JP3082575B2 - Manufacturing method of ceramic electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly, to a method for baking an external electrode applied to a ceramic electronic component.

[0002]

2. Description of the Related Art A ceramic electronic component, for example, a multilayer ceramic capacitor, is formed by laminating a required number of ceramic green sheets to which internal electrodes are applied, pressurizing, cutting and firing, and then applying and firing external electrodes. Manufactured.

[0003] Conventionally, the baking process of the external electrode is performed as shown in FIG.
As shown in (A), a large number of alumina or zirconia powders 2 are laid to a predetermined thickness on the surface of a heat-resistant sheath 1 that does not easily react with the external electrodes, and the external electrodes are applied and dried on the powders 2. The electronic components 3 are placed, the sheath 1 is inserted into a firing furnace, and heated at a temperature of 1000 ° C. or less, so that the external electrodes are baked.

In some cases, a thin sheet-like separator containing alumina or zirconia powder is used instead of the powder 2.

[0005]

By the way, powder 2
The separator and the separator prevent the contact between the sheath 1 and the electronic component 3. However, since the external electrode contains a glass component, powder may adhere to the external electrode after baking, and a process for removing the powder is required. Therefore, there is a problem that the cost is increased.

Further, since it is impossible to fix the electronic components 3 put in the sheath 1 (to prevent each electronic component from moving in the sheath 1), FIG.
As described above, contact between electronic components cannot be prevented, and the components may stick together at the external electrode 4 after baking. Furthermore, the use of powder has a problem that dust is generated and the working environment in the manufacturing process of the electronic part is deteriorated.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems caused by powder adhesion to external electrodes, eliminating the need for a step of removing the powder, and by sticking the external electrodes together and dusting the powder. It is an object of the present invention to provide a method of manufacturing a ceramic electronic component that can be manufactured.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a ceramic coated with an internal electrode.
Laminate the required number of green sheets and pressurize.
And baking of external electrodes after firing
In the step of performing , providing an adhesive layer on the surface of the sheath,
The baking process of the external electrode is performed in a state in which the plurality of ceramic electronic components to which the external electrodes are applied are individually and adhesively held on the adhesive layer, respectively. In addition, the outer surface of the adhesive on the holder with the adhesive formed on the surface
While holding the ceramic electronic component before electrode application,
Apply an external electrode material to the end, dry and provide an adhesive layer
Transfer the ceramic electronic components to the
After applying the electrode material and drying, hold the electronic components on the sheath
Adopted a configuration to bake the external electrode in the state
Things.

[0009]

The electronic components having the external electrodes applied and dried are arranged on an adhesive layer provided on the surface of the sheath so that the electronic components are not in contact with each other and are adhesively fixed, and the sheath is inserted into a firing furnace. Then, the external electrodes are baked.

The adhesive layer fixes the electronic components until the middle of the baking, prevents the electronic components from moving, and prevents the electronic components from coming into contact with each other. The use of powder in the baking step is omitted, the powder does not adhere to the external electrodes, and the removal step after baking is not required, and the deterioration of the environment due to powder dust can be prevented.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

In the first embodiment shown in FIGS. 1A and 1B, the sheath 11 used for baking the external electrode of the electronic component 3 is formed of a heat-resistant material which does not easily react with the external electrode.
An adhesive layer 12 is provided on the surface on which the
The adhesive is fixed.

The pressure-sensitive adhesive layer 12 is formed by applying a pressure-sensitive adhesive or applying a double-sided pressure-sensitive adhesive tape, and the electronic component 3 to be pressure-fixed on the pressure-sensitive adhesive layer 12 is set up as shown in FIG. 1A. Even in this state, it may be fixed by laying it sideways as shown in FIG. 1B. The material of the adhesive layer 12 may be selected so that it burns at a relatively low temperature and the burning process does not adversely affect the electronic component 3.

Next, the step of baking an external electrode using the sheath 11 will be described.

As shown in FIG. 2A, a chip holder 14 provided with a holding portion 13 having an adhesive material formed on the surface is separately prepared, and a large number of chip electronic components 3 are erected on the holding portion 13 of the holder 14. One end of the chip component is immersed in a paste-like external electrode material (not shown), and one external electrode is applied.

When the external electrodes are dried, the sheath 11 is opposed to the chip holder 14 and is moved closer to the chip holder 14. As shown in FIG. 2B, after the adhesive layer 12 is pressed against the chip component, the sheath 11 is moved. When separated, the electronic component 3 is transferred to the sheath 11 as shown in FIG. 2C. At this time, the adhesive layer 12 provided on the sheath 1 is
The adhesive force is set to be stronger than the holding force of the holding unit 13 of No. 4.

