JP3059744B2 - Liquid crystal display - Google Patents

Liquid crystal display

Info

Publication number
JP3059744B2
JP3059744B2 JP2180087A JP18008790A JP3059744B2 JP 3059744 B2 JP3059744 B2 JP 3059744B2 JP 2180087 A JP2180087 A JP 2180087A JP 18008790 A JP18008790 A JP 18008790A JP 3059744 B2 JP3059744 B2 JP 3059744B2
Authority
JP
Japan
Prior art keywords
flexible substrate
conductive film
anisotropic conductive
metal particles
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2180087A
Other languages
Japanese (ja)
Other versions
JPH0467126A (en
Inventor
修 山下
正義 磯部
雅則 田村
真 笠見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP2180087A priority Critical patent/JP3059744B2/en
Publication of JPH0467126A publication Critical patent/JPH0467126A/en
Application granted granted Critical
Publication of JP3059744B2 publication Critical patent/JP3059744B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【発明の詳細な説明】 (イ) 産業上の利用分野 本発明は駆動用の可撓性基板を電気的及び機械的に接
続した液晶セルを用いた液晶表示装置に関する。
The present invention relates to a liquid crystal display device using a liquid crystal cell in which a flexible substrate for driving is electrically and mechanically connected.

(ロ) 従来の技術 近年液晶表示装置は大容量表示を行うため、特開昭60
−225120号公報の如く液晶セルの近傍に駆動手段を配置
し、異方性導電膜を用いて駆動手段の配線の電気的及び
機械的接続をしていた。しかしこの公報では、用いられ
る異方性導電膜が1種類であるため再生がうまくいかな
かった。何故ならば硬質の金属粒子を含む異方性導電膜
を第1回目の圧着時に用いれば、金属粒子が硬く接触面
積が狭く、端子部と導電部との位置ずれによる接続不良
が生じやすい。また軟質の金属粒子を含む異方性導電膜
を第1回目の圧着時に用いれば、軟いので接続不良にな
りにくい。しかしもし接続不良になり再生する場合は、
第2回目の圧着時に以前の異方性導電膜が残っていてそ
の残部が金属粒子の圧着を妨害し、電気的、機械的接続
が十分にならない。これが第1の欠点である。
(B) Conventional technology In recent years, liquid crystal display devices have been disclosed in
As described in JP-A-225120, a driving means is arranged near a liquid crystal cell, and the wiring of the driving means is electrically and mechanically connected using an anisotropic conductive film. However, in this publication, reproduction was not successful because only one kind of anisotropic conductive film was used. If an anisotropic conductive film containing hard metal particles is used in the first compression bonding, the metal particles are hard and the contact area is small, and a connection failure due to a positional shift between the terminal portion and the conductive portion is likely to occur. In addition, if an anisotropic conductive film containing soft metal particles is used at the time of the first press-bonding, it is soft and hardly causes poor connection. However, if the connection is broken and playback starts,
At the time of the second press bonding, the previous anisotropic conductive film remains, and the remaining portion hinders the pressing of the metal particles, and the electrical and mechanical connections are not sufficient. This is the first disadvantage.

次に例えば1つの液晶セルに対して160本の端子から
成る長い可撓性基板と80本の端子から成る短い可撓性基
板を用いる場合、圧着がうまくいかない。何故ならば、
圧着部が長い可撓性基板は復元力が強く、また加圧力が
圧着部全体に分散しやすいので硬質の金属粒子の狭い接
触面積では剥離し易く、従って硬質の金属粒子がうまく
圧着できない。また短い可撓性基板に軟質の金属粒子を
圧着すると、金属粒子がつぶれすぎ隣接する金属粒子間
で洩れ電流が生じるなど、導電異方性が損われる。これ
が第2の欠点である。
Next, for example, when a long flexible substrate composed of 160 terminals and a short flexible substrate composed of 80 terminals are used for one liquid crystal cell, crimping is not successful. because,
A flexible substrate having a long crimping portion has a strong restoring force, and the pressing force is easily dispersed throughout the crimping portion, so that the hard metal particles are easily peeled off in a small contact area, so that the hard metal particles cannot be crimped well. In addition, when soft metal particles are pressed against a short flexible substrate, the conductive anisotropy is impaired such that the metal particles are excessively crushed and a leakage current occurs between adjacent metal particles. This is the second disadvantage.

更に必要に応じて1つの液晶セルに対して、硬質の可
撓性基板と軟質の可撓性基板を用いたい場合、例えば硬
質の可撓性基板に硬質の金属粒子を有する異方性導電膜
を用いるとうまくいかない。何故ならば可撓性基板が硬
いので反りかえようとする復元力が強く、硬質の金属粒
子の狭い接触面積では復元力を吸収することができず、
うまく圧着できない。また軟質の可撓性基板に軟質の金
属粒子を有する異方性導電膜を圧着すると、金属粒子が
軟いのでつぶれすぎて隣接する導電部同志がリーク又は
短絡する。これが第3の欠点である。
Further, when it is desired to use a hard flexible substrate and a soft flexible substrate for one liquid crystal cell, for example, an anisotropic conductive film having hard metal particles on the hard flexible substrate Does not work. Because the flexible substrate is hard, the restoring force to warp is strong, and the restoring force cannot be absorbed by the narrow contact area of the hard metal particles,
We cannot crimp well. In addition, when an anisotropic conductive film having soft metal particles is pressed on a soft flexible substrate, the metal particles are so soft that they are crushed too much and adjacent conductive portions leak or short-circuit. This is the third disadvantage.

(ニ) 課題を解決するための手段 本発明は上述の課題を解決するために、表面に端子部
を有する基板を用いる液晶セルと、軟質の金属粒子を含
む異方性導電膜を介して前記端子部の上に圧着される第
1の可撓性基板と、前記異方性導電膜の残部および硬質
の金属粒子を含む異方性導電膜を介して前記端子部の上
に圧着される第2の可撓性基板とを設けたものである。
(D) Means for Solving the Problems In order to solve the above problems, the present invention provides a liquid crystal cell using a substrate having a terminal portion on the surface and an anisotropic conductive film containing soft metal particles. A first flexible substrate crimped on the terminal portion, and a second flexible substrate crimped on the terminal portion via the remaining anisotropic conductive film and the anisotropic conductive film containing hard metal particles. And two flexible substrates.

そして本発明はまた、軟質の金属粒子を含む異方性導
電膜を介して液晶セルの端子部の上に圧着されかつ長尺
の圧着部を有する可撓性基板と、硬質の金属粒子を含む
異方性導電膜を介して端子部の上に圧着されかつ短尺の
圧着部を有する可撓性基板とを設けたものである。
The present invention also includes a flexible substrate having a long pressure-bonded portion, which is pressure-bonded onto a terminal portion of a liquid crystal cell via an anisotropic conductive film including soft metal particles, and hard metal particles. And a flexible substrate having a short crimping portion which is crimped on the terminal portion via an anisotropic conductive film.

さらにまた本発明は、軟質の金属粒子を含む異方性導
電膜を介して液晶セルの端子部の上に圧着される硬質の
可撓性基板と、硬質の金属粒子を含む異方性導電膜を介
して端子部の上に圧着される軟質の可撓性基板とを設け
たものである。
Still further, the present invention provides a hard flexible substrate press-bonded on a terminal portion of a liquid crystal cell via an anisotropic conductive film containing soft metal particles, and an anisotropic conductive film containing hard metal particles. And a soft flexible substrate that is crimped onto the terminal portion through the substrate.

(ホ) 作用 上述の手段により、第2回目の圧着時に硬質の金属粒
子が以前の異方性導電膜の残部を貫通し、端子部の接続
が十分できる。
(E) Function By the above-described means, the hard metal particles penetrate the remaining portion of the previous anisotropic conductive film at the time of the second pressure bonding, and the connection of the terminal portion can be sufficiently performed.

そしてまた上述の手段により圧着部の長さの異なる、
若しくは基板の硬さの異なる可撓性基板を強固にかつ異
方性を保って電気的、機械的に接続することができる。
And the length of the crimping part is different due to the above means,
Alternatively, flexible substrates having different substrate hardnesses can be electrically and mechanically connected firmly and anisotropically.

(ヘ) 実施例 最初に第1図と第2図と第3図に従い、本発明の第1
実施例を説明する。第1図は第1回目の圧着後の液晶表
示装置の部分断面図、第2図と第3図は第2回目(再生
時)のそれぞれ圧着前と圧着後の液晶表示装置の要部断
面図である。第1図に於いて、1は表面に複数の端子部
2を有するガラス等から成る基板である。1つの端子部
2は例えばピッチ200μmの160本の端子から出来ていて
端子部2は複数あるので端子の数は160×整数(本)と
なる。
(F) Embodiment First, according to FIG. 1, FIG. 2 and FIG.
An embodiment will be described. FIG. 1 is a partial cross-sectional view of the liquid crystal display device after the first press-fitting, and FIGS. 2 and 3 are main-portion cross-sectional views of the liquid crystal display device before and after the second press (at the time of reproduction), respectively. It is. In FIG. 1, reference numeral 1 denotes a substrate made of glass or the like having a plurality of terminal portions 2 on the surface. One terminal section 2 is made of, for example, 160 terminals having a pitch of 200 μm, and there are a plurality of terminal sections 2, so that the number of terminals is 160 × integer (number).

3は液晶セルであり、電極膜4と液晶配向膜5とを有
した基板1をスペーサー6にて一定間隔で貼り合わせ、
その間にカイラルネマティック液晶層7を挾持し、偏光
子等(図示せず)を基板1の両外側に貼り合わせたもの
である。また下側の基板1の上に設けられた電極膜4を
端縁に延長したものが端子部2であり、必要とあれば上
側の基板1の電極膜4をも図の紙面に直交する方向に延
長して同様の端子部としてもよい。
Reference numeral 3 denotes a liquid crystal cell, and the substrate 1 having the electrode film 4 and the liquid crystal alignment film 5 is bonded at regular intervals by spacers 6,
A chiral nematic liquid crystal layer 7 is interposed therebetween, and polarizers and the like (not shown) are bonded to both outer sides of the substrate 1. The terminal portion 2 is formed by extending the electrode film 4 provided on the lower substrate 1 to the edge, and if necessary, the electrode film 4 of the upper substrate 1 is also oriented in a direction perpendicular to the plane of the drawing. To extend to the same terminal portion.

はTAB(テープオートメーテッドボンディングパッ
ケージ)と呼ばれる、駆動手段を設けた第1の可撓性基
板である。この第1の可撓性基板は、錫メッキ銅片等
から成る多数の入力側リード箔9と出力側リード箔10を
集積回路素子11の端子としたものである。そしてこれら
のリード箔9と10はポリイミドシート等から成る絶縁シ
ート12で保持され、リード箔9と10と集積回路素子11の
接続点近傍は保護樹脂13で覆って保護される。
Reference numeral 8 denotes a first flexible substrate called TAB (Tape Automated Bonding Package) provided with driving means. The first flexible substrate 8 has a number of input-side lead foils 9 and output-side lead foils 10 made of tin-plated copper pieces or the like serving as terminals of the integrated circuit element 11. These lead foils 9 and 10 are held by an insulating sheet 12 made of a polyimide sheet or the like, and the vicinity of the connection point between the lead foils 9 and 10 and the integrated circuit element 11 is covered and protected by a protective resin 13.

1つの第1の可撓性基板は例えばピッチ200μmの1
60本の出力側リード箔10を有し、表示容量に応じて1つ
の液晶セル3に対して、数個ないし10数個の第1の可撓
性基板が用いられる。
One first flexible substrate 8 has a pitch of 200 μm, for example.
It has 60 output-side lead foils 10, and several to ten and several first flexible substrates 8 are used for one liquid crystal cell 3 according to the display capacity.

例えばソニーケミカル(株)のCP3131FTより構成され
た異方性導電膜14は、軟質の金属粒子15と接着剤16から
構成された圧着前の厚さが約35のものからなる。このう
ち接着剤16は熱硬化樹脂から成り、軟質の金属粒子15は
例えばSn−Pb合金である半田から成り、圧着前の粒子径
は10〜15μmであり、比較的硬度が小さい。
For example, the anisotropic conductive film 14 made of CP3131FT of Sony Chemical Co., Ltd. is made of soft metal particles 15 and an adhesive 16 and has a thickness before pressure bonding of about 35. Among them, the adhesive 16 is made of a thermosetting resin, the soft metal particles 15 are made of, for example, a solder made of an Sn—Pb alloy, and the particle diameter before compression is 10 to 15 μm, and has relatively small hardness.

そして端子部2の上に異方性導電膜14を接着した後に
TAB位置合せ装置にて、端子部2と出力側リード箔10を
位置合せした後、TAB熱圧着装置にて圧着を行う。この
圧着作業により、軟質の金属粒子15は押しづぶされて、
異方性導電膜14は約2μmの厚さとなる。
After bonding the anisotropic conductive film 14 on the terminal portion 2
After aligning the terminal portion 2 and the output-side lead foil 10 with a TAB positioning device, crimping is performed with a TAB thermocompression device. By this crimping work, the soft metal particles 15 are pressed down,
The anisotropic conductive film 14 has a thickness of about 2 μm.

次に上述の手段に於て位置ずれ又は部分的な剥離等の
導通不良を生じて再生する必要がある場合を第2図に従
い説明する。接続不良の第1の可撓性基板だけをスポ
ットヒーターを用いて熱を加えながら取り除く。そして
第1の可撓性基板と同じ構成をしかつ新しい再生用の
第2の可撓性基板17を準備しておく。綿棒にアセトンを
含ませて第1の可撓性基板14が取り除かれたあとの異方
性導電膜14をこすって取り除く、しかし完全にきれいに
ならないで異方性導電膜14の残部18が残る。
Next, the case where it is necessary to perform reproduction by causing a conduction defect such as displacement or partial peeling by the above means will be described with reference to FIG. Only the first flexible substrate 8 having poor connection is removed while applying heat using a spot heater. Then, a new second flexible substrate 17 for reproduction, which has the same configuration as the first flexible substrate 8 , is prepared. The anisotropic conductive film 14 after the first flexible substrate 14 has been removed by immersing acetone in a cotton swab is rubbed off, but the remaining portion 18 of the anisotropic conductive film 14 remains without being completely cleaned.

これは接着剤16が熱硬化性樹脂であるため、溶剤に完
全に溶けないためである。もし接着剤16が熱可塑性樹脂
ならば溶剤に完全に溶けるが、液晶表示装置として熱と
水分に対して耐性のある熱硬化樹脂を用いざるを得な
い。
This is because the adhesive 16 is a thermosetting resin and is not completely dissolved in a solvent. If the adhesive 16 is a thermoplastic resin, it is completely soluble in the solvent, but a thermosetting resin having heat and moisture resistance must be used for the liquid crystal display device.

次いで異方性導電膜19を用いる。これは例えばソニー
ケミカル(株)のCPU4221より構成された異方性導電膜1
9で、硬質金属粒子20と接着剤21から構成され、圧着前
の厚さは約20μmである。接着剤21は熱硬化性樹脂から
成り、硬質の金属粒子20を含む。硬質の金属粒子20は例
えば金属Niから成り、圧着前の粒子径は約10μmであ
り、比較的硬度が大きい。また他の材質としてIn、Au等
が使用できる。異方性導電膜の残部18の上に異方性導電
19が接着される。
Next, an anisotropic conductive film 19 is used. This is, for example, an anisotropic conductive film 1 composed of a CPU4221 of Sony Chemical Corporation.
In 9 , a hard metal particle 20 and an adhesive 21 are formed, and the thickness before pressure bonding is about 20 μm. The adhesive 21 is made of a thermosetting resin and includes hard metal particles 20. The hard metal particles 20 are made of, for example, metal Ni, have a particle size of about 10 μm before pressure bonding, and have relatively high hardness. In addition, In, Au, or the like can be used as another material. An anisotropic conductive film 19 is adhered on the remaining portion 18 of the anisotropic conductive film.

次に圧着後の液晶表示装置を第3図に従い説明する。
再びTAB位置合せ装置にて、端子部2と第2の可撓性基
17に設けられた出力側リード箔10の位置合せをした
後、以下の圧着条件により圧着する。
Next, the liquid crystal display device after pressure bonding will be described with reference to FIG.
After the terminal portion 2 and the output-side lead foil 10 provided on the second flexible substrate 17 are aligned again by the TAB positioning device, they are crimped under the following crimping conditions.

圧着条件:圧着温度=175〜185℃,圧着時間=20〜30
秒,圧着圧力=30〜50kgf/cm2 この圧着作業により、硬質の金属粒子20は硬いので、
異方性導電膜の残部18に含まれる軟質の金属粒子15の残
部及び接着剤16の残部を貫通する。その結果、端子部2
と出力側リード箔10の十分な電気的及び機械的接続を確
保出来る。また圧着後の異方性導電膜19の厚さは約3μ
mである。以上により本発明の第1実施例の説明を終わ
る。
Crimping conditions: Crimping temperature = 175 to 185 ° C, crimping time = 20 to 30
Second, compression pressure = 30 to 50 kgf / cm 2 By this compression work, the hard metal particles 20 are hard,
It penetrates through the remaining portion of the soft metal particles 15 and the remaining portion of the adhesive 16 included in the remaining portion 18 of the anisotropic conductive film. As a result, the terminal 2
Sufficient electrical and mechanical connection between the lead foil 10 and the output side can be secured. The thickness of the anisotropic conductive film 19 after compression is about 3 μm.
m. This concludes the description of the first embodiment of the present invention.

次に第4図と第5図に従い、本発明の第2実施例を説
明する。第4図は圧着部が50mm前後の比較的長い可撓性
基板を用いた液晶表示装置の要部断面図、第5図は圧着
部が25mm前後の比較的短い可撓性基板を用いた液晶表示
装置の要部断面図である。
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a cross-sectional view of a main part of a liquid crystal display device using a relatively long flexible substrate having a crimping portion of about 50 mm. FIG. 5 is a liquid crystal display using a relatively short flexible substrate having a crimping portion of about 25 mm. It is principal part sectional drawing of a display apparatus.

第4図に於て、2は例えばピッチ200μmの160本の端
子を有する端子部である。は第1の可撓性基板であ
り、第1実施例で説明した物と同じ材料から成り、長さ
50mmと比較的長い長尺の圧着部を有する。14は異方性導
電膜であり、軟質の金属粒子15と接着剤16から構成さ
れ、第1実施例で示した物との同じ材料から成る。そし
て端子部2の上に異方性導電膜14を介して長尺の圧着部
を有する可撓性基板が圧着される。
In FIG. 4, reference numeral 2 denotes a terminal portion having 160 terminals with a pitch of 200 μm, for example. Reference numeral 8 denotes a first flexible substrate, which is made of the same material as that described in the first embodiment, and has a length of
It has a relatively long crimping section of 50 mm. Reference numeral 14 denotes an anisotropic conductive film, which comprises soft metal particles 15 and an adhesive 16, and is made of the same material as that shown in the first embodiment. Then, the flexible substrate 8 having a long crimping portion is crimped on the terminal portion 2 via the anisotropic conductive film 14 .

第5図に於て22は例えばピッチ200μmの80本の端子
を有する端子部である。23は短尺の圧着部を有する可撓
性基板であり、ピッチ200μmの80本の出力側リード箔2
4と絶縁シート25を有する。圧着部の長さは比較的短く2
5mmである。19は異方性導電膜であり。硬質の金属粒子2
0と接着剤21から構成され、第1実施例で示した物と同
じ材料からなる。
In FIG. 5, reference numeral 22 denotes a terminal portion having, for example, 80 terminals with a pitch of 200 μm. Reference numeral 23 denotes a flexible substrate having a short crimp portion, and 80 output-side lead foils 2 having a pitch of 200 μm.
4 and an insulating sheet 25. Crimp length is relatively short2
5 mm. 19 is an anisotropic conductive film. Hard metal particles 2
0 and an adhesive 21 and are made of the same material as that shown in the first embodiment.

そして、端子部22の上に異方性導電膜19を介して短尺
の圧着部を有する可撓性基板23が圧着される。このよう
に圧着部の長さが異なる可撓性基板に異なる異方性導電
膜を用いる事により、導通不良や洩れ電流を生じること
なく接続できる。
Then, the flexible substrate 23 having a short crimping portion is crimped on the terminal portion 22 via the anisotropic conductive film 19 . By using different anisotropic conductive films for the flexible substrates having different lengths of the press-bonded portions, connection can be made without causing poor conduction or leakage current.

同様に硬さの異なる可撓性基板に異なる異方性導電膜
を組合せた第3実施例を第6図と第7図に従って説明す
る。第6図と第7図はそれぞれ硬質の可撓性基板もしく
は軟質の可撓性基板を用いた液晶表示装置の要部断面図
である。第6図に於て26は硬質の可撓性基板であり、例
えばピッチ200μmの160本の出力側リード箔10を強固に
支持するために厚さ300μmのポリイミドシート等から
成る絶縁シート27を有する。
Similarly, a third embodiment in which flexible substrates having different hardnesses are combined with different anisotropic conductive films will be described with reference to FIGS. 6 and 7. FIG. 6 and FIG. 7 are cross-sectional views of main parts of a liquid crystal display device using a hard flexible substrate or a soft flexible substrate, respectively. In FIG. 6, reference numeral 26 denotes a hard flexible substrate, which has an insulating sheet 27 made of a polyimide sheet or the like having a thickness of 300 μm for firmly supporting 160 output-side lead foils 10 having a pitch of 200 μm. .

その結果硬度が大きくなっている。異方性導電膜14
端子部2は第1実施例で示した物と同じ材料から成る。
そして軟質の金属粒子15を含む異方性導電膜14を介して
端子部2の上に硬質の可撓性基板26が圧着される。
As a result, the hardness is increased. The anisotropic conductive film 14 and the terminal 2 are made of the same material as that shown in the first embodiment.
Then, a hard flexible substrate 26 is pressed onto the terminal portion 2 via the anisotropic conductive film 14 containing the soft metal particles 15.

第7図に於て、軟質の可撓性基板28は出力側リード箔
10が低温融着用であるとか、基板の可撓性を十分大きく
する目的で厚さ150μmのポリイミドシート等から成る
絶縁シート29を有する、その結果、硬度が小さくなって
いる。そして、硬質の金属粒子20を含む異方性導電膜19
を介して端子部2の上に軟質の可撓性基板28が圧着され
る。この様に可撓性基板の硬度が異なっていても各々に
適合する異方性導電膜を用いることで確実な接続を行う
ことが出来る。
In FIG. 7, a soft flexible substrate 28 is an output side lead foil.
10 has an insulating sheet 29 made of a polyimide sheet or the like having a thickness of 150 μm for the purpose of low-temperature fusion or to sufficiently increase the flexibility of the substrate. As a result, the hardness is low. Then, anisotropic conductive film 19 containing hard metal particles 20
A soft flexible substrate 28 is crimped onto the terminal portion 2 through the terminal. Thus, even if the hardness of the flexible substrates is different, reliable connection can be achieved by using an anisotropic conductive film suitable for each.

(ト) 発明の効果 本発明は上述の手段により、位置ずれ又は部分的な剥
離等の導通不良を生じて再生する必要がある場合は、第
2回目の圧着時に硬質の金属粒子が以前の異方性導電膜
の残部を貫通して、端子部と可撓性基板との十分な電気
的及機械的接続を確保出来る。
(G) Effect of the Invention According to the present invention, when it is necessary to regenerate due to a conduction defect such as displacement or partial peeling by the above-described means, the hard metal particles are removed at the second press-bonding. Through the remaining portion of the isotropic conductive film, sufficient electrical and mechanical connection between the terminal portion and the flexible substrate can be secured.

そしてまた上述の手段により、長尺の圧着部を有する
可撓性基板又は硬質の可撓性基板は硬くて復元力がある
ので、それと軟質の金属粒子を組合せる事により、圧着
してもこの復元力に勝って金属粒子を十分かつ適正につ
ぶすことができる。また短尺の圧着部を有する可撓性基
板又は軟質の可撓性基板は軟いので、それと硬質の金属
粒子を組合せる事により、圧着しても金属粒子がつぶれ
すぎることがなく隣接する導電部同志が短絡することが
ないので、端子部と可撓性基板との十分な電気的及び機
械的接続を確保出来る。
Further, by the above-described means, the flexible substrate having a long crimp portion or the rigid flexible substrate is hard and has a restoring force. The metal particles can be sufficiently and properly crushed by overcoming the restoring force. In addition, since a flexible substrate having a short crimping portion or a soft flexible substrate is soft, by combining it with hard metal particles, the metal particles are not excessively crushed even when crimped, and the adjacent conductive portion Since the members are not short-circuited, a sufficient electric and mechanical connection between the terminal portion and the flexible substrate can be secured.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の第1実施例に於ける第1回目の圧着後
の液晶表示装置の部分断面図、第2図は本発明の第1実
施例に於ける第2回目(再生時)の圧着前の液晶表示装
置の要部断面図、第3図は本発明の第1実施例に於ける
第2回目(再生時)の圧着後の液晶表示装置の要部断面
図、第4図は本発明の第2実施例に於ける長尺の圧着部
を有する可撓性基板を用いた液晶表示装置の要部断面
図、第5図は本発明の第2実施例に於ける短尺の圧着部
を有する可撓性基板を用いた液晶表示装置の要部断面
図、第6図は本発明の第3実施例に於ける硬質の可撓性
基板を用いた液晶表示装置の要部断面図、第7図は本発
明の第3実施例に於ける軟質の可撓性基板を用いた液晶
表示装置の要部断面図である。 1……基板、2……端子部、3……液晶セル、……第
1の可撓性基板又は長尺の圧着部を有する可撓性基板、
14……軟質の金属粒子を含む異方性導電膜、15……軟質
の金属粒子、17……第2の可撓性基板、18……異方性導
電膜の残部、19……硬質の金属粒子を含む異方性導電
膜、20……硬質の金属粒子、22……端子部、23……短尺
の圧着部を有する可撓性基板、26……硬質の可撓性基
板、28……軟質の可撓性基板。
FIG. 1 is a partial cross-sectional view of a liquid crystal display device after a first press bonding in the first embodiment of the present invention, and FIG. 2 is a second cross section (at the time of reproduction) in the first embodiment of the present invention. FIG. 3 is a cross-sectional view of a main part of the liquid crystal display device before crimping, FIG. 3 is a cross-sectional view of a main part of the liquid crystal display device after the second (during reproduction) crimping in the first embodiment of the present invention, and FIG. FIG. 5 is a cross-sectional view of a main part of a liquid crystal display device using a flexible substrate having a long crimp portion according to a second embodiment of the present invention. FIG. FIG. 6 is a cross-sectional view of a main part of a liquid crystal display device using a flexible substrate having a crimp portion. FIG. 6 is a cross-sectional view of a main part of a liquid crystal display device using a rigid flexible substrate according to a third embodiment of the present invention. FIG. 7 is a sectional view of a main part of a liquid crystal display device using a soft flexible substrate according to a third embodiment of the present invention. Reference numeral 1 denotes a substrate, 2 denotes a terminal portion, 3 denotes a liquid crystal cell, 8 denotes a first flexible substrate or a flexible substrate having a long crimping portion,
14 ... anisotropic conductive film containing soft metal particles, 15 ... soft metal particles, 17 ... second flexible substrate, 18 ... remainder of anisotropic conductive film, 19 ... hard Anisotropic conductive film containing metal particles, 20 hard metal particles, 22 terminal part, 23 flexible substrate having short crimped part, 26 rigid hard substrate, 28 ... Soft flexible substrate.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田村 雅則 鳥取県鳥取市南吉方3丁目201番地 鳥 取三洋電機株式会社内 (72)発明者 笠見 真 鳥取県鳥取市南吉方3丁目201番地 鳥 取三洋電機株式会社内 (58)調査した分野(Int.Cl.7,DB名) G02F 1/1345 H05K 3/36 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masanori Tamura 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. (72) Makoto Kasami 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd. (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1345 H05K 3/36

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】表面に複数の端子部を有する基板を用いる
液晶セルと、軟質の金属粒子を含む異方性導電膜を介し
て前記複数の端子部の上に圧着される複数の第1の可撓
性基板と、複数の端子部の内の前記第1の可撓性基板が
取り除かれた端子部の上に前記異方性導電膜の残部およ
び硬質の金属粒子を含む異方性導電膜を介して圧着され
る第2の可撓性基板とを具備する事を特徴とする液晶表
示装置。
1. A liquid crystal cell using a substrate having a plurality of terminal portions on its surface, and a plurality of first pressure-bonded portions on said plurality of terminal portions via an anisotropic conductive film containing soft metal particles. A flexible substrate, and an anisotropic conductive film containing the remainder of the anisotropic conductive film and hard metal particles on the terminal portion from which the first flexible substrate of the plurality of terminal portions has been removed And a second flexible substrate that is press-bonded through the liquid crystal display device.
【請求項2】表面に端子部を有する基板を用いる液晶セ
ルと、軟質の金属粒子を含む異方性導電膜を介して前記
端子部の上に圧着されかつ長尺の圧着部を有する可撓性
基板と、硬質の金属粒子を含む異方性導電膜を介して前
記端子部の上に圧着されかつ短尺の圧着部を有する可撓
性基板とを具備する事を特徴とする液晶表示装置。
2. A liquid crystal cell using a substrate having a terminal portion on the surface, and a flexible portion having a long pressure-bonded portion which is pressure-bonded onto the terminal portion via an anisotropic conductive film containing soft metal particles. A liquid crystal display device comprising: a flexible substrate; and a flexible substrate having a short crimped portion that is crimped on the terminal portion via an anisotropic conductive film containing hard metal particles.
【請求項3】表面に端子部を有する基板を用いる液晶セ
ルと、軟質の金属粒子を含む異方性導電膜を介して前記
端子部の上に圧着される硬質の可撓性基板と、硬質の金
属粒子を含む異方性導電膜を介して前記端子部の上に圧
着される軟質の可撓性基板とを具備する事を特徴とする
液晶表示装置。
3. A liquid crystal cell using a substrate having a terminal portion on its surface, a hard flexible substrate pressed onto said terminal portion via an anisotropic conductive film containing soft metal particles, A soft flexible substrate which is pressed onto the terminal portion via an anisotropic conductive film containing metal particles.
JP2180087A 1990-07-06 1990-07-06 Liquid crystal display Expired - Fee Related JP3059744B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2180087A JP3059744B2 (en) 1990-07-06 1990-07-06 Liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2180087A JP3059744B2 (en) 1990-07-06 1990-07-06 Liquid crystal display

Publications (2)

Publication Number Publication Date
JPH0467126A JPH0467126A (en) 1992-03-03
JP3059744B2 true JP3059744B2 (en) 2000-07-04

Family

ID=16077223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2180087A Expired - Fee Related JP3059744B2 (en) 1990-07-06 1990-07-06 Liquid crystal display

Country Status (1)

Country Link
JP (1) JP3059744B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801487B2 (en) * 1992-04-30 1998-09-21 シャープ株式会社 Panel mounting structure, mounting method, and resin supply curing method

Also Published As

Publication number Publication date
JPH0467126A (en) 1992-03-03

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