JP3968142B2 - Support groove structure of semiconductor wafer in packaging container - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a support groove formed in a wafer support member applied to a packaging container for semiconductor wafers, and more specifically, a semiconductor wafer that is fragile and extremely dislikes even slight contamination, especially when transporting the wafer. The present invention relates to a support groove structure capable of maintaining stable positioning and a predetermined posture of the wafer during automatic operation by a robot with respect to a carrier.
[0002]
[Prior art]
A semiconductor wafer packaging container is generally composed of a wafer carrier that houses a plurality of semiconductor wafers, a container body that houses and holds the wafer carrier, a lid, a wafer retainer, and the like. Polypropylene is used as a general material for the wafer carrier and the container body, and the lid is made of polypropylene or polycarbonate. The wafer retainer is made of polypropylene or polyester.
[0003]
The semiconductor wafer is manufactured by thinly slicing a single crystal such as silicon, and since it is highly brittle and has a large effect on the physical properties due to contamination, during packaging and in various processing steps thereafter, Every effort must be made to prevent its breakage and contamination. Therefore, the semiconductor wafer packaging container not only prevents damage to the wafer due to external impact, but also causes contamination by particles generated by friction with the wafer retainer in the container, or outside air due to pressure difference or deformation of the container. It is necessary to avoid contamination due to intrusion. To that end, it is necessary to secure the wafer fixing property when the container is accommodated, avoid contact friction with the wafer retainer, etc., and further toughness and resistance of the container consisting of the container body and the lid. It is strictly required to ensure impact and airtightness.
[0004]
Conventionally, since the maximum diameter of a semiconductor wafer was 8 inches at most, the wafer was accommodated in the wafer carrier and the wafer was taken out from the carrier exclusively. Has occurred, and studies on these issues have been made. Specifically, semiconductor wafers with a maximum diameter of 12 inches (300 mm) have been put into practical use, and in various fields dealing with semiconductor wafers, such as wafer manufacturers, transportation related fields, and device manufacturers, toward the increase in size. Each wafer handling specification has been standardized.
[0005]
Of course, standardization has been considered even in the above-described wafer packaging container, and international standardization has already been determined by SEMI (Semiconductor Equipment and Material International) standards. The basic philosophy of the standardization is to appropriately cope with full automation in various processing processes accompanying the increase in size of semiconductor wafers. In other words, parts that used to be relied on by hand, such as cleaning, printing, cutting, and other processes in device manufacturers, are standardized, leaving the robot to handle all semiconductor wafers in each process for complete automation. Therefore, it is necessary to adapt to the automation even in a wafer packaging container. Incidentally, it is fundamental that a semiconductor wafer carried into a device manufacturer is handled in a horizontal posture in various processing steps of the device.
[0006]
On the other hand, when a semiconductor wafer is housed in a packaging container and transported to a device manufacturer, in order to avoid contamination due to contact friction with a support member such as a wafer carrier due to damage or vibration against impact, transportation of the semiconductor wafer It must be transported with its posture upright, and it must be firmly fixed so that it does not rattle. The transport posture is particularly effective when transporting the above-described semiconductor wafer that is becoming larger. On the other hand, as described above, it is handled in a horizontal posture in the subsequent processing steps.
[0007]
Conventionally, packaging containers for large wafers based on the above-described requirements have been put into practical use. This packaging container is roughly classified into two types, that is, a vertical type and a horizontal type, when the packaging containers developed for large-sized semiconductor wafers are roughly classified. In other words, the vertically mounted wafer packaging container is a storage structure suitable for vertically supporting and storing a semiconductor wafer stored in a wafer carrier and mounting the container body on a mounting table while maintaining its posture. The horizontal type wafer packaging container is a storage suitable for horizontally supporting a semiconductor wafer accommodated in a wafer carrier and placing the container body on a placing table in a state in which the posture is maintained. This type has a structure. Here, the specifications of the wafer carrier are standardized by the SEMI standard, and the basic structure is standardized.
[0008]
FIG. 5 is an exploded perspective view of a vertical type semiconductor wafer packaging container. Reference numeral 1 denotes a container body, 2 denotes a lid body, 3 denotes a wafer carrier housed in the container body 1 and the lid body 2, A wafer retainer 5 attached to the center of the back surface of the lid 2 is attached to the peripheral edge of the container body on the opening side, and a gasket 6 is hermetically sealed when the opening of the container body 1 is closed by the lid 2. It is a clamp and container gripping part that is integrally formed with the container body 1 when the cover body 2 is put on. The structure of this vertical type packaging container is essentially the same as the basic structure of a conventional general wafer packaging container, and is in a support groove formed in parallel with the arc-shaped inner peripheral wall of the wafer carrier 3. A plurality of semiconductor wafers are accommodated and supported, accommodated in the container body 1 in this state, covered with the lid 2 and closed by the clamp 6. A wafer retainer 4 formed with a plurality of support grooves having the same shape as the support grooves is attached to the center of the back surface of the lid body 2, and the container is closed by covering the lid body 2 and engaging the clamp 6. At the same time, the opposing peripheral edges of the plurality of semiconductor wafers accommodated and supported in the support grooves of the wafer carrier 3 are simultaneously pressed into the respective support grooves of the wafer retainer 4 so that the semiconductor wafer in the container is free from rattling. So support firmly.
[0009]
FIG. 6 is an exploded perspective view of a horizontal type semiconductor wafer packaging container. Reference numeral 1 'denotes a container body, 2' denotes a lid, 3 'denotes a wafer retainer 4' and the container body 1 'and lid 2'. A wafer carrier 5 ′ accommodated in the container is attached to the peripheral edge of the container body on the opening side, and is a gasket that hermetically seals when the opening of the container body 1 ′ is closed by the lid 2 ′, and 6 ′ is a container body 1 ′. And a lid 2 ', which is a clamp that seals both. The structure of the horizontal packaging container is different from that of a conventional general vertical wafer packaging container. Usually, the container main body 1 'and the lid 2' are containers for horizontally storing and supporting semiconductor wafers. Is divided into a main body side and a lid side. Therefore, the wafer carrier 3 'is stored horizontally in the container body 1'. However, unlike the vertical type lid 2, the lid 2 ′ does not require a wafer retainer 4 ′ on the back surface, and a wafer retainer on each peripheral side wall of the container body 1 ′ and / or lid 2 ′. When 4 'is attached, the wafer carrier 3' cannot be stored in the container, so that the wafer retainer 4 'is formed separately.
[0010]
Now, in order to accommodate and support semiconductor wafers in this horizontally mounted wafer packaging container, first, a required number of semiconductor wafers are horizontally stored in a wafer carrier 3 'in the same manner as in the vertically mounted type, and then from the wafer carrier 3'. Wafer retainers 4 ′ are respectively engaged with the peripheral surface portions of the corresponding wafer carrier 3 ′ so as to press and support the opposing peripheral edge portions of the exposed wafer. In this state, the wafer carrier 3 ′ is horizontally stored in the container body 1 ′ together with the wafer retainer 4 ′, and the four clamps 6 ′ are put on the container body 1 ′ and the lid body 2 ′ by covering the lid body 2 ′. Engage and seal tightly.
[0011]
It should be noted here that it is a robot that pulls out and inserts the large-diameter semiconductor wafer from the wafer carriers 3 and 3 '. Therefore, the wafer grip portion of this robot is also standardized. For example, when the semiconductor wafer is extracted from the wafer carrier 3, 3 ', the wafer carrier 3, 3 of the grip portion can be moved smoothly without damaging the wafer. The maximum movement range within ′ and the allowable range of grip force are standardized. Corresponding to this standardization, the form of the support groove formed on the wafer carriers 3 and 3 'is also strictly defined in the SEMI standard. According to this rule, the groove width of the support groove is defined to be at least 6 mm wide up to the depth corresponding to the radius of the semiconductor wafer W of 300 mmφ, which is the thickness (0 .775 mm) is about 10 times less.
[0012]
The conventional form of the support groove 7 will be described in detail with reference to FIG. 7. In FIG. 7, the wafer support groove 7 formed in multiple stages in the vertical direction is a wafer mounting on which the edge of the semiconductor wafer W is mounted. The minimum allowable value of the surface 7a is defined, and the dimension R from the accommodation center of the wafer carrier 3, 3 'to the wafer insertion / extraction port 7b of the support groove 7 is from 125 mm in the lateral direction (120 mm in the downward direction). The size from the accommodation center to the groove bottom 7c of the support groove 7 can be set slightly longer by +2 mm than the radius (150 mm) of the semiconductor wafer W. Therefore, when these values are taken into consideration, the depth length of the wafer mounting surface 7a is longer than 2 mm and longer than 27 mm (32 mm in the downward direction) when considering the diameter (300 mm) of the large semiconductor wafer W. Shorter than that. However, conventionally, as shown in the figure, the flat back end of the mounting surface and the half of the groove bottom 7c are connected by a taper surface having a large inclination angle so that the overall cross-sectional shape is nearly rectangular. The depth dimension d1 of the wafer mounting surface 7a is about 10 mm. Further, the dimension d2 between the mounting surfaces 7a of the adjacent support grooves 7 is defined as 10 mm, and the groove width w is defined as 6 mm or more as described above.
[0013]
[Problems to be solved by the invention]
Thus, as described above, when transporting a large-diameter semiconductor wafer, it is effective to support the wafer in a state in which the wafer is erected vertically and transport it while avoiding damage. However, the wafer support groove formed on the wafer support member of the conventional container body, wafer carrier, wafer retainer, etc. has a simple cross section that is almost rectangular as described above, and the groove width is the thickness of the semiconductor wafer. For example, when stored in a vertical packaging container, as shown schematically in FIG. 8 (a), the wafer carrier tends to tilt and The matching wafers come into contact with each other and are damaged during storage, or even if they are not correctly inserted into the corresponding support groove of the wafer retainer fixed to the lid, It is the cause.
[0014]
The same can be said for the horizontally placed packaging container. That is, when a semiconductor wafer is accommodated in a horizontal type packaging container, it is first inserted into the support groove of the wafer carrier by a robot or manually. Since insertion at this time is carefully performed, the wafer is accurately placed on the horizontal surface of the wafer placement portion of the support groove. In this state, the wafer retainer is fixedly fixed to the wafer carrier. However, since the support groove formed in the wafer retainer has the same form as the support groove form of the wafer carrier, the wafer retainer is accurately positioned around the periphery of the semiconductor wafer. The semiconductor wafer can be pressed and sandwiched between the portion and the support groove of the wafer carrier. Next, the wafer carrier containing the semiconductor wafer is housed in the container body, the lid is closed, and the wafer carrier is pressed and sealed.
[0015]
Since the semiconductor wafer is handled in a horizontal posture as already described in the processing step after the transportation, since this horizontal type packaging container is originally accommodated in a horizontal posture, the handling after the carry-in is also covered. It is only necessary to remove the body and take out the wafer carrier from the container body. In addition, since the semiconductor wafer is fixedly supported by a wafer carrier that is firmly housed and fixed inside the container, it can be considered rational that the attitude of each container can be basically changed.
[0016]
Even in such a horizontal packaging container, it is desirable to transport the semiconductor wafer vertically as described above. However, as long as the support groove is provided, the wafer supported in the wafer carrier is easy to move inside the support groove having the above-described form, and is inclined as shown in FIG. Then, since the supporting force between the support grooves is also reduced, it is inclined more and more, and the adjacent semiconductor wafers are in violent contact with each other like the vertical type packaging container, and are easily damaged. Furthermore, it is impossible to avoid vibrations during transportation, and the fact that the vibrations are quite intense further promotes the aforementioned phenomenon. Further, as described above, regardless of the vertical type or the horizontal type, the semiconductor wafer in the packaging container that is transported and carried into the device manufacturer is eventually converted into a horizontal posture. At this time, the semiconductor wafer in the tilted state as described above tilts and vigorously contacts the wafer mounting portion that forms a horizontal plane in the support groove when the horizontal posture is changed, and there is a risk of damage here.
[0017]
The present invention has been made in order to solve such problems, and the specific purpose thereof is either in the horizontal type or in the vertical type, in accordance with the above-mentioned standards, when removing or transporting a semiconductor wafer. An object of the present invention is to provide a semiconductor support groove structure that eliminates rattling of a semiconductor wafer, ensures a support posture thereof, and at the same time automatically positions and fixes the support groove.
[0018]
[Means for Solving the Problems]
The above object is applied to the packaging container which is the main configuration of the present invention. Round The semiconductor wafer support groove structure extends in an arc shape in parallel with the semiconductor wafer transfer support member, and each support groove has a wafer mounting portion formed of a horizontal plane for horizontally supporting the semiconductor wafer. A taper portion having a wedge-shaped cross section extending in the depth direction from the wafer placement portion; The apex of the tapered portion is deviated toward the wafer mounting portion side. This is achieved by the support groove structure of the semiconductor wafer in the packaging container.
[0019]
In other words, according to this configuration, when a semiconductor wafer is inserted into the support groove by a robot, the periphery of the semiconductor wafer is guided to the apex position of the tapered portion of the support groove in a line contact state, and forms a flat surface. The semiconductor wafer released from the robot without sliding on the placement surface descends while making line contact along the tapered surface under its own weight, and is smoothly placed on the placement surface. In addition, when the wafer carrier is set up vertically from this state, the semiconductor wafer is guided into the wedge-shaped apex position with the tapered surface guided in a line contact state.
[0020]
Further, the apex of the taper part is displaced toward the wafer mounting part side. Because For example, when a semiconductor wafer is inserted into the support groove in a horizontal posture, even if a part of the peripheral edge of the wafer is in line contact with the apex position of the taper portion, the shorter taper surface displaced toward the wafer mounting portion side is formed. Since it can slide down smoothly under its own weight and does not slide more than necessary, it can prevent the semiconductor wafer from being damaged or contaminated.
[0021]
As the semiconductor wafer transfer support member, a synthetic resin wafer carrier, a synthetic resin container main body that accommodates the wafer carrier, or a wafer retainer that is a semiconductor wafer press fixing member attached to the wafer carrier or container main body. There is.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be specifically described with reference to the illustrated examples. Since the support groove structure of the semiconductor wafer according to the present invention can be applied to the conventional packaging container shown in FIGS. 5 and 6 and described above, the structure of the structural member itself of the packaging container such as the container body, the wafer carrier, and the wafer retainer. Detailed description is omitted, and these are schematically shown in the figure.
[0023]
As described above, the structure of the support groove of this type of large semiconductor wafer W is such that when the semiconductor wafer W is horizontally accommodated and supported, the conventional wafer support groove has a substantially rectangular cross-section as shown in FIG. In addition, since the groove width w of the support groove 7 is extremely larger than the thickness of the semiconductor wafer W, the semiconductor wafer W accommodated in the support groove 7 is easy to move inside the support groove 7. In particular, it is tilted by intense vibration during transportation, and the pressure support by the wafer retainer is easily removed, resulting in severe rattling, resulting in damage and contamination.
[0024]
FIG. 1 shows a structure example of a support groove 70 of a typical semiconductor wafer W of the present invention. By the way, it is understood that the depth dimension of the wafer mounting surface 70a made of a flat surface should be larger than 2 mm and smaller than 32 mm among the standards accompanying the standardization related to the support groove 70 of this type of large semiconductor wafer W. it can. Therefore, in this embodiment, as shown in FIG. 1, the depth dimension of the mounting surface 70a is set to 3 mm, and a tapered surface 70d is formed from the back end of the mounting surface 70a to a position of 3 mm. The wall surface facing the mounting surface 70a is slightly inclined at the same inclination angle as in the prior art, and finally the inner surface of the mounting surface 70a is formed as a tapered surface 70e so as to intersect at the tip of the tapered surface 70d. The cross section is wedge-shaped.
[0025]
Therefore, according to the present embodiment, the depth dimension of the wafer mounting surface 70a that forms a flat surface from the wafer insertion / removal opening 70b of the support groove 70, and the wedge-shaped cross section formed by the upper and lower tapered surfaces 70d, 70e from the wafer insertion / removal opening 70b. The dimension to the vertex O is 6 mm, the height h from the wafer placement surface 70 a to the vertex O is 3 mm, the dimension D between the placement surfaces 70 a of the adjacent support grooves 70 is 10 mm, and the groove width w is as described above. 8 mm. As can be understood from these values, the position of the apex O of the wedge-shaped cross section formed by the upper and lower tapered surfaces 70d and 70e of the present embodiment is closer to the wafer mounting surface 70a than the center position of the wafer insertion / removal port 70b. 1 mm.
[0026]
According to the wafer support groove structure of the present invention having such a configuration, when the semiconductor wafer W is inserted into the support groove 70 by a robot (not shown), the peripheral edge of the semiconductor wafer W is in a line contact state and the apex O of the tapered surface 70d. The semiconductor wafer W released from the robot does not need to be slidably contacted with the mounting surface 70a that is guided to the above position and forms a flat surface, and the semiconductor wafer W released from the robot is lowered and mounted while its peripheral edge is in line contact along the tapered surface. It is smoothly placed on the placement surface 70a. Further, even when the wafer carrier 30 is erected vertically from this state, the semiconductor wafer W is guided to the tapered surface 70d or 70e in a line contact state and automatically fits at the position of the wedge-shaped vertex O. .
[0027]
This support groove form can also be applied to each of the support grooves 41a and 42a of the first and second wafer retainers 41 and 42, for example. When the wafer carrier 3 is accommodated in the vertically placed container main body 1 shown in FIG. 5 and closed with the lid body 2, in each support groove 4 a of the wafer retainer 4 attached to the container main body 1 and the lid body 2. However, as described above, the periphery of the semiconductor wafer W automatically fits in each vertex O of each support groove 4a, and complete positioning is performed, and the accommodated semiconductor wafer W is not tilted. Since there is no backlash, damage and contamination are prevented especially during transportation. The shape of the support groove is not limited to the illustrated example, and various modifications are possible as long as the positioning function is provided.
[0028]
Next, a further preferred embodiment of the present invention will be specifically described with reference to FIGS. FIG. 2 schematically shows a basic structure of a container main body of a semiconductor wafer packaging container to which a support groove structure according to the present invention is applied. FIG. 3 shows an operation for attaching and detaching the container and a wafer carrier accommodated therein. FIG. 4 is an explanatory view, and FIG. 4 is a cross-sectional view of a main part showing an enlarged form of the support groove. In the illustrated examples described below, all of the packaging container and all of its constituent members are schematically shown. However, this means that the configuration other than the characteristic portion is not particularly specified, and those This is because various changes can be made as long as the configuration of FIG. Therefore, illustration of a general-purpose member such as a gasket clamp is also omitted. The form of the container body of the packaging container shown in the illustrated example is specific to this embodiment, and the support groove structure of the present invention is not limited to the container body, and the conventional vertical type or horizontal type described above is not limited. Naturally, it can be applied to any type of container body.
[0029]
The semiconductor wafer packaging container is a novel combination of these advantageous container structures, which eliminates the above-mentioned disadvantages of the horizontal type and the vertical type, and is novel and rational that cannot be expected in the past. It will be apparent from the following description that the container has a typical container structure.
[0030]
2 and 3, reference numeral 10 denotes a container body, 30 denotes a wafer carrier, and 40 denotes a wafer retainer. Here, the structure of the wafer carrier 30 is standardized by the above definition except for the support groove structure described later, and the basic part is not substantially different from the conventional carrier structure described above. Omitted.
[0031]
The container body 10 includes a first divided container 11 and a second divided container 12 that are divided into two. In the present embodiment, it is important that the container body 10 is divided, and the divided form must be a form that does not hinder various subsequent operations. In this embodiment, the container body 10 has a substantially disk shape as a whole, and a part of the opposed peripheral surfaces is the first and second rectangular surfaces 11a and 12a.
[0032]
On the back surfaces of the first and second rectangular surfaces 11a and 12a, as shown in FIG. 2, a plurality of wafer support grooves 41a and 42a for accommodating and supporting part of the periphery of a semiconductor wafer (not shown) are arranged in parallel. Thus, the first and second wafer retainer portions 41 and 42 are configured. In this field, as is widely known, the right end of the wafer carrier 30 shown in FIG. 2 is the wafer insertion / removal opening 31 side, and the left end is the wafer receiving bottom 32 side. As shown in FIGS. 5 and 6, the normal wafer carrier has a wafer support groove formed in a side wall portion between the wafer insertion / removal openings 3a, 3a 'and the wafer receiving bottoms 3b, 3b', and also accommodates the wafer. Wafer support grooves are formed in the two bridging portions arranged with the central space portion of the bottom portions 3b and 3b 'interposed therebetween. Since the first and second wafer retainer portions 41 and 42 are formed on the inner surface of the peripheral wall portion of the container body 40 so as to correspond to the space portion formed between the portions where these support grooves are formed, these The wafer retainers 41 and 42 may be three or more.
[0033]
The container body 10 shown in FIG. 2 distributes the entire top plate portion 11b and the entire bottom plate portion 12b when placed horizontally to the top plate side and the bottom plate side, and corresponds to the wafer insertion / removal opening side of the wafer carrier 30. The first rectangular surface 11a is left on the top plate portion 11b, the second rectangular surface 12a corresponding to the wafer receiving bottom side of the wafer carrier 30 is left on the bottom plate portion 12b, and the peripheral wall portion 13 is along the peripheral surface. As indicated by reference numeral A in the figure, each of the first and second divided containers 11 and 12 is divided into two in the diagonal direction.
[0034]
The wafer carrier 30 containing a plurality of semiconductor wafers W is accommodated in the first and second divided containers 11, 12 thus divided into two, and each semiconductor wafer W is contained inside the container body 10 together with the wafer carrier 30. In order to support and fix the wafer carrier 30 on the bottom plate portion 12b of the second divided container 12, the second divided container 12 is placed horizontally on a predetermined placement section as shown in FIG. To load. At this time, since the semiconductor wafer W accommodated in each support groove of the wafer carrier 30 is placed on the wafer placement surface 70a which is a flat surface in the support groove described above, a stable horizontal posture is maintained. Is done. When the loading is completed, the wafer carrier 30 is slightly moved horizontally toward the bottom plate portion 12b of the second divided container 12 as indicated by an arrow Y in FIG. The peripheral edge of each semiconductor wafer W exposed from the second wafer retainer 42 is inserted and supported in the corresponding support groove 70 of the second wafer retainer 42. At this time, in the present embodiment, the support groove 70 has tapered surfaces 70d and 70e having a wedge-shaped cross section at the back, and the apex O of the tapered portion is set almost on the extended surface of the wafer mounting surface 70a. Since it is deviated to the wafer mounting part side, even if a part of the periphery of the semiconductor wafer in a horizontal posture is in line contact with the apex 0 part of the taper part, it is displaced to the wafer mounting part side. Since the lower taper surface 70e does not slide more than necessary and slightly slides by its own weight and reaches the wafer mounting surface 70a, the semiconductor wafer is not damaged or contaminated.
[0035]
As the semiconductor wafer transfer support member, a synthetic resin wafer carrier, a synthetic resin container main body that accommodates the wafer carrier, or a wafer retainer that is a semiconductor wafer press fixing member attached to the wafer carrier or container main body. There is. These operations are preferably all performed by a robot (not shown).
[0036]
When the wafer carrier 30 is stored in the second dividing container 12 in this way, the first dividing container 11 is then lowered in the direction of the arrow X to store the wafer carrier 30, and the first wafer retainer 41 is moved to the wafer carrier 30. It is made to oppose with the one part periphery of the semiconductor wafer W exposed to the wafer insertion / extraction opening side. Thereafter, when the second divided container 12 is horizontally moved in the direction indicated by the arrow Y in FIG. 2, each semiconductor wafer W is placed in the corresponding support groove of the first wafer retainer portion 41 provided in the container 12. The semiconductor wafer W is pressed and clamped between the first wafer retainer portion 41 and the second wafer retainer portion 42 at the same time as closing the D container main body 10 by applying a clamp (not shown) that is inserted accurately. It is firmly fixed and supported without rattling. In addition, since all the support grooves have a wedge-shaped cross section having upper and lower tapered surfaces 70d and 70e following the wafer mounting surface 70a at this time, the wafer position moves to the apex O of the wedge-shaped cross section and smoothly moves there. A support position is positioned. Further, when the wafer carrier 30 is taken out from the container main body 10, it can be easily performed by performing an operation opposite to the operation of storing the wafer carrier 30 in the container main body 10.
[0037]
Now, in order to transport the wafer carrier 30 accommodated in the container body 10 as described above to the carry-in destination together with the container body 10, when the wafer carrier 30 is inserted / removed in the above-mentioned horizontal configuration, the wafer carrier 30 is placed in the vertical configuration However, according to the packaging container according to the present embodiment, as can be understood from the above description, the semiconductor wafer W accommodated and supported by the wafer carrier 30 together with the wafer carrier 30 is the container body 10. Is automatically positioned at the apex O of the wedge-shaped cross section of the support groove 70 as described above, and is pressed and clamped by the first and second wafer retainer portions 41 and 42. Therefore, the wafers do not come into contact with each other and are not damaged without being tilted by intense vibration during transportation.
[0038]
【The invention's effect】
As is clear from the above description, according to the support groove structure of the semiconductor wafer packaging container according to the present invention, the semiconductor wafer is automatically positioned when being attached to or detached from the wafer carrier or the container body. The support posture is stabilized, and even when the posture is changed or transported, the wafers do not come into contact with each other, and since there is no backlash, wafer breakage and contamination are effectively prevented.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a main part of a wafer support groove showing a typical embodiment of the present invention applied to a semiconductor wafer packaging container.
FIG. 2 is an overall perspective view showing an example of a container body of a packaging container to which the wafer support groove is applied.
FIG. 3 is an explanatory view showing an operation of detaching a wafer carrier from the container body.
FIG. 4 is an enlarged cross-sectional view of a main part showing another form of the wafer support groove structure of the present invention applied to the wafer retainer portion of the container body.
FIG. 5 is an exploded perspective view showing an example of a packaging container for a conventional vertical type semiconductor wafer.
FIG. 6 is an exploded perspective view showing an example of a packaging container for a conventional horizontal type semiconductor wafer.
FIG. 7 is a cross-sectional view of a main part showing a conventional wafer support groove configuration.
FIG. 8 is an explanatory diagram showing the adverse effects of a conventional support groove structure.
[Explanation of symbols]
1,1 'container body
2,2 'lid
3 Wafer carrier
3a, 3a 'Wafer insertion / removal opening
3b, 3b 'Wafer storage bottom
4,4 'wafer retainer
5,5 'gasket
6,6 'Clamp and container grip
7 Wafer support groove
7a Wafer mounting surface
7b Wafer insertion / removal port
7c Groove bottom
11, 12 First and second divided containers
11a, 12a First and second rectangular surfaces
11b Top plate
12b Bottom plate
13 Perimeter wall
30 Wafer carrier
31 Wafer insertion / removal opening
40 Wafer retainer
41, 42 First and second wafer retainers
41a, 42a Wafer support groove
70 Wafer support groove
70a Wafer mounting surface
70b Wafer insertion / removal port
70d, 70e Vertical taper surface
W Semiconductor wafer
w Groove width of support groove
O Vertex of wedge-shaped cross section

Claims (4)

A support groove structure of the semiconductor wafer extending arcuately in parallel to the conveying support member of a semiconductor wafer which forms a circular applies to the packaging container,
Each support groove has a wafer mounting portion made of a horizontal plane for horizontally supporting the semiconductor wafer, and has a tapered portion having a cross-sectional wedge shape extending in the depth direction from the wafer mounting portion,
The apex of the tapered portion is deviated toward the wafer mounting portion side,
A support groove structure for a semiconductor wafer in a packaging container. 2. The semiconductor wafer support groove structure according to claim 1, wherein said semiconductor wafer transfer support member is a synthetic resin wafer carrier. 3. The semiconductor wafer support groove structure according to claim 1, wherein the semiconductor wafer transfer support member is a synthetic resin container for accommodating a wafer carrier.   The semiconductor wafer support groove structure according to claim 1, wherein the semiconductor wafer transfer support member is a wafer retainer attached to a wafer carrier or a synthetic resin container containing the wafer carrier.

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