JP3147664B2 - Surface mount components - Google Patents
Surface mount componentsInfo
- Publication number
- JP3147664B2 JP3147664B2 JP14330394A JP14330394A JP3147664B2 JP 3147664 B2 JP3147664 B2 JP 3147664B2 JP 14330394 A JP14330394 A JP 14330394A JP 14330394 A JP14330394 A JP 14330394A JP 3147664 B2 JP3147664 B2 JP 3147664B2
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- electrode
- view
- electronic component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Description
【０００１】[0001]
【産業上の利用分野】本発明は産業用電気機器および民
生用電気機器に使用され、回路基板に直付けされる面実
装部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component used for industrial electric equipment and consumer electric equipment and directly mounted on a circuit board.
【０００２】[0002]
【従来の技術】近年、面実装部品は電気機器の小型化、
薄型化、軽量化、省電力化に伴い重要な位置づけになっ
てきている。2. Description of the Related Art In recent years, surface mount components have become smaller in electrical equipment,
It has become important as thinner, lighter, and more energy efficient.
【０００３】以下に、従来の面実装部品について説明す
る。Hereinafter, a conventional surface mount component will be described.
【０００４】図３（ａ）（ｂ）は従来の面実装部品の斜
視図および断面図を示すものである。図３（ａ）（ｂ）
において、１は円柱形の電子部品素子、２はキャップ、
３は絶縁被覆樹脂である。キャップ２は、電子部品素子
１の円周面において、電気的および機械的に接続されて
おり、キャップ２そのものが外部電極となる。[0006] FIG. 3 (a) (b) shows a perspective view and a cross-sectional view of a conventional surface mount components. FIGS. 3A and 3B
To Oite, 1 electronic element cylindrical, 2 caps,
3 is an insulating resin. The cap 2 is electrically and mechanically connected on the circumferential surface of the electronic component element 1, and the cap 2 itself becomes an external electrode.
【０００５】図４（ａ）（ｂ）は従来の他の面実装部品
の斜視図および断面図を示すものである。図４（ａ）
（ｂ）において、１は円柱形の電子部品素子、２はキャ
ップ、４は板状の電極、７は成形樹脂である。キャップ
２は、電子部品素子１の円周面において、電気的および
機械的に接続されており、電極４はキャップ２に溶接に
より電気的および機械的に接続されている。電子部品素
子１を覆う角形の成形樹脂７から導出された電極４が外
部電極となる。[0005] FIG. 4 (a) (b) shows a perspective view and a cross-sectional view of another conventional surface mount components. FIG. 4 (a)
(B) in Oite, 1 electronic element cylindrical, 2 caps, 4 the plate-shaped electrode, 7 is a molded resin. The cap 2 is electrically and mechanically connected on the circumferential surface of the electronic component element 1, and the electrode 4 is electrically and mechanically connected to the cap 2 by welding. The electrodes 4 derived from the square molding resin 7 that covers the electronic component element 1 become external electrodes.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記の従
来の第１の構成では、形状が円柱形であるため実装時に
転がりやすく不安定である。また、従来の第２の構成で
は従来より多く使用されているリード線溶接機を流用で
きず、板状の電極を溶接するための溶接機が必要である
ことから高コストになるという課題を有していた。However, in the above-mentioned first conventional structure, the shape is cylindrical, so that it is easy to roll at the time of mounting and is unstable. Also, the second conventional configuration has a problem that the lead wire welding machine, which is used more frequently than the conventional one, cannot be used, and a welding machine for welding plate-shaped electrodes is required, resulting in high cost. Was.
【０００７】本発明は上記従来の課題を解決するもの
で、実装時に転がりにくい形状の面実装部品を提供する
ことを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a surface-mounted component having a shape that does not easily roll during mounting.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に本発明の面実装部品は、両端に電極キャップを備えた
リードレス型の円柱形電子部品素子と、前記両端の電極
キャップの平面部に取り付けられ、かつその両者の一部
が同一平面上になるように折り曲げられた板状の電極と
を備えた構成としたものである。 In order to achieve the above object, a surface mount component according to the present invention comprises a leadless cylindrical electronic component element having electrode caps at both ends, and a flat portion of the electrode caps at both ends. And a plate-like electrode which is bent so that a part of both of them is on the same plane.
Is provided.
【０００９】[0009]
【作用】この構成によって、電極部が実装平面上に安定
して乗るので実装時に転がりにくい形状を得ることがで
きる。[Effect] In this arrangement thus possible electrode portion to obtain stable hard shape rolling during mounting so ride on the mounting plane.
【００１０】[0010]
【実施例】（実施例１） 以下本発明の実施例１について、図面を参照しながら説
明する。図１（ａ），図１（ｂ）は本発明の実施例１に
おける面実装部品の斜視図、断面図を示すものである。
図１（ａ）（ｂ）において、１はリードレス型の円柱形
電子部品素子、２は電極キャップ、３は絶縁被覆樹脂、
４は板状の電極である。両端に電極キャップ２を備えた
リードレス型の円柱形電子部品素子１と、両端の電極キ
ャップ２の平面部２ａに取り付けられ、かつその両者の
一部が図１（ｂ）上の一点鎖線で表わされた同一平面上
になるように折り曲げられた一対の板状の電極４を備え
ている。EXAMPLES For the Examples 1 (Example 1) Hereinafter the present invention will be described with reference to the drawings. FIGS. 1A and 1B are a perspective view and a cross-sectional view of a surface mount component according to a first embodiment of the present invention .
Figure 1 (a) (b) to Oite, 1 cylindrical leadless
Electronic component element, 2 is an electrode cap, 3 is an insulating resin,
Reference numeral 4 denotes a plate-like electrode. A leadless cylindrical electronic component element 1 having electrode caps 2 at both ends, and a flat electronic part 1 attached to the flat portions 2a of the electrode caps 2 at both ends .
There is provided a pair of plate-like electrodes 4 that are partially bent so as to be on the same plane indicated by a dashed line in FIG.
【００１１】この図１（ａ）（ｂ）から明らかなよう
に、本発明の実施例１における面実装部品は、実装面と
して図１（ｂ）上の一点鎖線で表わされた平面を採用す
ると実装面が平面の電極になるため、実装時に転がりに
くい形状を得ることができる。As is apparent from FIGS. 1A and 1B, the surface mounting component according to the first embodiment of the present invention employs a plane indicated by a dashed line in FIG. 1B as a mounting surface. Then, since the mounting surface is a flat electrode, it is possible to obtain a shape that does not easily roll during mounting.
【００１２】（実施例２） 以下本発明の実施例２について、図面を参照しながら説
明する。図２（ａ），図２（ｂ）は本発明の実施例２に
おける面実装部品の斜視図、断面図を示すものである。
図２（ａ）（ｂ）において、１はリードレス型の円柱形
電子部品素子、２は電極キャップ、３は絶縁被覆樹脂、
４は板状の電極で、以上は図１（ａ）（ｂ）の構成と同
様なものである。図１（ａ）（ｂ）の構成と異なるのは
円柱形電子部品素子１の中央部に、コの字形の部品５を
装着し吸着平面部５ａを設けた点である。[0012] For Example 2 (Example 2) Hereinafter the invention will be described with reference to the drawings. FIGS. 2A and 2B show a second embodiment of the present invention.
FIG. 1 shows a perspective view and a cross-sectional view of a surface-mounted component.
In Fig 2 (a) (b), 1 is the lead-less cylindrical
Electronic component element, 2 is an electrode cap, 3 is an insulating resin,
Reference numeral 4 denotes a plate-like electrode, which has the same configuration as that shown in FIGS. What is different from the configuration of FIGS. 1 (a) and 1 (b)
The point is that a U-shaped component 5 is mounted at the center of the columnar electronic component element 1 and a suction flat portion 5a is provided.
【００１３】この図２（ａ）（ｂ）から明らかなよう
に、本発明の実施例２における面実装部品は、実装面が
平面の電極になるため、実装時に転がりにくい形状を得
ることができる。さらに、吸着平面部５ａを設けたた
め、自動実装で一般的に多く使用されている平面吸着ノ
ズル（エアーチャック）に対応でき、実装効率が向上す
るという効果が得られる。As apparent from FIGS. 2 (a) and 2 (b) , the surface-mounted component according to the second embodiment of the present invention has a flat mounting surface, so that it is possible to obtain a shape that does not easily roll during mounting. . Further, since the suction flat portion 5a is provided, it is possible to cope with a flat suction nozzle (air chuck) generally used in automatic mounting, and an effect that mounting efficiency is improved is obtained.
【００１４】[0014]
【発明の効果】以上のように本発明は、実施例１では、
両端に電極キャップを備えたリードレス型の円柱形電子
部品素子と、前記両端の電極キャップの平面部に取り付
けられ、かつその両者の一部が同一平面上になるように
折り曲げられた一対の板状の電極とを備えた構成を有し
ている。As described above, according to the first embodiment of the present invention,
A leadless cylindrical electronic component element having electrode caps at both ends, and a pair of plates attached to the flat portions of the electrode caps at both ends and bent so that a part of both of them is on the same plane; And an electrode having a shape of a circle .
【００１５】実施例２では、請求項１記載の面実装部品
の円柱形電子部品素子の中央部に、コの字形の部品を装
着し吸着平面部を設けた構成を有している。In a second embodiment, a U-shaped component is mounted at the center of the cylindrical electronic component element of the surface mount component according to the first aspect, and a suction flat portion is provided.
【００１６】この構成によって、電極部が同一平面上に
なるため、実装時に転がりにくい形状を得ることができ
る。According to this configuration, since the electrode portions are on the same plane, a shape that does not easily roll during mounting can be obtained.
【００１７】また、真空チャックの平面吸着ノズルを用
いて実装できるため、人手をかけずに製造ができるもの
である。Further, since the mounting can be performed by using the flat suction nozzle of the vacuum chuck, the manufacturing can be performed without manual operation.
【図１】 （ａ）本発明の実施例１における面実装部品の斜視図 （ｂ）同面実装部品の断面図[1] (a) a perspective view (b) cross-sectional view of the surface mount component surface mounted components in Example 1 of the present invention
【図２】 （ａ）本発明の実施例２における面実装部品の斜視図 （ｂ）同面実装部品の断面図[2] (a) a perspective view (b) cross-sectional view of the surface mount component surface mounted components in Example 2 of the present invention
【図３】 （ａ）従来の面実装部品の斜視図 （ｂ）従来の面実装部品の断面図FIG. 3A is a perspective view of a conventional surface mount component. FIG. 3B is a cross-sectional view of a conventional surface mount component.
【図４】 （ａ）従来の他の面実装部品の斜視図 （ｂ）従来の他の面実装部品の断面図FIG. 4A is a perspective view of another conventional surface mount component. FIG. 4B is a cross-sectional view of another conventional surface mount component.
１ 円柱形電子部品素子 ２ 電極キャップ ３ 絶縁被覆樹脂 ４ 電極 ５ コの字形の部品 DESCRIPTION OF SYMBOLS 1 Cylindrical electronic component element 2 Electrode cap 3 Insulating coating resin 4 Electrode 5 U-shaped part
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 平３−1402（ＪＰ，Ｕ) 実開 平４−4701（ＪＰ，Ｕ) 実開 平５−95001（ＪＰ，Ｕ) 実開 昭63−134504（ＪＰ，Ｕ) 実開 昭64−13718（ＪＰ，Ｕ) 実公 昭56−25280（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.7，ＤＢ名) H01C 1/00 - 1/16 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A 3-1402 (JP, U) JP-A 4-4701 (JP, U) JP-A 5-95001 (JP, U) JP-A 63- 134504 (JP, U) Shokai 64-13718 (JP, U) Shoko 56-25280 (JP, Y2) (58) Fields investigated (Int. Cl. 7 , DB name) H01C 1/00-1 / 16
Claims (2)
型の円柱形電子部品素子と、前記両端の電極キャップの
平面部に取り付けられ、かつその両者の一部が同一平面
上になるように折り曲げられた一対の板状の電極とを備
えた面実装部品。1. A leadless cylindrical electronic component element having electrode caps at both ends, and bent so as to be attached to the plane portions of the electrode caps at both ends and both of them to be on the same plane. And a pair of plate-shaped electrodes.
平面部を有するコの字形の部品を取り付けてなる請求項
１記載の面実装部品。2. A surface mount component according to claim 1, wherein a U-shaped component having a suction flat portion is attached to a central portion of the cylindrical electronic component element .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14330394A JP3147664B2 (en) | 1994-06-24 | 1994-06-24 | Surface mount components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14330394A JP3147664B2 (en) | 1994-06-24 | 1994-06-24 | Surface mount components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0817603A JPH0817603A (en) | 1996-01-19 |
| JP3147664B2 true JP3147664B2 (en) | 2001-03-19 |
Family
ID=15335627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14330394A Expired - Fee Related JP3147664B2 (en) | 1994-06-24 | 1994-06-24 | Surface mount components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3147664B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321407A (en) * | 1997-05-23 | 1998-12-04 | Murata Mfg Co Ltd | Surface-mount electronic components |
| JP2003086401A (en) * | 2001-06-25 | 2003-03-20 | Hokuriku Electric Ind Co Ltd | Surface-mounted electrical component and manufacturing method therefor |
| JP2007081238A (en) * | 2005-09-15 | 2007-03-29 | Teikoku Tsushin Kogyo Co Ltd | Surface mount type electronic component and its carrier tape |
| JP7319811B2 (en) * | 2019-04-01 | 2023-08-02 | Koa株式会社 | Resistor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5625280Y2 (en) * | 1976-03-30 | 1981-06-15 | ||
| JPS63134504U (en) * | 1987-02-24 | 1988-09-02 | ||
| JPS6413718U (en) * | 1987-07-15 | 1989-01-24 | ||
| JPH031402U (en) * | 1989-05-22 | 1991-01-09 | ||
| JPH044701U (en) * | 1990-04-24 | 1992-01-16 | ||
| JPH0595001U (en) * | 1992-06-02 | 1993-12-24 | 三洋電機株式会社 | Chip-shaped electronic component |
-
1994
- 1994-06-24 JP JP14330394A patent/JP3147664B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0817603A (en) | 1996-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3723684B2 (en) | Large current noise filter | |
| JP3147664B2 (en) | Surface mount components | |
| KR20080052407A (en) | Electrolytic condenser | |
| JPS60245116A (en) | Electronic part | |
| JP3191485B2 (en) | Terminal for speaker | |
| US6545855B1 (en) | Low inductance termination for electronic components | |
| JPH0462912A (en) | Electrolytic capacitor | |
| JPH0323825Y2 (en) | ||
| JPH058657Y2 (en) | ||
| JP2655629B2 (en) | Chip type solid electrolytic capacitor | |
| JPH0729617Y2 (en) | Coil device | |
| JPH0817602A (en) | Surface mount component | |
| JPH0424845B2 (en) | ||
| JPH0629161A (en) | Manufacture of chip type electrolytic capacitor | |
| CA2344076C (en) | Surface mounting surge absorber and surface mounting cap for surge absorber | |
| JP2000306710A (en) | Electronic component | |
| JPH113696A (en) | Terminal for battery | |
| JPH0238388Y2 (en) | ||
| JPS6042811A (en) | Electronic part | |
| JP2626770B2 (en) | Solid electrolytic capacitors | |
| JPH0419695B2 (en) | ||
| JPS6134216B2 (en) | ||
| JPH0331069Y2 (en) | ||
| JPH0770376B2 (en) | Method of manufacturing resistance substrate for variable resistor | |
| JP2841342B2 (en) | Electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080112 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090112 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090112 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100112 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |