JP3132817B2 - Processing method using focused ion beam - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a fine processing method for performing fine processing using a focused ion beam apparatus.

[Summary of the Invention]

The present invention is a focused ion beam apparatus in which the ion beam current can be changed by the variable multi-aperture, and selects and sets the aperture diameter of the variable multi-aperture according to the size of the region to be processed,
The processing conditions are also selected and set.

[Conventional technology]

Conventionally, when performing fine processing with a focused ion beam device equipped with a variable multi-aperture, in image observation, a small ion beam current is used with an aperture with a small hole diameter, and a peripheral image including the area to be processed is created and processed Irrespective of the size of the region to be processed, the processing is performed by switching to the same ion beam current as when forming an image, or to an aperture having a hole diameter determined for processing.

[Problems to be solved by the invention]

According to the conventional method, the ion beam current to be used is the same regardless of the size of the region to be processed. Therefore, an optimum ion beam current cannot be selected from the size of the region to be processed, and the throughput is not good.

[Means for solving the problem]

According to the present invention, the optimal aperture and the processing conditions are selected from a file in which the optimum aperture diameter is stored in a computer for each of the processing objectives, conditions, and the like according to the size of the processing area, and further set, thereby performing the processing. Throughput could be improved.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a flowchart showing processing steps of a processing method from recognition of a processing area to processing. 1 shows a focused ion beam processing apparatus including a variable multi-aperture.
In the recognition of the processing region in the processing step ST1, a region to be processed is determined and its size is obtained. Next, processing step ST2
If it is determined in the processing mode that the film forming processing is to be performed, the process proceeds to processing step ST3, and the gas gun control system 10 puts the gas gun 9 into the film forming processing state. Next, the process moves to processing step ST4. If it is determined in step ST2 that the etching process is to be performed, the process directly proceeds to processing step ST4. In processing step ST4, each processing mode (film forming processing, etching processing), processing accuracy as processing requirements, type of material to be processed, purpose of processing (wiring,
The optimum aperture diameter corresponding to the size of the correction area is selected from the file for each observation simplification, etc.), and the variable multi-aperture is moved by the variable multi-aperture control system 5 according to the optimum aperture diameter to set the optimum aperture.

Next, the process proceeds to processing step ST5, in which processing conditions (scan speed, processing time, scan pixel interval, etc.) corresponding to the setting conditions and aperture diameter selected from the file are set, and the processing in processing step ST6 is started.

〔The invention's effect〕

According to the present invention, since the optimal aperture can be selected, the optimal ion beam current can be selected, and the processing conditions corresponding to the optimal aperture can be selected, so that for an arbitrary size of the region to be processed, Optimal processing is performed efficiently and throughput is improved.

[Brief description of the drawings]

FIG. 1 is a flowchart of a processing method showing the processing method of the present invention. FIG. 2 is an overall configuration diagram for implementing the processing method of the present invention. DESCRIPTION OF SYMBOLS 1 ... Ion source 2 ... Ion beam 3 ... Lens system 4 ... Variable multi-aperture 5 ... Variable multi-aperture control system 6 ... Computer 7 ... Detector 8 ... Detector control system 9 ... Gas gun 10 ... Gas gun control system 11 ... Sample 12 ... Stage

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) H01J 37/30 H01J 37/09

Claims (1)

(57) [Claims] An ion source for generating an ion beam, a plurality of apertures for limiting the current of the ion beam are provided, a variable multi-aperture capable of selectively using the aperture, and a lens system for focusing the ion beam. A stage for mounting a sample to be processed by the ion beam, a detector for detecting secondary particles generated when the ion beam is irradiated onto the sample, a gas gun for blowing a compound gas, and the variable multi-aperture. In a focused ion beam processing apparatus comprising a computer for controlling the size of the sample surface based on the secondary particles, controlling the spraying of the compound gas from the gas gun, Aperture diameter corresponding to the processing mode of attaching processing or etching processing and processing accuracy as processing requirements And the scanning speed, processing time, and scan pixel interval as processing conditions at that time were stored in the computer, and were stored in accordance with the processing mode and processing requirements together with the size of the processing area to be processed on the sample surface. A processing method using a focused ion beam, wherein an aperture diameter of the variable multi-aperture and processing conditions at that time are selected and set, and the ion beam is scanned and processed.