JP3130845B2 - Semiconductor wafer carrier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer carrier used for storing and storing semiconductor wafers or transporting semiconductor wafers between processes of manufacturing semiconductor devices by processing the semiconductor wafers. .

[0002]

2. Description of the Related Art In a semiconductor device manufacturing factory, semiconductor wafers are stored in a wafer carrier (wafer cassette) and transported between processes for convenience of handling. 2. Description of the Related Art A conventional semiconductor wafer carrier is a container having an open top having a plurality of wafer storage grooves for individually positioning and holding respective semiconductor wafers, as described in Japanese Patent Application Laid-Open No. HEI 3-124043. It is.

[0003] In such a semiconductor wafer carrier whose upper side is opened, dust in the atmosphere easily enters through the upper opening, and there is a possibility that the semiconductor wafer housed inside is contaminated. Therefore, conventionally, Japanese Unexamined Patent Application Publication No. 3-124
As described in Japanese Patent No. 043, in order to prevent contamination of semiconductor wafers in a semiconductor wafer carrier by dust, the semiconductor wafer carrier is accommodated in a wafer carrier accommodating box, and the box is covered and stored. And transport.

[0004] The use of such a wafer carrier accommodating box prevents contamination of semiconductor wafers by dust. However, it is an obstacle to automation of automatic transfer between processes and automatic mounting and dismounting to and from a machine. . That is, the semiconductor wafer is placed at a predetermined position with respect to the wafer carrier, but is not always sufficiently positioned with respect to the wafer carrier storage box. Can not.

For this reason, when carrying out automatic conveyance,
The wafer carrier itself is transported without being housed in the wafer carrier housing box. As described above, in this case, a problem of contamination of the semiconductor wafer due to dust occurs.

In each step, the wafer carrier is taken out of the wafer carrier accommodating box, and the wafer carrier is set in the processing apparatus. In the processing apparatus, the wafer is taken out of the accommodating box to perform the processing. In this case, dust may enter through the upper opening of the wafer carrier between the time when the wafer carrier is removed from the wafer carrier storage box and the time when the wafer is removed from the wafer carrier. In this case, contamination of the semiconductor wafer by the dust may occur. Problem arises.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to eliminate the problem of contamination of semiconductor wafers by dust even when performing automatic transfer or setting a wafer carrier in a processing apparatus in each processing step. It is an object of the present invention to provide a wafer carrier capable of carrying a semiconductor wafer.

[0008]

According to the present invention, as a means for achieving the above object, there is provided a main body for accommodating a semiconductor wafer and a lid attached to the main body so as to be opened and closed. Is provided.

In one embodiment of the present invention, the lid opens and closes an opening formed in an upper part of the main body.

In one aspect of the present invention, a pair of mutually parallel grooves for accommodating the semiconductor wafers one by one for accommodating the semiconductor wafers are formed in a pair of inner surfaces facing each other. .

In one embodiment of the present invention, the groove for accommodating the wafer extends in a direction inclined with respect to the vertical direction.

In one aspect of the present invention, a pair of mutually parallel slide projections for opening and closing with respect to the main body are formed on the lid on a pair of inner surfaces facing each other. A pair of mutually parallel first slide grooves slidably engaged with the slide protrusion and a pair of mutually parallel slide grooves capable of achieving an open state are formed on the main body. Second slide grooves parallel to each other are formed.

In one embodiment of the present invention, the lid has a pair of mutually openable and closable attachments to the main body.
Is formed on the inner surface portion of a pair of opposed parallel sliding grooves in said the body the sliding groove and the first sliding convex portions parallel to each other a pair capable of realizing the slide engagement closed state And a pair of mutually parallel second slide projections which can slide and engage with the slide groove to realize an open state.

In one embodiment of the present invention, the engagement between the slide projection and the first slide groove and the second slide groove or the engagement between the slide groove and the first slide projection and the second slide groove is performed. The engagement with the slide convex portion is configured to slide in a direction inclined with respect to a horizontal plane, and in the closed state and the open state, the lid is biased obliquely downward with respect to the main body by the action of gravity. You.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a state in which a lid is opened in one embodiment of a semiconductor wafer carrier according to the present invention, FIG. 2 is a perspective view showing a state in which the lid is closed, and FIG. It is each perspective view of a lid. In these figures, 2 indicates a main body, and 4 indicates a lid.

The main body 2 has an opening at the top. Of the four upper edges forming the opening, two on the front side and the rear side are horizontal, but two on the right side and the left side extend in the AA 'direction with an inclination with respect to the horizontal plane. And the height gradually decreases toward the back. The pair of right and left outer surface portions of the main body 2 are formed in the AA ′ direction with an inclination with respect to the horizontal plane so as to be parallel to the corresponding opening edges. A first slide groove 21 is formed.

The front outer surface and the rear outer surface of the main body 2 are obliquely parallel to each other in the vertical direction so as to be substantially orthogonal to the two opening edges on the right and left sides. Is formed. The right-side outer surface and the left-side outer surface of the main body 2 are inclined with respect to the vertical direction so as to be parallel to the rear-side outer surface, respectively.
A pair of second slide grooves 22 formed in the direction B 'are formed.

A plurality of pairs of grooves 23 for accommodating wafers are formed in the right side inner surface and the left side inner surface of the main body 2 in parallel with each other in the BB 'direction.

On the other hand, FIG. 3 shows the lid 4 turned upside down.
As can be seen from (b), the rear side is cut away, and the right side inner surface and the left side inner surface are provided with either the first slide groove 21 or the second slide groove 22 of the main body 2. A pair of slide projections 41 that can be adapted to the above are formed.

FIG. 4 is a schematic diagram for explaining the operation of this embodiment.

In FIG. 4A, the slide projection 41 of the cover 4 is adapted to the first slide groove 21 of the main body 2. In this state, the cover 4 is moved in the direction of AA 'to 2 can be mounted in the closed position to achieve the state shown in FIG. 2 above, or the lid 4 can be removed from the closed position shown in FIG. When the lid 4 is attached to the closed position, the lid 4 is moved in the direction of A ′, and when the lid 4 is removed from the closed position,
The lid 4 is moved in the direction of A. In the closed position, the lid 4 is urged by the action of gravity in the direction A ′, that is, obliquely downward with respect to the main body 2. In this state, the lid 4
Are made to abut against corresponding portions of the main body 2 so that the lid 4 is locked at a predetermined position with respect to the main body 2 in the direction of A '.

In FIG. 4B, the slide projection 41 of the cover 4 is adapted to the second slide groove 22 of the main body 2. In this state, the cover 4 is moved in the direction BB 'to 4 can be mounted in the open position to achieve the state shown in FIG. 1 or the lid 4 can be removed from the open position shown in FIG. When attaching the lid 4 to the open position, move the lid 4 in the direction of B ′, and when removing the lid 4 from the open position,
The lid 4 is moved in the direction of B. In the state of the open position, the lid 4 is urged in the direction of B ′, that is, obliquely downward with respect to the main body 2 by the action of gravity. In this state, the lid 4
Are abutted against the corresponding portions of the main body 2 so that the lid 4 is locked at a predetermined position with respect to the main body 2 in the direction of B '.

The storage of the wafer in the wafer carrier and the removal from the wafer carrier are performed in the state shown in FIGS. 1 and 4B.

In the above-described embodiment, as shown in FIG. 4, the inner bottom surface 24 of the main body 2 is parallel to the AA 'direction, and therefore, along the grooves 23 for accommodating each wafer. The distance from the inner bottom surface 24 to the opening is constant.

As described above, in the present embodiment, since the groove 23 for accommodating the wafer is formed obliquely, the wafer is always positioned in the groove 23 by the action of gravity even when the carrier is being transported, so that the vibration occurs. Without having to
Therefore, there is no possibility that the collision with the main body 2 is repeated and the wafer is damaged or dust is generated due to wear.

In the present embodiment, the cover 4 may be used if necessary.
And the lid 4 can be held by the main body 2 while reliably maintaining the lid open state. Since the groove 23 for storing the wafer, the first slide groove 21 and the second slide groove 22 are formed in the main body 2, the operation of storing and taking out the wafer with respect to the main body 2, the opening position of the lid 4, The mounting to the closed position and the removal from these positions can be easily performed by an automatic machine. Thus, without causing the problem of contamination of the semiconductor wafer by dust, the wafer carrier is set in the processing apparatus in each processing step, and the cover 4 is automatically opened only for a minimum necessary time, and automatic transfer is performed. It is possible to do.

In the above embodiment, the first slide groove 21 and the second slide groove 22 are replaced with a first slide protrusion and a second slide protrusion, respectively, and the slide protrusion 41 is replaced with a slide groove. The same effect can be achieved.

Further, in the above embodiment, an example in which the lid 4 is detachable from the main body 2 is shown, but in the present invention, the lid can be opened and closed with respect to the main body as needed. For example, it may be attached irremovably by a hinge or the like.

[0030]

As described above, according to the present invention, since the lid is openably and closably attached to the semiconductor wafer carrier main body, the semiconductor wafer carrier can be automatically transferred without causing a problem of contamination by dust. Other automation can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which a lid is opened in an embodiment of a semiconductor wafer carrier according to the present invention.

FIG. 2 is a perspective view showing a state in which a lid is closed in an embodiment of the semiconductor wafer carrier according to the present invention.

FIG. 3 is a perspective view of a main body and a lid in one embodiment of the semiconductor wafer carrier according to the present invention.

FIG. 4 is a schematic diagram for explaining an operation in one embodiment of the semiconductor wafer carrier according to the present invention.

[Explanation of symbols]

 2 Body 4 Lid 21 First Slide Groove 22 Second Slide Groove 23 Wafer Storage Groove 24 Main Body Inner Bottom 41 Slide Convex

Claims (6)

(57) [Claims] 1. A main body for accommodating a semiconductor wafer, and a lid for opening and closing an opening of the main body, wherein the lid has a pair of mutually parallel sliding protrusions for opening and closing with respect to the main body. Parts are formed on a pair of inner surfaces facing each other, and the main body is slidably engaged with the slide projections to realize a closed state. A pair of mutually parallel second slide grooves formed so as to be able to realize an open state by sliding engagement with a portion. 2. A main body for accommodating a semiconductor wafer and a lid for opening and closing an opening of the main body, wherein the lid has a pair of mutually parallel slide grooves for opening and closing with respect to the main body. Are formed on a pair of inner surfaces facing each other, and the main body is slidably engaged with the slide groove to realize a closed state. A semiconductor wafer carrier comprising a pair of mutually parallel second slide projections which can be slid into engagement to realize an open state. 3. The engagement between the slide projection and the first slide groove and the second slide groove or the engagement between the slide groove and the first slide projection and the second slide projection. In this case, the lid is slid in a direction inclined with respect to a horizontal plane, and in the closed state and the open state, the lid is biased obliquely downward with respect to the main body by the action of gravity. The semiconductor wafer carrier according to claim 1 . Wherein said aperture is characterized in that it is formed in an upper portion of the body, a semiconductor wafer carrier according to claim 1. 5. The semiconductor device according to claim 1, wherein a pair of mutually parallel grooves for accommodating the semiconductor wafers are formed on a pair of opposed inner surfaces of the main body. The semiconductor wafer carrier according to claim 1 . Grooves of wherein for the wafer storage is characterized by extending inclined with respect to the vertical direction direction, the semiconductor wafer carrier according to claim 5.