JP3062363U - Heat spreader for high heat sources - Google Patents

Abstract

(57) [Summary] [Object] To provide a heat dissipating device capable of obtaining a highly efficient heat dissipating effect in a space having a poor air permeability and a limited size. A device for dissipating heat from an electronic device constituting an integrated circuit as a heat source, comprising: a heat absorber, a radiator, and a heat pipe. The heat absorber 1 is in contact with the heat source to absorb the heat of the heat source, and the heat radiator 3 is arranged at a distance from the heat absorber 1. The heat guide tube 2 is connected between the heat absorber 1 and the radiator 3, and transfers the amount of heat absorbed by the heat absorber 1 to the radiator 3.

Description

[Detailed description of the invention]

[0001]

[Industrial applications]

 The present invention relates to a heat dissipating device for dissipating heat from an electronic device constituting an integrated circuit as a heat source, and particularly to a heat dissipating device for dissipating heat from a high heat source in a narrow space with poor air permeability. It is.

[0002]

[Prior art]

 Today, electronic device design is evolving toward a combination of high performance and high density. For example, in Pentium II (registered trademark), which is a kind of CPU, an L2 cache memory is combined with a chipset. However, such a combination of high performance and high density causes a design problem of increasing the heat generation per unit volume or unit area of the electronic device. For example, the heat value of Pentium II reaches about 40 W.

FIG. 2 is a three-dimensional view depicting a known heat spreader. This type of heat spreader absorbs the heat generated by the CPU by directly attaching it to a CPU (not shown), and further dissipates the heat using a fin. In this type of heat spreader, it is necessary to increase the heat spread area by increasing the size of the heat spreader and increasing the number of fins used in accordance with the increase in the calorific value of the CPU. However, the size of the internal space of a computer (particularly a notebook computer) is limited, and the size of a heat spreader installed therein is naturally limited. On the other hand, if the dimensions are too small, there is a problem that a sufficient heat dissipation effect cannot be obtained.

[0004]

[Problems to be solved by the invention]

 Therefore, an object of the present invention is to provide a heat dissipating device that can obtain a highly efficient heat dissipating effect in a space having a poor ventilation and a limited size.

[0005]

Means for Solving the Problems The present invention is an apparatus for dissipating heat from an electronic device constituting an integrated circuit as a heat source, the heat absorbing device being in contact with the heat source and absorbing heat from the heat source. A radiator arranged at a distance from the heat sink, and connected between the heat sink and the radiator to transmit the amount of heat absorbed by the heat sink to the radiator, And a heat conducting part for dissipating heat from the

[0006] According to this configuration, the amount of heat absorbed by the heat absorber from the heat source (the electronic device forming the integrated circuit) is sent to the radiator through the heat guide tube and is released from the radiator. By placing the radiator in a wide and well-ventilated place, the maximum heat dissipation effect can be exhibited.

If the electronic device as a heat source is a CPU built in a computer, the heat sink is directly attached to the CPU, and the radiator is arranged in a well-ventilated place in the computer. With this configuration, the effect of dissipating the amount of heat generated by the CPU is favorably exhibited.

It is preferable that the heat conducting section is, for example, a heat conducting tube, and the heat conducting tube has flexibility. By doing so, the degree of freedom in arranging the radiator is increased.

Further, if the radiator has a fin for radiating heat, a high radiating effect can be obtained.

[0010]

Embodiment

 In order to clarify the purpose, features and advantages of the present invention, preferred embodiments of the present invention will be illustratively described in detail below with reference to the drawings.

FIG. 1 is a three-dimensional view illustrating a heat dissipating device for a high heat source according to the present invention. The heat dissipating device includes a heat absorber 1, a heat conducting unit including a heat conducting tube 2, and a radiator 3. The heat absorber 1 absorbs heat generated from the CPU by directly attaching the heat absorber to a CPU (not shown). The heat guide tube 2 is connected between the heat absorber 1 and the heat radiator 3 and transmits the heat of the heat absorber 1 to the heat radiator 3, and is preferably flexible in order to increase the degree of freedom of arrangement of the heat radiator 3. It has nature. The radiator 3 has a plurality of fins and dissipates the amount of heat transmitted through the heat guide tube 2.

Since the heat absorber 1 is limited by a space in which the heat absorber 1 is directly attached to the CPU, it is preferable to manufacture the heat absorber 1 in a smaller size. However, since the radiator 3 is not subject to such a space limitation, in the present invention, the radiator 3 can be placed at a place apart from the CPU and in a relatively large and well-ventilated place inside the portable computer. Therefore, the radiator 3 can be manufactured with a large size and provided with a large number of fins, so that the maximum heat dissipation effect can be exhibited.

Next, the feasibility of the present invention will be described based on numerical grounds based on experiments. Test: Pentium II 300, an Intel Company CPU, has a power of 40 W, and according to Intel's thermal specification, the temperature difference between its surface and its surroundings is 37 ° C or less. Cost. As a result of using the heat dissipating device according to the present invention with a 40 W CPU in an ambient environment of a room temperature of 24.9 ° C., the surface temperature of the CPU was 61.8 ° C., and the temperature difference was 36.9 ° C. Was satisfied.

Although the preferred embodiments have been disclosed above, they do not limit the scope of the present invention in any way, and anyone who is familiar with the technology can do so without departing from the technical idea of the present invention. Various changes may be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims for utility model registration.

[0015]

[Effect of the invention]

 The heat dissipating device according to the present invention includes a heat sink in contact with a heat source, a radiator, and a heat conducting portion connected between the heat sink and the radiator. Produced in large dimensions and placed in a large, well-ventilated area, maximum heat dissipation can be achieved without any spatial limitations.

[Brief description of the drawings]

FIG. 1 is a three-dimensional view illustrating a heat dissipating device for a high heat source according to the present invention.

FIG. 2 is a three-dimensional view depicting a known heat spreader.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat absorber 2 Heat guide tube 3 Radiator

Claims (5)

[Utility model registration claims] An apparatus for dissipating heat from an electronic device constituting an integrated circuit as a heat source, wherein the heat sink is in contact with the heat source and absorbs heat from the heat source, and is separated from the heat absorber. And a heat conducting unit connected between the heat sink and the radiator, for transmitting the amount of heat absorbed by the heat sink to the radiator and dissipating heat from the radiator. A heat dissipating device for a high heat source. 2. The electronic device as a heat source is a CPU built in a computer, wherein the heat sink is directly attached to the CPU, and the radiator is arranged in a well-ventilated place in the computer. Item 2. A heat dissipating device for a high heat source according to item 1. 3. The heat dissipating device for a high heat source according to claim 1, wherein the heat conducting section is a heat conducting tube. 4. The heat dissipating device for a high heat source according to claim 3, wherein the heat conducting tube has flexibility. 5. The heat dissipation device for a high heat source according to claim 1, wherein the radiator has a fin for radiating heat.