CN212936318U

CN212936318U - Panel laminating device

Info

Publication number: CN212936318U
Application number: CN202021280858.5U
Authority: CN
Inventors: 朱鹏程; 凌步军; 袁明峰; 冯高俊; 赵有伟; 滕宇; 孙月飞; 吕金鹏; 冷志斌
Original assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Current assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2021-04-09
Anticipated expiration: 2030-07-02

Abstract

The utility model discloses a panel laminating device, it includes: a base; one end of the upright post is fixed on one side surface of the base; the cross frame is arranged at one end of the upright post, which is far away from the base; the workbench is slidably mounted on the base, and the sliding direction of the workbench is consistent with the extending direction of the cross frame; an adhesive substance carrier table slidably mounted on the base; a pickup part installed at one end of the cross frame and allowing the pickup part to move in a direction perpendicular to the table; the peeling device is fixed on one side of the adhesive substance bearing platform, the working end of the peeling device extends to the surface side of the adhesive substance bearing platform, and the working end of the peeling device is in contact with the surface of the adhesive substance. The utility model discloses it is bad to aim at utilizing the non-contact mode of laser to offset or eliminate the device that causes owing to generating heat.

Description

Panel laminating device

Technical Field

The utility model belongs to the technical field of the display technology and specifically relates to an organic light-emitting diode (OLED) panel technical field especially relates to a panel laminating device.

Background

The organic light-emitting diode (OLED) display panel has excellent characteristics of no need of a backlight, high contrast, thin thickness, wide viewing angle, fast response speed, applicability to a flexible panel, wide temperature range, simple structure and process, etc. because of having a self-emitting OLED, and is considered as a new application technology for a next-generation flat panel display. An organic light-emitting diode (OLED) is a self-luminous material, does not need a backlight panel, has a wide viewing angle, uniform image quality, high response speed, easy colorization, can emit light by using a simple driving circuit, has a simple process, can be manufactured into a flexible panel, conforms to the principle of light weight, thinness, shortness and small size, and belongs to a medium-small size panel.

An organic light-emitting diode (OLED) is a curved panel used in a mobile phone today, and a Flexible Printed Circuit (FPC) needs to be attached to the curved panel for use, and with the trend of narrowing the edge of the mobile phone screen, an increasingly higher requirement is placed on the process of attaching the organic light-emitting diode (OLED) to the Flexible Printed Circuit (FPC), and generally, an Anisotropic Conductive Film (ACF) is used for attaching the organic light-emitting diode (OLED) to the Flexible Printed Circuit (FPC)) to attach the Flexible Printed Circuit (FPC) to the Flexible Printed Circuit (FPC), and the organic light-emitting diode (OLED) is attached to the Flexible Printed Circuit (FPC) by pressing the thermal plate, but the thermal plate which generates heat contacts the device, so that the device is easily damaged or defective.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a panel laminating device aims at utilizing the non-contact mode of laser to offset or eliminate because the device that generates heat and cause is bad.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model provides a panel laminating device, it includes:

a base;

one end of the upright post is fixed on one side surface of the base, and the upright post is arranged perpendicular to the base;

the cross frame is arranged at one end of the upright column, which is far away from the base, and is crossed with the upright column at an angle;

the workbench is slidably mounted on the base and corresponds to the position of the cross frame, and the sliding direction of the workbench is consistent with the extending direction of the cross frame;

a pickup part mounted on the cross frame and allowing the pickup part to move in a direction perpendicular to the table;

an adhesive substance carrying table slidably mounted on the base and located between the table and the pickup section;

a peeling device fixed at one side of the adhesive substance bearing table and having a working end extended to a surface side of the adhesive substance bearing table, the working end of the peeling device being in contact with the surface of the adhesive substance.

In an embodiment of the present invention, the panel attaching device further includes a first driving device, and the first driving device drives the pickup portion to ascend and descend.

In an embodiment of the present invention, the panel attaching device further includes a second driving device, the second driving device drives the adhesive material carrying table to move back and forth along the side of the base and linearly within a predetermined distance.

In one embodiment of the present invention, a bottom plate is disposed at the bottom of the adhesive material carrying platform.

In one embodiment of the invention, the second driving device comprises a cam member, which is in contact with the chassis.

In an embodiment of the present invention, the attaching device further includes a laser emitting portion, the laser emitting portion is installed on the cross frame and opposite to the other end of the pickup portion, and the emitting aspect of the laser emitting portion faces the workbench.

In an embodiment of the present invention, the panel attaching apparatus further includes a force applying portion, the force applying portion is installed on the cross frame and located on one side or both sides of the laser emitting portion, the direction of the force applied by the force applying portion faces the workbench, and the force applying portion is allowed to move in the direction perpendicular to the workbench.

In an embodiment of the present invention, the laser emitting portion includes a plurality of laser heads, allowing each of the laser heads to emit a laser beam.

In an embodiment of the present invention, an elastic member is disposed at a connection between the pickup portion and the cross frame.

In an embodiment of the present invention, the force applying portion is provided with a protection pad near one end of the working table.

The utility model discloses a panel laminating device can realize that Anisotropic Conductive Film (ACF) bonds the automatic of material and sticks to adopt laser as the heating source to bond, the non-contact mode that utilizes laser offsets or eliminates because the device that generates heat and cause is bad.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a panel laminating apparatus according to the present invention;

FIG. 2 is a schematic structural diagram of an adhesive substance attaching process;

FIG. 3 is a schematic structural diagram of an adhesive substance attaching process;

fig. 4 is a schematic structural diagram of an adhesive substance attaching process.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

An organic light-emitting diode (OLED) is a curved panel used in a mobile phone today, and a Flexible Printed Circuit (FPC) needs to be attached to the curved panel for use, and with the trend of narrowing the edge of the mobile phone screen, an increasingly high requirement is placed on the process of attaching the organic light-emitting diode (OLED) and the FPC, and generally, an Anisotropic Conductive Film (ACF) is used for attaching the organic light-emitting diode (OLED) and the FPC, and the organic light-emitting diode (OLED) and the FPC are attached to each other by pressing the bonding material through a hot plate, so that the organic light-emitting diode (OLED) and the FPC are attached to each other by pressing the hot plate, but the hot plate heated by the FPC is in contact with a device, and thus the device is easily damaged or defective.

Referring to fig. 1, the present invention provides a panel laminating apparatus, which includes: a base 100, a vertical column 200, a horizontal frame 300, a workbench 400, an adhesive substance carrying table 500, a pickup part 600, a peeling device 700, a laser emitting part 800 and a force applying part 900.

Referring to fig. 1, the base 100 may be made of any material with high hardness, which is not limited in the present invention. One end of the upright post 200 is fixed on a lateral surface of the base 100, the upright post 200 is perpendicular to the base 100, the cross frame 300 is disposed at one end of the upright post 200 far away from the base 100, and intersects with the upright post 200 to form an angle, in this embodiment, an angle of 90 degrees is formed between the cross frame 300 and the upright post 200, for example, the workbench 400 is slidably mounted on the base 100 and corresponds to a position where the cross frame 300 is located, a sliding direction of the workbench 400 is consistent with an extending direction of the cross frame 300, in some embodiments, a plurality of limiting devices can be further mounted on the base 100, when the workbench 400 slides along the base 100, a preset position on the base 100 can be stopped through the limiting devices, and the workbench 400 can be conveniently processed at the preset position of an upper workpiece to be processed. The adhesive material carrier 500 is slidably mounted on the Base 100, the adhesive material carrier 500 is mounted on the side of the Base 100 opposite to the vertical column 200, the adhesive material carrier 500 is loaded with an adhesive material, such as an Anisotropic Conductive Film (ACF), the Anisotropic Conductive Film (ACF) mainly comprises two parts of Conductive particles and insulating material, a layer of protective Film is respectively arranged on the upper and lower parts to protect the main component, when in use, the upper Film (Cover Film) is torn off, the Anisotropic Conductive Film (ACF) is attached to the substrate, the other layer of PET (Base Film) is torn off, the pick-up 600 is mounted at one end of the cross frame 300 and allowed to move along the direction perpendicular to the working table 400, in some embodiments, an elastic member is arranged at the connection position of the pick-up 600 and the cross frame 300, for elastically supporting the pickup 600. The laser emitting part 800 is mounted on the other end of the cross frame 300 opposite to the pickup part 600, the emitting side of the laser emitting part 800 faces the workbench 400, the force applying part 900 is mounted on the cross frame 300 and located on one side or two sides of the laser emitting part 800, the force applying direction of the force applying part 900 faces the workbench 400 and allows the force applying part 900 to move in the direction perpendicular to the workbench 400, in some embodiments, a protection pad is disposed at one end of the force applying part 900 close to the workbench 400 and is used for protecting a workpiece to be machined when the force applying part 900 contacts the workpiece to be machined. In some embodiments, the panel attaching apparatus further includes a first driving device, which can drive the picking part 600 to move up and down, and in some embodiments, the panel attaching apparatus further includes a second driving device, which can drive the adhesive substance carrying table 500 to move back and forth linearly along the side of the base 100 within a predetermined distance, in this case, the predetermined distance is smaller than the length of the base 100. In some embodiments, the panel attaching apparatus further includes a third driving device for driving the force applying portion 900 to be lifted. In some embodiments, the panel attaching apparatus may further include a peeling apparatus 700, the peeling apparatus 700 is fixed to one side of the adhesive material carrying platform 500 and extends to the surface side of the adhesive material carrying platform 500, in this embodiment, the working end of the peeling apparatus 700 is located above the adhesive material carrying platform 500, the working end of the peeling apparatus 700 is in contact with the surface of the adhesive material, and the separation film on the surface of the adhesive material can be peeled. In some embodiments, the laser emitting part 800 may include a plurality of laser heads, each of which may emit a laser beam. In this embodiment, for example, a plurality of laser heads are arranged corresponding to the bonding positions of the organic light-emitting diode (OLED) to be processed and the flexible printed circuit board FPC, so that laser beams emitted by the laser heads cover the positions of the organic light-emitting diode (OLED) to be processed and the flexible printed circuit board FPC where bonding is required.

Referring to fig. 1, in an embodiment of the present invention, a sliding table 400 is disposed on a base 100, more specifically, a sliding rail may be disposed on the base 100, a pulley may be disposed on the table 400, the pulley is matched with the sliding rail, so that the table 400 slides along a length direction of the base 100, and further a working area of the table 400 is divided into a bonding material attaching area and a laser bonding area, in the bonding material attaching area, a pickup portion 600 picks up a bonding material, such as an Anisotropic Conductive Film (ACF), on a bonding material carrying table 500, and then the picked bonding material is attached to a portion to be bonded of an organic light-emitting diode (OLED). The adhesive substance attaching region may include an adhesive substance carrier stage 500, a pickup 600, a first driving means, a second driving means, and a peeling means 700.

Referring to fig. 1, an adhesive substance is placed on the adhesive substance holder 500, and the free end of the picking portion 600 picks up the adhesive substance in the adhesive substance holder 500 to attach the adhesive substance to a portion to be adhered on an organic light-emitting diode (OLED). Specifically, the picking part 600 may be multiple, the free end of the picking part 600 may be provided with a manipulator to grab the adhesive substance, in some other embodiments, the picking part 600 may be further hollow, and the other end of the picking part 600 is connected to a vacuum pump, so that a negative pressure chamber is formed in the picking part 600, and the purpose of picking the adhesive substance is achieved through the vacuum adsorption effect. The pickup 600 may also be moved in a horizontal direction to align the workpiece to be processed.

Referring to fig. 1, in the present embodiment, in order to prevent the pickup portion 600 from being damaged when the pickup portion 600 contacts an organic light-emitting diode (OLED), the pickup portion 600 includes an elastic member, such as a spring, for elastically supporting the pickup portion 600. When the pickup portion 600 contacts an organic light-emitting diode (OLED), the free end of the pickup portion 600 inevitably contacts the OLED, which may cause a problem of damage to the pickup portion 600 or the OLED during the contact, and the pickup portion 600 is elastically supported by the spring to prevent the damage to the pickup portion 600 or the OLED.

Referring to fig. 2 to 4, the first driving device moves the pickup portion 600 up and down between a first contact position a1 where the pickup portion contacts the adhesive material in the adhesive material carrier 500 and a second contact position a2 where the pickup portion 600 contacts an organic light-emitting diode (OLED). In some embodiments, the first driving device includes a motor and a ball screw structure, and in other embodiments, the first driving device may be formed by other linear driving devices such as a linear guide (LMguide). The second driving device makes the adhesive material carrying platform 500 move back and forth along a straight line in a direction crossing the lifting direction of the picking part 600, so that the adhesive material carrying platform 500 is located between the picking part 600 and the organic light-emitting diode (OLED), or makes the adhesive material carrying platform 500 separate from the picking part 600 and the organic light-emitting diode (OLED). In some embodiments, the second driving means may include a motor, and a cam member 1000 combined with a rotational driving shaft of the motor to linearly reciprocate the bottom plate 501 in a state of contacting the bottom plate 501 provided at the bottom of the adhesive substance carrier 500. That is, when the cam member 1000 rotates, the outer surface contacts the base plate 501 to linearly reciprocate the base plate 501 forward or backward. Specifically, the cam member 1000 may have different lengths between the rotation axis TA and the both side ends with reference to the rotation axis TA, for example, the distance between the rotation axis TA and the first end is longer than the distance between the rotation axis TA and the second end, and thus may be divided into a first movement section 1010 in which the distance from the rotation axis TA to the first end is longer and a second movement section 1020 in which the distance from the rotation axis TA to the second end is shorter. The first movement section 1010 or the second movement section 1020 of the cam member 1000 comes into contact with the base plate 501 to linearly reciprocate the base plate 501.

Referring to fig. 2 to 4, in some embodiments, the roller 502 may be rotatably disposed on the bottom plate 501, and when the cam component 1000 rotates, the first moving section 1010 or the second moving section 1020 of the cam component 1000 contacts the roller 502 to linearly reciprocate the bottom plate 501. In order to maintain contact between the cam member 1000 and the roller 502, an elastic member may be provided to elastically press the roller 502 toward the cam member 1000, and in order to maintain contact between the cam member 1000 and the roller 502 when the cam member 1000 rotates, the elastic member elastically presses the roller 502 toward the cam member 1000, and thus applies an elastic restoring force to the roller 502 to maintain contact between the cam member 1000 and the roller 502.

Referring to fig. 1, the stripping device 700 is disposed at one side of the adhesive material carrier 500, the working end of the stripping device 700 is located at the upper side of the adhesive material carrier 500, the working end of the stripping device 700 can be set by a program or set by a sensor, so as to adjust the micro distance up and down according to the position of the adhesive material, and further contact the surface of the adhesive material, the separating films on the upper and lower surfaces of the adhesive material are stripped before and after the adhesive material is picked up by the picking portion 600, the stripping device 700 may be, for example, a robot or other devices, and the present invention is not limited in particular. The working end of the peeling apparatus 700 may also rotate, and when the peeling apparatus 700 completes the peeling work, the working end of the peeling apparatus 700 rotates to a side away from the adhesive substance, thereby preventing the pickup part 600 from being hindered from picking up the adhesive substance.

Referring to fig. 1, in the present embodiment, in a state where the adhesive material carrying table 500 is located between the pickup portion 600 and the organic light-emitting diode (OLED), the pickup portion 600 descends to the first contact position a1 to contact the adhesive material, and in a state where the adhesive material carrying table 500 is separated from between the pickup portion 600 and the organic light-emitting diode (OLED), the pickup portion 600 descends to the second contact position a2 to attach the adhesive material to the organic light-emitting diode (OLED).

Referring to fig. 1 to 4, before the pickup portion 600 contacts the adhesive substance, the pickup portion 600 stands by at a first standby position. In order to locate the adhesive substance carrier 500 between the pickup portion 600 and an organic light-emitting diode (OLED), the second driving device rotates the cam member 1000 in the first direction, and the adhesive substance carrier 500 moves toward the pickup portion 600 together with the base plate 501. Based on this, the first driving means lowers the pickup 600 toward the adhesive substance side, and brings the pickup 600 into contact with the adhesive substance in the adhesive substance carrier 500, thereby picking up the adhesive substance at the free end of the pickup 600. After the pickup 600 picks up the adhesive substance, the first driving means raises the pickup 600, thereby moving the pickup 600 to the second standby position of the pickup 600. At this time, the second driving device rotates the cam member 1000 in the second direction to move the base plate 501, so that the adhesive substance carrier 500 is separated from between the pickup 600 and an organic light-emitting diode (OLED). In order to attach the adhesive substance to the organic light-emitting diode (OLED), the pickup unit 600 moves to the second contact position, and the first driving device lowers the pickup unit 600 to attach the adhesive substance to a corresponding position on the organic light-emitting diode (OLED).

Referring to fig. 1, the organic light-emitting diode (OLED) with the adhesive substance attached thereto is moved to a laser bonding area under the driving of the worktable 400, the laser bonding area includes a laser emitting portion 800 and a force applying portion 900, in the laser bonding area, the flexible printed circuit board FPC is manually or mechanically covered on the organic light-emitting diode (OLED) with the adhesive substance attached thereto, and the flexible printed circuit board FPC is aligned with the organic light-emitting diode (OLED), so that the organic light-emitting diode (OLED) and the portion of the flexible printed circuit board FPC to be bonded are aligned with the laser emitting portion 800 by moving the worktable 400, the laser emitting portion 800 may include a plurality of laser heads, allowing each laser head to emit laser light, in this embodiment, for example, the laser head corresponds to the organic light-emitting diode (OLED) to be processed, OLED) and a Flexible Printed Circuit (FPC) are arranged, and a plurality of laser heads are arranged at the joint position of the OLED and the FPC, so that laser beams emitted by the laser heads cover the positions of the organic light-emitting diodes (OLEDs) to be processed and the FPC which need to be bonded. The laser is used as a heating source for bonding, and the non-contact mode of the laser is utilized to counteract or eliminate the device defect caused by heating. In other embodiments, the laser emitting portion 800 may also be driven to move, so that the plurality of laser heads on the laser emitting portion 800 are actively aligned with a portion to be bonded between an organic light-emitting diode (OLED) and the Flexible Printed Circuit (FPC). In some embodiments, the force application portion 900 is driven to move up and down by a third driving device, for example, in the present embodiment, a force application portion 900 is respectively disposed on two sides of the laser emitting portion 800, when the worktable 400 drives an organic light-emitting diode (OLED) to move to a position to be processed, the flexible printed circuit board FPC is covered on the organic light-emitting diode (OLED) to which an adhesive substance is attached, and the flexible printed circuit board FPC is aligned with the organic light-emitting diode (OLED), and at the same time, the position to be adhered is aligned with the laser emitting portion 800, the force application portion 900 is driven to descend by the third driving device, and the flexible printed circuit board FPC is pressed against the surface of the flexible printed circuit board FPC, and after precise alignment, the upper flexible printed circuit board FPC and the lower organic light-emitting diode (organic light-emitting diode, OLED), curing the insulating glue material of AFC after a period of non-contact heating by the laser beam and pressurization by the force application part 900, and finally forming a stable structure of vertical conduction and transverse insulation. The image and the amplitude of the laser beam can be adjusted and corrected according to the requirement. In some embodiments, a protection pad is disposed at an end of the force application portion 900 close to the worktable 400, so that when the force application portion 900 abuts against the surface of the flexible printed circuit board FPC, the flexible printed circuit FPC is prevented from being damaged.

The selected embodiments of the present invention disclosed above are merely provided to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention.

Claims

1. A panel attaching device characterized by comprising:

a base;

2. The panel bonding apparatus according to claim 1, further comprising a first driving device for driving the pickup portion to ascend and descend.

3. The apparatus of claim 1, further comprising a second driving device, wherein the second driving device drives the adhesive carrier to move linearly back and forth along the side of the base within a predetermined distance.

4. The apparatus of claim 3 wherein a bottom plate is provided at the bottom of the adhesive carrier.

5. The panel laminating apparatus of claim 4 wherein the second actuating means comprises a cam member, the cam member contacting the chassis.

6. The apparatus of claim 1, further comprising a laser emitting portion mounted on the cross frame opposite the other end of the pick-up portion, the emitting side of the laser emitting portion facing the platen.

7. The panel attaching apparatus according to claim 6, further comprising a force applying portion, the force applying portion being mounted on the cross frame and located on one side or both sides of the laser emitting portion, a force applying direction of the force applying portion facing the table and allowing the force applying portion to move in a direction perpendicular to the table.

8. The apparatus of claim 6, wherein the laser emitting portion includes a plurality of laser heads, allowing each of the laser heads to emit a laser beam.

9. The apparatus of claim 1, wherein the pick-up portion is connected to the cross frame by a resilient member.

10. The apparatus of claim 7, wherein a protective pad is disposed at an end of the force applying portion adjacent to the platen.