When the electronic component 3 is transferred to the adhesive layer 12 of the sheath 11 in this way, the other end of the electronic component 3 is dipped in a paste-like external electrode material, and the other external electrode is applied. dry.

As a result, external electrodes are applied and formed on both ends of the electronic component 3, and the electronic components 3 are arranged and fixed on the adhesive layer 12 of the sheath 11 as shown in FIG. 1A.
1 is directly inserted into the firing furnace to bake the external electrodes.

At the time of the above-mentioned baking, each electronic component 3
Since the electronic components are fixed by the adhesive layer 12, the electronic components do not move and come into contact with each other during handling, the external electrodes do not stick to each other, and the adhesive layer 12 is burned out on the way. Thus, the electronic component 3 after the baking of the external electrode can be taken out of the sheath 11 as it is.

Next, the sheath 11 in the second embodiment shown in FIG. 3 has a structure in which a powder coating layer 15 is provided on a surface on which the electronic part 3 is mounted, and an adhesive layer 12 is provided on the coating layer 15. It has become.

The powder coating layer 15 has a low reactivity with the ceramic when the powder is baked. The same ceramic as the electronic component 3 is mixed as a co-fabric, and the surface of the sheath 11 is spray-coated, for example. Then, it is formed by firing.

The powder coating layer 15 can have an uneven surface having a surface of 100 μm or less, preferably about several tens of μm, and is bonded to the electronic component 3 after the adhesive layer 12 is burned off when the external electrode is baked. The force will be reduced.

In this way, even if the adhesive layer 12 is burned out during baking and the electronic component 3 comes into direct contact with the powder coating layer 15, the electronic component 3 can be removed from the coating layer 15 without any trouble. it can.

In the first and second embodiments, the example of using the sheath 11 in the step of applying the external electrode has been described for the adhesive fixing of the electronic component 3 to the adhesive layer 12. After performing the application step separately, the electronic components 3 may be arranged and mounted on the adhesive layer 12 of the sheath 11.

Further, as the ceramic electronic component for firing the external electrodes, a resistor chip, an EMI chip filter, a multilayer component and the like can be exemplified in addition to the multilayer ceramic capacitor.

[0026]

As described above, according to the present invention, it is not necessary to use powder in the step of baking the external electrodes of the ceramic electronic component, and the powder does not adhere to the external electrodes after the baking of the external electrodes. The step of removing becomes unnecessary.

Further, since the electronic component is fixed and held by the adhesive layer, there is no contact between the electronic components at the time of baking, and the external electrodes can be prevented from adhering to each other.

Further, since it is not necessary to lay the powder on the sheath, deterioration of the environment due to the scattering of the powder can be prevented, and the external electrode coating step and the external electrode baking step can be performed continuously.

[Brief description of the drawings]

FIGS. 1A and 1B are front views in use showing the structure of a sheath used in the embodiment of the present invention.

FIGS. 2A, 2B, and 2C are front views sequentially showing an external electrode coating process using a sheath.

FIG. 3 is a front view showing a second embodiment of the sheath;

FIG. 4A is a front view showing a conventional sheath, and FIG. 4B is a plan view showing a state where external electrodes of an electronic component are bonded.

[Explanation of symbols]

 3 Electronic parts 11 Saya 12 Adhesive layer 15 Powder coating layer

Claims (2)

(57) [Claims] 1. A ceramic green coated with an internal electrode
The required number of sheets are stacked, pressed, cut, and baked.
Applying and baking of external electrodes performed after completion
In the process, an adhesive layer is provided on the surface of the sheath , and the plurality of ceramic electronic components after the external electrodes are applied are bonded to the adhesive layer.
Baking a step of baking the external electrodes in a state where they are individually held in an adhesive state. 2. Ceramic green coated with internal electrodes
The required number of sheets are stacked, pressed, cut, and baked.
Applying and baking of external electrodes performed after completion
In the process, the adhesive of the holder with the adhesive material formed on the surface
Holds ceramic electronic components before application of external electrodes on the material
Apply external electrode material to one end in the state, dry, and stick
Transfer ceramic electronic components to a sheath with a material layer
Apply an external electrode material to one end and dry it.
Baking external electrodes while holding components
A method for producing a ceramic electronic component, comprising: