JPH03289415A - Packaging method for metal wiring material - Google Patents
Packaging method for metal wiring materialInfo
- Publication number
- JPH03289415A JPH03289415A JP9110090A JP9110090A JPH03289415A JP H03289415 A JPH03289415 A JP H03289415A JP 9110090 A JP9110090 A JP 9110090A JP 9110090 A JP9110090 A JP 9110090A JP H03289415 A JPH03289415 A JP H03289415A
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- oxygen
- packaging
- sealed
- wiring materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000001301 oxygen Substances 0.000 claims abstract description 30
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 30
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000011261 inert gas Substances 0.000 claims abstract description 5
- 239000002985 plastic film Substances 0.000 claims abstract description 3
- 229940123973 Oxygen scavenger Drugs 0.000 claims description 9
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 239000002250 absorbent Substances 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000010949 copper Substances 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- 239000004033 plastic Substances 0.000 abstract description 7
- 229920003023 plastic Polymers 0.000 abstract description 7
- -1 polyethylene Polymers 0.000 abstract description 6
- 229910052786 argon Inorganic materials 0.000 abstract description 4
- 239000004698 Polyethylene Substances 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 abstract description 3
- 229920000573 polyethylene Polymers 0.000 abstract description 3
- 229920001155 polypropylene Polymers 0.000 abstract description 3
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Vacuum Packaging (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は金属配線材料の包装方法に関するもので、特に
、銅やはんだなどのように酸化されやすい金属でできた
ワイヤ、リボンなどの配線材料の包装に適用されるもの
である。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for packaging metal wiring materials, and in particular, wires made of metals that are easily oxidized such as copper and solder, It is applied to packaging wiring materials such as ribbons.
（従来の技術）
半導体の製造工程においては、銅やはんだなどのように
酸化されやすい金属でできたワイヤ、リボンなどの配線
材料が多量に使用される。このような金属配線材料は生
産計画に合わせて使用されるか、場合によっては工場に
おいて多量のストックをかかえ、長期にわたって保管さ
れることがある。したがって、これらの材料は特性を劣
化させることなく長期の保管に耐える包装が行なわれて
いることが望まれている。(Prior Art) In the manufacturing process of semiconductors, wiring materials such as wires and ribbons made of easily oxidized metals such as copper and solder are used in large quantities. Such metal wiring materials are used in accordance with production plans, or in some cases are kept in large quantities at factories and stored for long periods of time. Therefore, it is desired that these materials be packaged so that they can withstand long-term storage without deteriorating their properties.
従来行われている金属配線材料の包装は、ポリエチレン
やポリプロピレンなどでできたラミネートシート材で包
装を行う際、不活性の窒素ガスやアルゴンガスなどの置
換ガスを封入して酸素を追い出し、加熱シールを行うよ
うなものである。また、場合によっては包装の内部の水
分を除去するためにシリカゲルなどの乾燥剤を封入する
場合もある。Traditionally, metal wiring materials are packaged using laminate sheets made of polyethylene or polypropylene, which are filled with a replacement gas such as inert nitrogen gas or argon gas to drive out oxygen, and heat-sealed. It's like doing. In some cases, a desiccant such as silica gel may be included in the package to remove moisture inside the package.
（発明が解決しようとする課８）
このような金属配線材料に酸化が発生した場合には、そ
の酸化膜により材料の物性に悪影響が出ることが知られ
ている。例えば、従来のストックされた金属配線材料に
おいては、銅ボンディングワイヤでは接合強度が低下し
、あるいははんだリボンにおいては、表面の酸化膜の成
長によりはんだ接合の内部に巣が発生するという問題が
生じている。(Problem 8 to be Solved by the Invention) When oxidation occurs in such a metal wiring material, it is known that the oxide film adversely affects the physical properties of the material. For example, with conventional stocked metal wiring materials, copper bonding wires have a reduced bonding strength, or solder ribbons have problems such as the growth of an oxide film on the surface and the formation of cavities inside the solder joint. There is.
この原因としては、封入された置換ガスが空気を完全に
置換しておらず、空気中の酸素が包装内に残留し、この
酸素により酸化が進行すること、および包装に用いられ
ているラミネートシートの空気遮断性が完全ではなく、
包装後にこのシートを通して酸素が包装の内部に浸透す
ることが考えられる。This is due to the fact that the enclosed replacement gas does not completely replace the air, and oxygen in the air remains inside the packaging, which causes oxidation to progress, and the laminate sheet used for the packaging. The air barrier properties are not perfect,
It is possible that oxygen penetrates into the interior of the package through this sheet after packaging.
したがって、本願発明は包装状態で内部に残留しあるい
は浸透した酸素により金属配線材料の酸化が進行しない
金属配線材料の包装方法を提供することを目的とする。Therefore, an object of the present invention is to provide a method for packaging metal wiring materials in which oxidation of the metal wiring materials does not progress due to oxygen remaining inside or penetrating the packaging.
（課題を解決するための手段）
本発明にかかる金属配線材料の包装方法によれば、酸化
されやすい金属配線材料を保持部材に保持させる過程と
、保持部材を脱酸素剤とともにプラスチックシート材料
で全面を覆い気密封止する過程とを備えたことを特徴と
する。(Means for Solving the Problems) According to the method for packaging metal wiring materials according to the present invention, there is a process in which metal wiring materials that are easily oxidized are held in a holding member, and the holding member is covered with a plastic sheet material together with an oxygen scavenger. and a process of covering and hermetically sealing.
気密封止する過程が、１か所を残して封止した後、この
未封止部分から排気を行い、続いて不活性ガスを封入し
た後に完全密封する過程を備えるとよい。The process of hermetically sealing preferably includes a process of sealing all but one area, evacuating the unsealed area, then filling in an inert gas, and then completely sealing the area.
また、脱酸素剤に加えて酸素検知剤およびまたは吸湿剤
を共に封入すると良い。In addition to the oxygen scavenger, it is also preferable to encapsulate an oxygen detector and/or a moisture absorber.
（作 用）
本発明によれば、包装時に脱酸素剤を被包装金属配線材
料とともに封入してシールを行なっているため、包装当
初に残留した酸素のみでなく、包装後にシートを通して
浸透した酸素をも吸収除去する。このため、銅やはんだ
などの酸化しやすい金属でも酸化のない状態に保つこと
ができる。(Function) According to the present invention, since the oxygen scavenger is sealed together with the packaged metal wiring material during packaging, not only the oxygen remaining at the time of packaging but also the oxygen permeating through the sheet after packaging is removed. It is also absorbed and removed. Therefore, even metals that are easily oxidized, such as copper and solder, can be kept in an oxidized state.
包装時に不活性ガスで空気を置換すると包装当初の酸素
含有量が減少し、酸化をさらに効果的に防止することが
できる。When the air is replaced with an inert gas during packaging, the oxygen content at the time of packaging is reduced, and oxidation can be more effectively prevented.
さらに、酸素検知剤は残留酸素を確認でき、吸湿剤は酸
化の一因となりうる水分の除去に有効である。Additionally, oxygen detectors can check for residual oxygen, and moisture absorbers are effective in removing moisture that can contribute to oxidation.
（実施例） 以下、本発明の実施例を詳細に説明する。(Example) Examples of the present invention will be described in detail below.
第１図は本発明の一実施例における中央で破断した様子
を示す斜視図であって、銅ボンディングワイヤの場合の
包装を示している。FIG. 1 is a perspective view showing an embodiment of the present invention broken at the center, showing packaging for copper bonding wire.
銅ボンディングワイヤ１は金属あるいはプラスチック製
のスプール２に巻回されており、これらはプラスチック
ケース３の中に格納されている。A copper bonding wire 1 is wound around a spool 2 made of metal or plastic, and these are housed in a plastic case 3.
そして、このプラスチックケース３の中央部に設けられ
、スプールの芯部に対応する四部３ａには脱酸素剤４お
よび酸素検知剤５か載置されている。An oxygen scavenger 4 and an oxygen detector 5 are placed on four parts 3a provided in the center of the plastic case 3 and corresponding to the core of the spool.
この脱酸素剤としては、例えば三菱瓦斯化学（株）製の
商品名「エージレス」、酸素検知剤としては例えば三菱
瓦斯化学（株）製の商品名「エージレス・アイ」を使用
することができる。As the oxygen scavenger, for example, the product name "Ageless" manufactured by Mitsubishi Gas Chemical Co., Ltd. can be used, and as the oxygen detector, for example, the product name "Ageless Eye" manufactured by Mitsubishi Gas Chemical Co., Ltd. can be used.
そして、全体はポリエチレンとポリプロピレンのラミネ
ートシート６で包装され、周囲部が例えばシール専用の
ヒータで加熱されて融着され、封止か行われる。The whole is then packaged with a laminate sheet 6 of polyethylene and polypropylene, and the surrounding area is heated and fused using a heater dedicated to sealing, thereby sealing.
なお、この封止工程においては、ラミネートシートに１
か所の未封止部を設けるようにして封止を行い、この未
封止部を通して内部の排気を行って真空とし、つぎに内
部にアルゴンガスなどの不活性ガスを送り込んで内部の
空気を完全に置換させた後、残った未封止部の封止を行
うことにより、初期の酸素含有量を減少させることがで
きる。In addition, in this sealing process, 1
The seal is made by leaving some unsealed parts, the inside is evacuated through these unsealed parts to create a vacuum, and then an inert gas such as argon gas is sent into the inside to remove the air inside. After complete replacement, the remaining unsealed portions are sealed to reduce the initial oxygen content.
なお、上述した酸素検知剤は目視で酸素の残存を確認で
きる薬剤であって、エージレス・アイの場合、ピンク色
を呈していれば酸素がない状態を表わし、色かブルーに
変化すると酸素が約０．１％以上含まれていることを示
すことになる。The oxygen detection agent mentioned above is a drug that allows you to visually confirm the residual oxygen, and in the case of Ageless Eye, if it turns pink, it means there is no oxygen, and if the color changes to blue, it means that oxygen is around This indicates that the content is 0.1% or more.
はんだリボン、はんだワイヤの場合も同様に酸化膜除去
を行った後にスプールに巻き、脱酸素材と共にラミネー
トシール材で封止を行えば良い。In the case of solder ribbons and solder wires, the oxide film may be similarly removed, then wound onto a spool and sealed with a laminate sealing material together with a deoxidizing material.
必要に応じ、上述したように酸素検知剤を封入したり、
アルゴンガスによる空気の置換を行うことができる。If necessary, enclose an oxygen detection agent as described above,
Air replacement with argon gas can be performed.
また、以上の実施例においては、水分の存在を考慮して
いなかったが、水分の除去のために、乾燥剤、例えばシ
リカゲルを共に封入するようにしてもよい。Further, in the above embodiments, the presence of moisture was not taken into account, but a desiccant such as silica gel may be also included in order to remove moisture.
このような包装方法を行ったことによる酸化の進行の様
子を第２図を用いて説明する。この図は銅ボンディング
ワイヤを脱酸素剤を用いない従来の方法で包装したもの
と、本発明の方法を用いて包装したものとを１週間、２
週間、４週間、８週間それぞれ同じ環境で保管し、経時
変化によるワイヤボンディングにおける接合強度の変化
を示したグラフである。第２図においては、実線で本発
明の包装方法を、破線で従来の包装方法を示している。The progress of oxidation due to such a packaging method will be explained with reference to FIG. This figure shows copper bonding wires packaged using the conventional method without using an oxygen scavenger and those packaged using the method of the present invention for one week and two days.
It is a graph showing changes in bonding strength in wire bonding over time after storage in the same environment for 1 week, 4 weeks, and 8 weeks. In FIG. 2, the solid line indicates the packaging method of the present invention, and the broken line indicates the conventional packaging method.
これによれば、ボンディングワイヤ製造直後では約３４
ｇｆの強度が得られたものが、従来の包装方法では時間
の経過とともに接合強度の低下が見られ、８週間後には
わずかには２０ｇ ｆに低下してしまうのに対し、本発
明を適用した場合には強度の低下はほとんどなく、８週
間経過後であっても当初とほぼ同じ強度が得られたこと
が分かる。According to this, immediately after manufacturing the bonding wire, approximately 34
With the conventional packaging method, the bonding strength decreased over time, and the bond strength decreased to only 20gf after 8 weeks. In this case, there was almost no decrease in strength, and it can be seen that almost the same strength as at the beginning was obtained even after 8 weeks.
したがって、残存酸素がないこと、および脱酸素剤の吸
着動作が銅の表面に悪影響を与えないことが確認できた
。Therefore, it was confirmed that there was no residual oxygen and that the adsorption action of the oxygen scavenger did not adversely affect the copper surface.
また、はんだリボンにおいても本発明の包装方法を適用
することにより、表面酸化膜に起因する接合部における
巣の発生低減効果が確認された。Furthermore, by applying the packaging method of the present invention to solder ribbons, it was confirmed that the occurrence of cavities at the joints due to the surface oxide film was reduced.
以上のように、本発明によれば、包装時に脱酸素剤を共
に封止するようにしているため、封入工程における残留
酸素を完全に吸収する他、保管中にシール材を通して浸
透する酸素を除去できるため、酸化しやすい配線材料の
酸化を効果的に防止し、その特性を維持することができ
る。As described above, according to the present invention, since the oxygen absorber is sealed together with the oxygen absorber at the time of packaging, it not only completely absorbs residual oxygen during the packaging process, but also removes oxygen that permeates through the sealing material during storage. Therefore, it is possible to effectively prevent oxidation of wiring materials that are easily oxidized and maintain their characteristics.
第１図は本発明にかかる包装方法の一実施例を示す一部
切欠斜視図、第２図は本発明の包装方法と従来の包装方
法による接合特性の経時変化の比較を示すグラフである
。
１・・・ボンディングワイヤ、２・・・スプール、３・
・・プラスチックケース、４・・・脱酸素剤、５・・・
酸素検知剤、６・・・ラミネートシート。FIG. 1 is a partially cutaway perspective view showing an embodiment of the packaging method according to the present invention, and FIG. 2 is a graph showing a comparison of changes in bonding characteristics over time between the packaging method of the present invention and a conventional packaging method. 1... Bonding wire, 2... Spool, 3...
...Plastic case, 4...Oxygen absorber, 5...
Oxygen detection agent, 6... laminate sheet.
Claims (1)
る過程と、 前記保持部材を脱酸素剤とともにプラスチックシート材
料で全面を覆い気密封止する過程とを備えたことを特徴
とする金属配線材料の包装方法。 ２、気密封止する過程が、１か所を残して封止した後、
この部分から排気を行い、さらに不活性ガスを封入した
後に完全密封する過程を備えたことを特徴とする請求項
１記載の金属配線材料の包装方法。 ３、脱酸素剤に加えて酸素検知剤を共に封入するように
した請求項１記載の金属配線材料の包装方法。 ４、脱酸素剤に加えて吸湿剤を共に封入するようにした
請求項１または３記載の金属配線材料の包装方法。[Claims] 1. A process of holding a metal wiring material that is easily oxidized in a holding member, and a process of covering the entire surface of the holding member with a plastic sheet material together with an oxygen scavenger and hermetically sealing it. A packaging method for metal wiring materials. 2. After the process of hermetically sealing all but one place,
2. The method for packaging metal wiring materials according to claim 1, further comprising the step of evacuating the area, filling it with an inert gas, and then completely sealing the area. 3. The method for packaging metal wiring materials according to claim 1, wherein an oxygen detecting agent is enclosed in addition to the oxygen scavenger. 4. The method for packaging metal wiring materials according to claim 1 or 3, wherein a moisture absorbent is enclosed in addition to the oxygen absorber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9110090A JPH03289415A (en) | 1990-04-05 | 1990-04-05 | Packaging method for metal wiring material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9110090A JPH03289415A (en) | 1990-04-05 | 1990-04-05 | Packaging method for metal wiring material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03289415A true JPH03289415A (en) | 1991-12-19 |
Family
ID=14017102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9110090A Pending JPH03289415A (en) | 1990-04-05 | 1990-04-05 | Packaging method for metal wiring material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03289415A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010064385A1 (en) | 2008-12-01 | 2010-06-10 | 千住金属工業株式会社 | Package for storing minute solder ball and method for storing minute solder ball |
-
1990
- 1990-04-05 JP JP9110090A patent/JPH03289415A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010064385A1 (en) | 2008-12-01 | 2010-06-10 | 千住金属工業株式会社 | Package for storing minute solder ball and method for storing minute solder ball |
| JP4868267B2 (en) * | 2008-12-01 | 2012-02-01 | 千住金属工業株式会社 | Package body for storage of fine solder balls and storage method |
| US8434614B2 (en) | 2008-12-01 | 2013-05-07 | Senju Metal Industry Co., Ltd. | Storing package unit and a storing method for micro solder spheres |
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