the above-mentioned object, and as a result, the metal or inorganic material contained in the thick film is melted or sintered, and the glass bond is lowered to fix the functional component. It has been found that the softening or melting state of the glass component itself in the component or dielectric material is locally different in the substrate. The present invention has been made based on the above findings.

[0007]

A first aspect of the present invention to achieve the above-mentioned object is to provide a method for transporting a plurality of substrates including a film forming material sequentially in one direction. A baking method for uniformly performing a heat treatment on each of the substrates, and in a cooling process of the heat treatment, (a) a temperature equal to a set temperature set for each chamber so as to gradually decrease along the one direction. A heat equalizing step of accommodating each of the plurality of substrates at a set temperature for each of the plurality of substrates by accommodating each of the plurality of substrates for a predetermined time in each of a plurality of heating chambers whose temperature is controlled in advance. (B) an unloading step of sequentially sending each of the plurality of substrates heat-treated in each of the plurality of heating chambers from each of the plurality of heating chambers to a heating chamber having a lower set temperature than the heating chamber; ) A predetermined group of the plurality of substrates A gas supply step of supplying a gas having a temperature lower than a set temperature of the heating chamber to a predetermined heating chamber of the plurality of heating chambers to which the gas has been sent out; and (d) after the gas supply step, And carrying in another substrate following the predetermined substrate among the plurality of substrates into the heating chamber.

[0008]

According to the first aspect of the present invention, the plurality of substrates including the film forming material are set for each chamber so as to gradually decrease along the one direction in the soaking process in the cooling process of the heat treatment. After being soaked for a predetermined time at the set temperature, each of the substrates is sequentially sent out from the heating chamber to a heating chamber having a lower set temperature in the unloading step, but a predetermined one of the plurality of substrates is sent out in the gas supply step. A gas having a temperature lower than the set temperature is supplied to a predetermined heating chamber,
Thereafter, in the loading step, another substrate following the predetermined substrate is sent into the predetermined heating chamber. in this way,
Since the cooling process of the heat treatment is performed while repeating soaking in the heating chamber maintained at the set temperature set for each chamber so as to gradually decrease in one direction, the inside of the substrate including the film forming material Temperature variations are minimized. At this time, since a gas at a temperature lower than the set temperature is supplied to the heating chamber to which the substrate has been sent out without the substrate in the chamber, the output of the heating source provided in the heating chamber (that is, the temperature control) Output) is stabilized at a higher level than during the soaking of the substrate, after which the next substrate is fed. Thereby, in each heating chamber, the heat treatment of each of the plurality of substrates is started from the temperature control state in the empty room, and the temperature is sequentially increased by performing the heat treatment on the plurality of substrates higher than the set temperature of each heating chamber. Instability of the control is suppressed, and the time during which the substrate sent into the heating chamber is allowed to cool is sufficiently shortened, so that the temperature variation in the substrate is further reduced. Therefore, when the substrate is made of glass and is heat-treated at a temperature equal to or higher than the strain point, local changes in dimensions within the substrate, that is, distortion of the formed pattern are reduced as much as possible. The misalignment with the subsequent pattern is prevented, and the production yield is drastically improved even for a fine pattern or a large substrate. In addition, since the temperature variation in the substrate including the film forming material is reduced as much as possible as described above, the thick film dielectric layer, the partition wall dielectric layer, the thick film resistance layer, the electrode In the case where a layer and an inorganic color pigment layer are provided, the degree of melting and softening of the glass functioning as a bond component in the thick film becomes uniform, and melting and burning of a metal-metal oxide system are performed. The degree of knotting becomes uniform, withstand voltage quality, height and width dimensions of the partition, resistance value, discharge quality,
Variations in optical filter characteristics and the like are suitably reduced, and the production yield is dramatically improved even for a large substrate. Further, as described above, as a result of reducing the variation in the resistance value, the management load of the process and the process such as trimming are reduced or the load is reduced.

Incidentally, when a substrate is fed into the heating chamber, the output of the heating source, that is, the amount of temperature control is reduced by the heat brought in by the substrate. Therefore, when the heat is accumulated by successively feeding the substrates, the time in which the substrate is left to cool is gradually increased. Temperature variation tends to increase. Therefore, when the substrate is soaked, it is desired that such a cooled state be as short as possible, that is, that the temperature control output be kept high.

Further, according to the present invention, after the substrate subjected to the heat treatment is sent out from the predetermined heating chamber, the predetermined heating chamber is subjected to a temperature control output in an empty room, and thereafter, the other substrate is output. Since the substrate is fed, the thermal effect of the previously processed substrate on the substrate to be processed later is suppressed. Therefore, even when substrates having different dimensions and heat capacities are continuously processed, or when the substrates are intermittently transferred and heat-treated, the heat treatment can be performed without considering the transfer conditions. In addition, the control of the firing device is facilitated.

[0011]

A second aspect of the present invention for suitably implementing the above-described method is that a plurality of substrates including a film-forming material are sequentially transported in one direction. A baking apparatus for uniformly performing a heat treatment on each of a plurality of substrates, comprising: (a) a heating device provided in a part of a tunnel-shaped heating region in a longitudinal direction and thermally divided by a shutter device; A plurality of heating chambers whose temperatures are independently controlled by heaters, and (b) setting the temperature of each of the plurality of heating chambers so as to gradually decrease along the one direction by controlling the heating heater. A temperature control device that uniformly controls so as to match the set temperature of each chamber, and (c) in the process of sequentially transporting the plurality of substrates in one direction in the tunnel-shaped heating area, the plurality of substrates Each of the plurality of heating chambers A transfer device that sends a heat treatment for a predetermined time in each of the plurality of heating chambers and sends out the substrate that has completed the heat treatment in each of the plurality of heating chambers from each of the plurality of heating chambers, (d) An air supply device provided in each of the plurality of heating chambers, for supplying a gas having a temperature lower than a set temperature of the heating chamber, and (e) in each of the plurality of heating chambers, And an air supply control device that supplies the gas from the air supply device in a state where each of the substrates is sent out and the substrate is not located in the room.

[0012]

According to the second aspect of the present invention, the substrate containing the film forming material is sequentially fed into a plurality of heating chambers in the process of being transported along the one direction by the transport device in the cooling process of the heat treatment. In the plurality of heating chambers, the temperature is soaked for a predetermined time at a set temperature set for each chamber so as to gradually decrease along the one direction, but in a state where the substrate is sent out and the heating chamber is empty, A gas having a temperature lower than the set temperature of the heating chamber is supplied by the air supply device. in this way,
Since the cooling process of the heat treatment is performed while sequentially repeating the soaking in a plurality of heating chambers each maintained at the set temperature set for each chamber so as to gradually decrease in the process of being conveyed in one direction, the film Temperature variations in the substrate including the forming material are reduced as much as possible. At this time, a gas having a temperature lower than the set temperature is supplied by the air supply device into the heating chamber in which the substrate is sent out and becomes an empty chamber, so that the output of the heater provided in the heating chamber is equalized to the substrate. Because it can be stabilized in an elevated state than in the heat,
Since the heat treatment is started on the substrates sent into each heating chamber under the temperature control state in the empty chamber, the temperature control becomes unstable by sequentially heat-treating a plurality of substrates higher than the set temperature for each heating chamber. Is suppressed, the time that the substrate sent into the heating chamber is allowed to cool is sufficiently shortened,
Temperature variations in the substrate are further reduced. Therefore, when the substrate is made of glass and is heat-treated at a temperature equal to or higher than the strain point, local changes in dimensions within the substrate, that is, distortion of the formed pattern are reduced as much as possible. The misalignment with the subsequent pattern is prevented, and the production yield is drastically improved even for a fine pattern or a large substrate. In addition, since the temperature variation in the substrate including the film forming material is reduced as much as possible as described above, the thick film dielectric layer, the partition wall dielectric layer, the thick film resistance layer, the electrode In the case where a layer and an inorganic color pigment layer are provided, the degree of melting and softening of the glass functioning as a bond component in the thick film becomes uniform, and the melting and firing of a metal-metal oxide system is performed. The degree of knot becomes uniform,
Variations in withstand voltage quality, height and width dimensions of barrier ribs, resistance values, discharge quality, optical filter characteristics, and the like are suitably reduced, and the production yield is dramatically increased even for large substrates. Further, as described above, as a result of reducing the variation in the resistance value, the management load of the process and the process such as trimming are reduced or the load is reduced.

In the process of intermittently transporting the substrate containing the film-forming material in one direction, heat treatment is sequentially performed in a plurality of heating chambers, so that the substrate containing the film-forming material is continuously transported. Compared to the case where the temperature difference in the substrate including the film forming material is to be extremely reduced by the conventional firing apparatus in which a continuous heat curve is formed by
The overall length is reduced and the device becomes smaller.

[0014]

Preferably, in the firing method according to the first aspect of the present invention, the gas supply step includes supplying the gas at a temperature lower than a set temperature into the predetermined heating chamber. The temperature in a predetermined heating chamber is made lower than the set temperature. With this configuration, after the substrate is sent out of the heating chamber in the unloading step, the temperature in the heating chamber is reduced below the set temperature for each chamber in the gas supply step, and then the temperature is adjusted to match the set temperature. Controlled. Therefore, the heating chamber from which the substrate has been sent out, the temperature is once lowered in a state where no substrate is present in the chamber, then the temperature is raised, and after being controlled again to the set temperature, the next substrate is sent in. In the heating chamber, the heat treatment of each of the plurality of substrates is started under a constant temperature control state, so that the temperature variation in the substrates is further reduced.

Further, in the firing method according to the first aspect,
In the carrying-in step, after the temperature control amount in the predetermined heating chamber is increased in the gas supply step, the other substrate is immediately sent into the predetermined heating chamber. With this configuration, the time during which the heating chamber is vacant for performing the gas supply step is shortened as much as possible, so that the processing efficiency of the substrate is further improved.

Preferably, in the baking apparatus according to the second aspect of the present invention, the transfer devices are provided in parallel with each other such that a longitudinal direction and an axial direction are perpendicular to each other in the tunnel-shaped heating region. The apparatus further includes a plurality of rollers that support the substrate and that are driven to rotate around their axes in order to transport the substrate in the one direction. With this configuration, the substrate including the film-forming material is supported by the plurality of rollers that are driven to rotate around the axis and is transported in the one direction. Since it is easy to control the apparatus for each heating chamber to perform the sending and the feeding independently, compared to the case where the sending and the feeding are performed simultaneously in all the heating chambers, the time during which the heat treatment of the substrate is not performed in the heating chamber. Can be made as short as possible, and the processing efficiency of the substrate can be enhanced. In addition, compared to the case where the belt is conveyed by a mesh belt or the like, there is no sliding of the belt, which causes generation of dust, so that the degree of cleanliness in the heating area is increased, and the substrate is formed in the process of uniformly heat-treating the substrate. The function of the film is prevented from being damaged by the generated dust. In addition, in the case where the feeding and the feeding are simultaneously performed in all the heating chambers, in order to make the heating chamber to which the substrates are sent out empty once, the substrates must be transported every other chamber, and high processing efficiency is obtained. It cannot be done.

Further, in the firing apparatus according to the second invention,
The air supply device includes an air supply pipe provided at an upstream end of the substrate in the transport direction in order to supply a gas having a temperature lower than the set temperature to each of the plurality of heating chambers. With this configuration, since the low-temperature gas flows from the upstream end in the transport direction, which is the high-temperature side, toward the downstream in the transport direction, which is the low-temperature side, the occurrence of the temperature gradient in the heating chamber is further suppressed. In addition, variations in temperature within the substrate are further suppressed.

In the case where the transfer device of the baking apparatus according to the second invention includes a plurality of rollers for supporting and transferring the substrate, the plurality of rollers are made of ceramics. In this case, since the roller to be brought into contact with the substrate is made of ceramics,
Since the generation of dust and the like due to heating and heating of the roller in the heating region is suppressed, the cleanliness in the heating region is further enhanced.

Preferably, when the substrate contains a glass material, the substrate passes through a transition point or a strain point of the glass material while maintaining a uniform temperature state in the substrate. When the contained film forming material is fixed by melting or sintering of a metal or inorganic material, the melting point or the sintering point of the film forming material is passed through the substrate while maintaining a uniform temperature state. The set temperature for each room is
Set to a value near the transition point or strain point of the glass material contained in the substrate, or set to a value near the melting point or sintering point of the metal or inorganic material contained in the film forming material on the substrate. You.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

FIG. 1, FIG. 2, and FIG. 3 show the structure of a continuous baking apparatus 116 of a type in which baking is performed in the process of sequentially transporting a substrate 62 in one direction according to an embodiment of the present invention. 2 is a front view, FIG. 2 is a cross-sectional view along the longitudinal direction passing through the center of the furnace body in the width direction, and FIGS.
It is a figure which shows the cross section from ee to ee, respectively. In the figure, a first transport device 118 driven independently and a plurality of second
The transfer devices 120a, 120b, to 120f (hereinafter, simply referred to as a second transfer device 120 when not particularly distinguished) and a third transfer device 122 are arranged in series, and the substrate 62
Are the first transport device 118, the second transport device 120,
By being transported in one direction by the third transport device 122, it can be passed through tunnel-shaped furnace bodies 124 a, 124 b (hereinafter, simply referred to as the furnace body 124 unless otherwise distinguished).

The tunnel-shaped furnace body 124 has an inner wall made of, for example, heat-resistant glass such as β-spodumene crystallized glass. The substrate 6 is placed in the furnace body 124a.
2 is heated to the maximum processing temperature, and in the process, the substrate 6 is heated.
Preheating zone (preheating unit) 126 for burning and removing the binder (resin) contained in the film printed and formed on 2
And a heating zone (heating unit) 128 for holding the substrate 62 at the highest processing temperature for a predetermined time, and a slow cooling zone (slow cooling unit) 130 for gradually cooling the substrate 62. A cooling zone (cooling section) 132 for cooling the substrate 62 to around room temperature is provided in the furnace body 124b.

The first transfer device 118 is provided at a position corresponding to the preheating zone 126 and the heating zone 128. The first transfer device 118 includes a furnace body 124a
The rotation of the motor 134 equipped with a speed reducer, which is provided below and continuously driven, is controlled by the chain 136 and a plurality of line shafts 138a, 138b provided on one axis.
Through 138e (hereinafter, simply referred to as a line shaft 138 unless otherwise specified) at predetermined intervals along the longitudinal direction of the furnace body 124a.
0a, 140b, to 140f (hereinafter simply referred to as a miter gear 140 unless otherwise specified), and the drive sections 12 respectively assigned by the miter gear 140
7a, 127b, 127c, 127d (hereinafter simply referred to as drive section 127 unless otherwise distinguished), drive section 1
29a and 129b (hereinafter simply referred to as a drive section 129 unless otherwise distinguished) as shown in FIG.
By rotating the roller 166 provided in the inside 24a, the substrate 62 placed on the roller 166 is continuously transported at a predetermined first transport speed of, for example, about 300 (mm / min). is there.

FIG. 4 is an enlarged view showing the essential parts of the first transporting device 118 and the second transporting device 120 arranged vertically, with the intermediate portion omitted, and the driving section 12 shown in FIG.
Parts corresponding to 7a, 129b, and 131b are shown in the upper, middle, and lower rows, respectively. Drive section 12
Miter gear 140 of the first transporting device 118 corresponding to 7a
a includes a driving shaft 142a whose axial direction is provided along the longitudinal direction of the furnace body 124, and a driven shaft 144a whose axial direction is perpendicular to the longitudinal direction of the furnace body 124 (perpendicular to the paper). Have been. The rotation of the motor 134 is transmitted to the miter gear 140a by the chain 136, and the driving shaft 142a
Is rotated in the direction of the arrow, its driving shaft 142a
The line shaft 138a connected to the drive shaft 142 via the coupling 146 is rotated in the same direction as the driving shaft 142a, and the driven shaft 144a is rotated, for example, in the direction of the arrow in the drawing.

On the other hand, the miter gear 140f corresponding to the drive section 129b shown in the middle part of FIG.
Miter gear 1 provided at the right end of transport device 118
In 40f, one end of a driving shaft 142f is connected to a line shaft 138e via a one-way coupling 148. A motor 150 with a speed reducer is provided at the other end of the driving shaft 142f, and is connected to the other end via a one-way coupling 152. These one-way couplings 148 and 152 transmit only the rotation of the line shaft 138e and the motor 150 in the direction of the arrow in the drawing to the miter gear 140f, respectively.
, And is intermittently driven at a higher rotation speed than the line shaft 138. Therefore, while the motor 150 is stopped, the rotation of the line shaft 138e is transmitted to the driving shaft 142f via the one-way coupling 148, and the one-way coupling 152 is slid, while the motor 15
During the zero drive, the rotation is transmitted to the driving shaft 142f via the one-way coupling 152, and the one-way coupling 148 is slid. Therefore, while the motor 150 is being driven, the rollers 1 in the drive section 129b are not driven.
The substrate 62 on the substrate 66 is moved at the first transfer speed (for example, 300
For example, it is transported at a second transport speed of about 5000 (mm / min), which is faster than [mm / min]. In the drive sections 127b, 127c, to 129a, which are omitted, the line shafts 138a, 138b, to 138e have the coupling 1
The drive shafts 142 of the miter gears 140b, 140c, to 140e are connected to the drive shafts 142 through couplings (not shown) similar to the drive shafts 46, and the driven shafts 144 provided in the drive shafts 142 are rotated with the rotation of the drive shafts 142. .

Below the plurality of miter gears 140, a plurality of rotating shafts arranged along the longitudinal direction of the furnace body 124 in parallel with each other so that the axial direction is perpendicular and horizontal to the longitudinal direction of the furnace body 124. 154 are provided respectively. For this reason, the first transport device 118 has a large number of rotating shafts 15 along the longitudinal direction of the furnace body 124 over its entire length.
4 are provided. The rotating shaft 154 is
4 rotation, eg chain (or timing belt)
By being transmitted by 156, each is rotated in the direction indicated by the arrow in the figure. For this reason, when the motor 134 is driven, the rotating shafts 1 of a large number of the first transporting devices 118 arranged along the longitudinal direction of the furnace body 124
When the motor 150 is driven, the rotation is transmitted to the miter gear 140f, and the one-way coupling 148 substantially connects the line shaft 138e. The rotary shaft 154 provided below the miter gear 140f, that is, the heating zone 128
Drive section 129b adjacent to slow cooling zone 130
Is rotated at a speed similar to that of the slow cooling zone 130, which is faster than the rotation shafts 154 belonging to the other drive sections 127 and 129a in the first transport device 118. Therefore, in this embodiment, the drive section 129b driven by the miter gear 140f corresponds to an adjacent area where the transfer speed of the substrate 62 can be changed, and the motor 1
The speed changing device is constituted by 50 and the one-way couplings 148 and 152.

Further, the plurality of second transfer devices 120 are provided in FIG.
As shown for the drive section 131b in the lower part, the motor 15 with the speed reducer
8a, 158b,... 158f (hereinafter, simply referred to as a motor 158 unless otherwise specified), and below the motor 158, as in the case of the first transfer device 118, perpendicular to the longitudinal direction of the furnace body 124. Further, a plurality of rotation shafts 154 provided in the horizontal direction are provided. The rotation shaft 154 is rotated in the same direction by transmitting the rotation of the output shaft 160 of the motor 158 by the chain 156. That is, the plurality of second transfer devices 1
Numeral 20 includes motors 158 that are independently driven in place of the miter gear 140 to which the rotation of the motor 134 is transmitted in the first transfer device 118. The motor 158 is not only driven forward in the forward direction indicated by the arrow in the drawing, but also reversely driven to rotate alternately in the forward and reverse directions. Roller 1 connected to rotating shaft 154 during driving
66 is rotated so as to obtain the above-described second transport speed (for example, about 5000 [mm / min]), while the third transport speed of about 1300 (mm / min), which is slower during reverse driving, for example. Then, the roller 166 is rotated in the normal rotation direction and the reverse rotation direction so that the substrate 62 is reciprocated in the transport direction and the opposite direction.

As is apparent from FIG. 1, the third transfer device 122 has a configuration in which the number of miter gears 140 is reduced in the first transfer device 118 and the longitudinal direction of the furnace body 124 is inverted. . That is, the drive section 129
Drive section 133a, drive section 127b having the same configuration as that of section b.
Drive section 133b and drive section 1 having the same configuration as the above.
The driving section 133c has the same configuration as that of the driving section 133a. Therefore, the rotation of the motor with reduction gear 162 provided below the furnace body 124b is rotated by the miter gear 14 via the chain 163, the line shafts 138g, and 138f.
0i, 140h, and 140g, and the rotation shaft 154 provided in each drive section 133 is rotated. In the drive section 133a adjacent to the slow cooling zone 130, similarly to the drive section 129b, the rotation of the motor 164 with the speed reducer is transmitted via the one-way coupling, so that the rotation shaft 154 belonging thereto is intermittently driven. It is driven at a speed faster than the other rotation shafts 154, that is, at a speed synchronized with the second transport device 120. Therefore, in the cooling zone 132, the drive section 133a driven by the miter gear 140g also corresponds to an adjacent area where the transfer speed of the substrate 62 can be changed.

Returning to FIG. 2, a plurality of, for example, alumina rollers 166 are provided in the furnace body 124, as shown in FIGS.
As shown in aa to ee cross sections in FIG.
Both ends are provided so as to protrude from the side surface of the furnace body 124. A pair of bearings 167 are provided on the outer side of the furnace body 124,
167 (shown only in FIG. 3 (a)) is provided, and the rotating shaft 154 is supported coaxially with the roller 166. The rollers 166 are provided so as to be sandwiched between the pair of rotating shafts 154 from both sides. The rollers 166 are rotated with the rotation of the rotating shafts 154 transmitted through the chain 154. . Incidentally, FIG. 3 (a) is a view corresponding to a-a sectional view in FIG. 2, a ₂ -a ₂ sectional view is the same cross-sectional shape. The substrate 62 is supported by the rollers 166 in the furnace body 124. Therefore, the roller 16
When the roller 6 is rotated, it is conveyed in one direction with the rotation. At this time, the preheating zone 12 in which the first transfer device 118 and the third transfer device 122 are provided.
6. In the heating zone 128 and the cooling zone 132, the roller 166 is continuously rotated to continuously transport the substrate 62, while in the slow cooling zone 130 in which the second transporting device 120 is provided, the roller 166 is rotated. Are rotated intermittently, and the substrate 62 is intermittently transported. That is, in the present embodiment, the first transport device 11
8 and the third transfer device 122 correspond to a continuous transfer device,
The second transport device 120 corresponds to an intermittent transport device.

As is clear from FIGS. 1, 2 and 3, FIG.
In addition, the preheating zone 126 includes
A plurality of temperature detectors TC for detecting the temperature of
At three positions in the width direction at the center in the longitudinal direction for each drive section 127
At the top and bottom of the furnace body 124 and
And multiple zones below and independently for each zone
The heaters H controlled in the respective driving sections 127
4 zones each in the longitudinal and width directions of the furnace body 124
Are provided. That is, FIGS.
Although a part is omitted in FIG. 5, the driving section 1 is shown in FIG.
27a, each drive section 127
The feed direction A of the substrate 62 and the diagram orthogonal thereto
The roller 166 is divided into four parts each in the longitudinal direction.
A total of 16 heaters H₁₁₁₁, H₁₁₁₂, H₁₁₁₃, H₁₁₁₄, H
₁₁₂₁, H₁₁₂₂, H₁₁₂₃, H₁₁₂₄, H₁₁₃₁, H₁₁₃₂, H
₁₁₃₃, H₁₁₃₄, H₁₁₄₁, H₁₁₄₂, H₁₁₄₃, H₁₁₄₄(Drive
H is assigned to each of the sections 127b, 127c, and 127d.₁₂₁₁
~ H₁₂₄₄, H₁₃₁₁~ H₁₃₄₄, H₁₄₁₁~ H₁₄₄₄Is provided
Are provided as a pair above and below the furnace body 124, respectively.
And heater H₁₁₂₁And H₁₁₃₁Between heaters, heater H₁₁₂₂,
H₁₁₂₃, H₁₁₃₂, And H₁₁₃₃Between heaters, heater H
₁₁₂₄And H₁₁₃₄Between the temperature detectors T
C ₁₁₁, TC₁₁₂, TC₁₁₃(Drive section 127b, 12
TCs for 7c and 127d respectively₁₂₁~ TC_{one two Three}, TC
₁₃₁~ TC₁₃₃, TC₁₄₁~ TC₁₄₃) Is arranged
You. FIG. 2 shows an example of a part above the drive section 127a.
So that each temperature detector TC and heater H are controlled.
Connected to the control device 168 and detected by the temperature detector TC
The output of the heater H is controlled according to the temperature signal given.

The preheating zone 126 includes a furnace body 124.
At the upper part of the inlet of the drive section 127a on the inlet side of the
Are provided, and the following drive sections 127b, 127
c, 127d, the exhaust pipe 17
2 are provided. The air supply pipe 170 and the exhaust pipe 172 are made of, for example, the same alumina ceramic as the roller 166 and are provided so as to penetrate in the width direction of the furnace body 124. The air supply pipe 170 is connected to an air supply pipe 174 provided on the side surface of the furnace body 124 at both ends thereof, and supplies air guided from an air supply source (not shown) into the furnace body 124. Also, exhaust pipe 1
Numerals 72 are connected to exhaust pipes 176 provided on the sides of the furnace body 124 at both ends thereof.
The air supplied to the inside is sucked in from the plurality of exhaust pipes 172 in the process of flowing through the inside, and is discharged from the outlet 178. As shown in FIGS. 6 (a) and 6 (b), the air supply pipe 170 and the exhaust pipe 172
One or a long hole-shaped nozzle 181 is provided at a plurality of locations.

The heating zone 128 has a heating zone.
Temperature Detectors for Detecting Temperatures in the Temperature Range 128
The TC is applied to the longitudinal direction of the furnace body 124 for each drive section 129.
When it is provided up and down at each of three positions in the width direction
In both cases, a plurality of
And each zone is independently controlled.
Heaters H are provided in the furnace body 12 for each drive section 129.
4 zones in the longitudinal direction, 4 zones in the upper direction on both sides in the width direction
There are six zones each including a zone. That is, the figure
As shown in FIG. 5 (b), the substrate 6
2 feed direction A and rollers (not shown) orthogonal to the feed direction A
A total of 16 sets of 166 divided into four in the longitudinal direction
Heater H₂₁₁₁, H₂₁₁₂, H₂₁₁₃, H₂₁₁₄, H₂₁₂₁, H
₂₁₂₂, H_{twenty one twenty three}, H₂₁₂₄, H₂₁₃₁, H₂₁₃₂, H₂₁₃₃, H
₂₁₃₄, H₂₁₄₁, H₂₁₄₂, H₂₁₄₃, H_{twenty one 44}Of the furnace body 124
The furnace body 12 is provided as a pair at each of the upper and lower sides.
4 in the feed direction A on the upper side on both sides in the width direction.
And divided into four (four) heaters H₂₁₁₅, H₂₁₂₅, H
₂₁₃₅, H₂₁₄₅, H₂₁₁₆, H₂₁₂₆, H₂₁₃₆, H₂₁₄₆(Drive
H in section 129b₂₂₁₁~ H₂₂₄₆) Is a pair on both sides
It is arranged. Also, the heater H₂₁₁₁Of which, H₂₁₁₂And H
₂₁₁₃Between, H₂₁₁₄Of which, H₂₁₂₁And H₂₁₃₁Between
H ₂₁₂₂, H₂₁₂₃, H₂₁₃₂, H₂₁₃₃During, H₂₁₂₄And H₂₁₃₄
Between, H₂₁₄₁Of which, H₂₁₄₂And H₂₁₄₃Between, H₂₁₄₄Inside
Nine sets of temperature detectors TC at each position₂₁₁₁, TC_{twenty one 12},
TC₂₁₁₃, TC₂₁₂₁, TC₂₁₂₂, TC₂₁₂₃, TC₂₁₃₁,
TC₂₁₃₂, TC₂₁₃₃(TC section 129b₂₂₁₁~
TC₂₂₃₃) Are arranged above and below.

The slow cooling zone 130 includes a plurality of shutter devices S ₁ , S ₂ ,..., S _{7 at} equal intervals along the longitudinal direction of the furnace body 124. S), and the slow cooling zone 130 has a plurality of, for example, six, first heating chambers R ₁ , second heating chambers R ₂ , to sixth heating chambers R ₆ (hereinafter particularly distinguished) corresponding to the drive section 131. When not performed, it is simply divided into a heating chamber R).

The shutter device S described above, the cross-sectional structure in FIG. 2, as shown respectively (d-d sectional view in FIG. 2) cross-section through a shutter system S ₂ in FIG. 3 (d), for example, a furnace body 124 A shutter 194 corresponding to a movable dividing wall which can be moved up and down at a position between a partition plate 190 made of a heat-resistant glass plate or the like made of the same material as the inner wall, shutter guides 192, 192, and rollers 166, and a lower part of the furnace body 124 And three small jacks 196 for moving the shutter 194 up and down and
And 198 g to 198 g. As shown in FIG. 2, the partition plate 190 has two heat-resistant glass plates fixed to the upper portion of the furnace body 124 at a small interval corresponding to the thickness of the shutter 194. Further, the shutter guide 192 is provided below the partition plate 190 on the side surface of the furnace body 124 and is disposed at a small interval corresponding to the thickness of the shutter 194 similarly to the partition plate 190, though not shown. And two heat-resistant glass plates. For this reason, the shutter 1 extending from the side surface to the upper surface of the furnace body 124 by the partition plate 190 and the shutter guides 192, 192.
A shutter guide groove having a thickness of 94 is formed. The motors 198a, 198b, to 198g (hereinafter simply referred to as the motor 198 unless otherwise specified) are controlled independently by the control device 168. The shutter 194 is guided in the guide groove formed in the shutter guide 192 up and down by the motor 198 is driven, at its uppermost position, the partition plate as shown for the shutter apparatus S ₁ in FIG. 2 The upper end is fitted into the groove formed in 190. For this reason, each heating chamber R is completely separated from the adjacent heating chamber R while the shutter devices S provided before and after the heating chamber R are closed. Substrate 62 in furnace body 124
Roller 166 is provided in a state in which a gap is provided between the rollers 166, so that the shutter 194 is moved up and down through the gap,
The heating chamber R can be completely separated. The small jack 196 is connected to each other by a drive shaft 200 via a coupling.
98 driven synchronously.

Each drive section 13 of the slow cooling zone 130
1 includes a plurality of temperature detectors TC for controlling the temperature of each heating chamber R controlled by the control device 168 and a plurality of heaters H for heating each heating chamber R, respectively, as shown in FIG. ) (TC ₃₁₁₁ to TC ₃₁₃₃ and H _{3111 to} H _{3146 for} the drive section 131a, and TC _{3211 to} T 311 for the drive section 131b).
C ₃₂₃₃ and H _{3211 to} H ₃₂₄₆ , T
C _{3311 to} TC ₃₃₃₃ and H _{3311 to} H ₃₃₄₆ , drive section 13
1d includes TC ₃₄₁₁ to TC ₃₄₃₃ and H _{3411 to} H ₃₄₄₆ , and drive section 131e includes TC ₃₅₁₁ to TC ₃₅₃₃ and H ₃₅₁₁ to H ₃₅₁₁ .
H ₃₅₄₆ and TC ₃₆₁₁ to TC ₃₆₃₃ and H _{3611 to} H ₃₆₄₆ are provided in the drive section 131f. Further, inside each heating chamber R, an air supply pipe 18 for supplying cooling air from the upper and lower portions to the rear side (upstream side) in the transport direction of the substrate 62.
0 and 180, and an exhaust pipe 182 for discharging the cooling air from the upper part on the front side (downstream side) in the transport direction. The air supply pipe 180 and the exhaust pipe 182 are similar to the air supply pipe 170 and the exhaust pipe 172 provided in the preheating zone 126, respectively, and have a round hole nozzle 171 or a long hole nozzle 181.
Is provided with a tube made of alumina ceramics. In addition, the air supply pipe 180 and the exhaust pipe 182
Are connected to an air supply pipe 184 and an exhaust pipe 186 provided outside the furnace body 124, respectively, and are connected to an air supply source (not shown) from the air supply source (not shown) to the air supply pipe 184 of each heating chamber R. Air supply pipes 185a, 18 provided in
5b, to 185f (only the air supply pipe 185a is shown; hereinafter, when not particularly distinguished, simply referred to as the air supply pipe 185), the cooling air is guided, and the air in each heating chamber R sucked from the exhaust pipe 182 is removed. It is discharged from the discharge port 188. Each air supply pipe 185 has a solenoid valve 208a, 208
b, to 208f (only the solenoid valve 208a is shown; hereinafter, simply referred to as the solenoid valve 208 unless otherwise specified), and the controller 168 starts and stops the supply of air into the heating chamber R and supplies the same. The volume is adjusted.
Therefore, in the present embodiment, an air supply device is configured by the air supply pipe 180, the air supply pipe 184, the air supply pipe 185, and the solenoid valve 208. In the figure, the air supply pipes 184 and 184 provided above and below the heating chamber R are connected to a common air supply pipe 185, but are connected to separate air supply pipes 185 each having an electromagnetic valve 208. It may be controlled independently.

The cooling zone 132 has a temperature detector TC for detecting the temperature in the cooling zone 132.
₄₁ , TC ₄₂ , and T ₄₃ are provided on the upper side at the center position in the width direction of the longitudinal center of the furnace body 124 for each drive section 133, and the length substantially equal to the width dimension is provided on the upper and lower sides of the furnace body 124. A plurality of cooling jackets C are provided for each drive section 133 in three rows in the longitudinal direction of the furnace body 124. The cooling jacket C allows the cooling water supplied from the cooling water pipe 202 shown in FIG. 1 through the branch pipe 204 to flow therein. The upper and lower three cooling jackets C are connected to each other, and the cooling water sequentially circulated through the three cooling jackets C is provided on the opposite side surface shown in FIG. Not drained from drains. The flow rate of the cooling water supplied to the cooling jacket C is controlled by solenoid valves 206 a and 206 provided in the branch pipe 204 for each drive section 133.
b, 206c. This cooling zone 13
2 provided with a temperature detector TC and a solenoid valve 206
Is also connected to the control device 168, and controls the amount of cooling water flowing through the cooling jacket C based on the temperature signal detected by the temperature detector TC.

FIG. 7 is a diagram showing the structure of the control device 168. Drive section 12 of preheating zone 126, heating zone 128, slow cooling zone 130, and cooling zone 132
7, 129, 131, and 133 (or the heating chamber R), the temperature detected by the temperature detectors TC ₁₁₁ , TC ₁₁₂ , and TC ₄₃ for detecting the temperature inside the furnace body 124 provided by a predetermined number. Each of the signals shown is time-divided at a predetermined cycle by the multiplexer 68, and is converted into a digital signal by the A / D converter 70, and then input to the arithmetic and control circuit 72. The arithmetic control circuit 72 is configured by, for example, a microcomputer, processes input signals in accordance with a program stored in advance in a ROM while utilizing a temporary storage function of a RAM, and outputs a motor drive circuit MD via an output interface 74. a signal for the first transfer device 118 continuously driven to _1, the signal for driving the driving segment 127b of the first transfer device 118 to the motor driving circuit MD ₂ in synchronism with the driving speed of the second conveying unit 120 And each heater drive circuit D ₁₁₁₁ ,
D _1112, to to D _3646, a heater H _1111, H _1112, ~H ₃₆₄₆
Supplying a signal for driving the, also, the motor driving circuit MD _31, MD _32, the second transfer device 120a to to MD _36,
A signal for intermittently driving the shutter driving motors 120b and 120f, and a signal for driving the shutter driving motors 198a, 198b and 198g to the motor driving circuits MD _S1 , MD _S2 and MD _S7 , A signal for continuously driving the third transport device 122 to the motor drive circuit MD _41, and a drive section 133 a of the third transport device 122 to the motor drive circuit MD ₄₂ in synchronization with the drive speed of the second transport device 120. And a solenoid valve driving circuit SD ₁ , SD ₂ , SD ₃ , SD _a1 , S
D _a2 , to SD _a6 to solenoid valves 206a, 206b, 206
c, 208a, 208b, to 208f.

