JP3145190B2 - Method for manufacturing sensor element with bracket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to a manufacturing method of the bracket with the sensor element to the bracket on the back surface of the insulating substrate and the electrodes and the sensor film is formed on the surface is formed by bonding.

[0002]

2. Description of the Related Art FIGS. 5A and 5B show a plan view and a side view of a conventional sensor element with a bracket such as a humidity sensor or a dew sensor. In these figures, reference numeral 1 denotes an insulating substrate; A pair of electrodes 2 and 2 and a sensor coating 3 are formed on the insulating substrate 1. The sensor coating 3 is connected to a pair of electrodes 2, 2, and lead wires 5, 5 having one end connected to a connector 4 are connected to the pair of electrodes 2, 2 by soldering. A bracket 6 is adhered to the back surface of the insulating substrate 1 with an adhesive. The width dimension W1 of the bracket 6 is larger than the width dimension W2 of the insulating substrate 1, and the width direction end of the bracket 6 projects outside beyond the width direction end of the insulating substrate 1. Bracket 6
Is formed with a through hole 7.

[0003] In the conventional method of manufacturing the sensor element with the bracket, the bracket 6 is individually bonded to the back surface of the insulating substrate 1.

[0004]

As in the conventional manufacturing method, when the brackets are bonded to the insulating substrate 1 one by one, it takes a long time to perform the bonding operation, and as a result, the price of the sensor element increases. In addition, in the case of a characteristic test or the like performed after the bracket 6 is adhered to the insulating substrate 3, if the sensor elements are not handled carefully, the sensor elements rub against each other to damage the sensor coating, resulting in poor product yield. There was a problem.

An object of the present invention is to provide a method of manufacturing a sensor element with a bracket, which allows easy attachment of a bracket and is inexpensive.

Another object of the present invention is to provide a method for manufacturing a bracket-attached sensor element capable of improving the product yield.

[0007]

According to the first aspect of the present invention, a sensor element with a bracket is formed by forming an electrode and a sensor coating connected to the electrode on the surface of an insulating substrate and bonding a bracket to the back surface of the insulating substrate. The method is intended for manufacturing. First, a bracket connection body is prepared in which a plurality of bracket pieces arranged at predetermined intervals from each other so as to form a row are connected to a connection portion. Then, the back surface of the sensor assembly board is bonded to the bracket connector. The sensor assembly substrate includes a plurality of sensors each including an electrode and a sensor coating connected to the electrode.
The elements are formed on the surface at predetermined intervals. In the present invention, this sensor assembly board is
The element is adhered to the bracket connector so as to correspond to each bracket piece of the bracket connector (adhesion step). Next, the sensor assembly substrate is separated into a plurality of insulating substrates along the separation portion of the sensor assembly substrate located outside the width direction of each bracket piece for separating the bracket piece from the connecting portion (separation step). In addition, the separation of the bracket piece and the separation of the sensor assembly board may be performed in one of them at once and the other may be performed later.
After separating one insulating substrate or one bracket piece, the corresponding bracket piece or insulating substrate may be separated, and the order and mode of separation are arbitrary. When manufacturing chip components, it is not necessary to connect lead wires.However, when connecting lead wires by soldering, solder the lead wires to each electrode of the sensor assembly board before or after the bonding process. Is preferred.

According to the second aspect of the present invention, a separation groove is formed between the bracket piece and the connection portion of the bracket connection body.

According to the third aspect of the present invention, positioning pieces used for positioning the sensor assembly board are provided on both sides of the row of the plurality of bracket pieces of the bracket connection body. The positioning piece is provided with a positioning engagement portion that engages with the sensor assembly substrate.

[0010]

According to the manufacturing method of the first aspect of the present invention, the sensor assembly board is adhered to the bracket connector so that each sensor element corresponds to each bracket piece of the bracket connector, and then the bracket piece is removed. By separating the sensor assembly board along the cut-off portion of the sensor assembly board located outside the width direction of each bracket piece while separating from the connecting part, the work of bonding a plurality of brackets to the insulating board once Can be done. In addition, since the plurality of sensor elements can be treated as substantially one until the separation operation is performed, the manufacturing time of the sensor elements can be reduced, and
Automation of work becomes easy, and a sensor element can be provided at low cost. Further, the sensor coating is less likely to be damaged by a necessary operation before the separating operation.

According to the second aspect of the present invention, if a separating groove is formed between the bracket piece and the connecting portion of the bracket connecting body, the work of separating the bracket piece becomes very easy.

According to the third aspect of the present invention, when the positioning pieces provided on both sides of the row of the plurality of bracket pieces are provided with positioning engaging portions for engaging with the sensor assembly board, the positioning of the sensor assembly board with respect to the bracket joint body is provided. Work becomes easier.
Note that the positioning engagement portion can be easily formed by punching, cutting and raising, bending, and the like.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 (A) and 1 (B) are a plan view and a side view of a sensor element with a bracket in which the present invention is applied to a dew sensor, and FIG. 5 shows parts similar to those of the conventional sensor element shown in FIG. The reference numeral obtained by adding 10 is attached. In these figures, reference numeral 11 denotes an alumina insulating substrate, and a pair of electrodes 12 and
The sensor coating 13 is formed between the pair of electrodes. Lead wires 15, 15 each having one end connected to the connector 14 are connected to the pair of electrodes 12, 12.
Are connected by soldering. A bracket 16 made of aluminum is adhered to the back surface of the insulating substrate 1 with an epoxy adhesive. This bracket 16 is provided for fixing the sensor element, and a mounting screw is inserted into a through hole 17 provided at one end in the longitudinal direction. The width W1 of the bracket 16 is equal to the width W2 of the insulating substrate 11.
The widthwise end of the bracket 16 is adhered to the back surface of the insulating substrate 11 so as not to exceed the widthwise end of the insulating substrate 11.

Next, an embodiment of a method for manufacturing the sensor element shown in FIG. 1 will be described. 2A to 2C show a plan view, a right side view, and a front view of the bracket connector 101 used in this embodiment. Bracket connector 101
Is a connecting portion 104 including a straight portion 102 and twelve projecting pieces 103 projecting from one side in the width direction of the straight portion 102.
And positioning pieces 105 and 106 connected to the two projecting pieces 103 on both sides, and ten projecting pieces 10 at the center.
.. Are connected to ten bracket pieces 107. The bracket connecting body 101 is formed integrally by punching, but the connecting portion of the protruding piece 103, the positioning pieces 105, 106 and the bracket piece 107 has a V-shaped cross section on both sides in the thickness direction. Groove g is formed. Each groove g is formed along the straight portion 101 of the connecting portion 104, and each piece can be relatively easily connected to the connecting portion 1 by an operator applying a certain force with a finger.
04 can be separated. Positioning piece 10
Each of 5 and 106 has a projection p at a position corresponding to the vertex of a triangle. These protruding projections p constitute a positioning engagement portion that facilitates positioning of the sensor assembly substrate on the bracket connector 101 when the sensor assembly substrate described later is bonded to the bracket connector 101. The bracket pieces 107 are attached to the protruding pieces 103 so as to form a row with substantially equal intervals between them.

After fixing the bracket connecting member 101 to a jig (not shown), the sensor assembly substrate 108 is bonded to the bracket connecting member 101 as shown in FIGS. 3A and 3B. In FIG. 3, the sensor assembly substrate 108
Since the mask sheet 109 is stretched over this, the coating pattern is not shown, and only the electrodes 12 are shown. The sensor assembly substrate 108 is formed by forming a plurality of sensor elements formed of electrodes and a sensor coating connected to the electrodes at predetermined intervals on the surface of an elongate substrate made of alumina. A V for separating from the surface side of the substrate along the separating portions 110 between the elements;
A groove is formed. Like the groove g formed in the bracket coupling body 101, the groove is formed to such an extent that an operator can relatively easily separate the insulating substrate by hand. The grooves formed along the separating portions 110 are:
The sensors extend in the width direction of the sensor assembly board 108 and are provided at substantially equal intervals L in the longitudinal direction. The distance L is set to be substantially equal to the distance between the central axes of the bracket pieces 107. Thus, the insulating substrate can be separated without any trouble. The sensor assembly substrate 108 is bonded by applying an epoxy-based adhesive to the back surface of the sensor assembly substrate 108. Needless to say, the adhesive may be applied to the bracket connecting portion 101 to perform the bonding.

Here, referring to FIG.
A brief description will be given of a method of manufacturing the device. First, using a large ceramic substrate S having a grid-shaped separation groove formed on the surface as shown in FIG. 4A, electrodes and a sensor coating are formed in each of the grids by a known method. Attach a mask sheet that can be easily separated as shown in FIG.
FIG. 4B shows a state in which masking has been performed. After completion of the masking, the sensor substrates 108 are formed by dividing each ceramic substrate S for each row. In the example of FIG.
The illustration of the electrodes and the sensor coating is omitted. In the example of FIG. 3, the sensor element is also formed on the insulating substrate adhered to the positioning pieces 105 and 106, but when forming the coating of the sensor element on the ceramic substrate S, the positioning piece is formed. It is a matter of course that a film may not be formed in advance on the portions adhered to 105 and 106.

After the bonding is completed, in this embodiment, the lead wires 15 shown in FIG. 1 are soldered to the electrodes 12 of each sensor element. Of course, the soldering of the lead wires may be performed before the bonding operation. After soldering, a cleaning operation is performed to remove the flux. After cleaning work,
The mask sheet 109 is peeled off, and an electrical characteristic test is performed on each sensor element. In the characteristic inspection, the inspection work is easy because the sensor elements are connected. After the inspection, the bracket piece 107 and the sensor assembly board 108 are separated. In this embodiment, since the separation groove g is provided in both the bracket connecting body 101 and the sensor assembly board 108, the separation operation can be easily performed manually. In the present embodiment, since the separating operation can be performed manually, the possibility of damaging the sensor coating by the separating operation is greatly reduced, and the yield of products can be improved. It is needless to say that the separating operation can be performed by using a known cutting means without providing the separating groove.

In the above-described embodiment, the bracket connector having one row of bracket pieces is used. However, rows of bracket pieces may be provided on both sides in the width direction of the linear portion 102 of the bracket connector 101. The shape and structure of the bracket connection body are arbitrary.

Further, in the above embodiment, the bracket assembly is fixed to the jig first, and the sensor collecting board is adhered to the bracket assembly afterward. However, the sensor assembly board is fixed to the jig, and the bracket is assembled later. Needless to say, the connection body may be bonded to the sensor assembly substrate. The sensor assembly board also
The sensor unit is not limited to the one in which the sensor units are arranged in one row as in the above embodiment. And so on.

[0020]

According to the manufacturing method of the first aspect of the present invention, since the operation of bonding the brackets to a plurality of insulating substrates at once can be performed at a time, the operation of bonding the brackets becomes easy, and the separating operation can be performed. Until the operation is performed, a plurality of sensor elements can be treated as substantially one, so that the manufacturing time of the sensor elements can be reduced, the operation can be easily automated, and the sensor elements can be provided at low cost. Further, since the sensor elements do not rub against each other, it is possible to prevent the sensor coating from being damaged, and it is possible to greatly improve the yield of products.

According to the second aspect of the present invention, there is an advantage that the work of separating the bracket pieces becomes very easy.

According to the third aspect of the present invention, there is an advantage that the work of positioning the sensor assembly board with respect to the bracket connection body is facilitated.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a side view of a sensor element with a bracket in which the present invention is applied to a dew sensor.

FIGS. 2A to 2C are a plan view, a right side view, and a front view of a bracket connector used in the embodiment.

FIGS. 3A and 3B are a plan view and a right side view of a state where a sensor assembly board is bonded to a bracket connection body.

FIGS. 4A to 4C are diagrams for explaining a method of manufacturing a sensor assembly substrate.

5 (A) and (B) are a plan view and a side view of a conventional sensor element with a bracket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1,11 Insulating board 2,12 Electrode 3,13 Sensor coating 4,14 Connector 5,15 Lead wire 6,16 Bracket 7,17 Through hole 101 Bracket connection body 102 Straight part 103 Projection piece 104 Connection part 105,106 Positioning piece 107 Bracket piece 108 Sensor assembly board 109 Mask sheet 110 Separation part g Separation groove

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields investigated (Int. Cl. ⁷ , DB name) G01N 27/00-27/49 G01K 1/00-19/00

Claims (3)

(57) [Claims] 1. A method of manufacturing a sensor element with a bracket, comprising: an electrode and a sensor coating connected to the electrode formed on a surface of an insulating substrate, and a bracket attached to a back surface of the insulating substrate. A step of preparing a bracket connection body in which a plurality of bracket pieces arranged at a predetermined interval from each other are connected to the connection portion, and a plurality of electrodes comprising an electrode and a sensor coating connected to the electrode. A back surface of a sensor assembly substrate having sensor elements formed on the front surface at predetermined intervals is bonded to the bracket connector so that each sensor element corresponds to each bracket piece of the bracket connector. Bonding, separating the bracket piece from the connecting portion, and separating the sensor assembly board located outside the width direction of each bracket piece. A separating step of separating the sensor assembly substrate into a plurality of insulating substrates along a portion. 2. A method of manufacturing a bracket with the sensor element according to claim 1, disconnecting grooves are formed between the bracket piece and the connecting portion of the bracket coupling body. 3. The bracket coupling body has positioning pieces used for positioning the sensor assembly board on both sides of the row of the plurality of bracket pieces, and the positioning piece engages with the sensor assembly board. The method for manufacturing a sensor element with a bracket according to claim 1 or 2 , further comprising an engaging portion.