JP3090700U - Light-emitting bipolar module - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To solve the problem that the cooling effect of the conventional light emitting diode module is low, and to enhance the cooling effect, increase the luminous efficiency, and increase the brightness of the light emitting diode module. Provide a bipolar module. SOLUTION: Positive and negative electric tabs of a light-emitting bipolar body are soldered to first and second substrates made of metal, respectively, thereby improving cooling efficiency and heat resistance of a light-emitting bipolar body module and further increasing current. In addition, since the light-emitting dipole module has an enhanced cooling effect, the light-emitting dipole module has an increased luminous efficiency of the light-emitting dipole and an increased brightness of the light.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a kind of light emitting dipole module, and more particularly to a technical field in which a light emitting dipole is fixed to a metal substrate to enhance a cooling effect of the light emitting dipole module.

[0002]

[Prior art]

 Conventional light-emitting dipole lights mainly include an electric circuit board made of one plastic insulating material in one case, and the board is first provided with an electric circuit using a conductive material and then placed at a required position. A large number of light-emitting dipoles were mounted and fixed to the board with soldered tin.

[0003]

[Problems to be solved by the invention]

 However, this type of light emitting dipole has advantages such as compactness and energy saving as compared with the conventional light, but has a problem that its brightness is inferior to the conventional light. The cause is related to the luminous efficiency of the light emitting dipole. That is, when the current is increased and the light emission efficiency is increased, there is a problem in that the amount of heat in the local area is excessively increased. In particular, since the electric circuit board is made of plastic, its heat-resistant temperature is much lower than that of a light-emitting dipole chip or conductive metal, and its heat conduction coefficient is low, so that it is difficult to quickly release heat. For this reason, there is a problem that the current is limited and the brightness of the light emitting dipole light cannot be increased.

[0004] The problem of the present invention has been made in view of the problem that the cooling effect of the conventional light emitting bipolar module is low. It is an object of the present invention to provide a light-emitting dipole module with increased brightness.

[0005]

[Means for Solving the Problems]

 In order to solve the above problem, the invention of claim 1 includes one metal substrate and one or more light emitting dipoles, wherein the metal substrate is made of a conductive metal, and the metal substrate is made of at least one first substrate and one or more light emitting dipoles. An insulating part is provided between the first substrate and the second substrate, the first substrate and the second substrate are insulated, and the first substrate and the second substrate are respectively powered. The light-emitting dipole has one or more light-emitting chips, the light-emitting chips are mounted on one support portion, and one positive current tab is provided on the bottom of the support portion. And the positive and negative tabs, the positive and negative tabs have a certain area, the light emitting dipole is installed on a metal substrate, and the positive and negative tabs are on a first substrate and a second substrate, respectively. Each is fixed with solder, and the positive and negative tabs are electrically connected to the first and second substrates, respectively. Cooling effect, characterized in Rukoto is Ru Ah with high Light-Emitting Diodes module. According to the invention of claim 2, the light-emitting bipolar module is installed in one case, the case has one translucent portion, and an installation space for accommodating the light-emitting bipolar module therein is provided. The light emitting diode module having a high cooling effect according to claim 1, wherein: According to a third aspect of the present invention, the metal substrate includes a plurality of first and second substrates, and the first and second substrates are arranged in parallel and parallel, and one insulating layer is interposed therebetween. The light-emitting dipole module having a high cooling effect according to claim 1. The invention according to claim 4 is that the metal substrate is composed of a large number of first substrates and second substrates, and the first substrate and the second substrate are bent in various directions, respectively, and the light emitting dipoles are directed in various directions. The light emitting diode module having a high cooling effect according to claim 1, wherein the light emitting diode module emits light. According to a fifth aspect of the present invention, there is provided a light emitting bipolar module having a high cooling effect according to the first aspect, wherein an electronic device such as an electric resistor or a capacitor is fixed to the metal substrate by soldering.

The operation of each of the present inventions is to improve the cooling efficiency and heat resistance of the light emitting bipolar module by soldering the positive and negative electric tabs of the light emitting bipolar body to the first and second metal substrates, respectively. In addition, since the current can be further increased and the light emitting dipole module has an enhanced cooling effect, the light emitting efficiency of the light emitting dipole is increased and the brightness of the light is increased.

[0007]

[Embodiment of the invention]

 A preferred embodiment of the present invention will be described with reference to the drawings. FIGS. 1 and 2 show the structure of the first embodiment of the present invention. However, these drawings are provided for explanation, and the present invention is not limited to these embodiments unless the characteristics of the present invention are impaired. Of course.

The first embodiment of the present invention is a light-emitting dipole module having an improved cooling effect. The light-emitting dipole module includes one metal substrate 2 and one or more light-emitting dipoles 3. Consists of The metal substrate 2 is made of a conductive metal and includes at least one first substrate 21 and one second substrate 22. There is one insulating portion 23 between the first substrate 21 and the second substrate 22, and insulates the first substrate 21 from the second substrate 22. Further, the first substrate 21 and the second substrate 22 are respectively connected to positive and negative electrodes of a power supply. In this embodiment, the insulating portion is one insulating tank, and the metal substrate 2 is divided into a first substrate 21 and a second substrate 22. The first substrate 21 and the second substrate 22 each have a plurality of connection legs 24, 24A.

The light-emitting dipole 3 includes one or more light-emitting chips 31, and the light-emitting chip 31 is installed on one support part 32, and one positive electrode tab 321 and one negative electrode There are tabs 322. The bottom surfaces of the positive tab 321 and the negative tab 322 have a certain area. Further, the light emitting bipolar body 3 is mounted on the metal substrate 2, the positive electrode tab 321 is fixed to the first substrate 21 and the negative electrode tab 322 is fixed to the second substrate 22 by solder, respectively. The substrate 21 and the second substrate 22 are electrically connected.

FIG. 3 shows a use situation of the first embodiment. One connecting component 1 is installed between the first substrate 21 and the second substrate 22 of the metal substrate 2. In this embodiment, the connecting component 1 is one electric circuit board. A number of devices 11 such as electric resistors are inserted into the electric circuit board. In addition, the first board 21 and the second board 22 are fixed to the connecting component 1 (electric circuit board) by the plurality of connecting legs 24, 24A provided on the first board 21 and the second board 22 of the metal plate 2, respectively. Then, the first substrate 21 and the second substrate 22 are connected to the positive and negative electrodes of the power supply through the conductor 13 respectively.

It should be noted here that, in the first embodiment, the positive and negative electric tabs 321 and 322 of the light emitting bipolar body 3 are fixed to the first substrate 21 and the second substrate 22 by solder, respectively. It itself has conductivity, and there is no need to make an electrical circuit with other conductive materials. The heat resistance temperature of the metal substrate 2 is higher than that of plastic, and the heat conductivity is also higher. As a result, the current can be increased, and the luminous efficiency of the light-emitting bipolar body 3 can be increased.

Naturally, the present invention is not limited to the first embodiment. Other devices, such as an electric resistor and a capacitor, can be fixed to the metal substrate 2 of the present invention by soldering. In addition, the second embodiment shown in FIG. 4 includes one case 15, the case 15 includes one translucent portion 16, and has an installation space 17 for accommodating the light-emitting dipole module therein. .

In a third embodiment shown in FIG. 5, the metal substrate 2A is composed of a large number of first and second substrates 21 and 22, and the first and second substrates 21 and 22 are arranged in parallel and parallel. Has one insulating layer 23A sandwiched therebetween to form a multilayer structure.

In a fourth embodiment shown in FIG. 6, the metal substrate 2B is composed of a number of first substrates 21 and a number of second substrates 22, and the first substrate 21 and the second substrate 22 are each bent in a number of directions. It is installed in the case 15. Thereby, the light emitting dipole 3 can emit light in various directions.

[0015]

[Effect of the invention]

 As described above, the present invention provides a light emitting diode module by fixing the positive tab 321 and the negative tab 322 of the light emitting diode 3 to the first substrate 21 and the second substrate 22 of the metal substrate 2 by soldering or the like, respectively. The cooling effect and heat resistance of the light emitting device can be improved, and further, by increasing the power, the luminous efficiency of the light emitting dipole can be increased, and further, the brightness of the light emitting dipole light can be increased. Further, the light-emitting dipole module can be extended as necessary, and the practicability and convenience are improved.

[Brief description of the drawings]

FIG. 1 is a three-dimensional view of a first embodiment of the present invention.

FIG. 2 is a three-dimensional exploded view of the first embodiment of the present invention.

FIG. 3 is an explanatory view of a use state of the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of a use state of the second embodiment of the present invention.

FIG. 5 is a three-dimensional view of Embodiment 3 of the present invention.

FIG. 6 is an explanatory view of a fourth embodiment of the present invention.

[Explanation of symbols]

 (1) Connecting component 1 Device (13) Conductor (1) Case (1) Translucent part (1) Installation space (2) (2A) (2B) Metal substrate (21) First substrate (22) Second substrate ( 23) Insulation part (23A) Insulation layer (24) (24A) Connecting leg (3) Light emitting dipole (30) Light emitting chip (31) Support part (20) Positive tab (21) Negative tab

Claims (5)

[Utility model registration claims] 1. A metal substrate comprising one or more light emitting dipoles, wherein said metal substrate is made of a conductive metal and said metal substrate is at least one metal substrate.
One first substrate and one second substrate, an insulating portion is provided between the first substrate and the second substrate, the first substrate and the second substrate are insulated, and the first substrate and the second substrate Each of the substrates is connected to a positive electrode and a negative electrode of a power supply. The light-emitting dipole has one or more light-emitting chips, and the light-emitting chips are mounted on one support portion, and one light-emitting chip is provided on a bottom of the support portion. There are a positive tab and a negative tab, the positive tab and the negative tab have a certain area, the light emitting dipole is installed on a metal substrate, and the positive tab is on the first substrate, and the negative tab is the second A light-emitting dipole module having a high cooling effect, wherein each of the positive and negative tabs is fixed to the substrate by solder, and the positive and negative electric tabs are electrically connected to the first and second substrates, respectively. 2. A light emitting diode module is installed in a case, said case has one translucent portion, and the interior has an installation space for accommodating the light emitting diode module. The light-emitting dipole module having a high cooling effect according to claim 1. 3. The method according to claim 1, wherein the metal substrate is composed of a number of first and second substrates, and the first and second substrates are arranged in parallel and parallel, and one insulating layer is interposed therebetween. The light-emitting dipole module having a high cooling effect according to claim 1. 4. A metal substrate comprising a plurality of first and second substrates, wherein the first and second substrates are bent in various directions, respectively, and the light emitting dipole emits light in various directions. The light-emitting dipole module having a high cooling effect according to claim 1, wherein: 5. The light-emitting dipole module according to claim 1, wherein an electronic device such as an electric resistor or a capacitor is fixed to the metal substrate by soldering.