JP3149664B2 - Flip chip bonding equipment - Google Patents

Abstract

PURPOSE:To provide a flip chip bonding equipment capable of reliably bonding a flip chip having bumps to a substrate at a high speed. CONSTITUTION:In a flip chip bonding equipment by vacuum-sucking a flip chip 1 to a nozzle 16 and bonding the flip chip to electrodes 4 of a substrate 3 positioned on a substrate holder 25, an extension 16a is provided to the nozzle 16, the flip chip 1 is vacuum-absorbed to the bottom surface of this extension 16a, and a heating tool 26 is provided above the bonding position P. The nozzle 16 descends and the bumps 2 of the flip chip 1 vacuum-sucked to the bottom of the nozzle are placed on an ACF 5 adhering to the electrodes 4. At that time, the heating tool 26 descends and touches the extension 16a thereby transferring its heat to the ACF 5. Then, ACF 5 is hardened and the bumps 2 are bonded to the electrodes 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding apparatus for bonding a flip chip to a substrate by heating the flip chip with a heating tool.

[0002]

2. Description of the Related Art As a chip to be bonded to a substrate, a flip chip having a bump (protruding electrode) on its lower surface is known. FIG. 4 is a sectional view of a conventional flip chip bonding head. In the figure, reference numeral 1 denotes a flip chip, on the lower surface of which a bump 2 is projected.
Reference numeral 3 denotes a substrate such as a liquid crystal panel, and an anisotropic conductive sheet (hereinafter referred to as ACF) is provided on the electrode 4 on the upper surface thereof.
5 is attached in advance. Reference numeral 6 denotes a table device on which the substrate 3 is positioned.

A bonding head 7 is provided with a nozzle 8 having a substantially U-shaped cross section at a lower portion thereof, and the flip chip 1 is vacuum-sucked by vacuum suction through a suction hole 9 at the center thereof. The bonding head 7 has a built-in positive power supply 10a and a negative power supply 10b,
When a large current is applied to the nozzle 8 constantly or in a pulsed manner, the nozzle 8 is heated by its internal resistance.

Next, the operation will be described. The bonding head 7 is driven by a moving unit (not shown) to move above the flip chip supply unit, and vacuum-adsorbs and picks up the flip chip 1 provided in the flip chip supply unit on the lower surface of the nozzle 8. Next, the bonding head 7 moves above the substrate 3 and descends there, thereby pressing the flip chip 1 against the substrate 3. At this time, the nozzle 8 generates heat by its own internal resistance due to the flow of a large current, and
The bump 2 is bonded to the electrode 4 by heating the ACF 5 with the heat.

[0005]

However, in the above-mentioned conventional configuration, since the bonding head 7 is provided with the heavy plus power supply section 10a and the minus power supply section 10b, the bonding head 7 is made heavy and, therefore, the flip chip supply is performed. Can not move at high speed between the part and the substrate 3,
There was a problem that the work efficiency was not improved. In addition, since the nozzle 8 is constantly or frequently supplied with a large current and generates heat internally, the nozzle 8 is thermally deformed and the lower surface of the nozzle 8 on which the flip chip 1 is vacuum-adsorbed is easily distorted.
However, there is a problem that the pickup error easily occurs, and the force for pressing the flip chip 1 against the substrate 3 becomes uneven, so that a bonding failure is likely to occur.

Accordingly, the present invention provides a flip chip bonding apparatus capable of increasing the moving speed of the nozzle by reducing the weight of the nozzle side, bonding the flip chip to the substrate with high work efficiency, and preventing thermal deformation of the nozzle. The purpose is to provide.

[0007]

For this purpose, the present invention provides a nozzle for vacuum-sucking a flip chip, which is provided with an extending portion extending laterally, and which is located above a bonding position of the flip chip and which is vertically moved. A heating tool for landing on the upper surface of the extending portion by driving up and down by the means and heating the flip chip via a nozzle to bond the flip chip to the substrate is provided.

[0008]

According to the above construction, by disposing a heating tool, which is a heating means for the nozzle, separately from the nozzle and above the bonding position, the weight of the nozzle is reduced, and the nozzle is connected to the flip chip supply unit and the substrate. The flip chip bonding can be performed with high work efficiency by moving between the members at a high speed. Further, it is possible to prevent the nozzle from being unnecessarily thermally deformed by minimizing the heating frequency of the nozzle.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a flip chip bonding apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of a main part of the flip chip during bonding, and FIG. 3 is a bottom view of the nozzle. In FIG. 1, reference numeral 11 denotes a plate-like top plate, and a driving unit 12 is provided at the center of the upper surface. Drive unit 12
A turntable 14 is connected to the rotating shaft 13. A plurality of nozzle shafts 15 are provided vertically along the outer edge of the turntable 14, and a nozzle 16 is attached to a lower end of the nozzle shaft 15.

A flip chip supply unit 17 and a table device 21 are provided below the moving path of the nozzle 16. The flip chip supply unit 17 includes an X table 18, a Y table
A table 19 and a support table 20 are stacked, and a large number of flip chips 1 are provided on the support table 20. Therefore, when the X table 18 and the Y table 19 are driven, the flip chip 1 on the support table 20 moves horizontally in the X direction and the Y direction, and the nozzle 16 picks up a predetermined flip chip 1 by vacuum suction.

The table device 21 is provided with an X table 2
2, Y table 23, θ table 24, substrate holder 25
Are laminated. The substrate 3 is positioned on the substrate holder 25. Therefore, when the X table 22 or the Y table 23 is driven, the substrate 3 moves horizontally in the X direction or the Y direction.
Rotates horizontally to position a predetermined coordinate position of the substrate 3 below the flip chip 1 vacuum-adsorbed to the nozzle 16.

When the drive unit 12 is driven, the turntable 14 is rotated by an index in the direction of the arrow. While the index rotation is stopped, the nozzle 16 is connected to the flip chip supply unit 17.
, The flip chip 1 on the support table 20 is vacuum-adsorbed and picked up. The flip chip 1 thus picked up is transported above the substrate 3 by the index rotation of the turntable 14 in the direction of the arrow. Therefore, the flip chip 1 is mounted on the substrate 3 by the nozzle 16 performing up and down operations while the index rotation is stopped.

In FIG. 1, a flip chip 1 is mounted on a substrate 3.
A heating tool 26 is provided above a bonding position P for bonding to the substrate. A cylinder 27 is provided on the lower surface of the top plate 11 as a vertically moving means, and a heating tool 26 is connected to a lower end of the rod 28. Therefore, when the rod 28 of the cylinder 27 projects, the heating tool 26 descends, and when the rod 28 retracts, the heating tool 26 rises.

In FIG. 2, suction holes 30 and 31 communicating with each other are formed in the nozzle shaft 15 and the nozzle 16, and the flip chip 1 is flattened by sucking in vacuum by a suction device (not shown). Vacuum suction on the bottom surface. The nozzle 16 has a flat plate shape, one end of which is connected to the lower end of the nozzle shaft 15, and the other end of which is an extension 16 a extending horizontally to the side. . Inside the turntable 14,
A vertical movement mechanism for vertically moving the nozzle shaft 15 and the nozzle 16 is incorporated. The flat lower surface of the heating tool 26 is in contact with the flat upper surface of the extension 16a.
Reference numeral 29 denotes a heater housed inside the heating tool 26. In FIG. 2, reference numeral 2 denotes a bump protruding from the lower surface of the flip chip 1, reference numeral 4 denotes an electrode formed on the upper surface of the substrate 3, and reference numeral 5 denotes an ACF adhered on the electrode 4 in advance. Note that there is also a method in which the ACF 5 is attached to the lower surface of the bump 2 of the flip chip 1.

2 and 3, a vertical hole 32 communicates with the tip of the suction hole 31. The vertical hole 32 communicates with a radiation groove 33. This radiation groove 33 is
Are formed radially in four directions on the lower surface of the extension portion 16 a of the Flip chip 1, and the flip chip 1 is vacuum-sucked through the radiation groove 33.

This flip chip bonding apparatus is configured as described above. Next, the operation of bonding the flip chip 1 to the substrate 3 will be described. In FIG. 1, a nozzle 16 that picks up the flip chip 1 provided in the flip chip supply unit 17 by vacuum suction is provided.
The substrate 3 positioned on the table device 21 by the index rotation of the turntable 14 in the direction of the arrow.
Move up. In this case, the substrate 3 is moved in the X direction or the Y direction by driving the table device 21 in advance, and the predetermined coordinate position is positioned at the bonding position P.

When the turntable 14 stops the index rotation, the up-down movement mechanism built in the turntable 14 is operated, and the nozzle 16 descends, as shown in FIG. Is landed on the ACF5. At the same time, the rod 28 of the cylinder 27
Then, the heating tool 26 descends, the flat lower surface thereof contacts the flat upper surface of the extension 16 a of the nozzle 16, and presses the flip chip 1 against the ACF 5.

The heating tool 26 is heated by a heater 29 in advance.
It is heated to about 00 ° C. Therefore, the heat is transferred to the flip chip 1 through the extension 16a of the flat nozzle 16.
And the flip chip 1 is heated. Then, the heat cures the ACF 5 and the pump 2 is bonded to the electrode 4. Note that the thickness of the flip chip 1 is, for example, about 0.5 mm. Therefore, if the nozzle 16 is formed of a metal having good thermal conductivity, heat can be transferred to the ACF 5 without difficulty to be cured by heating. The upper surface of the extension 16a of the nozzle 16 and the lower surface of the heating tool 26 are flat surfaces as shown in FIG. 2, so that the lower surface of the heating tool 26 is firmly grounded to the upper surface of the extension 16a for transmission. Can be heated.

[0019]

As described above, according to the present invention, since the heating tool is formed separately from the nozzle and is disposed above the bonding position, the weight on the nozzle side can be reduced. The flip chip can be bonded to the substrate with good workability while moving the nozzle between the flip chip supply unit and the substrate at a high speed. In addition, the nozzle is heated by the heating tool only when necessary, so it is possible to prevent thermal deformation caused by excessive heating of the nozzle, so that the flip chip can be reliably picked up and pressed against the substrate with even force and bonded it can.

[Brief description of the drawings]

FIG. 1 is a side view of a flip chip bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a main part of the flip chip bonding apparatus during bonding of the flip chip according to one embodiment of the present invention;

FIG. 3 is a bottom view of a nozzle of the flip chip bonding apparatus according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view of a conventional flip chip bonding head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flip chip 2 Bump 3 Substrate 16 Nozzle 16a Extension part 17 Flip chip supply part 21 Table device 26 Heating tool 27 Cylinder (vertical movement means)

Claims (1)

(57) [Claims] 1. A table device for positioning a substrate, and a nozzle for vacuum-sucking and transferring a flip chip to the substrate, the nozzle having an extending portion extending laterally, and a flip chip. A heating tool that is located above the bonding position, and that is driven by vertical movement means to perform vertical movement, thereby landing on the upper surface of the extending portion, and heating the flip chip via the nozzle to bond the flip chip to the substrate. A flip chip bonding apparatus comprising: