JP3147498U - Lighting device - Google Patents

Abstract

Provided is a lighting device that can utilize direct light and indirect light by using an insulating substrate and a reflecting plate on which a plurality of LEDs are arranged.
An illuminating device 1 comprising an LED and a reflecting plate 3, an insulating base on which a plurality of LEDs are arranged, a high thermal conductive metal plate 4 to which the insulating substrate is attached, and the metal plate are held. And a reflection plate 3 that is detachably attached to the apparatus body 2 and faces the LED arrangement surface of the insulating substrate on which the plurality of LEDs are arranged, and reflects the light of the LEDs.
[Selection] Figure 1

Description

  The present invention relates to an illuminating device, and particularly to an illuminating device that uses an insulating substrate and a reflecting plate on which a plurality of LEDs are arranged, and that uses direct light from the LED and indirect light from the reflecting plate.

  In recent years, various lighting devices using LEDs have been proposed and commercialized. Unlike conventional light source configurations, LEDs have a long life and low power consumption.

  As an LED illumination light source that uses this feature, there is an LED module in which a plurality of LED bare chips are mounted on a substrate at a high density, and the surface of the LED bare chips is covered with a light transmitting resin (see Patent Document 1). Also, a three-dimensional insulating base having a main surface substantially opposite to a predetermined irradiation range, and a tapered surface formed with a predetermined taper on the back side of the main surface and invisible from the predetermined irradiation range The direct illumination LED provided on the main surface of the insulating base material, the indirect illumination LED provided on the tapered surface, and the LED light emitted from the indirect illumination LED are incident on the material, and predetermined irradiation is performed. There is also an LED lamp made of a reflecting plate that reflects toward the range (see Patent Document 1).

JP 2003-124528 A JP 2008-91238 A

  However, the technique proposed in Patent Document 1 is an LED module in which a plurality of LED bare chips are mounted on a substrate at a high density, and provides an illumination light source that is easy to attach and detach with a connector and takes heat dissipation into consideration. However, no specific proposal has been made regarding an illumination device using a reflector. Moreover, although the technique described in patent document 2 implement | achieves direct illumination and indirect illumination with a single light source, it was not the structure which considered heat dissipation.

  In view of the above problems, the present inventor uses an insulating substrate and a reflecting plate on which a plurality of LEDs are arranged to make effective use of the direct light of the LED and the indirect light by the reflecting plate, and effectively uses a highly thermally conductive metal plate. It came to provide the illuminating device which can use and efficiently radiate the heat | fever which generate | occur | produces from LED.

  For this reason, the illuminating device of the present invention is an illuminating device composed of LEDs and a reflecting plate, and includes an insulating base on which a plurality of LEDs are arranged, a high thermal conductive metal plate to which the insulating substrate is attached, and the metal. An apparatus main body that holds a plate, and a reflection plate that is detachably attached to the apparatus main body and faces the LED arrangement surface of the insulating substrate on which the plurality of LEDs are arranged, and reflects the light of the LEDs. It is characterized by.

  The high thermal conductivity metal plate is formed by bending a flat plate into a V shape, and holding the open side of the V shape below the device body, and an insulating substrate on which the plurality of LEDs are arranged. It is characterized by being attached to both sides of the outside.

  The high thermal conductivity metal plate is formed by bending a flat plate into a polygonal column shape, and is separated and held by holding members attached to both ends of the polygonal column shape below the apparatus main body. An insulating substrate on which the LEDs are arranged is attached to the outer surface of the polygonal column.

  As the insulating substrate used in the present invention, it is desirable that an electric circuit is formed on an insulating substrate made of aluminum or iron as a base material.

  According to the present invention, since the insulating base on which the plurality of LEDs are arranged and the high thermal conductive metal plate are attached, the heat generated by the LEDs can be efficiently radiated.

  In addition, since the high thermal conductive metal plate is formed by being bent into a V shape or a polygonal shape, it has an effect that the heat radiating surface area becomes very large with respect to a device to be installed.

  In addition, a reflection plate is attached to the main body of the device so as to face the LED arrangement surface of the insulating substrate on which a plurality of LEDs are arranged, so that direct light from the LED and indirect light from the reflection plate can be efficiently used. it can.

  Hereinafter, although this invention is demonstrated, referring drawings which show an Example, it cannot be overemphasized that this invention is not limited to a present Example. FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a front explanatory view of FIG. 1, FIG. 3 is an explanatory view showing an LED substrate, and FIG. 4 is a perspective view showing another embodiment.

  As shown in FIG. 1 and FIG. 2, the lighting device 1 of the present invention includes a device main body 2 composed of a metal casing having an open upper portion, and a circular arc shape in a side view attached to the lower portion of the device main body 2 with bolts. A highly heat-conductive metal plate 4 formed by bending a metal plate such as aluminum, and a triangular prism shape, and three LED substrates 5 attached to substantially the center of the outer surface of the metal plate 4. Then, the plurality of LEDs arranged on the surface of the LED substrate 5 are driven by the power supply from the power supply device 6 to emit light.

  The reflector 3 is formed by coating the surface of the aluminum plate with high-purity titanium and silicon so that the reflectance is 90% or more, and is formed into an arc shape when viewed from the side, and is attached to the lower surface of the apparatus body 2 with bolts. It attaches possible and reflects the light which LED7 mentioned later light-emits efficiently.

  The high thermal conductive metal plate 4 is made of a metal plate having excellent thermal conductivity such as aluminum or copper, and is formed in a triangular prism shape having an outer surface larger than an area to which an LED substrate 5 described later can be attached. It is welded after being bent by a bending machine. And the holding member 8 connected with the both ends of the said apparatus main body 2 at the longitudinal direction is attached to the both ends of the high heat conductive metal plate 4, and the space | interval of the high heat conductive metal plate 4 and the apparatus main body 2 is established by the long hole 9. It is adjusted and attached, and can be rotated around the bolt 13 by a connecting portion 12 and a bolt 13 extending from the center of the end of the high thermal conductive metal plate 4.

  As shown in FIG. 3, the LED substrate 5 has a circuit pattern (not shown) formed on an insulating substrate 9 having an insulating layer formed on the surface of a metal base, and the LED 7 is mounted via a connecting metal paste. It is configured. And it attaches to the outer surface of three surfaces of the said heat conductive metal plate 4 with a volt | bolt, respectively, and is connected with the power supply device 6 mentioned above via the connector 10. FIG. A transparent cover 11 for preventing damage to the LEDs 7 is attached to the top of the LED substrate 5.

  The lighting device of the present invention having the above-described configuration attaches an insulating substrate on which a plurality of LEDs are arranged on the outer surface of a highly thermally conductive metal plate formed in a triangular prism shape, and causes the LEDs to emit light by power feeding from the power supply device. Therefore, the heat generated with the light emission of the LED can be efficiently radiated through the high thermal conductive metal plate, and deterioration of the LED and peripheral circuits due to heat can be prevented. And since the reflecting plate is attached facing the insulating substrate surface in which LED is arrange | positioned, the light which LED emitted can be reflected efficiently and can be supplied as indirect light. In the present embodiment, an example of using a highly heat conductive metal plate formed in a triangular prism shape has been described, but a polygonal shape of a square or more may be used.

  Next, another embodiment of the present invention will be described with reference to FIG. In addition, the LED board of a present Example is equivalent to said Example, and description is abbreviate | omitted.

  As shown in the figure, the lighting device 1 of the present invention is formed into a substantially V-shape by bending a device body 2 composed of a metal housing with an open top and a metal plate such as aluminum. A highly heat conductive metal plate 4 attached to the open side of the shape and the lower part of the apparatus main body 2 by bolts, two LED boards 5 attached to the approximate center of the outer surface of the metal plate 4, It comprises a pair of reflectors 3 mounted opposite to the surface on which the LEDs are arranged, and the LED 7 on the LED substrate 5 is driven by the power supply from the power supply device 6 to emit light.

The reflection plate 3 is formed by coating the surface of the aluminum plate with high-purity titanium and silicon so that the reflectivity is 90% or more, and is formed in a polygonal shape when viewed from the side. It superposes | stacks with the high heat conductive metal plate 4, and is attached so that attachment or detachment is possible with a volt | bolt.

  The metal plate 4 having high thermal conductivity such as aluminum or copper is used as the high thermal conductive metal plate 4 and has an outer surface larger than the area where the LED substrate 5 can be attached and is formed in a V shape. It is formed by leaving an edge portion that is bent by a bending machine and connected to the apparatus main body 2 described above.

  The illuminating device of the present invention having the above-described configuration is provided with an insulating substrate having a plurality of LEDs disposed on the outer surface of a V-shaped high thermal conductive metal plate, and the LEDs are fed by power supply from the power supply device. Since light is emitted, the heat generated along with the light emission of the LED can be efficiently radiated through the high thermal conductive metal plate, and deterioration of the LED and peripheral circuits due to heat can be prevented. And since the reflecting plate is attached facing the insulating substrate surface in which LED is arrange | positioned, the light which LED emitted can be reflected efficiently and can be supplied as indirect light.

  As mentioned above, according to the illuminating device of the present invention, the reflection plate is attached to face the LED arrangement surface of the insulating substrate on which the plurality of LEDs are arranged, and efficient direct light from the LED and indirect light from the reflection plate can be obtained. While being able to utilize, since the insulating base | substrate which has arrange | positioned several LED and the high heat conductive metal plate were attached, the heat | fever which LED generate | occur | produces can be thermally radiated efficiently.

It is explanatory drawing which shows one Example of the illuminating device which concerns on this invention. It is front explanatory drawing of FIG. It is explanatory drawing which shows a LED board. It is explanatory drawing which shows another Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Illuminating device 2 Apparatus main body 3 Reflecting plate 4 High heat conductive metal plate 5 LED board 6 Power supply device 7 LED
8 Holding member 9 Long hole 10 Connector 11 Transparent cover 12 Connecting part 13 Bolt

Claims (3)

  An illuminating device comprising an LED and a reflecting plate, an insulating base on which a plurality of LEDs are arranged, a highly thermally conductive metal plate to which the insulating substrate is attached, a device main body for holding the metal plate, and the device An illuminating device, comprising: a reflection plate that is detachably attached to a main body, is opposed to an LED arrangement surface of an insulating substrate on which the plurality of LEDs are arranged, and reflects light of the LEDs.   The high thermal conductivity metal plate is formed by bending a flat plate into a V shape, and the open side of the V shape is held below the device main body, and the insulating substrate on which the plurality of LEDs are arranged is disposed on both outer surfaces. The lighting device according to claim 1, wherein the lighting device is attached to the lighting device.   The high thermal conductivity metal plate is formed by bending a flat plate into a polygonal column shape, and is held apart by holding members attached to both ends of the polygonal column shape below the device body, and the plurality of LEDs The illuminating device according to claim 1, wherein an insulating substrate on which the light is disposed is attached to an outer surface of the polygonal column.

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