The above heaters H₁₁₁₁, H₁₁₁₂, ~
H₂₂₄₆In the preheating zone 126 and the heating zone 128
The temperature of the furnace body 124 is uniform in the width direction and the longitudinal direction
A predetermined temperature gradient is formed in the (transfer direction of the substrate 62)
And the heater H₃₁₁₁, H₃₁₁₂, ~ H₃₆₄₆Is the Xu
The temperature in each heating chamber R of the cooling zone 130 is set in advance.
Each is set in advance to be equal at the specified temperature.
In accordance with the target temperature ratio of each part
Is being controlled. For example, the width of the furnace body 124
Heater H located at the center₁₁₁₂, H₁₁₁₃, H₁₁₂₂, H
₁₁₂₃, ~ H₃₆₄₂Compared to the heater located at the end in the width direction.
TA H₁₁₁₁, H₁₁₁₄, H₁₁₂₁, H₁₁₂₄, ~ H ₃₆₄₄Output
Enhanced. Further, the temperature is low in the longitudinal direction of the furnace body 124.
Side (the drive zone of the preheating zone 126 and the heating zone 128)
In the portion 129a, the rear side in the transport direction of the substrate 62 is heated.
Drive section 129b of zone 128 and slow cooling zone 13
0, the heater located on the front side in the transport direction)
H₁₁₁₁, H₁₁₁₂, H₁₁₁₃, H₁₁₁₄, H₁₂₁₁, H₁₂₁₂, H
₁₂₁₃, H₁₂₁₄, ~ H₂₁₁₆, And H₂₂₄₁, H₂₂₄₂, H
₂₂₄₃, H₂₂₄₄, H₂₂₄₅, H₂₂₄₆, H₃₁₄₁, H₃₁₄₂, H
₃₁₄₃, H₃₁₄₄, H₃₁₄₅, H₃₁₄₆, ~ H₃₆₄₆Is for each zone
High temperature side of 126, 128, 130 (opposite side above)
Heater H located at₁₁₄₁, H₁₁₄₂, H₁₁₄₃, H₁₁₄₄, H
₁₂₄₁, H₁₂₄₂, H₁₂₄₃, H ₁₂₄₄, ~ H₂₁₄₆, And H
₂₂₁₁, H₂₂₁₂, H₂₂₁₃, H₂₂₁₄, H₂₂₁₅, H₂₂₁₆, H
₃₁₁₁, H₃₁₁₂, H₃₁₁₃, H₃₁₁₄, H₃₁₁₅, H₃₁₁₆, ~ H
₃₆₁₆The output is increased as compared with.

FIGS. 8 and 9 show a continuous firing apparatus 116.
When the substrate 62 including the film forming material is baked using the method, the position of each substrate 62 and the time t _{0 in} FIG.
6 is a timing chart showing a temperature rise / fall curve of the substrate 62 carried into the storage device. In FIG. 8, the dashed line indicates the boundary of each drive section 127 and the like, and is equal to the boundary of each heating chamber R in the slow cooling zone 130 as shown in the figure. That is, the vertical axis indicates the longitudinal direction (the substrate 6) in the furnace body 124.
2 transport direction). A plurality of real curves drawn upward to the right each correspond to the movement of each substrate 62, and the magnitude of the inclination represents the speed of the transport speed. Hereinafter, a method of firing the substrate 62 will be described with reference to these timing charts.

First, at time t ₀ , the unfired substrate 6
2 according to the loading direction shown in FIG.
Are carried in from the drive section 127 side. At this time, the shutter devices S provided in the slow cooling zone 130 are all closed, the respective heating chambers R are separated from each other, and the temperature of the substrate 62 is raised and lowered by the temperature curve shown in FIG. As such, each zone 126, 128 of the furnace body 124,
The heater H provided in 130 is driven by feedback control to heat the inside of the furnace body 124, and the electromagnetic valve 206 provided in the cooling zone 132 is driven to flow cooling water through the cooling jacket C. Each part of each zone is maintained at a preset target temperature. In addition, the motor 134 and the motor 162 are driven, and the rollers 166 in the first transport device 118 and the third transport device 122 are rotated clockwise in FIG. Thus, the loaded substrate 62 is transported toward the heating zone 128 at a predetermined first transport speed.

[0041] Then, at time t ₁ has elapsed from the time t _0, for example, 300 seconds to a predetermined time, the next substrate 62 is carried into the preheating zone 126, at time t ₂ has elapsed further predetermined time of about 300 seconds Then, the next substrate 62 is carried into the preheating zone 126. That is, preheating zone 1
The substrates 62 are sequentially carried into the substrate 26 at predetermined intervals of, for example, about 300 seconds. The substrate 62 thus sequentially loaded
Is transported to the end of the preheating zone 126 while being supported by the roller 166 being driven in rotation,
For example, the temperature is raised to a predetermined maximum firing temperature MT of about 500 (° C.) in about 1100 seconds, for example. T in FIGS. 8 and 9
Time point ₃ shows this state. In the present embodiment, the step of raising the temperature to the maximum firing temperature MT corresponds to a temperature raising step (or a preheating step).

In the subsequent heating zone 128, the substrate 6
2 is continuously conveyed from the preheating zone 126 by the first conveying device 118 while being kept at the maximum firing temperature MT. However, the transport speed in the heating zone 128 is initially the first transport speed as in the preheating zone 126,
When the board 62 completely enters the drive section 129b, the motor 1
By driving 50, the speed is increased to the second transport speed. At this time, the heating zone 128 and the slow cooling zone 130
To the shutter device S ₁ is provided is opened, the second transfer device 120a a predetermined second transport speed to drive the roller 166 in the heating chamber R ₁ (i.e. the same transport and driving segment 129b between the Speed). Therefore, the substrate 62 is moved from the heating zone 128 to the slow cooling zone 130.
It is conveyed rapidly to the heating chamber R ₁ or heating chamber R ₁ held first to soaking temperature KT _1. t ₄ time shows this state. In the present embodiment, until it is carried into the heating chamber R ₁ from reaching the maximum firing temperature MT,
That is, the step of heating while being conveyed in the heating zone 128 corresponds to the heating step, and the heating time (so-called keep time) is, for example, about 400 seconds. Substrate 62 which is carried into the annealing zone 130 in this way, a predetermined temperature (i.e. soaking temperature of the first to sixth) previously set in the heating chamber _{R KT 1, KT 2, ~KT} 6 The temperature is maintained for a predetermined time, the temperature is uniformed, and the process of rapidly transporting the heat to the heating chamber R is repeated, while the temperature is gradually cooled according to a stepwise temperature-falling curve shown in FIG. The first soaking temperature KT ₁ is a temperature lower than the highest firing temperature MT by a predetermined value ΔKT of several (° C.) to several tens (° C.), and the second soaking temperature KT ₂ and the third The soaking temperature KT ₃ to the sixth soaking temperature KT ₆ are temperatures further lowered by a predetermined value ΔKT, respectively.

For example, the temperature rise curve shown in FIG.
The cooling condition in a predetermined cooling period following the maximum firing temperature MT of about 500 (° C.) or more is an important factor in heat treatment of the substrate 62 including the film forming material. For example, VFD (fluorescent display tube), PDP (plasma display panel),
PALC (Plasma Addressed Liquid Crystal Display), FED
When used for (field emission display), if the substrate 62 is made of glass having a low strain point represented by soda lime glass, the temperature in the substrate 62 becomes uneven and the cooling rates of the respective parts differ from each other. This causes local changes in the dimensions of the cell, making it difficult to align the multilayer thick-film printing, or combining a large number of cells by combining the thick-film printing surfaces of the front and rear plates. When used in a PDP or FED for forming a semiconductor device, a portion where a cell cannot be formed is generated due to a shift between the two. For example, as the size becomes larger, such as 40 inches, the manufacturing yield is reduced at an accelerated rate. FIG. 10 shows a dimension (solid line) of the substrate 62 in the conventional firing method in which the cooling rate at the front end side in the transport direction is higher than the cooling rate at the rear end side in the transport direction.
Is shown in comparison with the dimension before sintering (dashed line). Further, when a large number of thick-film printed resistors and thick-film bonding pads are provided on the substrate 62, the temperature inside the substrate 62 becomes non-uniform and the cooling rates of the respective parts are different from each other. Then, depending on the degree of melting and softening of the glass component contained as a binder in the thick film layer having a function,
Since the resistance and bonding suitability depend on the degree of melting and sintering of the metal and inorganic material particles contained in the thick film, the manufacturing yield increases as the size of the substrate 62 increases due to variations in the resistance and bonding suitability of the printed resistor. Is acceleratedly reduced. Furthermore, even when a rib wall having a predetermined height is formed on the substrate 62 by laminating the dielectric layers by the thick film printing, the temperature in the substrate 62 becomes uneven and the cooling rates of the respective parts are different from each other. The firing shrinkage, that is, the thickness and width of the thick film are affected by the degree of melting and softening of the glass component contained in the thick film.
As the size becomes larger, the manufacturing yield decreases at an accelerated rate.

FIG. 11 is a flowchart showing a main part of the operation of the arithmetic and control circuit 72, for example, the control of the transfer of the substrate 62 in the slow cooling zone 130 and the like. The substrate 62 carried into the slow cooling zone 130, that is, the heating chamber R, is transported while being soaked in accordance with this flowchart for each heating chamber R. First, in step S1, it is determined whether the preparation for carrying out the substrate 62 has been completed in the rear drive section. Here, the "rear-side driving classification", the drive segment 131a which means driving sections adjacent each heating zone 128 side with respect to the heating chamber R of (upstream), for example, corresponds to the heating chamber R ₁ drive segment driving segment 129b in the heating zone 128 corresponds to the heating chamber R ₂ 131
The drive section 131a corresponds to b. Therefore, the preparation for carrying out the rear drive section is, for example,
In the heating chamber R _1, the drive partitioned as described above 129b
Completed with the substrate 62 has entered completely within, at the heating chamber R _2, completed with a possible soaking or first soaking step for a predetermined time in the heating chamber R ₁ is completed.

If the determination in step S1 is affirmative,
In steps S2 and S3, the rear shutter device S is opened. As is apparent from the definition of "rear side" of the above, for example, a shutter device S ₁ is equivalent to the rear side shutter device S in the heating chamber R _1, the heating chamber R ₂ in which the shutter unit S ₂ Equivalent to. T ₅ point shows this state as shown in FIG. 12 of an enlarged main portion of FIG. Then, when the rear shutter device S is opened, the motor 158 in the heating chamber R is transported and driven in synchronization with the rear driving section in step S4 corresponding to the carry-in process, whereby the substrate 62 is moved to the heating chamber R. It is carried in. For example, in the heating chamber R _1, together with the conveying speed of the drive segment 129b by the motor 150 is driven is increased to the second transport speed, the transport speed of the second conveying device 120a corresponding to the heating chamber R ₁ The motor 158a is driven to rotate forward so as to have the second transport speed, that is, the transport speed similar to that of the drive section 129b. In the heating chamber R _2, second transfer device 120a, 120b of the motor 158
a and 158b are both driven to rotate forward so as to obtain the second transport speed. As a result, the two driving sections corresponding to the heating chamber R into which the substrate 62 is carried out and carried in have the same transport speed, and the substrate 62 and the rollers 166 are not slid at all, so that the inside of the heating chamber R is not moved. The substrate 62 is promptly carried in.

When the substrate 62 is loaded into the heating chamber R as described above, it is determined in step S5 that the loading of the substrate is completed, and the motors of the two drive sections are stopped in step S6. Substrate 62 for example in the heating chamber R ₁
While but when it is carried, the substrate 62 is stopped in its heating chamber R ₁ by the motor 158a is stopped,
By stopping the motor 150, the transport speed of the drive section 129b of the heating zone 128 is returned to the first transport speed. Then, the opened rear shutter S is closed in steps S7 and S8, and a timer (not shown) provided in the control device 168 is reset and operated in step S9. T ₆ time in FIG. 12 shows this state. The time from when the rear shutter device S is opened to when it is closed, that is, the time required for transporting the substrate 62 is, for example, about 30 seconds. As a result, the heating chamber R is separated from the adjacent heating chamber R and the like to form a closed space. Therefore, the thermal influence from the adjacent heating chamber R or the like is cut off, and the substrate 62 carried into the heating chamber R is heated to a predetermined soaking temperature KT _n (n = 1 to 6).

In the soaking process, in step S10, the motor 15 of the second transfer device 120 in the drive section 131 corresponding to the heating chamber R into which the substrate 62 has been loaded.
8 is driven in reverse. As a result, the roller 166 in the heating chamber R is synchronously and periodically inverted and driven, and the substrate 62 is moved within the heating chamber R by a predetermined range as shown by a broken line in FIG. Is reciprocated back and forth in the transport direction along the surface at the third transport speed.
Therefore, in the present embodiment, the reciprocating device is constituted by the plurality of second transporting devices 120 (reciprocating device) and the control device 168 (reciprocating device) for reversing the motor 158 provided in each of the second conveying devices 120 (reciprocating device). I have.
This reciprocating movement is continued until the unloading of the substrate 62 is started in a later step. That is, in the present embodiment, the reciprocating movement process is performed over the entire period during the execution of the soaking process. Therefore, during the soaking process in each heating chamber R, the heating effect is dispersed by changing the relative position between the heater H and the substrate 62, or the temperature of each part of the substrate 62 is reduced to the atmosphere near the surface. Are further uniformized by the mutual interference through the heater H, and the temperature variation due to the amount of heat supplied from the heater H and the difference in the heat capacity of each part is suppressed. Moreover, the reciprocating stroke r (= 2 × r / 2) is set larger than the diameter d of the roller 166. For this reason, since a specific portion of the substrate 62 is not constantly positioned on the roller 166, a thermal imbalance due to heat conduction between the substrate 62 and the roller 166 and a roller 166 on the rear surface of the substrate 62. Is prevented from being heated by the heater H provided on the lower side of the roller 166, thereby suppressing the occurrence of thermal imbalance. Therefore, the temperature distribution in the substrate 62 becomes more uniform in the soaking process.

In step S11 following step S10, it is determined whether a predetermined time has elapsed since the timer was operated in step S9. The predetermined time is a time required for surely equalizing the temperature of the entire surface of the substrate 62 at the temperature set for each heating chamber R, and is, for example, about 180 seconds. Initially, the determination in step S11 is denied, so the reversal drive of the motor 158 is continued. However, if the determination is affirmed, the process proceeds to steps S12 and S13 to open the front shutter device S. The front-side shutter device S includes a cooling zone 132 in each heating chamber R.
This is the shutter device S located on the side. T ₇ point of Figure 12 shows this state.

If it is determined in step S13 that the front shutter device S has been opened, the flow proceeds to step S14 corresponding to the unloading step, where the motor 158 of the second transport device 120 is transported in synchronization with the front drive section. Driven. The "front-side driving segment", as opposed to the posterior side drive segment, each cooling zone 132 side with respect to the heating chamber R of means driving segment that is adjacent to (downstream side), for example in the heating chamber R ₁ The heating chamber R ₂ for the corresponding drive section 131a
Corresponding drive segment 131b to the drive segment 131c corresponding to the heating chamber R ₃ for driving segment 131b is further driven classification 133a of the cooling zone 132 for driving segment 131f corresponding to the heating chamber R ₆ Corresponds to this. As a result, the substrate 62 is transferred to the next heating chamber R at the second transfer speed. When the unloading of the substrate 62 is completed, the determination in step S15 is affirmed, and the process proceeds to step S16, where the motor 158 of the drive section 131 corresponding to each heating chamber R is stopped together with the motor of the front drive section,
Further, in steps S17 and S18, the front shutter device S is closed. T ₈ point in FIG. 12 shows this state. The time required for unloading the substrate 62, that is, the time from when the front shutter device S is opened to when it is closed again is, for example, about 30 seconds as in the case of loading.

In step S19 following step S18,
In addition, not shown provided in the control device 168.
The timer is reset and activated. And gas
In step S20 corresponding to the supply step, the heating chamber R
The solenoid valve 208 is opened in a state where the substrate 62 does not exist inside.
As a result, the rear side (in the transport direction)
Gas from the upstream side) lower than the set temperature KT
Some cooling air is supplied by the air supply pipe 180,
It is discharged from the front side by an exhaust pipe 182. This supply and discharge
Is continued for a predetermined time, for example, about several seconds to several tens of seconds.
You. As a result, the substrate 62 is unloaded and heated.
The temperature in the chamber R tends to fall below the set temperature, and
The output of the motor H, that is, the temperature control amount is increased. That
Time t ₉In step S21, a predetermined time has elapsed.
It is determined that the air supply and exhaust are stopped in step S22.
After that, the temperature in the heating chamber R, which was once apt to decrease,
Maintain good soaking condition by feedback control.
Control is again performed at a predetermined set temperature. And step
Returning to S1, the feedback control is executed or
Is driven at the rear side while maintaining the set temperature.
Wait for completion of preparation for unloading substrate 62 from section
You. T in FIG._TenThe point in time is when the wait is over,
After the step has been completed, the judgment of step S1
Indicates a positive state. That is, in this embodiment,
The substrate 62 is unloaded from the heating chamber R and the heating chamber
The transfer of the substrate 62 into the R is performed with a time lag.
Therefore, the heating chamber R is emptied every time one substrate 62 is heat-treated.
It will be in a room state. Therefore, the substrate 62 is unloaded.
Time t since_TenThe rear shutter device S is opened at
Until the heating chamber R is empty,
That is, under the same conditions as before the substrate 62 is first loaded.
The temperature control state in which the heater H is maintained at a predetermined output value
Temperature control in such an empty state.
The next substrate 62 is added under the constant temperature control state where
It is carried into the heat chamber R. Therefore, in this embodiment,
Is a cycle from step S22 in which the supply and exhaust are stopped.
Step S1 in the heating chamber R, which has once been on a downward trend
Is controlled so as to be equal to a predetermined set temperature KT.
It corresponds to the temperature control process, but in reality, the temperature control is
While the substrate 62 is heat-treated while being transported intermittently,
Has been implemented. Further, the front shutter device S is closed.
After the shutter is opened until the rear shutter device S is opened
Between (t ₈~ T_Ten) Stabilizes the temperature control state in the heating chamber R
Corresponding to a stable period, for example, about 30 seconds
is there. That is, when the temperature control is stable, the next substrate 6
2 is sent quickly, so the stable period is longer than the soaking period.
Since they are sufficiently short, they are shown in FIGS.
As shown in FIG.
They are executed with a time lag from each other. Also, the rear shutter
After the device S is opened, the shutter device S on the rear side is opened again.
Until the heating chamber R is opened, it is one cycle of each heating chamber R.
This time is between the loading of the substrate 62 into the preheating zone 126.
Interval (t₀~ T ₁, T₁~ T_Two), That is,
It is about 300 seconds.

Incidentally, when the substrate 62 that has been soaked in the heating chamber R is carried out of the heating chamber R, the shutter device S
It is expected that the temperature distribution in the heating chamber R will be slightly disturbed with the opening and closing of. For this reason, if the next substrate 62 is carried into the heating chamber R as it is, the heat treatment is started in a state in which the temperature distribution is slightly disturbed. It is difficult to remove. Therefore, the substrate 62 may be subjected to the heat treatment while maintaining the state where the temperature distribution in the heating chamber R is disturbed, and the slow cooling step may be performed in a state where the temperature variation occurs in the substrate 62. The heating chamber R is provided with the substrate 6
While the chamber is soaked at a predetermined set temperature during the soaking process 2, the substrate 62 carried into the heating chamber R is kept at a higher temperature than the set temperature of the heating chamber R until then. Therefore, after carrying out the soaked substrate 62 and immediately carrying in the next substrate 62, the substrate 6
It is expected that the heat brought in by the heater 2 will be accumulated and the output of the heater H in the heating chamber R will gradually decrease. For this reason, the temperature control in the heating chamber R becomes unstable, or the state in which the heaters H are all turned off and the substrate 62 is allowed to cool naturally can take a long time. Temperature variations based on the difference in ease of heat dissipation are likely to occur, and a long soaking time in each heating chamber R is required. Therefore, in order to suppress these inconveniences, as described above, after the substrate 62 is unloaded, the heating chamber R
By supplying cooling air into the chamber and temporarily lowering the temperature, the next substrate 62 is carried in with the temperature controlled in the vacant room. Thus, the plurality of substrates 62 sequentially transported are always loaded into the heating chamber R in which the same temperature control state is realized.

In this way, each heating chamber R has a mutual difference of △ KT
A first soaking temperature KT ₁ , a second soaking temperature KT ₂ ,
The substrate 62 is stepwise cooled according to the temperature curve shown in the slow cooling step of FIG. 9 by being transported while being sequentially soaked at the sixth to sixth soaking temperatures KT ₆ . Accordingly, in the present embodiment, the step of sequentially performing the soaking process in each heating chamber R corresponds to the soaking process, and the initial predetermined period of the cooling process closely related to the distortion of the substrate 62, that is, the substrate 6
In a predetermined period in which the distortion or the molten state of the glass material included in 2 is greatly affected to uniform, the heating chamber R ₁ in which the substrate 62 is set to be lower by a predetermined value ΔKT sequentially,
R ₂ , to R ₆ , are carried in order and are soaked therein. When the soaking process in the heating chamber R ₆ is completed, the substrate 62 is carried out to the cooling zone 132 by performing Step S12 and the subsequent steps in the heating chamber R ₆ . That is, when the shutter device S ₇ corresponding to the front side shutter device S is opened in step S12, S13,
In step S14, the motor 158f is driven to rotate forward and the motor 164 is driven, so that the second transfer device 120f, that is, the drive section 131f, and the drive section 133a of the third transfer apparatus 122 are driven in synchronization with each other, and the substrate 62 There is being carried is out of the heating chamber R ₆ into the cooling zone 132. T ₁₄ time points 8 and 9 shows this state. Thereafter, the motor 164 of the third transfer device 122 is stopped, and the substrate 62 is moved to the cooling zone 13.
2 and is carried out from the right end thereof at a first carrying speed. In the process, as shown in FIG. 9, it is rapidly cooled at a cooling rate substantially similar to the heating rate. T ₁₅ the time of FIG. 8 shows this state. The time required for the cooling process is, for example, about 700 seconds, and the time (from t ₀ to the time from when the substrate 62 is carried into the preheating zone 126 to when the cooling is completed).
t ₁₅ ) is, for example, about 3500 seconds (about 1 hour). As described above, since the substrate 62 is sequentially loaded into the preheating zone 126 at a predetermined time interval of, for example, about 300 seconds, as is clear from FIG.
It is sequentially carried out of the cooling zone 132 at predetermined time intervals of about seconds.

As described above, according to the present embodiment, the plurality of substrates 62 including the film forming material are formed such that the chambers are gradually lowered along the one direction in the soaking process in the cooling process of the heat treatment. The set temperatures KT ₁ , KT ₂ ,
ＫKT ₆ , each of them is soaked for a predetermined time (t _{4 to} t ₅ ), and then sequentially sent out from the heating chamber R to the heating chamber R having a lower set temperature in the unloading step. A gas (cooling air) having a temperature lower than the set temperature KT is supplied into the predetermined heating chamber R from which the predetermined substrate 62 has been sent out, and then another gas following the predetermined substrate 62 in the loading process. The substrate 62 is sent into the predetermined heating chamber R. As described above, since the cooling process of the heat treatment is performed while repeating the soaking in the heating chamber R maintained at the set temperature KT set for each chamber so as to gradually decrease in one direction, Temperature variations in the substrate 62 including the film forming material are reduced as much as possible. At this time, the heating chamber R from which the substrate 62 has been sent out
In the state where the substrate 62 does not exist in the room, the set temperature KT
Since the cooling air at a lower temperature is supplied, the output of the heater H provided in the heating chamber R is stabilized in a state in which the output is higher than that during the soaking of the substrate 62, and then the next substrate 62 is Sent in. As a result, in each heating chamber R, the heat treatment of each of the plurality of substrates 62 is started under a temperature control state in a certain empty chamber, and thus the plurality of substrates 62 having a higher temperature than the set temperature of each heating chamber R is started. Are successively heat-treated to prevent the temperature control from becoming unstable, the time in which the substrate 62 sent into the heating chamber R is allowed to cool is sufficiently shortened, and the temperature variation in the substrate 62 is reduced. It is made smaller. For this reason, when the substrate 62 is made of glass, local changes in dimensions within the substrate 62 and displacement of thick film printing or the like due to the local change are prevented, and the production yield is drastically increased. In particular, when the substrate 62 is made of soda-lime glass, the effect is remarkable because the temperature is raised to a temperature equal to or higher than the strain point. Further, since the temperature variation in the substrate 62 including the film forming material is reduced as much as possible as described above, there are cases where a large number of thick film resistors and rib-like walls are provided on the surface of the substrate 62. The
The degree of melting of the glass functioning as a binder in the thick-film printing layer becomes uniform, and the variation in the resistance value of the thick-film resistor and the variation in the height of the rib-like wall are reduced appropriately.

According to the present embodiment, when manufacturing a large-sized electronic device substrate, an inexpensive soda-lime glass can be used as the substrate 62. Compared with the above, there is an advantage that the cost is significantly reduced, and at the same time, the glass is not easily broken due to a difference in hardness due to a difference in hardness and a difference in the coefficient of thermal expansion from the thick film layer during firing.

Further, according to the present embodiment, after the substrate 62 subjected to the heat treatment is sent out from the predetermined heating chamber R, the predetermined heating chamber R is kept empty and the set temperature K for each chamber is set.
The output of the heater H is increased so as to be maintained at T, and is controlled to the initial state in which the heat treatment of the substrate 62 is started. After that, since the other substrate 62 is fed, the substrate 62 to be processed later is Of the substrate 62 that has been processed earlier is suppressed. Therefore, even when the substrates 62 having different dimensions and heat capacities are continuously processed, or when the substrates 62 are intermittently transferred and heat-treated, the heat treatment can be performed without considering the transfer conditions. This makes it easy to control the firing device 116.

According to the present embodiment, the heat treatment is performed in the plurality of heating chambers R during the process in which the substrate 62 containing the film forming material is intermittently transferred by the second transfer device 120 in one direction. The substrate 6 containing the film-forming material is formed by a conventional baking apparatus in which a continuous heat curve is formed by continuously transporting the substrate 62 containing the film-forming material.
As compared with the case where the temperature difference in the inside 2 is to be made extremely small, the overall length is shortened and the device becomes compact.

Further, according to this embodiment, the temperature in the heating chamber R is reduced by supplying the cooling air into the heating chamber R through the air supply pipe 184. For this reason, since the temperature in the heating chamber R is rapidly lowered by the supplied cooling air, the time required for cooling can be shortened as compared with the case where the heating chamber R is naturally cooled.
2, the processing efficiency is improved. That is, the gas supply step of supplying gas having a temperature lower than the set temperature KT into the heating chamber R is performed by natural cooling, that is, by simply discharging high-temperature air in the heating chamber R from the exhaust pipe 182. Although a low-temperature gas may be supplied along with the convection of heat at the time of discharging, if the cooling air is positively supplied as in the embodiment, the processing efficiency is increased compared to the case of natural cooling. It is.

Further, in this embodiment, after the output of the heater H in the heating chamber R, that is, the temperature control amount is increased in the gas supply step, another substrate 62 is immediately sent into the heating chamber R. Therefore, the time during which the inside of the heating chamber R is vacant for performing the gas supply step is shortened as much as possible, and the processing efficiency of the substrate 62 is further improved. Note that if the gas supply step is performed during the soaking process of the substrate 62, the temperature of the substrate 62 may be varied due to the flow of the gas. It is desirable.

According to the present embodiment, the first transfer device 1
18, a transporting device including the second transporting device 120 and the third transporting device 122 are provided in parallel with each other so that the longitudinal direction and the axial direction are perpendicular to each other in the tunnel-shaped furnace body 124. And a plurality of rollers 166 that are each driven to rotate around its axis to convey the substrate 62 in one direction. With this configuration, the substrate 62 is supported by the plurality of rollers 166 that are driven to rotate around the axis and is transported in one direction. However, when the substrate 62 is transported by the rollers 166, the transport device is heated. By controlling each chamber R, the feeding and feeding are performed independently as described above, so that the heat treatment of the substrate 62 is performed in the heating chamber R as compared with the case where the feeding and feeding are performed simultaneously in all the heating chambers R. The time during which the substrate 62 is not left untouched can be reduced as much as possible, and the processing efficiency of the substrate 62 can be increased. In addition, compared to the case where the belt 62 is conveyed by a mesh belt or the like, there is no sliding of the belt, which causes generation of dust, so that the degree of cleanliness in the furnace body 124 is increased. The function of the formed film is prevented from being damaged by the generated dust.

Further, in the present embodiment, the air supply pipe 180 constituting the air supply device is provided at the upstream end of the substrate 62 in the transport direction in each of the plurality of heating chambers R. Therefore, since the cooling air flows from the upstream end in the transport direction, which is the high-temperature side, toward the downstream in the transport direction, which is the low-temperature side, the generation of a temperature gradient in the heating chamber R is further suppressed, and the substrate is cooled. Variations in the temperature within 62 are further suppressed.

In this embodiment, the plurality of rollers 166 provided in the transfer device are made of alumina ceramics. For this reason, since the roller 166 that is brought into contact with the substrate 62 is made of ceramics, it is possible to suppress the generation of dust and the like due to the deterioration or rust caused by the heating of the roller 166 in the furnace body 124. Therefore, the cleanliness inside the furnace body 124 is further enhanced.

While the embodiment of the present invention has been described in detail with reference to the drawings, the present invention can be embodied in still another embodiment.

For example, in the above-described embodiment, each time one substrate 62 is soaked in heat, the heating chamber R is emptied once, so that there is a time lag between unloading and loading the substrate 62 from the heating chamber R. Although provided and performed, for example, when the substrate 62 is transported so as to be stored in every other heating chamber R, unloading and loading in each heating chamber R may be performed simultaneously. In that case, the second transfer device 120
Similar to the transfer device 118 and the third transfer device 122, the motor may be connected by the line shaft 138 and the miter gear 140 and driven by one motor.

In the embodiment, the cooling air is supplied into the heating chamber R in the heating chamber cooling step.
If the output of the heater H can be increased in a sufficiently short time even after natural cooling, supply of cooling air may not be performed.

In the embodiment, the substrate 62 is reciprocated in the transport direction during the soaking process in the heating chamber R. However, since the inside of the heating chamber R is sufficiently heated, This reciprocation does not necessarily have to be performed.

In the embodiment, the first transfer device 1
18 and the third transfer device 122 transmit the rotation of the motor 134 or 162 by the line shaft 138 and the miter gear 140 and also set the transfer speed to the second transfer device 12.
The drive sections 129b and 133a, which are desired to be equal to 0, are provided with a motor 150 or 164 and a one-way coupling 148, etc.
Although the transport speeds of b and 133a are configured to be changed, for example, the drive sections 129b and 133a may be independently driven with variable rotation speed motors similarly to the second transport device 120. Good. In addition, all driving sections of the first transport device 118 and the third transport device 122 may be independently driven.

Further, the shutter device S which has been opened and closed in the embodiment is provided with the substrate 6 from the upper surface of the roller 166.
A member whose position is fixed at a distance slightly larger than the thickness of the second member may be used. In short, what is necessary is just to enable temperature control between the heating chambers independently.

In the above embodiment, the transition point or strain point of the glass constituting the substrate 62 or the glass contained in the thick film printed thereon passes through the substrate 62 while maintaining a uniform temperature state. As described above, when the film forming material contained in the substrate 62 is fixed by melting or sintering a metal or inorganic material, the melting point or sintering point of the film forming material is set to a uniform temperature in the substrate 62. to pass while keeping the state, the first set temperature KT ₁ or second set temperature KT ₂ is set to a value near the transition point or a strain point of the glass material contained in the substrate 62, or The above substrate 62
It is set to a value near the melting point or sintering point of the metal or inorganic material contained in the above film forming material.

In the embodiment, the furnace body 124 and the shutter device S are made of β-spodumene crystallized glass, and the roller 166 is made of alumina ceramics. However, these may be made of other ceramics. . For example, the furnace body 124 and the like may be made of alumina ceramics or mullite, and the roller 166 may be made of mullite or spodumene. Further, in the roller hearth kiln using the rollers 166 as in the continuous firing apparatus 116 of the embodiment, since the sliding portion does not need to be provided in the furnace body 124, the material of each part is made of, for example, a material having high heat resistance. It may be made of a metal such as SUS310.

Although not specifically exemplified, the present invention can be embodied with various modifications and improvements based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an overall configuration of a continuous firing apparatus according to an embodiment of the present invention.

FIG. 2 is a view in which a cross section along a longitudinal direction of the furnace body of the embodiment of FIG. 1 is partially omitted.

FIGS. 3A to 3E are aa to ee in FIG.
It is a figure each corresponding to a viewing cross section.

FIG. 4 is a view for explaining the transfer device of the embodiment of FIG. 1;

FIG. 5 is a view for explaining a plurality of heater arrangements in the embodiment of FIG. 1;

FIGS. 6 (a) and (b) are diagrams showing an air supply pipe and an exhaust pipe of the embodiment of FIG. 1, respectively.

FIG. 7 is a block diagram illustrating a control circuit according to the embodiment of FIG. 1;

FIG. 8 is a time chart showing a substrate transfer position in the embodiment of FIG. 1;

FIG. 9 is a diagram showing a set temperature of each zone, that is, a firing temperature curve of a substrate in the embodiment of FIG. 1;

FIG. 10 is a diagram illustrating local dimensional deformation of a substrate in a conventional baking apparatus.

FIG. 11 is a flowchart illustrating the operation of the arithmetic and control circuit of the embodiment of FIG. 1;

FIG. 12 is a diagram describing in detail a main part of the time chart of FIG. 8;

FIG. 13 is a diagram illustrating a reciprocating movement of the substrate during the soaking process in the heating chamber in the embodiment of FIG. 1;

[Explanation of symbols]

116: continuous firing device # 118: first transport device, 120: second transport device, 12
2: third transfer device} (transport device) H: heater R _1, R _2, to R _6: a plurality of heating chambers 166: roller 168: control device (temperature controller, air supply controller) {1
80: air supply pipe, 184: air supply pipe, 185: air supply pipe,
208: Solenoid valve 気 (air supply device)

Continued on the front page (72) Inventor Hiroyuki Mori 3-36 Noritake Shinmachi, Nishi-ku, Nagoya City, Aichi Prefecture Inside Noritake Company Limited (72) Inventor Hironobu Ichihara 3-1-1 Noritake Shinmachi, Nishi-ku, Nagoya City, Aichi Prefecture Noritake Company Limited Limited (72) Inventor Yoji Sato 3-36 Noritakeshinmachi, Nishi-ku, Nagoya-shi, Aichi Prefecture No. 36 Noritake Company Limited Limited (72) Inventor Susumu Sakamoto Yasucho, Asakura-gun, Fukuoka Prefecture (3) References JP-A-10-67541 (JP, A) JP-A-1-252886 (JP, A) JP-A-9-175871 (JP, A) (58) Fields surveyed (Int. Cl. ⁷ , DB name) C03C 17/00-17/44 F27B 9/00-9/40 C04B 35/64

Claims (4)

(57) [Claims] 1. A baking method for uniformly performing a heat treatment on each of a plurality of substrates including a film forming material in a process of sequentially transporting the plurality of substrates in one direction, wherein in the cooling process of the heat treatment, By accommodating each of the plurality of substrates for a predetermined time in each of a plurality of heating chambers that are temperature-controlled in advance so as to match a set temperature set for each chamber so as to gradually decrease along one direction. A soaking step of soaking each of the plurality of substrates at a set temperature for each of the chambers; and removing each of the plurality of substrates heat-treated in each of the plurality of heating chambers from each of the plurality of heating chambers. An unloading step of sequentially sending out to a heating chamber having a lower set temperature than the heating chamber; and setting the heating chamber in a predetermined heating chamber of the plurality of heating chambers to which a predetermined substrate of the plurality of substrates has been sent. Supply gas at a temperature lower than the temperature A gas supply step, and after the gas supply step, a loading step of feeding another substrate following the predetermined substrate among the plurality of substrates into the predetermined heating chamber, comprising: A method for firing a substrate comprising: 2. A baking apparatus for uniformly performing heat treatment on each of a plurality of substrates including a film forming material in a process of sequentially transporting the plurality of substrates in one direction, wherein the plurality of substrates have a longitudinal shape in a tunnel-shaped heating region. A plurality of heating chambers that are provided in a part of the direction in a manner that is thermally divided by a shutter device and whose temperature is independently controlled by a heater, and that each of the plurality of heating chambers is controlled by controlling the heater. A temperature control device that uniformly controls the temperature so as to match the set temperature of each chamber set so as to be gradually lowered along the one direction; and the plurality of substrates in the tunnel-shaped heating region. In the step of sequentially transporting in one direction, each of the plurality of substrates is sent into each of the plurality of heating chambers and subjected to heat treatment for a predetermined time in each of the plurality of heating chambers, and in each of the plurality of heating chambers. Finished heat treatment A transfer device that sends out the substrate from each of the plurality of heating chambers; an air supply device provided in each of the plurality of heating chambers, for supplying a gas having a temperature lower than a set temperature of the heating chamber; In each of the plurality of heating chambers, an air supply control device that supplies the gas from the air supply device in a state where each of the plurality of substrates is sent out by the transfer device and the substrate is not located in the room. An apparatus for baking a substrate including a film forming material. 3. The transfer device is provided in parallel with each other so that a longitudinal direction and an axial direction are perpendicular to each other in the tunnel-shaped heating area, supports the substrate, and moves the substrate in the one direction. 3. The apparatus for firing a substrate including a film-forming material according to claim 2, further comprising a plurality of rollers that are respectively driven to rotate around the axis for transport. 4. An air supply pipe provided at an upstream end of the substrate in the transfer direction to supply a gas lower than a set temperature of the heating chamber to each of the plurality of heating chambers. An apparatus for firing a substrate containing the film-forming material according to claim 2.