JP3092565B2 - Semiconductor device encapsulation method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for encapsulating a semiconductor device, and more particularly, to a method for encapsulating a semiconductor device using a granular resin for resin encapsulation.

[0002]

2. Description of the Related Art A conventional example is disclosed in JP-A-6-32614.
No. 5 discloses a mold for resin sealing with a shutter gate. FIG. 5 shows this resin sealing mold.

The resin sealing mold shown in FIG. 5 is equipped with a shutter gate 10 for opening and closing a gate port 11 in conjunction with a resin injection operation and a mold opening operation. The shutter gate 11 provided between the gate port 11 and the cavity 12 has a structure that opens and closes in conjunction with a resin injection operation and a mold opening operation by a shutter gate pin.

Another conventional example is disclosed in JP-A-6-12.
There is a resin sealing mold disclosed in Japanese Patent No. 4971. This resin sealing mold is shown in FIG.

The resin sealing mold shown in FIG. 6 is a mold equipped with a shutter gate.
In order to equip with a knockout rod 14 for pushing up the shutter gate 13 on the sub-plate 15 of the sealing press, the drive mechanism of the shutter gate 13 is simplified.

[0006]

In the prior art shown in FIGS. 5 and 6, however, the filling of the sealing resin is improved by the use of the shutter gate, but the sealing resin is replaced with a tablet resin. When using granular resin,
Since the behavior of the resin is different, there is a problem that voids are generated in the molded product when the resin is sealed using a granular resin.

An object of the present invention is to provide a semiconductor device sealing method suitable for resin sealing using a granular resin.

[0008]

To achieve the above object, according to an aspect of a method of encapsulating a semiconductor device according to the present invention, the granules resin
A method encapsulated resin-encapsulated semiconductor device using it, sealing
Filling the granule resin into the mold pot,
Close the shutter gate provided between the cavity and the
The cavity air and air inside the cavity
Runner, cull, and air in the pot
Degassing process and pressurizing with a plunger to flow resin
Fluidized resin is filled in the cull and the runner.
Opening the shutter gate and opening the cavity
Wherein the step of filling the flow resin into I, wherein step
Are sequentially performed.

Further, the space between the pot and the cavity is closed by a shutter gate, and the pot and the inside of the cavity are evacuated through the air vent.

According to the present invention, the cavity and the runner communicating with the cavity and the inside of the pot filled with the granular resin which communicates with the runner are degassed. The granular resin is supplied to the cavity through a runner.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1 to 3 are sectional views showing a first embodiment of the present invention in the order of steps.

As shown in FIG. 1, a pot 8, a cull 1, a runner 2, and a cavity 3 are provided on a mold mating surface of a resin sealing mold, and an air vent communicating with the cavity 3 is provided. The pot 8 is filled with the granular resin 7, and the granular resin 7 is extruded into the car 1 by the plunger 9. The runner 2 connects the cull 1 and the cavity 3, and a shutter gate 6 for opening and closing is provided at a connection portion between the cull 1 and the cavity 3. The pot 8, cull 1,
A seal ring 16 that shields the runner 2 and the cavity 3 from the outside air is provided. Further, a cavity side deaeration path 4 and a pot side deaeration path 5 are provided.

First, as shown in FIG. 1, a granule resin 7 is filled in a pot 8, and thereafter, a shutter gate 6 between the runner 2 and the cavity 3 is closed, and only through an air vent of the resin sealing mold. Air in the pot 8 and the cavity 3 is deaerated through the cavity side deaeration passage 4.

Further, the plunger 9 is provided in the pot side deaeration passage 5.
The air in the pot 8 is degassed through the gap between the pot 8 and the air.

Next, as shown in FIG. 2, with the shutter gate 6 closed, the plunger 9 is extruded into the pot 8 and the granular resin 7 is compacted in the plunger 9 by pressure.
Thereby, air does not remain in the gap of the granular resin.

Next, as shown in FIG. 3, the shutter gate 6 is opened, a resin 7 is injected into the cavity 3, and the semiconductor element is sealed with the resin in the cavity 3.

The deaeration pressure in FIG. 1 is -710 mm
Hg to -750 mmHg to eliminate voids in molded products.

In FIG. 2, it is necessary to consolidate with the plunger 9 under a pressure enough to completely fill up to the shutter gate 6. The pressure is equal to the cull 1 and the runner 2 pressure.
And so on. Insufficient consolidation leaves gaps between the granular resins, which also cause voids in the molded article.

In FIG. 1, deaeration starts after the granular resin is charged, during which time the shutter gate is closed.
The reason is that the granular resin easily warms up, so that the compaction starts immediately and the time until the encapsulation is shortened.

In FIG. 2, while the shutter gate is kept closed, the resin does not flow into the cavity and the granular resin is sufficiently compacted. Then, as shown in FIG. 3, the shutter gate is opened and sealed.

(Embodiment 2) FIG. 4 is a diagram showing Embodiment 2 of the present invention.

In the second embodiment of the present invention, resin sealing of a semiconductor element on a matrix lead frame is performed.
As shown in FIG. 4, the lead frame is installed over a plurality of cavities 3, and if a shutter gate 6 is provided from the runner 2 to the gate, the runner and the runner on the lead frame can be enclosed in a runner type matrix. Easy to break. Enclosure method is Embodiment 1.
After degassing, the granular resin is compacted in the same manner as described above, and then sealed in the cavity.

[0024]

As described above, according to the present invention, voids in a molded article of a granular resin encapsulated article can be reduced, and the reliability of the package can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention in the order of steps.

FIG. 2 is a cross-sectional view showing Embodiment 1 of the present invention in the order of steps.

FIG. 3 is a sectional view illustrating Embodiment 1 of the present invention in the order of steps.

FIG. 4 is a sectional view showing Embodiment 2 of the present invention.

FIG. 5 is a sectional view showing a conventional example.

FIG. 6 is a sectional view showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cal 2 Runner 3 Cavity 4 Cavity side deaeration path 5 Pot side deaeration path 6 Shutter gate 7 Granule resin 8 Pot 9 Plunger 10 Shutter gate 11 Gate port 12 Cavity 13 Shutter gate 14 Knockout rod for shutter gate 15 Subplate

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/56 B29C 45/02 B29C 45/26 B29C 45/34

Claims (2)

(57) [Claims] 1. A method for encapsulating a resin-encapsulated semiconductor device using a granular resin, comprising the steps of: filling a granule resin into a pot of a sealing mold;
Close the shutter gate provided between the cavity and the cavity.
Air through the cavity side deaeration passage
Runners, culls, and pot empty
Degassing process and pressurizing with plunger
Fluid to fill the cal and the runner with fluid resin.
The shutter gate is opened, and the key is opened.
A method for manufacturing a semiconductor device , comprising a step of filling the cavity with the fluid resin, wherein the steps are sequentially performed . 2. The method according to claim 1, wherein a space between the pot and the cavity is closed by a shutter gate, and the pot and the inside of the cavity are evacuated through an air vent.