JP3114164B2 - Optical module manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus for manufacturing an optical module equipped with a light operating component and a lead frame by using a mold.

[0002]

2. Description of the Related Art There has been proposed a technique for manufacturing an optical module in which an electronic circuit portion in which light-operating parts are connected by wires and a lead frame are mounted on a mold and integrally molded using a resin material.

In this optical module, a wire bonder for connecting an optical operating component of an optical connector and a lead frame to an electronic circuit formed on the lead frame with an Al wire, and a work to which the wire is connected are mounted on a mold. It has been manufactured using a molding machine for integrally molding a resin material.

[0004]

However, in the conventional optical module manufacturing apparatus, the means for transferring the work for the wire bonder and the means for transferring the work to the mold in the molding machine are implemented by separate independent methods. Therefore, at the stage where the wiring is completed, it is necessary for an operator to manually transfer the work from the work clamp jig for the wire bonder to the transfer pallet and from the transfer pallet to the mold for the molding machine. In addition, the parts electrically connected to each other by wires were not fixed in relative positions with high precision, so stress was applied to the aluminum wires during this transfer work, reducing the wire strength and reducing the post-process. Therefore, it is necessary to maintain the relative positions of these components with high precision, and to attach / detach / convey them. Furthermore, since it was difficult to achieve the exact same relative position with the mold of a very high-precision molding machine, it was necessary to provide the degree of freedom to absorb the positioning error when mounting the mold on the mold. was there. In addition, since the transfer operation is performed in a batch process, it is not suitable for a single-line production line, and it is necessary to prepare a large number of pallets for temporary storage.

Accordingly, the present invention is intended to prevent a reduction in wire strength after electrical connection between an optical actuating component and a lead frame and an electronic circuit, to reduce wire breakage after molding of a product with a mold, and to perform a transfer / transport operation. It is an object of the present invention to provide an apparatus capable of realizing labor saving and single-piece production.

[0006]

SUMMARY OF THE INVENTION The present invention relates to a pallet for holding a relative position between a light-operating component and a lead frame while maintaining the relative positions of the light-operating component and the lead frame. Wire connecting means for connecting the formed electronic circuit with wires, conveying means for conveying the light-operated component and the lead frame connected by the connecting means while being held on the pallet to the mold, and light-operated component and the lead frame And a die mounting means for adsorbing the lead frame and the optically actuated component conveyed by the conveying means while maintaining the relative position of.

[0007]

According to the present invention, from the wire connection means to the mold, the optically actuated component and the lead frame are conveyed in a state where their relative positions are maintained. The wire connection of the electronic circuit formed on the substrate and the mounting of the mold are automatically executed.

[0008]

An embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements will be denoted by the same reference symbols, without redundant description.

First, the basic configuration of the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view illustrating an optical module manufacturing apparatus according to an embodiment, FIG. 2 is a perspective view illustrating a configuration example of a suction unit and a molding machine, and FIG. 3 is a diagram illustrating a structure of the suction unit.

This manufacturing apparatus includes a setting section 1, an automatic work clamping section / aluminum wire bonders (wire connection means) 2, 13, an adsorption section (die mounting means) 3, and a molding machine 4.
And transporting devices 6, 7, 8, 9 for transporting between them.

First, when the pallet 5 is transported to the setting section 1 by the transport device 6, the pallet 5 is stopped at a predetermined position. At this time, an operator positions and mounts the components of the optical module on the pallet 5. In this embodiment, the optically operating components and the lead frame that constitute the optical module are placed on the pallet 5, and while maintaining their relative positions, the workpiece is automatically clamped to the work clamping unit 2, the suction unit 3, and the molding machine 4. And must be automatically transported. Therefore, the pallet 5 has a rectangular groove 53a for receiving a part of the light operating component on the lead pin side, and a light operating component (light receiving component, light emitting component, etc.).
A V-shaped groove 53b for receiving a part of the front end of the lead frame, and a mounting surface 53c for mounting a lead frame and an electronic circuit portion formed on the lead frame are formed (see FIG. 4B).

By the way, the pallet 5 is
The light actuating component positioned above has a built-in light actuating element such as a light receiving element and a light emitting element, and the islands constituting the lead frame have electronic circuits (receiving circuit, transmitting circuit) connected to the light actuating element. ) Are already mounted. Further, in the setting section 1, the lead frame, the light-operating component and the electronic circuit are not yet connected.

After the light-operated parts and the lead frame have been set, the pallet 5 is transferred to the automatic work clamping section 2 by the transfer device 6. In the work automatic clamping section 2, a work of connecting wires between the lead frame positioned on the pallet 5 and the optically actuated component is performed. That is, the wire bonding between the lead pin and the island portion constituting the lead frame by the wire bonder 13,
Wire bonding is performed between the electronic circuit formed on the island portion and the optically active component.

When the connection work in the automatic work clamping section 2 is completed, the pallets 5 are transferred to the suction section 3 by the transfer devices 7 and 8. Since the transfer device 8 is at a position one step higher than the transfer device 7, the pallet 5 transferred by the transfer device 7 is lifted to the height of the transfer device 8 by the lift 10. Thereafter, the pallet 5 is transported to the suction section 3 by the transport device 8, and the work of mounting the lead frame and the optically actuated component on the molding machine 4 is performed. After being mounted, the pallet 5 is moved by the lift 11 to the recovery transport device 12 located below.
And transported to the setting unit 1.

The suction unit 3 includes a suction hand 3A for holding the optical components and the lead frame positioned on the pallet as they are, and a holding plate 3 for holding the suction hand 3A.
B (FIG. 4A). These are mounted on a Z-direction stage 3z provided with a moving mechanism capable of moving in the Z direction via the suction transfer device 9, and the Z-direction moving stage 3z is provided with a moving mechanism capable of moving in the Y direction. Since the Y-direction stage 3y is mounted on the X-direction stage 3x provided with a moving mechanism capable of moving in the X-direction, the suction unit 3 can be moved in any direction (FIG. 2).

The suction hand 3A has a vacuum chamber 31 built therein, and a suction surface 32 for sucking the frame portion of the lead frame is formed on the bottom surface thereof (FIGS. 3B and 3C). The suction surface 32 is formed with a positioning groove 33 for positioning a wire-connected lead frame and an optical component, and a plurality of suction holes 32 a and 32 b communicating with the vacuum chamber 31.
Is exposed.

The positioning groove 33 comprises a rectangular groove 33a for accommodating electronic circuit components mounted on the island portion of the lead frame, and a semicircular groove 33b for positioning the optically actuated component. The arrangement and shape of the suction surface 32 for sucking the portion are rectangular grooves 53a, V grooves 53b, and mounting surfaces 53c (FIG. 4) formed on the pallet 5.
(See (b)), the lead frame and the optically actuated component are held as they are without changing the relative position held by the pallet 5.

The holding plate 3B is disposed substantially in parallel with the suction surface 32, and guides a vacuum pipe 35 connected to a vacuum pump 34 (FIG. 2) by a guide pipe 39 formed on the holding plate 3B, thereby holding the suction plate. Since it is connected to the hand 3A, the air in the vacuum chamber 31 can be sucked. In the vacuum chamber 31,
Since the suction holes 32a and the suction holes 32b communicate with each other, the light-actuated components held by the positioning groove 33b and the frame portion of the lead frame on which the electronic circuit components abut on the suction surface are sucked.

Next, a description will be given, with reference to FIGS. 4 and 5, of a positioning structure for a light-operating component and a lead frame in a suction portion, a pallet, and a mold that can be used in this embodiment.

FIG. 4A shows a positioning structure of the suction hand.
FIG. 2B shows a positioning structure of the transfer device and the pallet,
FIG. 6 (c) is a longitudinal sectional view cut from the Z direction (see FIG. 2) showing the positioning structure of the mold, and FIG. 6 (a).
FIG. 4B shows a state in which the light-operating component is positioned by the pallet, FIG. 4B shows a state in which the light-operating component is positioned on the pallet, and FIG. Z direction showing the state of being sandwiched between (see FIG. 2)
FIG. 5 is a longitudinal sectional view cut from FIG.

Next, a description will be given of a positioning mechanism of the transfer device with reference to FIG. FIG. 5 is a perspective view showing an example of a positioning mechanism of the transport device. The positioning unit on the transfer device 8 includes:
A stopper 8 having a lifting / lowering operation function capable of holding the stop position of the pallet 5 and retracting below the upper surface of the conveyor belt 87.
4, 85, 86 and a positioning plate 83 are arranged,
In the initial state, the stopper 84 is retracted downward, and the stopper 85,
86 is at the upper limit position. The first pallet is stopper 85
Temporarily stops in a state of slipping with the transport belt 87,
The next pallet collides with the first pallet and stops once again. Then, the next pallet that has collided and stopped is fitted at its upper limit by the ascending operation of the stopper 84 formed so that the positioning pin 81 is fitted into the pin hole 51b of the pallet, and the position is held. Next, when the stopper 85 is retracted below the upper surface of the transport belt 87 by the descending operation, the first pallet is again transported to the stopper 86 on the transport belt 87 and temporarily stops. Thereafter, the positioning pin 81 is fitted into the pin hole 51b of the pallet by the raising operation of the positioning plate 83, whereby the pallet 5 is positioned above the upper surface of the transport belt 87 on the transport device 8 (FIG. 4B). (Fig. 5). In addition, the transfer devices 6 and 7
Has a function of transporting the pallet 5 by the transport belt 87 before and after the automatic work clamping device 2,
The optically actuated components and the lead frame are transported on the pallet 5 with the relative position maintained.

A pin hole 32c into which the positioning pin 82 is inserted is formed on the suction surface 32 of the suction section 3 (FIG. 4A). Therefore, when the suction part 3 sucks the optically actuated component and the lead frame on the pallet 5, the positioning pins 8 of the positioning plate 83 formed on the transport device 8 are used.
2 is inserted into the pin hole 32c of the suction unit 3, whereby the suction unit 3 and the pallet 5 are accurately positioned (FIG. 4).
(A), (b)). As described above, the rectangular grooves 33a, 53a, the semicircular grooves 33b, 53 of the suction portion 3 and the pallet 5
Since the arrangement and shape of b and the like correspond to each other, the optically actuated component and the lead frame are moved from the pallet 5 to the suction portion 3 as they are without changing their relative positions (FIGS. 6A and 6B). )).

Further, a pin member 36, one end of which is fixed to the suction hand 3A and the other end of which is movably held by a holding plate 3B, is mounted on the suction portion 3 and the suction hand 3A.
A compression coil spring 37 is wound around an intermediate portion of the pin member 36 exposed between the holding plate 3B. For this reason, since the suction hand 3A and the holding plate 3B are urged away from each other, it is possible to press the light actuated component and the lead frame to suck. Therefore,
The optically actuated component and the lead frame are closely attached to the suction hand 3A, and the suction success rate is further improved.

A guide hole 38 larger than the pin diameter of the pin member 36 is formed in the holding plate 3B.
8 is formed on the connection side (opposite side of the suction hand 3A) of the guide pipe 39 with a tapered first engagement portion 38a, and the contact portion of the pin member 36 is in close contact with the first engagement portion 38a. Thus, a second engagement portion 36a is formed. Guide hole 38
Is formed larger than the pin member 36, even if the position of the suction portion 3 with respect to the pallet 5 is slightly shifted, the position shift is absorbed by the movement of the pin member 36 in the guide hole 38. Then, the first engagement portion 38a
The suction hand 3A roughly reproduces the positioning of the suction hand 3A with respect to the holding plate 3B by the close contact between the and the second engagement portion 36a.

The molding machine 4 includes a conventional type mold composed of an upper mold 4A and a lower mold 4B, and each mold has a semicircular groove 41, 4 for positioning an optically actuated component.
2. Carrier portions 43 and 44 for accommodating island portions of the lead frame are formed (see FIG. 6C).
By injecting the resin material into the carrier portion, the optically actuated component and the lead frame are integrally molded. The lower mold 4B has positioning pins 4 fitted in the pin holes 32c at positions corresponding to the pin holes 32c formed in the suction hand 3A.
5 are formed. The pin hole 32c is provided in the lower mold 4B.
Is formed in accordance with the arrangement dimensions of the positioning pins 45 at the operating temperature (at the time of temperature rise: 150 to 200 degrees Celsius). Therefore, when mounting the optically actuated component and the lead frame on the lower mold 4B, the positioning pin 45 is inserted into the pin hole 32c of the suction section 3 so that the suction section 3 and the lower mold 4B are inserted.
Are accurately positioned.

In particular, a compression coil spring 37 is mounted on the suction portion 3 to absorb a shock, thereby reducing the risk of damaging the lower mold 4B.

Further, in the present embodiment, a circumferential groove G is formed on the outer periphery of the light operating component to be used, and this circumferential groove G is
B is engaged with the projection P formed on the lower mold 4B.
Is realized (FIG. 6C). Therefore, the light-operated component is stabilized in the mold, and the light-activated component is not moved by the injection pressure of the resin material.

As described above, according to the optical module manufacturing apparatus according to the present embodiment, errors in the level of the pallet, the suction unit, and the positional accuracy at the time of loading and unloading are absorbed, and
Wire connection and die mounting are realized in a state of being held on the pallet, that is, in a state in which the relative positions of the optically actuated component and the lead frame are maintained, so that labor saving can be achieved.

Further, since the optically actuated component and the lead frame are conveyed while maintaining their relative positions, the burden on the wire connecting the two components that are not relatively fixed is small. Therefore, it is possible to use a Au wire (less than φ100 μm) with a smaller diameter or a smaller diameter than the conventional Al wire, and it is possible to reduce costs and achieve high reliability.

The present invention is not limited to the above embodiment,
Variations and modifications are possible without departing from the spirit of the invention.

For example, in this embodiment, the transfer device and the pallet are positioned by engaging the convex portion formed on the pallet mounting surface of the transfer device with the concave portion formed on the bottom surface of the pallet. Alternatively, a concave portion may be formed on the pallet mounting surface of the transfer device, and a convex portion may be formed on the bottom surface of the pallet.

Similarly, in the present embodiment, the protrusion formed near the pallet mounting surface of the transfer device and the recess formed on the suction surface of the suction unit are engaged with each other, whereby the suction unit with respect to the transfer device is engaged. Although positioning is performed, a concave portion may be formed on the pallet mounting surface of the transfer device, and a convex portion may be formed on the suction surface. Similarly, a concave portion may be formed on the mounting surface of the mold.

[0033]

As described above, according to the present invention, from the wire connection means to the mold, the optically actuated component and the lead frame are transported in a state where their relative positions are maintained. Wire connection between the component and the lead frame and mounting of the mold are automatically performed. Therefore, it is possible to provide a highly productive apparatus which can save labor and can be applied to a single-line production line.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of an optical module manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a configuration example of a suction unit and a molding machine of the optical module manufacturing apparatus according to the embodiment of the present invention.

FIG. 3 is a diagram illustrating a structure of a suction unit of the optical module manufacturing apparatus according to the embodiment of the present invention.

FIG. 4 is a vertical cross-sectional view showing a positioning structure of an optical component and a lead frame in a suction unit, a pallet, and a mold that can be used in the embodiment of the present invention, which is cut in a Z direction.

FIG. 5 is a perspective view showing an external appearance of a pallet positioning mechanism in a suction unit 3 of the transfer device 8;

FIG. 6 is a vertical sectional view cut from the Z direction showing a positioning state of an optical component and a lead frame in a suction unit, a pallet, and a mold that can be used in the embodiment of the present invention.

[Explanation of symbols]

1: Setting part, 2: Automatic work clamping part, 3:
Suction part, 3A ... suction hand, 3B ... holding plate, 31 ... vacuum chamber, 32 ... suction surface, 33 ... positioning groove, 34 ..., vacuum pump, 35 ... vacuum pipe, 36 ... pin member, 37 ... compression coil spring, 38: guide hole, 39: guide pipe, 4: molding machine, 4A: upper mold, 4B: lower mold, 41, 42
... Semicircular grooves, 43, 44 ... Carrier part, 45 ... Positioning pins, 5 ... Pallets, 6, 7, 8, 9 ... Conveying devices, 81,
82: positioning pins, 83: positioning plates, 84, 85,
Reference numeral 86: stopper, 87: transport belt, 10, 11: lift, 12: recovery transport device, 13: wire bonder.

────────────────────────────────────────────────── ⁷ Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI // B29L 11:00 (56) References JP-A-5-192954 (JP, A) JP-A-4-307214 (JP, A) JP-A-2-214629 (JP, A) JP-A-62-212112 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 45/00-45/84 B29C 33 / 12 G02B 6/42

Claims (7)

(57) [Claims] 1. A manufacturing apparatus for manufacturing an optical module having a light operating component and a lead frame using a mold, wherein the pallet holds the light operating component and the lead frame while maintaining their relative positions, and the pallet. Wire connecting means for connecting the optically actuated component and the lead frame to an electronic circuit portion formed on the lead frame by wires while being held by the pallet, and being connected by the connecting means while being held by the pallet. Conveying means for conveying the light actuated component and the lead frame to the mold, and maintaining the relative positions of the light actuated component and the lead frame while maintaining the relative positions of the light actuated component and the lead frame. An optical module manufacturing apparatus comprising: a die mounting means for sucking and mounting the die to the die. 2. The optical module manufacturing apparatus according to claim 1, wherein the light operating component includes a light emitting component and / or a light receiving component. 3. The light according to claim 1, wherein a pair of concave portions are formed on a bottom surface of the pallet, and a convex portion that engages with the concave portion is formed on a pallet mounting surface of the transporting means. Module manufacturing equipment. 4. A method according to claim 1, wherein a convex portion is formed near a pallet mounting surface of said transport means, and a concave portion is formed in said mold mounting means to engage with said convex portion. Optical module manufacturing equipment. 5. A first member having a suction surface that communicates with a vacuum chamber and suctions the pallet, wherein the mold mounting means is arranged substantially in parallel with the suction surface and suction tube sucked from the vacuum chamber. , A pin member fixed to the first member and held movably by the second member, and a direction wound around the pin member to separate the first member and the second member. And a guide hole larger than the outer diameter of the pin member is formed in the second member, and the first member is tapered on the opposite side of the guide hole from the first member. A joining portion is formed, and a second engaging portion that is in close contact with the first engaging portion is formed in a contact portion of the pin member, and the first engaging portion and the second engaging portion are in close contact. Wherein the first member is positioned with respect to the second member. Optical module manufacturing apparatus of claim 1, wherein. 6. The first member has at least one pair of positioning holes formed on the suction surface, the mold has a pin portion protruding from the positioning hole, and the pin is inserted into the positioning hole. By inserting the part,
6. The optical module manufacturing apparatus according to claim 5, wherein the optically actuated component, the electronic circuit unit, and the lead frame held by the suction unit are positioned in the mold. 7. The optical module manufacturing apparatus according to claim 6, wherein the positioning hole is formed in accordance with a size of a pin portion at a use temperature of the mold.