JP3090707U - Printed board - Google Patents

Abstract

(57) [Summary] [Problem] Three or more types of electric parts can be independently connected between three or more land parts in one chip land, and three in one chip land The above-mentioned lands can also be used for connection by electric components, which can reduce the pattern area on the surface of the substrate body, improve the efficiency of pattern design, reduce the size of the substrate body, and reduce costs. Provided is a printed circuit board capable of achieving the following. SOLUTION: One chip land 3 is provided on the surface of a substrate body 1, and in three directions near the periphery of the chip land,
At least three land portions 7, 8, 9 are provided, and the electrical component 10 is provided between the required one land portion 7 and the chip land 3 among the at least three land portions 7, 8, 9.
And the electric component 10 is installed in a connected state.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 According to the present invention, a chip land is provided on the surface of the substrate body, a land portion is provided near the chip land, and an electric component is bridged between the chip land and the land portion. Related to printed circuit boards that are installed in a connected state.

[0002]

[Prior art]

 Conventionally, as this type of printed circuit board, for example, as shown in FIG. 3, two land portions 101 and 102 correspond to the two land portions 101 and 102 via a pattern 103 portion. Two independent chip lands 104 and 105 are provided, and an electric component 106 is placed between one land portion 101 and one chip land 104 in a connected state, or the land 102 on the other side is connected. Another electrical component 107 is connected between the chip land 105 and the other chip land 105 in a connected state. However, in this conventional printed circuit board, since two chip lands 104 and 105 are provided, there is a problem that the surface area of the board main body is made large.

Further, Japanese Patent Application Laid-Open No. 2001-85818 describes a package component for surface mounting and a printed wiring board. This is because, as shown in FIGS. 4, 5 (a) (b), 6 (a) (b) (c) (d), the three-terminal type surface mount package component 214 has the same shape and the same size. The respective internal structures are formed as a transistor 215, a resistor 216, a capacitor 217, or a filter 218. These are selectively mounted on a printed wiring board having a common land portion 213 to switch control functions. However, this was only the case where the internal structure of a package component having the same shape was a plurality of electrical components.

[0004] Japanese Patent Application Laid-Open No. 2002-50837 describes a surface mounting structure. As shown in FIGS. 7, 8A, 9B, and 9A, 9B, this is achieved by appropriately selecting the DDR-SRAMs 361 to 316 in the DIMM 316 in which a plurality of DDR-SRAMs 361 to 364 can be arranged. When reducing the E.364, when arranging the equivalent load in the vacant portion, the surface mounting structure for arranging the equivalent load is composed of the first pad C1 to the fourth pad C4. By appropriately arranging capacitors at C1 to fourth pads C2, it is possible to appropriately select two types of surface mounting structures. However, in this case, only two types of surface mounting structures cannot be realized.

[0005]

[Problems to be solved by the invention]

 The present invention solves the above-mentioned conventional problems, and allows three or more types of electric parts to be independently connected between three or more land portions in one chip land, thereby enabling one chip land to be installed. Can be used for connection with three or more lands by electrical components, reducing the pattern area on the surface of the board body, improving the efficiency of pattern design, and reducing the size of the board body. The purpose is to provide a printed circuit board that can be manufactured at a reduced cost.

[0006]

[Means for Solving the Problems]

 The present invention has been proposed to solve the above-mentioned problems. The invention described in claim 1 is to provide one chip land on the surface of the substrate body, and to provide three chip lands near the periphery of the chip land. In the direction, three adjacent land portions are positioned at 90 degrees or 180 degrees with respect to the chip land, and further provided so that the distances between the land portions and the chip land are equal. An electric component is provided between one required land portion and the chip land among the three land portions, and the electric component is installed in a connected state.

According to a second aspect of the present invention, a single chip land is provided on the surface of the substrate body, and at least three lands are provided in at least three directions near the periphery of the chip land. It is characterized in that an electric component is stretched between one required land portion and the chip land among the land portions, and the electric component is installed in a connected state.

According to a third aspect of the present invention, in each of four directions near the periphery of the chip land, four land portions adjacent to each other are located at 90 degrees with respect to the chip land. The distance between the land portion and the chip land is provided to be equal to each other, and an electric component is stretched between one required land portion and the chip land among the four land portions. It is characterized in that it is configured to install electrical components in a connected state.

[0009]

[Embodiment of the invention]

 Hereinafter, embodiments of the printed circuit board according to the present invention will be described with reference to the drawings. 1A and 1B show a part of a substrate main body in a printed circuit board according to a first embodiment of the present invention, wherein FIG. 1A is a wiring diagram thereof, and FIG.

In the printed circuit board according to the first embodiment, as shown in FIG. 1B, one chip land 3 connected to one pattern 2 is provided on the surface of a substrate body 1. In three directions near the periphery, three land portions 7, 8, 9 are provided, each of which is connected to another pattern 4, 5, 6, respectively. As shown in FIG. , 8, and 9, the electrical component 10 is installed in a connected state between one required land portion 7 and the chip land 3. When the land 8 is used, another electric component 11 is installed between the land 8 and the chip land 3 in a state where the electric component 10 is not installed, and the land 9 is used. In this case, another electric component 12 may be installed between the land 9 and the chip land 3 while the electric components 10 and 11 are not installed.

The electric components 10, 11, and 12 are not limited to resistors having different resistance values as shown in FIG. 1A, and other electric components such as a capacitor may be installed. Of course.

Therefore, according to the printed circuit board of the first embodiment, three types of electric components 10, 11, 12 are independently provided between one chip land 3 and three lands 7, 8, 9. One chip land 3 can also be used for connection with the three land portions 7, 8, 9 by the electric components 10, 11, 12 so that the pattern area on the surface of the substrate body 1 can be reduced. The efficiency of pattern design can be improved by reducing the size, and the size of the substrate body can be reduced, thereby reducing the cost.

FIGS. 2A and 2B show a part of a substrate main body in a printed circuit board according to a second embodiment, wherein FIG. 2A is a wiring diagram thereof, and FIG. In the printed circuit board according to the second embodiment, as shown in FIG. 2 (b), one chip land 3 is provided on the surface of the substrate body 1 so that one corner of the pattern 2A is connected to one inclined pattern. In four directions near the periphery of the chip land 3, four land portions 7, 8, 9, and 16 are provided which are continuous with different patterns 4, 5, 6, and 15, respectively, as shown in FIG. As described above, of the four land portions 7, 8, 9, and 16, the electric component 10 is stretched between one required land portion 7 and the chip land 3, and the electric component 10 is connected in a connected state. I am trying to install it. When another land portion 8, 9 or 16 is used, other types of electric components 11, 12, 17 are installed between one chip land 3 in the same manner as in the first embodiment.

Therefore, according to the printed circuit board of the second embodiment, four types of electric components 10, 11, 12, and 4 are provided between one chip land 3 and four land portions 7, 8, 9, 16. 17 can be installed independently in a connected state, and one chip land 3 can also be used for connection to the four lands 7, 8, 9, 16 by the electric components 10, 11, 12, 17 and the substrate. The pattern area on the surface of the main body can be reduced, the efficiency of pattern design can be improved, and the size of the substrate main body can be reduced, thereby reducing costs.

[0015]

[Effect of the invention]

 As described above, according to the invention of claim 1, one chip land is provided on the surface of the substrate main body, and three land portions are formed in three directions near the periphery of the chip land. At a position of 90 degrees or 180 degrees with respect to the land. Further, the land is provided so that the distance between the land and the chip land is equal to each other. The configuration is such that the electric components are laid between the chip lands and the electric components are installed in a connected state, so that the following effects are obtained. In other words, three types of electrical components can be installed independently in a connected state between one land and three lands, and one land can also be used for connection with the three lands. As a result, the pattern area on the surface of the substrate main body can be reduced, the efficiency of pattern design can be improved, and the size of the substrate main body can be reduced and cost can be reduced.

According to a second aspect of the present invention, one chip land is provided on the surface of the substrate body, and at least three land portions are provided in at least three directions near the periphery of the chip land. Among the lands, a required electric part is bridged between one required land part and the chip land, and the electric part is installed in a connected state, so that the following effects are obtained. That is, three or more types of electrical components can be independently connected between three or more land portions with one chip land, and one chip land can be connected to three or more land portions. Prints that can also be used for connection by electrical components, can reduce the pattern area on the surface of the board body, improve the efficiency of pattern design, and can reduce the size of the board body and reduce costs The purpose is to provide a substrate.

According to a third aspect of the present invention, in each of four directions near the periphery of the chip land, four adjacent land portions are positioned at 90 degrees with respect to the chip land. The distance between the chip land and the chip land is set to be equal to each other. Of the four land parts, the electric part is hung between one required land part and the chip land, and this electric part is Since it is configured to be installed in a connected state, four types of electrical components can be installed independently in a connected state between one chip land and four lands, and four lands can be installed in one chip land. It can also be used for connection with electrical parts and parts, reducing the pattern area on the surface of the board body, improving the efficiency of pattern design, reducing the size of the board body and reducing costs. Can be planned.

[Brief description of the drawings]

FIGS. 1A and 1B show a part of a substrate main body in a printed circuit board according to a first embodiment of the present invention, wherein FIG. 1A is a wiring diagram thereof and FIG.

FIGS. 2A and 2B show a part of a substrate main body in a printed circuit board according to a second embodiment, wherein FIG. 2A is a wiring diagram thereof and FIG.

FIG. 3 is a partial surface view showing a part of a board main body in a conventional printed board.

FIG. 4 is a conceptual diagram showing a wiring pattern for mounting a conventional package component for surface mounting.

5A and 5B show a conventional package component for surface mounting, and FIG.
Is a front view thereof, and (b) is a side view thereof.

FIGS. 6 (a), (b), (c) and (d) are conceptual views each showing the internal structure of a package component for surface mounting.

FIG. 7 is an explanatory view showing a conventional surface mounting structure.

FIG. 8A is a configuration diagram illustrating one embodiment of the same-surface mounting structure,
(B) is a block diagram showing another aspect of the same-surface mounting structure.

FIG. 9A is an external perspective view in which a DIMM is installed on a motherboard provided on a computer using a memory module having the same mounting structure, and FIG. 9B is a perspective view of the DIM.
FIG. 3 is a block diagram showing an internal configuration of M.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board main body 3 Chip land 7, 8, 9 Land part 10, 11, 12 Electrical parts 16 Land part 17 Electrical parts

Claims (3)

[Utility model registration claims] 1. A chip land is provided on the surface of a substrate body, and three land portions are formed in three directions near the periphery of the chip land. And the distance between the land portion and the chip land is provided so as to be equal to each other, and an electric power is supplied between one required land portion and the chip land among the three land portions. A printed board characterized by being constructed so as to hang components and install the electrical components in a connected state. 2. A chip land is provided on a surface of a substrate body, and at least three land portions are provided in at least three directions near the periphery of the chip land. An electric component is stretched between one required land portion and the chip land,
A printed circuit board, wherein the electric component is installed in a connected state. 3. A land adjacent to four chip portions in four directions near the periphery of the chip land, each of which is at a position of 90 degrees with respect to the chip land. The distances are provided so as to be equal to each other, and an electric component is stretched between one required land portion of the four land portions and the chip land, and the electric component is installed in a connected state. The printed circuit board according to claim 2, wherein: