JP3120383U - Solder wire packaging structure - Google Patents

Abstract

It is an object of the present invention to provide a solder wire packaging structure that is free from the risk of quality degradation.
A solder wire packaging structure, wherein the solder wire is vacuum-packed in a state of being housed in a synthetic resin bag body. The solder wire is an Sn-based solder wire that does not contain lead, the solder wire 5 is wound around a winding bobbin, and the winding bobbin 6 with the solder wire is placed in a synthetic resin bag 9. Solder wire packaging structure characterized by being vacuum packaged in a stored state. The solder wire packaging structure, wherein the vacuum degree of the vacuum packaging is -0.1 MPa to -0.07 MPa.
[Selection] Figure 1

Description

  The present invention relates to a packaging structure for a solder wire, and more particularly to a packaging structure for a winding bobbin with a solder wire.

  Conventionally, as shown in FIG. 2, a predetermined length of solder wire 5 is wound in multiple layers on a winding bobbin 4 provided with annular flanges 3 at both axial ends of a core tube 2 having a hollow hole 1. A winding bobbin 6 with a solder wire around which a solder wire 5 is wound is known (for example, see Japanese Patent Application Laid-Open No. 6-9753).

As shown in FIG. 2, the packaging structure of the winding bobbin 6 with solder wire for circulating or displaying the winding bobbin 6 with solder wire (coil bobbin of wire solder) as described above is shown in FIG. When packaging with the shrinkable synthetic resin film 7, the synthetic resin film 7 has a contoured cross-sectional shape, and an intermediate portion from the outer peripheral side in the radial direction from the hollow hole 1 at the center of the one annular flange 3. The one end on the inner diameter side of the synthetic resin film 7 is located at a position away from the outer peripheral surface, and from here, the outer surface and inner surface of one annular flange 3, the outer peripheral surface of the solder wire 5 wound many times, The other annular flange 3 has an approximately U-shaped cross section over the inner surface of the annular flange 3 and an intermediate portion from the outer peripheral side of the annular flange 3, and is wrapped over the entire circumference of the wire wound bobbin 6. Winding with solder wire Packaging structure of the bottle 6 has been known.
Japanese Utility Model Publication No. 6-9753

(1) In the case of the packaging structure of the winding bobbin 6 with a solder wire as described above, since the solder portion is not hermetically sealed by the synthetic resin film 7, the synthetic resin film 7 can be used when it is displayed indoors or outdoors. If condensation occurs on the solder wire 5 inside the synthetic resin film 7 due to a temperature difference between the inside and outside of the resin film 7, it takes about half a day before the condensation disappears. In the solder wire 5, since it is easy to bond with oxygen molecules in moisture condensed with tin, there is a problem that condensation is promoted, tin oxide is generated and discolored, and quality and product value are lowered. . Further, when displaying or storing for a long period of time, there is a problem that the solder wire 5 is exposed to the outside air and is oxidized as the month and day elapses, resulting in a yellowish discoloration, which degrades the quality and product value.
The main object of the present invention is to provide a solder wire packaging structure that can advantageously solve the above-described problems and that does not cause a decrease in quality.

The solder wire packaging structure of the first device is characterized in that in the solder wire packaging structure, the solder wire is vacuum packaged in a state of being housed in a synthetic resin bag.
In the second device, in the solder wire packaging structure of the first device, the solder wire is an Sn-based solder wire not containing lead, and the solder wire is wound around a winding bobbin, and the solder The wire-wound bobbin is vacuum-packed while being housed in a synthetic resin bag.
The third device is characterized in that, in the solder wire packaging structure of the first or second device, the vacuum degree of vacuum packaging is set to -0.07 MPa.

According to the packaging structure of the present invention, the following effects can be obtained.
According to the first device, since the solder wire is vacuum-packed, it is possible to prevent the solder wire from being oxidized and discolored. As described above, it is possible to reliably prevent tin from being oxidized and discoloration of the solder wire by the action of promoting oxidation due to condensation, and the quality of the solder wire can be maintained.
According to the second device, since the solder wire wound around the bobbin is vacuum-packed, it is possible to prevent the solder wires wound in a multi-layered manner from being randomly wound, and to contain Sn-based solder that does not contain lead. It is possible to prevent the wire from being oxidized and discolored, and during the long-term storage of the solder wire or during transportation or display, tin is oxidized by the oxidation promoting action due to condensation as in the conventional case, and the solder wire is Discoloration can be reliably prevented, and the quality of the solder wire can be maintained.
According to the third device, since the degree of vacuum is set to -0.1 MPa to -0.07 MPa, Sn caused by dew condensation in the synthetic resin bag body during transportation or display even when the air temperature fluctuates. Oxidation of the base solder wire can be prevented, and the yellowish discoloration due to the oxidation does not occur, thereby eliminating the possibility of causing a decrease in product value due to discoloration of the solder wire, and deforming the cross section of the solder wire. The fear can be eliminated, and a predetermined cross-sectional shape conforming to the standard can be maintained for a long time. Therefore, the product value can be maintained over a long period of time.

  Next, the present invention will be described in detail based on the illustrated embodiment.

  1A and 1B show a packaging structure of a winding bobbin with a solder wire according to an embodiment of the soldering wire packaging structure of the present invention, wherein FIG. 1A is a perspective view, and FIG. Is a longitudinal front view thereof.

  In the solder wire wrapping structure of the present invention, the winding bobbin 6 with the solder wire formed by arranging the solder wires 5 in multiple layers and winding them on the winding bobbin 4 is made of a synthetic resin made of a vinyl chloride resin or a polyethylene resin film. It is a packaging structure that is arranged in a cylindrical body 8 and hermetically sealed. As one form for doing this, a winding bobbin 6 with a solder wire is placed in a synthetic resin bag 9 formed by sealing one end side of the synthetic resin cylindrical body 8 by heat sealing 10. In the disposed state, the internal air is sucked from the opening side of the other end side of the synthetic resin bag body 9 so that the inside of the synthetic resin bag body 9 is in a vacuum state with a degree of vacuum of about −0.07 MPa. The other end side of the synthetic resin bag 9 is heat-sealed 10 and hermetically sealed.

  Alternatively, in a state where the winding bobbin 6 with solder wire is disposed in the synthetic resin cylindrical body 8, one end side of the synthetic resin cylindrical body 8 is heat-sealed 10 and sealed, and in this state, the other end The inside air is sucked from the opening side on the side, and the inside of the synthetic resin tubular body 8 is brought to a vacuum state with a degree of vacuum of about −0.07 MPa. The end side can be heat-sealed 10 to be vacuum-sealed. Alternatively, the winding bobbin 6 with a solder wire may be disposed in a synthetic resin bag 9 manufactured by a known means as appropriate and sealed in a vacuum.

  As described above, when the inside of the synthetic resin bag body 9 is in a vacuum state with a degree of vacuum of about -0.07 MPa, the both ends of the synthetic resin bag body 9 are sealed at room temperature. Since no condensation occurs inside, the oxidation of tin in the lead-free solder wire 5 that does not contain lead due to the condensation is prevented, thereby eliminating the possibility of causing the quality of the solder wire 5 to deteriorate. be able to.

As described above, since the degree of vacuum is a means for preventing condensation due to fluctuations in the temperature, the degree of vacuum may be a degree of vacuum that does not cause condensation due to fluctuations in the temperature. It may be 0.1 MPa to -0.07 MPa.
As described above, when the degree of vacuum is set to -0.1 MPa to -0.07 MPa, when the room temperature or the outside air temperature is lowered inside the packaged body of the synthetic resin bag 9, the synthetic resin In the bag body 9, the humidity of the air in the synthetic resin bag body 9 can be reduced to prevent dew condensation, and in the packaging bag body 9, dew condensation can be prevented. This prevents the oxidation reaction between tin and oxygen therein, prevents discoloration of the solder wire due to the oxidation of tin, and improves the soldering workability without reducing the wettability during soldering.

  Next, with respect to the Sn-based solder wire not containing lead, the bobbin-wrapped solder wire was housed in a synthetic resin bag body 9 made of a commercially available vinyl chloride resin bag body and vacuum packaged (vacuum packed). The test about the presence or absence of the change of the solder wire 5 by the degree of vacuum at the time is demonstrated.

  The solder wire 5 has two types of metal, Sn-3.0% Ag-0.5% Cu and Sn-3.5% Ag, and is a bobbin 6 with a solder wire formed as a bobbin-wound solder wire. Vacuum packing was performed at 0.1 MPa (0 Torr) and -0.07 MPa (225 Torr), and the surface condition of the solder wire was visually confirmed at 24 hours and 120 hours, respectively. In either case, the surface of the solder wire 5 was indented and not scratched, and the solder wire was not deformed.

  The above two lead-free solder metals can be vacuum-packed at -0.1MPa (0Torr), but after vacuum packing, there are packing operations such as packing many vacuum-packed items. It was also found that in the vacuum packaging at (0 Torr), the synthetic resin bag 9 is easily scratched. Therefore, when there is a scratch, there is a high risk that air will enter the synthetic resin bag 9 from the scratch. On the other hand, in vacuum packaging at -0.07 MPa (225 Torr), a large number of vacuum-packed items are not easily scratched during work such as boxing, and there is little risk of air entering, and -0.07 MPa (225 Torr) ) Also proved better to vacuum package.

In addition, when vacuum-wrapping a solder wire such as a wire or a rod, for example, when vacuum-wrapping a winding bobbin wound with a solder wire, the cross-sections of the solder wire in a state of being aligned and wound on the bobbin, Since it is in a point contact state (a line contact state in the longitudinal direction of the solder wire), when the degree of vacuum is high, each solder wire of the outermost layer is pressed radially inward by the packaging film, and radially inward of the outermost layer. The solder wire of the adjacent first inner layer is pressed, and the first inner layer presses the inner second inner layer, and then presses to the inner layer successively, so that the pressing force remains high for a long time. Then, each layer is crushed and the cross-sectional shape is deformed, which may result in a non-standard cross-sectional shape, which may reduce the product value.
If the degree of vacuum is too high in terms of the pressing force, the synthetic resin bag 9 presses the solder wire 5 having a circular cross section toward the center side in the bobbin radial direction, and the bobbin radial direction The solder wire 5 located on the outer side presses the solder wire 5 located on the inner side in the bobbin radial direction, and the solder wires 5 having a circular cross section located on the outer side in the radial direction or the inner side in the radial direction are pressed against each other. 5 may be deformed from a circular cross section, and in order to reduce the film thickness of the synthetic resin bag body 9, it is preferable to be set to about −0.07 MPa (225 Torr).

  As a material of the synthetic resin bag 9, for example, a known synthetic resin film such as vinyl chloride, a high-density polyethylene film, a composite film obtained by laminating a low-density polyethylene film and a nylon film, or the like is appropriately cylindrical or bag-shaped. What is necessary is just to vacuum-pack.

  In the illustrated embodiment, the case where the winding bobbin around which the solder wire is wound is vacuum packaged is shown. However, when the present invention is implemented, the present invention may be applied to the case where other types of solder wires are packaged. .

BRIEF DESCRIPTION OF THE DRAWINGS The packaging structure of the solder wire of this invention is shown, Comprising: (a) is a perspective view, (b) is a vertical side view of (a). The packaging structure of the solder wire of a prior art is shown, Comprising: (a) is a perspective view, (b) is a vertical side view of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Hollow hole 2 Core tube 3 Flange 4 Winding bobbin 5 Solder wire 6 Winding bobbin 7 with a solder wire Synthetic resin film 8 Synthetic resin cylindrical body 9 Synthetic resin bag body 10 Thermal fusion

Claims (3)

Solder wire packaging structure, wherein the solder wire is vacuum packaged in a state of being housed in a synthetic resin bag. The solder wire is an Sn-based solder wire not containing lead, and the solder wire is wound around a winding bobbin, and the winding bobbin with the solder wire is stored in a synthetic resin bag body. 2. The solder wire packaging structure according to claim 1, wherein the solder wire packaging structure is vacuum packaged. The solder wire packaging structure according to claim 1 or 2, wherein the vacuum degree of the vacuum packaging is -0.1 MPa to -0.07 MPa.

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