JPH0447887B2 - - Google Patents

Description

Detailed Description of the Invention (Technical Field) The present invention relates to a thin film magnetic head, and in particular to an improvement in the structure of a thin film magnetic head having a head chip formed by forming a magnetic material and an electrode material on a substrate by a thin film deposition method. It is related to.

(Description of the prior art) Thin film magnetic heads are generally produced by sputtering, vapor deposition, etc. a magnetic thin film made of a magnetic material such as sendust or permalloy and a conductive film made of a conductive material such as Au, Cu, Al, etc. on a substrate made of ferrite or the like. It is formed by a thin film deposition method, and these thin films are appropriately shaped by a process such as photoetching to form a magnetic circuit and an electric circuit in a predetermined pattern.

In order to connect the electrode portion of this electric circuit to an external electrode, a structure as described below has conventionally been used.

FIG. 1 is a diagram showing a general thin film magnetic head chip. In Fig. 1, 2 is a substrate on which a magnetic circuit and an electric circuit are formed by film formation and film shaping, 4 is a protection plate pasted to the substrate 2, 6 is an electrode part of the electric circuit, and 8 is a substrate formed by grinding, wrapping, etc. This is the formed media sliding surface.

FIG. 2 is a perspective view showing the structure of a conventional thin film magnetic head, and FIG. 3 is a sectional view thereof. In FIG. 2, 12 is a chip holder to which the head chip 10 shown in FIG. 1 is bonded with adhesive, and 13 is a flexible printed circuit board bonded to the chip holder 12.
This is an FPC, and the electrodes 11 on the FPC 13 and the electrodes on the head chip 10 are arranged so as to be closely aligned on the same plane.

The distance between these two electrodes 6 and 11 is as shown in FIG.
The wires are connected by ultrasonic bonding of thin wires 14 made of Al, Au, etc. At this time, if there are a plurality of electrodes as shown in the figure, wire bonding is performed sequentially for each electrode. 15 is an elastic adhesive such as Si resin, which covers the wire bonding portion. At the rear of FPC13 there is a rubber-like
The other chip holder 16 is overlapped with the FPC holding member 18 in between, and the chip holder 12,
An adhesive 17 is filled and hardened in the gap between the head chip 10 and the chip holder 16 to bond them together.

In the conventional thin film magnetic head having the structure as described above, the pair of electrodes are connected by wire bonding. Therefore, it was necessary to connect each electrode one by one, which required a large number of man-hours.
Furthermore, since it requires minute connections, it is difficult to automate using a microscope. Furthermore, the wire 14 is very thin and easily breaks, resulting in poor reliability, and for this reason, a coating material such as Si resin is required. Furthermore, since the adhesive strength of the wire bonding part is weak, FPC
There were various drawbacks such as the necessity of securely fixing the 13 parts.

(Object of the Invention) The present invention is intended to eliminate all of the above-mentioned drawbacks, and more specifically, to simplify the manufacturing process and structure, and to provide a thin film magnetic head that is inexpensive and highly reliable.

(Explanation based on Examples) The present invention will be described below using Examples. Fourth
Figures A and B show a head chip holder which is a component of a thin film magnetic head according to an embodiment of the present invention.
The figure is a sectional view of the thin film magnetic head of this embodiment.

In the figure, the same components as those in FIG. 3 are given the same numbers, and their explanations are omitted. The head chip holder 21 shown in FIG. 4A is provided with a reference surface 23 for positioning by pressing against the side surface of the medium sliding surface of the head chip 10.
4 (so-called elastic connector) is formed with a step portion 25 for striking when it is pressed and displaced. On the other hand, the head tip holder 22 shown in FIG.
A reference surface 26 for positioning the FPC 13 is provided.

First, the side surface of the head chip 10 is pressed against the reference surface 23 of the head chip holder 21 and bonded with adhesive. Next, attach the FPC13 to the chip holder 22.
Press it against the reference surface 26 and fix it by bonding with adhesive in the same manner. At this time, the reference surface 23 of the holder 21
and the reference surface 26 of the holder 22 are made to coincide.
Then, the holder 21 and the holder 22 are made to face each other, so that the electrode portions of the head chip 10 and the electrode portions of the FPC 13 are opposed to each other, and each electrode corresponds one-to-one with a predetermined gap. Here, elastic connector 2
4 is placed in the gap between both electrodes, and both holders 21, 22
By tightening and connecting the connectors with screws, jigs, etc., the connector 24 is pressed against both electrodes due to its elasticity. At this time, the dimension in which the elastic connector 24 is compressed can be kept constant by the step 25 provided at the rear of the chip holder 21, and variations in contact resistance can be eliminated.

The structure of the thin film magnetic head according to the embodiment of the present invention as described above has the following advantages. First, if the precision of the reference planes 23, 26, the chip 10, and the FPC 13 are made accurate, a large number of electrodes can be reliably connected at once, and the number of man-hours during manufacturing can be greatly reduced. Furthermore, since there is no risk of wire breakage and the contact resistance of the connector is constant, a highly reliable head with uniform characteristics can be obtained. Furthermore, the head chip 10 and the FPC 13 can be fixed using the connector 24, and a coated portion of Si resin or the like is not required, so that manufacturing is simplified and automation of manufacturing can be easily achieved. Furthermore, even if a wire breaks during use after the head is completed, each part can be easily replaced, which is extremely advantageous in terms of maintenance.

(Description of Effects) As described above with reference to the embodiments, according to the present invention, it is possible to obtain a thin film magnetic head that has a simple manufacturing process and structure, is inexpensive, and has high reliability.

[Brief explanation of drawings]

Fig. 1 is a diagram showing a general thin film magnetic head chip, Fig. 2 is a perspective view showing the structure of a conventional thin film magnetic head, Fig. 3 is a sectional view showing the structure of a conventional thin film magnetic head, and Fig. 4 A. , B are perspective views showing a chip holder which is a component of a thin film magnetic head as an embodiment of the present invention, and FIG. 5 is a sectional view showing a thin film magnetic head as an embodiment of the present invention. 2 is a substrate, 6 is an electrode, 10 is a head chip, 1
1 is an electrode, 21 is a first chip holder, 22 is a second chip holder, and 24 is an elastic connector member.

Claims (1)

[Scope of Claims] 1. A head chip formed by forming a magnetic material and a conductive material on a substrate by a thin film deposition method, a first chip holder having a reference surface for positioning the chip, and the first chip holder. a second chip holder, which is provided to face the chip holder and has an electrode facing the electrode of the head chip with a predetermined gap therebetween; A magnetic head comprising: an elastic connector member for electrically connecting both electrodes when connected to a chip holder.