JPH05192955A - Apparatus for producing optical module - Google Patents

Abstract

PURPOSE:To provide the present apparatus reducing the disconnection of a wire after molding by preventing the lowering of the strength of the wire after the electrical connection of an optical operation part, a lead frame and an electronic circuit part and capable of embodying the reduction of labor in transfer and feed work and an individual conveyor production instead of a batch system. CONSTITUTION:A palette 5 holding an optical operation part and a lead frame in such a state that the relative position of them is kept and wire connection means 2, 3 connecting the optical operation part, the lead frame and the electronic circuit formed on the lead frame in the state held on the palette 5 by wires are provided. Further, feed means 7, 8, 9 feeding the optical operation part and lead frame connected by the wire connection means 2 in the state held on the palette 5 to a mold 4 and a mold mounting means 3 sucking the optical operation part and lead frame fed by the feed means 7,8,9 in such a state that the relative position of the optical operation part and the lead frame is kept to mount them on the mold 4 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus for manufacturing an optical module equipped with an optical actuating component and a lead frame by using a mold.

[0002]

2. Description of the Related Art An optical module manufacturing technique has been proposed in which an electronic circuit portion in which an optical actuation component is connected by a wire and a lead frame are mounted in a mold and integrally molded using a resin material.

In this optical module, an optical actuating component of an optical connector, a lead frame, and a wire bonder for connecting an electronic circuit formed on the lead frame with a wire made of Al, and a work to which the wire is connected are mounted on a mold. It was manufactured using a molding machine that integrally molds the resin material.

[0004]

However, in the conventional optical module manufacturing apparatus, the means for transporting the work for the wire bonder and the means for transporting the work to the mold in the molding machine are implemented by separate and independent methods. Therefore, at the stage where the wiring is completed, it is necessary for the worker to manually transfer the work from the work clamp jig for the wire bonder to the transfer pallet, and further from the transfer pallet to the mold for the molding machine. In addition, the parts electrically connected to each other by wire were not fixed in relative position with high accuracy, so stress was applied to the aluminum wire during this transfer work, and the wire strength was reduced. Therefore, it is necessary to maintain the relative positions of these parts with high accuracy, and to attach / detach / transport the parts. Furthermore, since it was difficult to achieve the exact same relative position with respect to the mold of a very high-precision molding machine, it is also necessary to realize and have the degree of freedom to absorb the positioning error when mounting on the mold. was there. Moreover, since this transfer work was performed in batch processing, it was not suitable for a single-flow production line, and it was necessary to prepare a large number of pallets for temporary storage.

Therefore, the present invention prevents reduction of wire strength after electrical connection between the optical actuating component and the lead frame and the electronic circuit, reduces wire breakage after molding the product with the mold, and further transfers and conveys work. It is an object of the present invention to provide a device capable of realizing labor saving and single-flow production.

[0006]

DISCLOSURE OF THE INVENTION The present invention provides a pallet for holding a relative position of a light actuated component and a lead frame, and a light actuated component, a lead frame and a lead frame on the pallet. Wire connecting means for connecting the formed electronic circuits with wires, conveying means for conveying the photo-actuated component and lead frame connected by the connection means to the mold while being held on the pallet, photo-actuated component and lead frame And a die mounting means for adsorbing and mounting the photo-actuated component and the lead frame conveyed by the conveying means in a state where the relative position is maintained.

[0007]

According to the present invention, the photo-actuated component and the lead frame are transported from the wire connecting means to the mold in a state where their relative positions are maintained. Wire connection of the formed electronic circuit and die mounting are automatically performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. In the description, the same elements will be denoted by the same reference symbols, without redundant description.

First, the basic structure of the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing an optical module manufacturing apparatus according to an embodiment, FIG. 2 is a perspective view showing a configuration example of a suction unit and a molding machine, and FIG. 3 is a diagram showing a structure of the suction unit.

This manufacturing apparatus comprises a setting unit 1, a workpiece automatic clamping unit, aluminum wire bonders (wire connecting means) 2 and 13, a suction unit (die mounting means) 3, a molding machine 4.
And transporting devices 6, 7, 8 and 9 for transporting between them.

First, when the pallet 5 is transported to the setting section 1 by the transport device 6, the pallet 5 is stopped at a predetermined position, and at this time, an operator positions and mounts the components of the optical module on the pallet 5. In the present embodiment, the optical actuating parts and the lead frame which form the optical module are placed on the pallet 5, and the workpiece automatic clamp part 2, the suction part 3 and the molding machine 4 are maintained in a state where their relative positions are maintained. And have to be transported automatically. Therefore, the pallet 5 has a rectangular groove 53a for receiving a part of the light-operated component on the lead pin side, and the light-actuated component (light-receiving component, light-emitting component, etc.).
A V-shaped groove 53b that receives a part of the front end side thereof, and a mounting surface 53c on which the lead frame and the electronic circuit portion formed on the lead frame are mounted (see FIG. 4B).

By the way, the pallet 5 is set in the setting section 1.
The photo-actuated parts positioned above have built-in photo-actuated elements such as light-receiving elements and light-emitting elements, and the islands that make up the lead frame have electronic circuits (receiver circuit, oscillator circuit) connected to the photo-actuated elements. ) Has already been mounted. Further, in the setting section 1, the lead frame, the light actuated component and the electronic circuit are not yet connected.

After the photo-actuated parts and the lead frame are set, the pallet 5 is conveyed to the workpiece automatic clamping section 2 by the conveying device 6. In the work automatic clamping part 2, the work of connecting the lead frame positioned on the pallet 5 and the wire in the light actuated component is performed. That is, wire bonding between the lead pins and the island portion, which form the lead frame by the wire bonder 13,
Wire bonding is performed between the electronic circuit formed on the island portion and the photo-actuated component.

When the connection work in the workpiece automatic clamping unit 2 is completed, the pallet 5 is transported to the suction unit 3 by the transport devices 7 and 8. Since the carrier device 8 is located one step higher than the carrier device 7, the pallet 5 carried by the carrier device 7 is lifted to the height of the carrier device 8 by the lift 10. After that, the pallet 5 is transported to the suction unit 3 by the transport device 8, and the work of mounting the lead frame and the optically actuated component on the molding machine 4 is executed. After the mounting, the pallet 5 is placed below by the lift 11 and is a transport device 12 for recovery.
And is transported to the setting section 1.

The suction part 3 includes a suction hand 3A for holding the optical components and the lead frame positioned on the pallet as they are, and a holding plate 3 for holding the suction hand 3A.
B (FIG. 4 (a)). These are mounted on a Z-direction stage 3z equipped with a moving mechanism that can move in the Z-direction via the suction conveyance device 9, and this Z-direction moving stage 3z includes a moving mechanism that can move in the Y-direction. Since the Y-direction stage 3y is installed on the stage 3y, and the Y-direction stage 3y is installed on the X-direction stage 3x equipped with a moving mechanism that can move in the X-direction, the suction unit 3 can be moved in any direction (Fig. 2).

The suction hand 3A contains a vacuum chamber 31, and a suction surface 32 for suctioning the frame portion of the lead frame is formed on the bottom surface thereof (FIGS. 3B and 3C). A positioning groove 33 for positioning the lead frame connected to the wire and the light actuated component is formed on the suction surface 32, and a plurality of suction holes 32a, 32b communicating with the vacuum chamber 31 are formed.
Is exposed.

The positioning groove 33 is composed of a rectangular groove 33a for accommodating an electronic circuit component mounted on the island portion of the lead frame, and a semicircular groove 33b for positioning an optically actuated component, and these and the frame of the lead frame. The arrangement and shape of the suction surface 32 for sucking the parts are the rectangular groove 53a, the V groove 53b, and the mounting surface 53c (FIG. 4) formed on the pallet 5.
Since it is formed in correspondence with (b), the lead frame and the light actuated component can be held as they are without changing the relative position held by the pallet 5.

The holding plate 3B is arranged substantially parallel to the suction surface 32, and a vacuum pipe 35 connected to a vacuum pump 34 (FIG. 2) is guided by a guide pipe 39 formed on the holding plate 3B to suck it. Since it is connected to the hand 3A, the air in the vacuum chamber 31 can be sucked. In the vacuum chamber 31,
Since the suction holes 32a and the suction holes 32b described above are communicated with each other, the light actuated component held in the frame portion of the lead frame on which the electronic circuit component abutting the suction surface and the positioning groove 33b are sucked.

Next, the positioning structure of the suction part, the photo-actuated parts in the pallet and the mold, and the lead frame which can be used in this embodiment will be described with reference to FIGS. 4 and 5.

FIG. 4A shows a positioning structure of the suction hand,
FIG. 2B shows a positioning structure for the transport device and the pallet,
5C is a vertical cross-sectional view taken along the Z direction (see FIG. 2) showing the positioning structure of the mold, and FIG.
Is a state in which the light-actuated component is positioned by the suction portion, FIG. 7B is a state in which the light-actuated component is positioned in the pallet, and FIG. 7C is an upper die and a lower die in which the light-actuated component is mounted on the mold. Z direction (see Fig. 2)
It is a longitudinal cross-sectional view cut from FIG.

Next, the positioning mechanism of the transfer device will be described with reference to FIG. FIG. 5 is a perspective view showing an example of a positioning mechanism of the transport device. In the positioning part on the transport device 8,
A stopper 8 having an elevating function capable of holding the pallet 5 at the stop position and retracting it below the upper surface of the conveyor belt 87.
4, 85, 86 and the positioning plate 83 are arranged,
In the initial state, the stopper 84 is retracted downward, the stopper 85,
86 is at the upper limit position. The first pallet is stopper 85
And once stopped in a state of slipping with the conveyor belt 87,
The next pallet collides with the first pallet and stops similarly. Then, the next pallet, which has collided and stopped, is fitted and held at the upper limit by the ascending operation of the stopper 84 formed so that the positioning pin 81 fits into the pin hole 51b of the pallet. Next, when the stopper 85 is retracted below the upper surface of the conveyor belt 87 by the descending operation, the first pallet is again placed on the conveyor belt 87, conveyed to the stopper 86, and temporarily stopped. After that, the positioning pin 81 is fitted into the pin hole 51b of the pallet by the raising operation of the positioning plate 83, so that the pallet 5 is positioned on the transport device 8 above the upper surface of the transport belt 87 (FIG. 4B). Figure 5). The transport devices 6 and 7
Has a function of transporting the pallet 5 by the transport belt 87 before and after the workpiece automatic clamping device 2,
The light actuated component and the lead frame are transported on the pallet 5 with their relative positions maintained.

Further, the suction surface 32 of the suction portion 3 is formed with a pin hole 32c into which the positioning pin 82 is inserted (FIG. 4 (a)). Therefore, when the suction part 3 sucks the photo-actuated components and the lead frame on the pallet 5, the positioning pin 8 of the positioning plate 83 formed in the carrying device 8 is positioned.
By inserting 2 into the pin hole 32c of the suction unit 3, the suction unit 3 and the pallet 5 are accurately positioned (FIG. 4).
(A), (b)). As described above, the rectangular grooves 33a and 53a, the semicircular grooves 33b and 53 of the suction section 3 and the pallet 5 are formed.
Since b and the like correspond in arrangement and shape, the photo-actuated component and the lead frame are moved from the pallet 5 to the suction unit 3 as they are without changing their relative positions (FIGS. 5A and 5B). ).

Further, a pin member 36, one end of which is fixed to the suction hand 3A and the other end of which is movably held by a holding plate 3B, is attached to the suction unit 3 in the suction unit 3 and the suction hand 3A.
A compression coil spring 37 is wound around the intermediate portion of the pin member 36 exposed between the holding plate 3B and the holding plate 3B. Therefore, since the suction hand 3A and the holding plate 3B are urged in the direction in which they are separated from each other, the light actuated component and the lead frame can be pressed and suctioned. Therefore,
The photo-actuated component and the lead frame are in close contact with the suction hand 3A, and the suction success rate is further improved.

A guide hole 38 larger than the pin diameter of the pin member 36 is formed in the holding plate 3B.
8 has a tapered first engaging portion 38a on the connection side of the guide pipe 39 (opposite side of the suction hand 3A), and the contact portion of the pin member 36 is in close contact with the first engaging portion 38a. Thus, the second engaging portion 36a is formed. Guide hole 38
Since the pin member 36 is formed to be larger than the pin member 36, even if the position of the suction portion 3 with respect to the pallet 5 is slightly displaced, the displacement of these positions is absorbed by the movement of the pin member 36 in the guide hole 38. Then, the first engaging portion 38a
When the suction hand 3A and the second engaging portion 36a are in close contact with each other, the rough positioning of the suction hand 3A with respect to the holding plate 3B is reproduced.

The molding machine 4 comprises a conventional type mold including an upper mold 4A and a lower mold 4B, and each mold has a semi-circular groove 41, 4 for positioning an optical operation part.
2. Carrier parts 43 and 44 for accommodating the island parts of the lead frame are formed (see FIG. 6C),
By injecting the resin material into the carrier part, the optical actuation part and the lead frame are integrally molded. The lower die 4B has a positioning pin 4 which is fitted into the pin hole 32c at a position corresponding to the pin hole 32c formed in the suction hand 3A.
5 is formed. In addition, the pin hole 32c,
Is formed according to the arrangement dimension of the positioning pin 45 at the operating temperature (at the time of temperature increase: 150 to 200 degrees Celsius). Therefore, when mounting the photo-actuated component and the lead frame on the lower die 4B, the positioning pin 45 is inserted into the pin hole 32c of the adsorption portion 3 so that the adsorption portion 3 and the lower die 4B are inserted.
Are accurately positioned.

In particular, since the compression coil spring 37 is attached to the suction portion 3 to absorb the shock, the risk of damaging the lower die 4B is reduced.

Further, in this embodiment, a circumferential groove G is formed on the outer circumference of the photo-actuator used, and the circumferential groove G is formed in the lower mold 4.
By engaging with the protrusion P formed on B, the lower mold 4B
The alignment in FIG. 6 is realized (FIG. 6 (c)). Therefore, the photo-actuated component is stable in the mold, and the photo-actuated component does not move due to the injection pressure of the resin material.

As described above, according to the optical module manufacturing apparatus according to the present embodiment, the errors in the level accuracy of the pallet, the suction part, and the molding machine and the positional accuracy at the time of loading / unloading are absorbed,
Since the wire connection and the die mounting are realized in a state of being held on the pallet, that is, in a state where the relative positions of the light actuated component and the lead frame are maintained, it is possible to save labor.

Further, since the optical actuating component and the lead frame are conveyed in a state where their relative positions are maintained, the load on the wire connecting the two components that are not relatively fixed is small. Therefore, it is possible to use an Au wire (φ100 μm or less) having a diameter smaller than or smaller than that of a conventional Al wire, and it is possible to achieve cost reduction and high reliability.

The present invention is not limited to the above embodiment,
Modifications and alterations are possible without departing from the spirit of the invention.

For example, in the present embodiment, the convex portion formed on the pallet mounting surface of the conveying device and the concave portion formed on the bottom surface of the pallet are engaged with each other to position the conveying device and the pallet. A recess may be formed on the pallet mounting surface of the transfer device, and a projection may be formed on the bottom surface of the pallet.

Similarly, in this embodiment, the convex portion formed in the vicinity of the pallet mounting surface of the conveying device and the concave portion formed on the adsorbing surface of the adsorbing portion are engaged with each other, whereby Although the positioning is performed, a concave portion may be formed on the pallet mounting surface of the carrying device and a convex portion may be formed on the suction surface. Similarly, a recess may be formed on the mounting surface of the mold.

[0033]

As described above, according to the present invention, the photo-actuated component and the lead frame are transported from the wire connecting means to the mold while maintaining their relative positions. Wire connection between parts and lead frame and die mounting are automatically performed. Therefore, labor saving can be achieved, and it is possible to provide a highly productive device that can be applied to a single-piece production line.

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of an optical module manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration example of a suction unit and a molding machine of the optical module manufacturing apparatus according to the embodiment of the present invention.

FIG. 3 is a diagram showing a structure of a suction portion of an optical module manufacturing apparatus according to an embodiment of the present invention.

FIG. 4 is a vertical cross-sectional view taken from the Z direction showing a positioning structure of an optical component and a lead frame in a suction unit, a pallet and a mold that can be used in an embodiment of the present invention.

FIG. 5 is a perspective view showing an external appearance of a pallet positioning mechanism in a suction unit 3 of the transfer device 8.

FIG. 6 is a vertical sectional view cut from the Z direction showing a positioning state of an optical part and a lead frame in a suction part, a pallet and a mold which can be used in an embodiment of the present invention.

[Explanation of symbols]

1 ... Setting part, 2 ... Work automatic clamp part, 3 ...
Adsorption part, 3A ... Adsorption hand, 3B ... Holding plate, 31 ... Vacuum chamber, 32 ... Adsorption surface, 33 ... Positioning groove, 34 ..., Vacuum pump, 35 ... Vacuum pipe, 36 ... Pin member, 37 ... Compression coil spring, 38 ... Guide hole, 39 ... Guide pipe, 4 ... Molding machine, 4A ... Upper mold, 4B ... Lower mold, 41, 42
... Half-circle groove, 43, 44 ... Carrier part, 45 ... Positioning pin, 5 ... Pallet, 6, 7, 8, 9 ... Conveying device, 81,
82 ... Locating pin, 83 ... Locating plate, 84, 85,
86 ... Stopper, 87 ... Transport belt, 10, 11 ... Lift, 12 ... Recovery transport device, 13 ... Wire bonder.

Claims (7)

[Claims] 1. A manufacturing apparatus for manufacturing an optical module including an optical actuation component and a lead frame by using a mold, and a pallet for holding the relative position of the optical actuation component and the lead frame, and the pallet. A wire connecting means for connecting the photo-actuated component and the lead frame to an electronic circuit portion formed on the lead frame with a wire in a state of being held by the pallet, and a connection by the connecting means in a state of being held in the pallet. And a conveying means for conveying the photo-actuated component and the lead frame to the mold, and the photo-actuated component and the lead frame conveyed by the conveying means while maintaining the relative positions of the photo-actuated component and the lead frame. An optical module manufacturing apparatus configured to include a die mounting unit that sucks and attaches to the die. 2. The optical module manufacturing apparatus according to claim 1, wherein the light actuating component includes a light emitting component and / or a light receiving component. 3. The light according to claim 1, wherein the bottom surface of the pallet is formed with a pair of concave portions, and the pallet mounting surface of the conveying means is formed with a convex portion that engages with the concave portion. Module manufacturing equipment. 4. A convex portion is formed in the vicinity of the pallet mounting surface of the conveying means, and a concave portion that engages with the convex portion is formed in the mold mounting means. Optical module manufacturing equipment. 5. The die mounting means comprises a first member having a suction surface which is in communication with a vacuum chamber and which sucks the pallet, and a suction tube which is disposed substantially parallel to the suction surface and sucks from the vacuum chamber. And a pin member fixed to the first member and movably held by the second member, and a direction wound around the pin member to separate the first member and the second member from each other. A guide hole larger than the outer diameter of the pin member is formed in the second member, and a tapered first engaging member is formed on the opposite side of the first member from the guide hole. A mating portion is formed, a second engaging portion that is in close contact with the first engaging portion is formed in the contact portion of the pin member, and the first engaging portion and the second engaging portion are in close contact with each other. The first member is positioned with respect to the second member by Optical module manufacturing apparatus of claim 1, wherein. 6. The at least one pair of positioning holes is formed in the suction surface of the first member, and a pin portion to be inserted into the positioning hole is projectingly provided in the mold, and the pin is provided in the positioning hole. By inserting the part,
6. The optical module manufacturing apparatus according to claim 5, wherein the photo-actuated component and the electronic circuit portion held by the suction means and the lead frame are positioned in the mold. 7. The optical module manufacturing apparatus according to claim 6, wherein the positioning hole is formed in accordance with the size of the pin portion at the working temperature of the mold.