JP3070375B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing electronic components used in various electronic devices.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication (Kokai) No. 3-225904 discloses a method of applying a conductive paste to individual laminated chips separated from a laminated body by cutting the laminated body into individual laminated chips. A groove is formed, and then the cut groove is filled with a conductive paste, and the conductive paste is applied to the laminated chip by cutting the center of the conductive paste.

[0003]

However, in the above-mentioned conventional device, the center portion of the conductive paste must be cut after being dried in order to separate it into individual laminated chips. However, the sharpness of the corners of the individual laminated chips caused cracks and chipping.

[0004] Therefore, an object of the present invention is to produce a highly reliable electronic component without cracking or chipping by increasing the productivity.

[0005]

In order to achieve the above object, the present invention provides a method for forming an adhesive layer on a substrate,
A plurality of components are arranged and arranged on the upper surface of the adhesive layer
Forming a laminate and separating the components of the laminate from each other.
Release and form a groove to reach the adhesive layer below
And pouring the electrode paste into the grooves and drying.
The electrode paste obtained by the drying.
A space is formed in the groove by the contraction of
An electrode layer is formed on both sides of the groove .

[0006]

As a result, the electrode paste is formed with a gap on both side walls of the groove. Therefore, there is no need to cut the paste in the groove to separate the left and right electronic components, and the productivity is extremely high, and a highly reliable electronic component can be manufactured.

[0007]

【Example】

(Embodiment 1) In FIG. 1, reference numeral 1 denotes a substrate made of alumina, the upper surface of which is mirror-finished. This substrate 1
The adhesive layer 2 is formed on the upper surface of the substrate as shown in FIG.
This adhesive layer is made of boron nitride, PVB (polyvinyl butyral), and xylene, and is provided on the upper surface of the substrate 1 so as to have a thickness of 100 μm. The surface of the adhesive layer 2 is also a horizontal surface, and the upper surface of FIG.
The ferrite layer 3 having a thickness of 500 μm is provided by printing using a metal mask. Next, as shown in FIG. 4, a plurality of coil conductors 4 made of silver and palladium are arranged on the upper surface of the ferrite layer 3 by printing at a predetermined interval in the vertical and horizontal directions. Next, as shown in FIG. 4, the ferrite layer 5 having a thickness of 50 μm is printed on the upper surface thereof, and the coil conductor 4 is printed thereon. Thus, the coil conductor 4 is laminated via the ferrite layer 5.

The stacked coil conductors 4 are helically formed by electrically connecting the other end of the lower coil conductor 4 and one end of the coil conductor 4 thereabove by through holes. Is done. Next, as shown in FIG. 5, a 500 μm thick ferrite layer 6 is formed on the upper surface by printing using a metal mask.

Next, as shown in FIG. 6, grooves 7 reaching the adhesive layer 2 are formed so as to separate the coil conductors 4 in the vertical direction.
It is formed by dicing. The width of the groove 7 is 150 μ
Then, the substrate was inclined obliquely upward from the insertion side of the needle 9 with the needle 9 inserted into the groove 7 with the dispenser 8 fixed as shown in FIG. Move in state. As a result, the groove 7 is filled with the electrode paste. However, since the groove 7 is filled in a state where the groove 7 is inclined obliquely upward, excess electrode paste is sequentially discharged. Then, as shown in FIG. 7, while the substrate 1 is kept in a flat state, the substrate 1 is dried by natural drying for 30 minutes.
After drying at 50 ° C. for 10 minutes, electrode layers 10 for external electrodes are formed on both side walls of the groove 7 as shown in FIG. This electrode layer 10 is left and right separated until it reaches the adhesive layer 2 of the groove 7 as shown in FIG.

Next, as shown in FIG. 8, a groove 11 reaching the adhesive layer 2 for separating the coil conductors in the horizontal direction is provided. In this state, the substrate 1 is kept horizontal as shown in FIG.
When dried at 150 ° C. for 10 minutes and baked, the main components of the adhesive layer 2 evaporate, so that a plurality of coil components 12 individually separated as shown in FIG. And a plurality of them are arranged in the horizontal direction.

As shown in FIG. 10, each of the coil components has a coil conductor 4 in a spiral state, and electrode layers 10 are provided at both ends thereof. That is, one end of the lowermost layer of the spiral coil conductor is connected to the electrode layer 10, and the other end of the uppermost layer is connected to the electrode layer 10.

Embodiment 2 In FIG. 13, reference numeral 1 denotes a substrate formed of alumina, the upper surface of which is mirror-finished. On the upper surface of the substrate 1, an adhesive layer 2 is formed as shown in FIG. This adhesive layer 2 is made of boron nitride,
It is made of PVB (polyvinyl butyral) and xylene, and is provided on the upper surface of the substrate 1 so as to have a thickness of 100 μm. The surface of the adhesive layer 2 is also a horizontal plane. On this upper surface, as shown in FIG. 14, projections 16 for chamfering along the outer shape of each component are provided by printing or coating.

The upper surface is 500 μm thick as shown in FIG.
Is provided by printing using a metal mask. Next, as shown in FIG. 16, a plurality of coil conductors 4 made of silver and palladium are arranged on the upper surface of the ferrite layer 3 by printing at a predetermined interval in the vertical and horizontal directions. Next, as shown in FIG.
The μm ferrite layer 5 is printed, and the coil conductor 4 is printed thereon. Thus, the coil conductor 4 is laminated via the ferrite layer 5.

These laminated coil conductors 4 are spirally formed by electrically connecting the other end of the coil conductor 4 in the lower layer and one end of the coil conductor 4 thereabove by through holes, thereby forming a coil. You. Next, as shown in FIG. 17, a 500 μm thick ferrite layer 6 is formed on the upper surface by printing using a metal mask.

Next, as shown in FIG. 18, a groove 7 reaching the adhesive layer 2 is formed by dicing so as to separate the coil conductors 4 in the vertical direction. The width of the groove 7 is 150 μ
m. Next, as shown in FIG. 25, a chamfer 15 is formed at a corner of the upper surface of the ferrite layer 6 by a mold 13. Next, as shown in FIG. 23, with the dispenser 8 fixed and the needle 9 inserted in the groove 7, the substrate 1 is
Is moved obliquely upward from the insertion side.
As a result, the groove 7 is filled with the electrode paste. However, since the groove 7 is filled in a state where the groove 7 is inclined obliquely upward, excess electrode paste is sequentially discharged.

Then, as shown in FIG.
24 is dried for 30 minutes by natural drying while keeping the flat surface, and then dried at 150 ° C. for 10 minutes, the electrode layers 10 for external electrodes are formed on both side walls of the groove 7 as shown in FIG. This is because the evaporation of the solvent from the inside of the electrode paste causes the electrode layer 10 to contract in volume and to be separated into right and left. Therefore, this electrode layer 10 is left and right separated until it reaches the adhesive layer 2 of the groove 7 as shown in FIG. 24 without cutting the center of the electrode paste.

Next, as shown in FIG. 20, a groove 11 reaching the adhesive layer 2 for separating the coil conductors in the horizontal direction is provided.
Further, as shown in FIG.
Chamfers 21 are formed at the corners of the top and side surfaces of the. In this state, as shown in FIG.
After drying for 10 minutes, the main component of the adhesive layer 2 evaporates, so that a plurality of coil components 12 individually separated on the substrate 1 as shown in FIG. Are arranged in a state in which a plurality are arranged.

As shown in FIG. 22, each of the coil components has a coil conductor 4 in a spiral state, and electrode layers 10 are provided at both ends thereof. That is, one end of the lowermost layer of the spiral coil conductor is connected to the electrode layer 10, and the other end of the uppermost layer is connected to the electrode layer 10.

Embodiment 3 Hereinafter, a third embodiment of the present invention will be described with reference to the drawings. In FIG. 27, 1
Reference numeral 7 denotes a substrate formed of alumina. On its upper surface, a groove 18 along the outer shape of the component has a groove width of 300 μm and a groove depth of 500 μm.
μm. In the groove 18 of the substrate 17, as shown in FIG. 28, an adhesive layer 19 is formed simultaneously with the projection for chamfering. A coil is formed on this upper surface as shown in FIG. Next, as shown in FIG. 30, the grooves 18 of the substrate 17 are separated so as to separate the coil conductors 4 in the vertical direction.
A dicing groove 20 reaching the adhesive layer 19 is formed by dicing. The width of the dicing groove 20 is 1
50 μm and the depth from the substrate 17 is 300 μm.

Next, similarly to the second embodiment, a chamfer 15 is formed at a corner of the upper surface of the ferrite layer 6 using a mold as shown in FIG. Next, as in the second embodiment, the dicing groove 20 is filled with an electrode paste. Then, as shown in FIG. 31, the substrate 17 is dried for 30 minutes by natural drying in a state where the substrate 17 is kept in a flat state, and dried at 150 ° C. for 10 minutes.
As shown in FIG. 32, electrode layers 23 for external electrodes are formed on both side walls of the dicing groove 20 in the same manner as in the second embodiment. This is because, similarly to the second embodiment, the solvent evaporates from the inside of the electrode paste, causing the electrode layer 23 to contract in volume and to be separated into right and left. Therefore, without cutting the center of the electrode paste, this electrode layer 23
As shown in FIG. 6, the dicing groove 20 is separated left and right until it reaches the adhesive layer 19.

Next, as shown in FIG. 33, dicing grooves 22 are formed to reach the adhesive layer 19 for separating the coil conductors in the horizontal direction, and chamfers 21 are formed on the upper and side corners as in the second embodiment. Form. In this state, as shown in FIG. 33, when the substrate 17 is kept horizontal and dried at 150 ° C. for 10 minutes and then baked, the main component of the adhesive layer 19 evaporates. As described above, the plurality of individually separated coil components 12 are arranged in a state where the plurality of coil components 12 are aligned in the vertical direction and the horizontal direction. If it is desired to form the external electrode layer 23 thick, the dicing groove 20 must be filled with a large amount of electrode paste. Therefore, precipitation of the electrode paste increases. Therefore, in order to keep the electrode layer 23 separated left and right, it is necessary to increase the depth of the adhesive layer. However, Example 2
However, it is extremely difficult to increase the thickness of the adhesive layer in terms of cost and workability. In the second embodiment, this problem is solved by forming the groove 18 of the substrate 17 deep, and a thicker electrode layer is formed.

[0022]

As described above , according to the present invention , the drying
Space is formed in the groove due to shrinkage of the electrode paste
Since the electrode layer is formed on both sides of the groove , the electrode paste is formed with a gap on both side walls of the groove. Therefore, there is no need to cut the paste in the groove to separate the left and right electronic components as in the conventional case, and the productivity is extremely increased. Further, it is possible to manufacture a highly reliable electronic component without cracks or chips. You can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a manufacturing process of a first embodiment of a method for manufacturing an electronic component according to the present invention.

FIG. 2 is a perspective view showing a manufacturing process of the embodiment.

FIG. 3 is a perspective view showing a manufacturing process of the embodiment.

FIG. 4 is a perspective view showing a manufacturing process of the embodiment.

FIG. 5 is a perspective view showing a manufacturing process of the embodiment.

FIG. 6 is a perspective view showing a manufacturing process of the embodiment.

FIG. 7 is a perspective view showing a manufacturing process of the embodiment.

FIG. 8 is a perspective view showing a manufacturing process of the embodiment.

FIG. 9 is a perspective view showing a manufacturing process of the embodiment.

FIG. 10 is a perspective view of an electronic component formed by the manufacturing process of the embodiment.

FIG. 11 is a perspective view showing a manufacturing process of the embodiment.

FIG. 12 is an enlarged sectional view of the product of the embodiment.

FIG. 13 is a perspective view showing a manufacturing process of a second embodiment of the method for manufacturing an electronic component according to the present invention.

FIG. 14 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 15 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 16 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 17 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 18 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 19 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 20 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 21 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 22 is a perspective view of an electronic component formed by the manufacturing process of the second embodiment.

FIG. 23 is a perspective view showing a manufacturing process of the second embodiment.

FIG. 24 is an enlarged sectional view of the product of the second embodiment.

FIG. 25 is an enlarged sectional view showing the manufacturing process of the second embodiment.

FIG. 26 is an enlarged sectional view showing the manufacturing process of the second embodiment.

FIG. 27 is a perspective view illustrating a manufacturing process of a third embodiment of the method of manufacturing an electronic component according to the present invention.

FIG. 28 is a perspective view showing a manufacturing process of the third embodiment.

FIG. 29 is a perspective view showing a manufacturing process of the third embodiment.

FIG. 30 is a perspective view showing the manufacturing process of the third embodiment.

FIG. 31 is a perspective view showing a manufacturing process of the third embodiment.

FIG. 32 is an enlarged sectional view of the product of the third embodiment.

FIG. 33 is a perspective view showing a manufacturing process of the third embodiment.

FIG. 34 is a perspective view showing a manufacturing step of the third embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Adhesive layer 3 Ferrite layer 4 Coil conductor 5 Ferrite layer 6 Ferrite layer 7 Groove 8 Dispenser 9 Needle 10 Electrode layer 11 Groove 12 Coil component 13 Mold 14 Mold 15 Chamfer 16 Chamfer projection 17 Substrate 18 Groove 19 Adhesive layer 20 Dicing groove 21 Chamfer 22 Dicing groove 23 Electrode layer

Continuation of the front page (72) Inventor Keiichi Nakao 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-5-101996 (JP, A) JP-A-58-168214 (JP) , A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01G 13/00 H01C 17/28 H01F 17/00, 41/04 H05K 3/46

Claims (9)

(57) [Claims] A step of forming an adhesive layer on a substrate;
Lamination of multiple components aligned on the top surface of the adhesive layer
Forming a body and separating the components of the laminate from each other
To form a groove that reaches the adhesive layer below it
And pouring the electrode paste into the grooves and drying.
And collecting the electrode paste by the drying.
A space is formed in the groove by shrinking and
A method for manufacturing an electronic component, wherein electrode layers are formed on both sides of a groove . 2. The product in a state in which a laminate onto the adhesive layer
2. The method for manufacturing an electronic component according to claim 1, wherein the layer body is inclined, and in this inclined state, the electrode paste is poured into the groove. 3. The electronic component manufacturing method according to claim 1, wherein a first groove for separating the individual components in the vertical direction and a second groove for separating the individual components in the horizontal direction are provided as the grooves. . 4. A projection for chamfering is provided on an upper surface of the adhesive layer.
Provide a laminated body with multiple parts arranged and arranged on the upper surface
The method for manufacturing an electronic component according to claim 1. 5. A groove is formed in a substrate, and an adhesive layer is buried in the groove.
Multiple parts are aligned on the upper surface
The method for manufacturing an electronic component according to claim 1, further comprising a laminated body . 6. The method according to claim 1 , wherein a projection for chamfering is provided on an upper surface of the adhesive layer.
Item 6. The method for producing an electronic component according to Item 5 . 7. A mold, a blade, and a sand tub for chamfering.
5. A method according to claim 4, wherein one of last and etching methods is used.
7. The method for manufacturing an electronic component according to any one of claims 6 to 6 . 8. A printing and coating method as a chamfering projection.
Or adhesive layer formation
The method of manufacturing an electronic component according to claim 4 , wherein the electronic component is formed at the same time . 9. A method for filling an electrode paste, the method comprising:
Spencer, drawing, blade, printing
The method for manufacturing an electronic component according to claim 1.