JP3104675B2 - Circuit board and marking method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board suitable for use on, for example, a printed circuit board and a marking method therefor.

[0002]

2. Description of the Related Art Generally, a circuit board such as a printed wiring board is subjected to various functional tests for electrical characteristics after manufacturing. If the specified characteristics are satisfied, the product is determined to be good, and if not, it is determined to be defective.

Conventionally, such non-defective / defective products are identified by:
This is performed by using a marking method in which an operator performs a marking process on the circuit board by stamping or the like after inspection. In this method, a circuit board is subjected to a marking process such as stamping based on an inspection result, and a non-defective / defective product is identified by the marking.

[0004] This type of marking method is disclosed in Japanese Patent Application Laid-Open Nos. 2-250347 and 1-30934.
Japanese Unexamined Patent Application Publication No. 5 (1999) -175, adopts a method disclosed in Japanese Unexamined Patent Application Publication No. 2005-125, respectively, as "a method for inspecting a semiconductor integrated circuit" and "a method for marking a semiconductor chip and a marking apparatus therefor".

[0005] In these methods, light is emitted from a light radiator to a semiconductor integrated circuit wafer coated with a photosensitive substance based on an inspection result to change the color of the photosensitive substance, thereby discriminating a nondefective / defective product. .

[0006]

However, in the former case (marking process by stamping or the like), since the marking process is performed by an operator (manually), the marking position is visually set during the marking process to perform the marking process. Therefore, there is a problem that the marking process is complicated.

[0007] On the other hand, in the latter (marking process using radiation light), since the marking process is performed by light emission, it is necessary to prepare optical means separately from the electrical means used for circuit inspection during the marking process. This causes a problem that the processing space is widened.

[0008] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a circuit board and a marking method capable of easily performing a marking process and reducing a processing space. I do.

[0009]

In order to achieve the above object, a circuit board according to a first aspect of the present invention is a circuit board having a substrate body having a practical circuit, wherein the substrate body has a marking with a heating element. to form a use circuit, this
Selectable marking circuit or practical circuit for power supply circuit
And a marking switch.
The configuration is such that thermal paper located near the heating element in the road is provided. Therefore, the power by switching the changeover switch
When the heating element generates heat by the voltage supply from the source circuit ,
The circuit board is identified as a non-defective or defective product by the discoloration of the thermal paper located near the heating element.

According to a second aspect of the present invention, in the circuit board according to the first aspect, a thermal paper is wound around the heating element. Therefore, when the heating element generates heat by the voltage supply, the circuit board is identified as a non-defective or defective product due to the discoloration of the thermal paper wound around the heating element.

[0011] The invention according to claim 3 is the invention according to claim 1 or 2.
In the circuit board described above, the heating element is configured by a resistance element. Therefore, when the resistance element generates heat by the voltage supply, the circuit board is identified as a non-defective or defective product due to the discoloration of the thermal paper located near the resistance element.

The invention according to claim 4 (Markin on a circuit board)
Method) is to place thermal paper in advance on the substrate body for forming the circuit board.
A marking circuit having a heating element arranged in the vicinity thereof
Path with the practical circuit and this practical circuit or
Selective connection to marking circuit by changeover switch
Power supply circuit, and the power supply voltage from this power supply circuit
Based on the inspection result of the practical circuit,
A method of discoloring the thermal paper by supplying the thermal element
I have.

Therefore, the switching of the changeover switch causes
When the power supply circuit and the marking circuit are
Voltage is supplied from the source circuit to the heating element, and the vicinity of the heating element
Color of the thermal paper placed in the
Can obtain a circuit board that can be identified as a defective product.

According to the fifth aspect of the present invention, the circuit of the fourth aspect is provided.
The circuit board marking method
To supply power supply voltage to heating element according to inspection result
There is. Therefore, the power supply voltage to the heating element
Supply is performed based on the inspection result that makes the circuit board non-defective.
You .

The invention according to claim 6 is the invention according to claim 4 or 5.
In the circuit board marking method described above,
Switch is controlled by a controller.
It is . Therefore, the controller controls the changeover switch.
The switching of the changeover switch is performed .

The invention according to claim 7 is the circuit according to claim 6.
In the method of marking a circuit board, the controller
The quality of the circuit board based on the test result of the circuit
There is a way . Therefore, if the controller is a practical circuit
The inspection result of the
You .

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the drawings. FIG. 1 shows a first embodiment of the present invention.
FIG. 3 is a block diagram showing a main part of the circuit board according to FIG. In the figure
The circuit board denoted by reference numeral 1 is
Switch 3, controller 4, heating element 5, and thermal paper 6
I have.

The substrate body 2 is a practical circuit including the first wiring 7.
(Not shown) and a marking circuit including the second wiring 8
(Not shown).

A switching switch is provided on the circuit forming surface of the substrate body 2.
The first wiring 7 or the second wiring 8 by switching the switch 3
A power supply circuit 9 for supplying a power supply voltage is formed.

The changeover switch 3 is a switch for selectively connecting the first wiring 7 or the second wiring 8 to the power supply circuit 9, and is mounted on the circuit forming surface of the substrate main body 2. As a result, the power supply circuit 9 is connected to the second wiring 8 after the inspection of the practical circuit (not shown) (when the circuit board 1 is non-defective), and in other cases, the power supply circuit 9 is connected to the first wiring 7. Connected.

The controller 4 is a controller that determines a good or defective product of the circuit board 1 (practical circuit) based on the inspection result by the inspection device 10 and controls switching of the changeover switch 3 based on the determination result. Substrate body 2
Is mounted on the circuit formation surface of

When the result of the determination is "good", the changeover switch 3 is switched to disconnect the first wiring 7 from the power supply circuit 9 and connect the second wiring 8 to the power supply circuit 9. Is done. On the other hand, if the result of the determination is “defective”, the first wiring 8 and the power supply circuit 9 remain connected.

The heating element 5 is formed of a resistance element as a circuit component, and is provided with a second wiring 8 of a marking circuit (not shown).
And is mounted on the circuit forming surface of the substrate body 2. Thus, when the power supply voltage from the power supply circuit 9 is supplied to the heating element 5, the heating element 5 generates heat.

The thermal paper 6 is wound around the heating element 5 and
It is mounted on the circuit forming surface of the substrate body 2. Thus, when the power supply voltage is supplied to the heating element 5, the color of the thermal paper 6 changes, and the circuit board 1 is identified as a non-defective product.

In the circuit board thus configured, the circuit board 1 is identified as a non-defective or defective product due to the discoloration of the thermal paper 6 due to the supply of voltage to the heating element 5 after inspection of a practical circuit (not shown). . Therefore, in the present embodiment, since the marking process can be performed automatically, the setting of the marking position conventionally required at the time of the marking process becomes unnecessary.

Further, in this embodiment, since the marking process uses electrical means as in the case of the circuit inspection, it is not necessary to separately provide an optical means at the time of the marking process as in the prior art.

Next, a marking method according to this embodiment will be described with reference to FIG. FIG. 2 is a flowchart illustrating a marking method according to the first embodiment of the present invention. First, an inspection is performed on n inspection items on the circuit board 1 by the controller 4, and pass / fail is determined for each of the inspections 1 to n (step S1).

Next, a marking process is performed based on the determination result in step S1 (step S2). That is, all of the inspection items 1 to n are determined to be good. If the circuit board 1 is a good product, the changeover switch 3 is switched (for a certain period of time) by a signal from the controller 4, and the first wiring 7 and the power supply The connection with the circuit 9 is released, and the power supply circuit 9 and the second wiring 8 are connected.

As a result, the power supply voltage is supplied from the power supply circuit 9 to the heating element 5 in the second wiring 8 on which the thermal paper 6 is wound in advance (for a certain period of time), and the heating element 5 generates heat. The thermal paper 6 is discolored. In this way, the marking process can be performed reliably.

If there is a defective portion on the circuit board 1 in any of the inspections in step S1, no signal is output from the controller 4 to the changeover switch 3 until the cause of the defect is eliminated. The one wiring 7 and the power supply circuit 9 remain connected. Thus, the thermal paper 6 does not change color, indicating that the circuit board 1 is defective.

That is, in the present marking process, a marking circuit (not shown) having the heating element 5 in which the thermal paper 6 is wound in advance on the substrate main body 2 is formed together with a practical circuit (not shown). The thermal paper 6 is discolored by supplying a power supply voltage to the heating element 5 of the application circuit (not shown) based on the test result of the practical circuit (not shown).

Next, a circuit board according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a block diagram showing a main part of a circuit board according to a second embodiment of the present invention. In FIG. 3, members (parts) other than the circuit board and thermal paper of FIG. Detailed description is omitted. In FIG. 1, a circuit board denoted by reference numeral 21 includes a board body 2, a changeover switch 3, a controller 4, a heating element 5, and a thermal paper 22.

The thermal paper 22 is located near the heating element 5 and is mounted on the circuit forming surface of the base member 2. Thus, when the power supply voltage is supplied to the heating element 5, the color of the thermal paper 6 changes, and the circuit board 1 is identified as a non-defective or defective product. Note that the thermal paper 22 only needs to be arranged at a position where the color of the thermal paper 22 changes when the power supply voltage is supplied to the heating element 5.

Therefore, in the present embodiment, the circuit board 1 is identified as a non-defective or defective product due to the discoloration of the thermal paper 22 due to the supply of voltage to the heating element 5 after the inspection of the practical circuit (not shown). As in the case of the first embodiment, the marking process can be automatically performed, and the setting of the marking position conventionally required at the time of the marking process becomes unnecessary.

In the present embodiment, since the marking process uses electrical means as in the case of the circuit inspection, it is not necessary to separately prepare optical means at the time of the marking process. The same is true.

In each embodiment, whether the inspection result is good or bad and switching of the changeover switch 3 is performed by the circuit board 1.
Although the case where the control is performed by the above controller 4 has been described, the present invention is not limited to this. The controller (not shown) connected to the changeover switch 3 and the inspection apparatus 10 is separately prepared, and the controller ( (Not shown), the quality of the inspection result is determined and the changeover switch 3 is switched.

In each embodiment, the circuit board 1
Although the example in which the thermal papers 6 and 22 are discolored when is a non-defective product has been described, the present invention is not limited to this. Needless to say, in such a case, the color may not be changed.

In addition, in each of the embodiments, a case has been described in which a resistance element mounted on the substrate body 2 separately from the resistance element of the practical circuit is used as the heating element 5, but the present invention is not limited to this. Even if other circuit components such as a resistance element or an integrated circuit element of a practical circuit are used, the same effect as in the above-described embodiment can be obtained.

[0039]

As described above, according to the present invention, when a marking circuit with a heating element is formed on a substrate body,
In both cases, this marking circuit or practical circuit
A changeover switch to selectively connect to the road
Since the thermal paper located in the vicinity of the heating element of the king circuit is disposed, if the heating element generates heat by the supply of voltage from the power supply circuit by switching the changeover switch, the thermal paper located in the vicinity of the heating element will be generated. The circuit board is identified as a non-defective or defective product by the discoloration.

Therefore, since the marking process can be automatically performed, the setting of the marking position required conventionally in the marking process becomes unnecessary, and the marking process can be easily performed.

Further, since the marking process uses electrical means as in the case of circuit inspection, it is not necessary to separately prepare optical means at the time of the marking process as in the prior art, and the processing space can be reduced. You can also plan.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a main part of a circuit board according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a marking method according to the first embodiment of the present invention.

FIG. 3 is a block diagram showing a main part of a circuit board according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Board main body 3 Changeover switch 4 Controller 5 Heating element 6 Thermal paper 9 Power supply circuit 10 Inspection device

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) G01R 31/00, 31/02, 31/28 H01L 21/66 H05K 3/00

Claims (7)

(57) [Claims] 1. A circuit board provided with a board body having a practical circuit, wherein a marking circuit with a heating element is formed on the board body.
And the marking circuit or the practical circuit as a power supply circuit.
A circuit board on which a changeover switch to be selectively connected is mounted, and a thermal paper is disposed near a heating element of the marking circuit. 2. The circuit board according to claim 1, wherein a thermal paper is wound around the heating element. 3. The circuit board according to claim 1, wherein the heating element is formed of a resistance element. 4. A heat-sensitive paper is previously placed on a substrate body for forming a circuit board.
For marking with a heating element located near it
The circuit is formed together with the practical circuit, and the switch to the practical circuit or the marking circuit is performed.
A power supply circuit selectively connected by a switch is formed, and a power supply voltage from the power supply circuit is compared with a test result of the practical circuit.
To the heating element in the marking circuit based on
Characterized in that the thermal paper is discolored by
Circuit board marking method . 5. A method according to claim 1, wherein said circuit board is a non-defective product.
Supplying a power supply voltage to the heating element.
The method for marking a circuit board according to claim 4 . 6. The control of switching the changeover switch
5. The control according to claim 4 or
A method for marking a circuit board according to claim 5 . 7. The controller according to claim 1 , wherein said controller detects the practical circuit.
Judging the quality of the circuit board based on the inspection result.
7. The method for marking a circuit board according to claim 6, wherein: