JP3118398U - Lightweight and thin image sensor package - Google Patents

Abstract

A lightweight, thin, and compact image sensor package that does not require a new printed circuit board image sensor that can be used with different standard chips.
A lightweight, thin, and compact image sensor package includes an upper surface and a lower surface on a printed circuit board, and is formed into a chip storage area and four sides of the chip storage area at a central position of the upper surface, respectively. A number of first electrodes are formed, and a number of second electrodes electrically connected to the first electrode are formed on the lower surface. The chip is installed at the position where the printed circuit board is placed, and a number of welding mats formed around the sensor zone and the sensor zone are installed. The multiple conductors are electrically connected from the chip welding mat to the first electrode of the printed circuit board, and transmit the chip signal from the first electrode on the upper surface of the printed circuit board to the second electrode on the lower surface of the printed circuit board. The molded body is molded on the non-sensor area and a large number of conductors of the chip by a compression method, and is covered with the non-sensor area and the large number of conductors of the chip, and the sensor area of the chip is exposed to form a molded body. The transparent layer is placed on the molded body and covered with the sensor area of the chip.
[Selection] Figure 2

Description

  The present invention relates to a light and thin image sensor package, which does not require a new image sensor for a printed circuit board by using different standard chips.

  As shown in FIG. 1, a known image sensor structure includes a printed circuit board 10 on which a first surface 12 and a second surface 14 are placed. First contacts 15 are formed on all four sides of the first surface 12, and second contacts 16 are formed on all four sides of the second surface 14. The first contact 15 and the second contact 16 are electrically connected to each other by a conducting wire 17 extending from the side surface of the printed circuit board 10. An upper surface 20 and a lower surface 22 are provided on the convex edge layer 18, and the lower surface 22 adheres to the first surface 12 of the printed circuit board 10. A storage chamber 24 is formed together with the printed circuit board 10. A large number of welding mats 27 are installed on the image sensor chip 26 in four directions, installed in a storage chamber 24 formed by the printed circuit board 1 and the convex edge layer 18, and fixed on the first surface 12 of the printed circuit board 10. . The plurality of conductive wires 28 include a first end point 30 and a second end point 32, the first end point 30 is electrically connected to the image sensor chip 26, and the second end point 32 is electrically connected to the first contact 15 of the substrate 10. . The transparent layer 34 adheres to the upper surface 20 of the convex edge layer 18.

  When manufacturing the above-described image sensor, an appropriate gap must always be left between the image sensor chip 26 and the convex edge layer 18, and the conductor 28 is passed therethrough. This method is difficult to manufacture and cannot effectively reduce the packing body. Furthermore, when the size of the image sensor chip is changed, the printed circuit board 10 must be newly designed, which not only extends the production but also increases the production cost.

  The main object of the present invention is to provide a practical, lightweight, thin and compact image sensor package that is convenient to manufacture and reduces production costs.

  Another object of the present invention is to provide a more practical light-weight thin image sensor package with a reduced packing size.

  The present invention includes an upper surface and a lower surface on a printed circuit board, and in the central position of the upper surface, a chip storage area and a plurality of first electrodes respectively formed in the chip storage area are formed. In addition, a large number of second electrodes are formed on the lower surface so as to be electrically connected to the first electrode. The chip is installed at the position where the printed circuit board is placed, and a number of welding mats formed around the sensor zone and the sensor zone are installed. The multiple conductors are electrically connected from the chip welding mat to the first electrode of the printed circuit board, and transmit the chip signal from the first electrode on the upper surface of the printed circuit board to the second electrode on the lower surface of the printed circuit board. The molded body is molded on the non-sensor area and a large number of conductors of the chip by a compression method, and is covered with the non-sensor area and the large number of conductors of the chip, and the sensor area of the chip is exposed to form a molded body. The most important feature is that the transparent layer is placed on the molded body and covered with the sensor area of the chip.

The invention of claim 1 is a lightweight, thin and compact image sensor package in which an upper surface and a lower surface are installed, and a chip storage area and a plurality of chip storage areas are formed at the center of the upper surface. A printed circuit board on which a first electrode is formed and a plurality of second electrodes electrically connected to the first electrode are electrically connected to each other on the lower surface, and a sensor in which the printed circuit board is placed. A chip on which a large number of welding mats are to be formed around the area and the sensor area, and an electrical connection from the chip welding mat to the first electrode of the printed circuit board, and the chip signal is transmitted to the first electrodes on the upper surface of the printed circuit board To the second electrode on the lower surface of the printed circuit board, and formed on the non-sensor area and the multiple conductors of the chip by a compression method, and the non-sensor area and the multiple conductors of the chip Lightweight, thin and compact image consisting of a molded body that covers and exposes the sensor area of the chip, and forms a convex edge layer, and a transparent layer that covers the convex edge layer and covers the sensor area of the chip. The sensor package.
The invention of claim 2 is a lightweight, thin and compact image sensor package according to claim 1, wherein the image sensor package is made of an epoxy resin and molded by a compression method.
The invention of claim 3 is a lightweight, thin and compact image sensor package according to claim 1, wherein a concave hole is formed, and a transparent layer is placed in the concave hole. It is said.

  The light and thin image sensor package of the present invention has advantages that it is convenient for manufacturing and effectively reduces the product packing size.

  As shown in FIG. 2, the present invention includes a printed circuit board 40, a chip 42, a large number of conductive wires 44, a molded body 46, and a transparent layer 48.

  As shown in FIG. 3, the printed circuit board 40 is made of a plastic or ceramic material, and an upper surface 50 and a lower surface 52 are set on the printed board 40. A chip storage area 54 and a chip storage area are located at the center of the upper surface 50. A large number of first electrodes 56 formed respectively on the four sides of the section 54 are formed. A plurality of second electrodes 58 are formed on the lower surface 52 so as to be connected to the first electrode 56 and face each other.

  The chip 42 is installed at the chip storage section 54 position of the printed circuit board 40, the sensor section 60 is installed thereon, and a large number of welding mats 62 are formed around the sensor section.

  A large number of conductive wires 44 are electrically connected from the welding mat 62 of the chip 42 to the first electrode 56 of the printed circuit board 40, and the signal of the chip 42 is transmitted from the first electrode 56 on the upper surface 50 of the printed circuit board 40 to the printed circuit board 40. To the second electrode 58 on the lower surface.

  As shown in FIG. 4, the molded body 46 is formed of an epoxy resin by a compression method, covers the non-sensor area of the chip 42 and a large number of conductors 44, and exposes the sensor area 60 of the chip to form a molded body. Thereafter, the molded body 46 is cut into a single image sensor package state.

It is sectional drawing of a well-known image sensor. It is a package state sectional view of the image sensor of the present invention. It is sectional drawing of the package state of the image sensor of 1st Example of this invention. It is sectional drawing of the package state of the image sensor of 2nd Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Printed circuit board 12 1st surface 14 2nd surface 15 1st contact 16 2nd contact 17 Conductor 18 Convex edge layer 20 Upper surface 22 Lower surface 24 Storage chamber 26 Image sensor chip 27 Welding mat 28 Conductor 30 First end point 32 Second end point 34 Transparent layer 40 Printed circuit board 42 Chip 44 Multiple conductors 46 Molded body 48 Transparent layer 50 Upper surface 52 Lower surface 54 Chip storage area 56 First electrode 58 Second electrode 60 Sensor area 62 Welding mat

Claims (3)

  In a light and thin compact image sensor package, an upper surface and a lower surface are installed, and in the central position of the upper surface, a plurality of first electrodes are formed to be molded in each of the chip storage area and the chip storage area, On the lower surface, a large number of second electrodes that are electrically connected to the first electrode are installed in the storage area of the printed circuit board and the printed circuit board that are electrically connected to each other. A chip on which a large number of welding mats are installed, and electrical connection from the chip welding mat to the first electrode of the printed circuit board, and the signal of the chip from the first electrode on the upper surface of the printed circuit board to the lower surface of the printed circuit board A plurality of conductors to be transmitted to the second electrode of the chip and formed on the non-sensor area and the plurality of conductors of the chip in a compression method, covering the non-sensor area and the plurality of conductors of the chip, and Exposing the Sir-ku, image sensor package, wherein the molded body to form a convex edge layer, covered on tongue layer, to be composed of a transparent layer covering covers the sensor Ward chip.   2. The lightweight and thin image sensor package according to claim 1, wherein the image sensor package is made of an epoxy resin and is molded by a compression method.   2. The image sensor package according to claim 1, wherein a concave hole is formed, and a transparent layer is installed in the concave hole.

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