JP3061090B2 - Manufacturing method of electrical contact material - Google Patents
Manufacturing method of electrical contact materialInfo
- Publication number
- JP3061090B2 JP3061090B2 JP5032751A JP3275193A JP3061090B2 JP 3061090 B2 JP3061090 B2 JP 3061090B2 JP 5032751 A JP5032751 A JP 5032751A JP 3275193 A JP3275193 A JP 3275193A JP 3061090 B2 JP3061090 B2 JP 3061090B2
- Authority
- JP
- Japan
- Prior art keywords
- contact material
- pdzn
- layer
- contact
- electrical contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気接点材料、特に開
閉接点に適する電気接点材料の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electrical contact material, particularly an electrical contact material suitable for a switching contact.
【０００２】[0002]
【従来の技術】従来より開閉接点に用いる電気接点材料
としては、Ｃｕ−Ｎｉ30％のベース材に、Ａｇ又はＡｇ
−Ｐｄ60％若しくはＡｇ−Ｎｉ10％の接点材をクラッド
したものがある。これらの電気接点材料は、耐環境性の
向上、初期接触抵抗の安定化の為に、接触部表面に薄く
Ａｕ−Ａｇ８％、Ａｕ−Ａｇ10％をクラッドすることが
多い。2. Description of the Related Art Conventionally, as an electrical contact material used for a switching contact, a base material of 30% of Cu-Ni is used with Ag or Ag.
There is a cladding of a contact material of -Pd60% or Ag-Ni10%. In many cases, these electric contact materials are thinly clad with 8% Au-Ag and 10% Au-Ag on the contact surface in order to improve environmental resistance and stabilize initial contact resistance.
【０００３】然し乍ら、このように接触部表面にＡｕ−
Ａｇ８％、Ａｕ−Ａｇ10％をクラッドしたものは、開閉
接点としては、耐粘着性に劣り、また超音波洗浄時や搬
送中に接点同志のくっつきが発生する。この為、Ａｕ−
Ａｇ８％、Ａｕ−Ａｇ10％の硬さを高くして耐粘着性の
向上を図ることが行なわれるが、加工上限界がある。ま
た、その他の元素を添加して硬さを高くすると、接触抵
抗が不安定となる。[0003] However, in this way, the Au-
When clad with 8% Ag and 10% Au-Ag, the switching contacts have poor adhesion resistance, and the contacts come into contact during ultrasonic cleaning or transport. For this reason, Au-
Although the hardness of Ag 8% and Au-Ag 10% is increased to improve the adhesion resistance, there is a limit in processing. If the hardness is increased by adding other elements, the contact resistance becomes unstable.
【０００４】このようなことから硬さが高くて耐粘着
性、耐消耗性に優れ、また接触抵抗が低く安定し、さら
に耐環境性にも優れた電気接点材料として、ＰｄＺｎの
金属間化合物からなる電気接点材料が提案されている
が、加工が困難で、接点形状に加工することは極めて難
しい。[0004] From these reasons, PdZn intermetallic compound is used as an electrical contact material having high hardness, excellent adhesive resistance and wear resistance, low contact resistance, stable and excellent environmental resistance. Although electrical contact materials have been proposed, they are difficult to process and very difficult to process into contact shapes.
【０００５】[0005]
【発明が解決しようとする課題】そこで本発明は、接点
形状に近いところで、接触部表面に所要の厚さのＰｄＺ
ｎ金属間化合物層又はＰｄＺｎ金属間化合物の分散層
（以下ＰｄＺｎ層という）を形成して上記特性を有する
電気接点材料を製造する方法を提供しようとするもので
ある。SUMMARY OF THE INVENTION Therefore, the present invention provides a PdZ having a required thickness on the surface of a contact portion near a contact shape.
An object of the present invention is to provide a method for forming an n-intermetallic compound layer or a dispersion layer of a PdZn intermetallic compound (hereinafter referred to as a PdZn layer) to produce an electrical contact material having the above characteristics.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
の本発明の電気接点材料の製造方法は、Ｐｄ又はＰｄ合
金の接触部表面に、 400〜 900℃の非酸化性雰囲気中で
Ｚｎを蒸着して、 0.1〜20μｍのＰｄＺｎ層を形成する
ことを特徴とするものである。According to the present invention, there is provided a method for producing an electrical contact material, comprising the steps of: depositing Zn on a contact surface of Pd or a Pd alloy in a non-oxidizing atmosphere at 400 to 900 ° C. It is characterized by forming a PdZn layer of 0.1 to 20 μm by vapor deposition.
【０００７】本発明の電気接点材料の製造方法に於い
て、接触部表面にＺｎを非酸化性雰囲気中で蒸着する際
の温度を、 400〜 900℃とした理由は、 400℃未満では
Ｚｎのベーバーが不十分でＰｄＺｎ金属間化合物ができ
ず、 900℃を超えるとＰｄＺｎ金属間化合物が多くなり
過ぎて脆くなり、割れが発生するようになるからであ
る。実質的には 600〜 800℃が接触抵抗が低く安定した
ＰｄＺｎ層を得るのに好適である。In the method for producing an electrical contact material according to the present invention, the temperature at which Zn is deposited on the contact surface in a non-oxidizing atmosphere is set to 400 to 900 ° C. This is because the PdZn intermetallic compound cannot be formed due to insufficient barber, and if the temperature exceeds 900 ° C., the PdZn intermetallic compound becomes excessively large, becomes brittle, and cracks occur. Substantially 600 to 800 ° C. is suitable for obtaining a stable PdZn layer with low contact resistance.
【０００８】また、形成するＰｄＺｎ層の厚さを 0.1〜
20μｍとした理由は、 0.1μｍ未満では初期の目的を達
成できる電気接点材料とならず、20μｍを超えると、脆
くなり、割れが発生し、下地のＡｇリッチ層が露出し、
粘着、消耗、硫化を起こすからである。尚、ＰｄＺｎ層
を形成した後は、加工しないのが好ましいが、必要に応
じて適宜溶接、フォーミング等の加工を行なっても良
い。The thickness of the PdZn layer to be formed is set to 0.1 to
The reason for setting it to 20 μm is that if it is less than 0.1 μm, it will not be an electrical contact material that can achieve the initial purpose.
This is because sticking, wear, and sulfurization occur. In addition, after forming the PdZn layer, it is preferable not to perform processing, but processing such as welding and forming may be performed as needed.
【０００９】[0009]
【作用】上記のように本発明の電気接点材料の製造方法
は、Ｐｄ又はＰｄ合金の接点材料の接触部表面に、 400
〜 900℃の非酸化性雰囲気でＺｎを蒸着して、 0.1〜20
μｍのＰｄＺｎ層を形成するのであるから、温度と時間
の設定によりＰｄＺｎ層の厚さを 0.1〜20μｍの範囲で
適切にコントロールできて所要の厚さの安定したＰｄＺ
ｎ層を有する電気接点材料が容易に得られ、しかも生産
性が良い。また、こうして得られた電気接点材料の 0.1
〜20μｍのＰｄＺｎ層は、硬さが高くて耐粘着性、耐消
耗性に優れ、また接触抵抗が低くて安定しており、さら
に耐環境性に優れていて、ＰｄＺｎの金属間化合物の特
性が有効に生かされている。As described above, the method for producing an electrical contact material according to the present invention employs a method of forming a Pd or Pd alloy contact material on a contact surface of a contact material.
Deposit Zn in a non-oxidizing atmosphere at ~ 900 ° C, 0.1 ~ 20
Since a PdZn layer having a thickness of μm is formed, the thickness of the PdZn layer can be appropriately controlled within the range of 0.1 to 20 μm by setting the temperature and time, and a stable PdZN layer having a required thickness can be obtained.
An electrical contact material having an n-layer can be easily obtained, and the productivity is good. In addition, 0.1% of the electrical contact material thus obtained was used.
The PdZn layer of up to 20 μm has high hardness, excellent adhesion resistance and wear resistance, low contact resistance and stability, and excellent environmental resistance. It has been effectively used.
【００１０】[0010]
【実施例】本発明の電気接点材料の製造方法の一実施例
を説明すると、厚さ 0.4mm、幅1.2mmのＣｕ−Ｎｉ30％
のベース材に、厚さ 0.3mm、幅 1.2mmのＡｇ−Ｐｄ50％
の接点材をクラッドしてなる長尺の接点材料を、Ｎ2 ガ
ス雰囲気中、 600℃の管状炉に通し、Ａｇ−Ｐｄ50％の
接点材の接触部表面にＺｎを蒸着した処、図１のグラフ
に示すように３分で２μｍ、30分で10μｍ、 120分で20
μｍのＰｄＺｎ層が形成された。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the method for producing an electric contact material according to the present invention will be described below. Cu-Ni 30% having a thickness of 0.4 mm and a width of 1.2 mm is described.
Ag-Pd50% 0.3mm thick and 1.2mm wide
A long contact material clad with the above contact material was passed through a tubular furnace at 600 ° C. in an N 2 gas atmosphere, and Zn was vapor-deposited on the contact surface of the contact material of 50% Ag-Pd. As shown in the graph, 2 μm in 3 minutes, 10 μm in 30 minutes, 20 μm in 120 minutes
A μm PdZn layer was formed.
【００１１】また、厚さ 0.3mm、幅 1.0mmのＣｕ−Ｎｉ
30％のベース材に、厚さ 0.2mm、幅1.0mmのＡｇ−Ｐｄ2
0％、Ａｇ−Ｐｄ30％、Ａｇ−Ｐｄ50％、Ａｇ−Ｐｄ60
％の接点材を夫々クラッドして長尺の各接点材料を、Ｎ
2 ガス雰囲気の管状炉に通し、 400〜 800℃の範囲内
で、各接点材の接触部表面にＺｎを蒸着してＰｄＺｎ層
を形成して得た各電気接点材料に於けるＰｄＺｎ層の接
触抵抗の変化を接触抵抗６ｇで測定した処、図２のグラ
フに示すような結果を得た。この図２のグラフに示すよ
うに 600〜 800℃でＺｎを蒸着してＡｇ−Ｐｄ合金の各
接点材の接触部表面に形成したＰｄＺｎ層の接触抵抗は
著しく低く安定していることが判る。Further, Cu-Ni having a thickness of 0.3 mm and a width of 1.0 mm is used.
Ag-Pd2 with 0.2mm thickness and 1.0mm width on 30% base material
0%, Ag-Pd30%, Ag-Pd50%, Ag-Pd60
% Of each contact material is clad, and each long contact material is N
2 Passing through a tubular furnace in a gas atmosphere and depositing Zn on the contact surface of each contact material within the range of 400 to 800 ° C. to form a PdZn layer. When the change in resistance was measured with a contact resistance of 6 g, a result as shown in the graph of FIG. 2 was obtained. As shown in the graph of FIG. 2, it can be seen that the contact resistance of the PdZn layer formed on the contact surface of each contact material of the Ag-Pd alloy by depositing Zn at 600 to 800 ° C. is extremely low and stable.
【００１２】[0012]
【発明の効果】以上の説明で判るように本発明の電気接
点材料の製造方法によれば、温度と時間の設定によりＰ
ｄＺｎ層の厚さを 0.1〜20μｍの範囲で適切にコントロ
ールできて所要の安定したＰｄＺｎ層を有する電気接点
材料が容易に得られ、しかも生産性が良い。またこうし
て得られた電気接点材料の 0.1〜20μｍのＰｄＺｎ層
は、硬さが高くて耐粘着性、耐消耗性に優れ、また接触
抵抗が低くて安定しており、さらに耐環境性に優れてい
て、ＰｄＺｎの金属間化合物の特性が有効に生かされて
いて、開閉接点に用いる電気接点材料として極めて有用
なものとなる。As can be seen from the above description, according to the method for producing an electrical contact material of the present invention, the P and P can be controlled by setting the temperature and time.
The thickness of the dZn layer can be appropriately controlled in the range of 0.1 to 20 μm, so that an electric contact material having a required stable PdZn layer can be easily obtained, and the productivity is good. The PdZn layer of 0.1 to 20 μm of the electrical contact material thus obtained is high in hardness, excellent in adhesion resistance and wear resistance, low in contact resistance and stable, and excellent in environmental resistance. As a result, the properties of the intermetallic compound of PdZn are effectively utilized, and it is extremely useful as an electric contact material used for switching contacts.
【図１】Ｎ2 ガス雰囲気中、 600℃の管状炉に接点材料
を通し、接触部表面にＺｎを蒸着してＰｄＺｎ層を形成
した際の蒸着時間と層厚の関係を示すグラフである。FIG. 1 is a graph showing the relationship between the deposition time and the layer thickness when a PdZn layer is formed by passing a contact material through a tubular furnace at 600 ° C. in an N 2 gas atmosphere and depositing Zn on the contact surface.
【図２】Ａｇ−Ｐｄ合金の接点材料に対するＰｄＺｎ層
の形成温度と接触抵抗の関係を示すグラフである。FIG. 2 is a graph showing a relationship between a formation temperature of a PdZn layer and a contact resistance with respect to a contact material of an Ag—Pd alloy.
Claims (1)
面に、 400〜 900℃の非酸化性雰囲気中でＺｎを蒸着し
て、 0.1〜20μｍのＰｄＺｎ金属間化合物層又はＰｄＺ
ｎ金属間化合物の分散層を形成することを特徴とする電
気接点材料の製造方法。1. A Pd or PdZn intermetallic compound layer or a PdZn layer having a thickness of 0.1 to 20 μm by depositing Zn in a non-oxidizing atmosphere at 400 to 900 ° C.
A method for producing an electrical contact material, comprising forming a dispersion layer of n-intermetallic compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5032751A JP3061090B2 (en) | 1993-01-28 | 1993-01-28 | Manufacturing method of electrical contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5032751A JP3061090B2 (en) | 1993-01-28 | 1993-01-28 | Manufacturing method of electrical contact material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06223673A JPH06223673A (en) | 1994-08-12 |
| JP3061090B2 true JP3061090B2 (en) | 2000-07-10 |
Family
ID=12367556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5032751A Expired - Lifetime JP3061090B2 (en) | 1993-01-28 | 1993-01-28 | Manufacturing method of electrical contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3061090B2 (en) |
-
1993
- 1993-01-28 JP JP5032751A patent/JP3061090B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06223673A (en) | 1994-08-12 |
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