JPH05142555A - Liquid crystal display unit and formation of electrode projection - Google Patents

Liquid crystal display unit and formation of electrode projection

Info

Publication number
JPH05142555A
JPH05142555A JP30168591A JP30168591A JPH05142555A JP H05142555 A JPH05142555 A JP H05142555A JP 30168591 A JP30168591 A JP 30168591A JP 30168591 A JP30168591 A JP 30168591A JP H05142555 A JPH05142555 A JP H05142555A
Authority
JP
Japan
Prior art keywords
liquid crystal
electrode
substrate
crystal panel
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP30168591A
Other languages
Japanese (ja)
Inventor
Yuji Narumi
雄二 鳴海
Takumi Suzuki
巧 鈴木
Yuichi Ota
祐一 太田
Masakuni Itagaki
雅訓 板垣
Hisao Takahashi
久雄 高橋
Hiroshi Fujimura
浩 藤村
Hiroyuki Sakayori
寛幸 坂寄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP30168591A priority Critical patent/JPH05142555A/en
Publication of JPH05142555A publication Critical patent/JPH05142555A/en
Withdrawn legal-status Critical Current

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  • Liquid Crystal (AREA)

Abstract

PURPOSE:To assure connection with a smaller number of processes by forming projections on the electrode surfaces of a flexible substrate or a tab for driving and applying an adhesive on the electrode surfaces to be connected, thereby joining the projections to the transparent electrodes of a liquid crystal panel substrate. CONSTITUTION:The plural projections 15 are formed in the positions corresponding to the plating layer of the electrodes 12 on the flexible substrate 11 surface by pressing with a press mold. The adhesive substrate 16 is thereafter applied by means, such as printing, on the electrode terminal surface of the flexible substrate 11 formed with the projections 15. The projections 15 are formed on the electrode 12 surfaces in such a manner and further the juncture of the flexible substrate 11 coated with the adhesive 16 and the electrode terminals of the transparent electrodes of the liquid crystal panel substrate are thermcompression bonded. Then, the electrical connection of the projections 15 formed on the electrodes 12 of the flexible substrate 11 with the electrode terminals of the transparent electrodes is then obtd. while expelling the adhesive 16 thinly covering then surfaces of the projections 15 when the projections are brought into pressurized contact with the electrode terminals of the transparent electrodes of the liquid crystal panel substrate. The physical connection of both electrodes is also obtd. by curing of the adhesive material 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、可撓性フイルムからな
る液晶パネル基板と駆動回路基板とを接続するフレキシ
ブル接続基板、又は該液晶パネル基板と直接接続される
駆動用TABの接続部の改良に係わる液晶表示ユニット
及び接続部に設けられる突起の形成方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a flexible connection board for connecting a liquid crystal panel substrate made of a flexible film and a drive circuit board, or a connecting portion of a driving TAB directly connected to the liquid crystal panel board. The present invention relates to a method for forming a projection provided on a liquid crystal display unit and a connecting portion.

【0002】[0002]

【従来の技術】従来、一対の液晶パネル基板を僅かな間
隙を設けて貼り合わせ、この間隙に液晶を充填して形成
される液晶表示素子において、液晶パネル基板1に形成
した透明電極端子2に駆動回路基板3の配線端子4を接
続するに際して、図7に示すように、配線電極6を形成
したフレキシブル接続基板5を介在させている。そし
て、フレキシブル接続基板5の配線電極6の一方の電極
端子6aと液晶パネル基板1の透明電極端子2との間、
配線電極6の他方の電極端子6bと駆動回路基板3の配
線端子4との間を夫々、異方導電性コネクタ7a,7b
で接続している。
2. Description of the Related Art Conventionally, in a liquid crystal display element formed by bonding a pair of liquid crystal panel substrates with a slight gap therebetween and filling the gaps with liquid crystal, transparent electrode terminals 2 formed on the liquid crystal panel substrate 1 are used. When connecting the wiring terminals 4 of the drive circuit board 3, as shown in FIG. 7, a flexible connection board 5 having wiring electrodes 6 is interposed. Then, between one electrode terminal 6a of the wiring electrode 6 of the flexible connection substrate 5 and the transparent electrode terminal 2 of the liquid crystal panel substrate 1,
Between the other electrode terminal 6b of the wiring electrode 6 and the wiring terminal 4 of the drive circuit board 3, respectively, anisotropic conductive connectors 7a and 7b are provided.
Are connected with.

【0003】また、駆動用ICとしてTAB8を用いた
場合が図8に示され、これでは、フレキシブル接続基板
5の配線電極6の一方の電極端子6aを、液晶パネル基
板1の透明電極端子2に接続し、配線電極6の他方の電
極端子6bを、TAB8の出力電極端子に接続し、夫々
異方導電性コネクタ7a,7cを介在させている。TA
B8と、バスライン,電源ラインを配置したプリント基
板9とは、半田づけ10によって接続されている。
A case where a TAB 8 is used as a driving IC is shown in FIG. 8, in which one electrode terminal 6a of the wiring electrode 6 of the flexible connection substrate 5 is connected to the transparent electrode terminal 2 of the liquid crystal panel substrate 1. Then, the other electrode terminal 6b of the wiring electrode 6 is connected to the output electrode terminal of the TAB 8, and the anisotropic conductive connectors 7a and 7c are interposed therebetween. TA
B8 and the printed circuit board 9 on which the bus line and the power supply line are arranged are connected by soldering 10.

【0004】前述したように、液晶表示ユニットにおい
て、電極端子間の接続に多くの異方導電性コネクタが使
用されているのは、液晶パネル基板に形成された透明電
極(ITO)は半田ぬれ性が悪く、半田づけができず、
また、ポリマーフイルムの如き液晶パネル基板は半田づ
け温度に耐えることができないこと、表示容量の大きい
液晶パネル基板は電極ピッチが0.4mm以下と狭いこ
と、液晶パネル基板、駆動回路基板又はフレキシブル接
続基板の各電極は表面状態が平坦であり、電極同士を密
着させるだけでは信頼性が低いこと等の理由による。
As described above, in the liquid crystal display unit, many anisotropic conductive connectors are used to connect the electrode terminals because the transparent electrodes (ITO) formed on the liquid crystal panel substrate are solder wettable. Is bad, I can not solder,
Also, liquid crystal panel substrates such as polymer films cannot withstand soldering temperatures, liquid crystal panel substrates with a large display capacity have a narrow electrode pitch of 0.4 mm or less, liquid crystal panel substrates, drive circuit substrates or flexible connection substrates. The surface condition of each of the electrodes is flat, and the reliability is low only by bringing the electrodes into close contact with each other.

【0005】ところで、液晶パネル基板の電極端子とフ
レキシブル接続基板,駆動回路基板の電極端子との接続
部分に異方導電性コネクタが使用されると、接続に要す
る工程数が多くなる。すなわち、先ず、異方導電性コネ
クタを所定の長さに切断、次いで、フレキシブル接続基
板の一方の電極端子に異方導電性コネクタの仮圧着、フ
レキシブル接続基板の他方の電極端子に異方導電性コネ
クタの仮圧着、フレキシブル接続基板の一方の異方導電
性コネクタのセパレータの剥離、液晶パネル基板とフレ
キシブル接続基板との接続、フレキシブル接続基板の他
方の異方導電性コネクタのセパレータの剥離、駆動回路
基板とフレキシブル接続基板との接続の各工程を必要と
する。
By the way, if an anisotropic conductive connector is used at the connecting portion between the electrode terminals of the liquid crystal panel substrate and the electrode terminals of the flexible connection substrate and the drive circuit substrate, the number of steps required for the connection increases. That is, first, the anisotropic conductive connector is cut into a predetermined length, and then temporary compression of the anisotropic conductive connector is applied to one electrode terminal of the flexible connection board and anisotropic conductivity is applied to the other electrode terminal of the flexible connection board. Temporary crimping of connector, separation of one anisotropic conductive connector separator of flexible connection board, connection of liquid crystal panel substrate and flexible connection board, separation of other anisotropic conductive connector separator of flexible connection board, drive circuit Each step of connecting the board and the flexible connection board is required.

【0006】そして、異方導電性コネクタの価格が高い
こと、異方導電性コネクタの中にある導電性粒子は、液
晶パネル基板、フレキシブル接続基板、駆動回路基板の
各電極端子に対して半田づけのように合金を形成するも
のでなく、各電極端子の表面に点接触又は面接触により
導通を行っているため、接着剤、各基板の伸縮、変形等
により、信頼性が低下すること等の欠点も有している。
Further, the price of the anisotropic conductive connector is high, and the conductive particles in the anisotropic conductive connector are soldered to the electrode terminals of the liquid crystal panel substrate, the flexible connection substrate and the drive circuit substrate. Since it does not form an alloy like the above and conducts electricity by point contact or surface contact with the surface of each electrode terminal, the reliability may deteriorate due to the adhesive, expansion and contraction of each substrate, deformation, etc. It also has drawbacks.

【0007】[0007]

【発明が解決しようとする課題】本発明は、液晶パネル
基板とフレキシブル接続基板又は駆動用TABにおける
各電極端子の接続において、高価な異方導電性コネクタ
を使用することなく、工程数の少ない、接続の信頼性の
高い接続部を設けた液晶表示ユニットを提供することを
目的とするものである。
SUMMARY OF THE INVENTION The present invention has a small number of steps for connecting an electrode terminal in a liquid crystal panel substrate and a flexible connection substrate or a driving TAB without using an expensive anisotropic conductive connector. An object of the present invention is to provide a liquid crystal display unit provided with a connection portion with high connection reliability.

【0008】[0008]

【課題を解決するための手段】本発明は、前記目的を達
成するために、可撓性フイルムを液晶パネル基板とし、
該液晶パネル基板上に形成した透明電極端子と駆動回路
基板上に形成した配線端子とを接続するに際してフレキ
シブル接続基板を用いる液晶表示ユニットにおいて、前
記フレキシブル接続基板の電極接続端子表面に突起を形
成し、且つフレキシブル接続基板と液晶パネル基板又は
駆動回路基板との接続される各電極端子のいずれか一方
の表面に、絶縁性接着剤を塗布して接続することを特徴
とするものである。
In order to achieve the above object, the present invention uses a flexible film as a liquid crystal panel substrate,
In a liquid crystal display unit using a flexible connection substrate when connecting transparent electrode terminals formed on the liquid crystal panel substrate and wiring terminals formed on a drive circuit substrate, a projection is formed on the electrode connection terminal surface of the flexible connection substrate. In addition, an insulating adhesive is applied to the surface of either one of the electrode terminals connected to the flexible connection board and the liquid crystal panel board or the drive circuit board for connection.

【0009】また、本発明は、前記液晶表示ユニットに
おいて、液晶パネル基板及び駆動回路基板と接続される
フレキシブル接続基板には、液晶パネル基板及び駆動回
路基板に形成される電極数より1本以上多い電極を備
え、且つフレキシブル接続基板の電極接続端子表面に形
成した突起の配置が隣接する電極で異なることを特徴と
するものである。
According to the present invention, in the liquid crystal display unit, the flexible connection board connected to the liquid crystal panel board and the drive circuit board has one or more electrodes than the electrodes formed on the liquid crystal panel board and the drive circuit board. It is characterized in that the electrodes are provided, and the arrangement of the protrusions formed on the surface of the electrode connection terminal of the flexible connection substrate is different between the adjacent electrodes.

【0010】更に、本発明は、可撓性フイルムを液晶パ
ネル基板とし、該液晶パネル基板上に形成した透明電極
端子と駆動用TABの電極端子とを接続してなる液晶表
示ユニットにおいて、前記駆動用TABの電極端子表面
に突起を形成し、駆動用TABと液晶パネル基板との接
続される電極端子のいずれか一方の表面に、絶縁性接着
剤を接着して接続することを特徴とするものである。
Further, the present invention provides a liquid crystal display unit comprising a flexible film as a liquid crystal panel substrate, and a transparent electrode terminal formed on the liquid crystal panel substrate and an electrode terminal of a driving TAB are connected to each other. Characterized in that a protrusion is formed on the surface of the electrode terminal of the driving TAB, and an insulating adhesive is adhered to the surface of either one of the electrode terminals where the driving TAB and the liquid crystal panel substrate are connected. Is.

【0011】本発明は、前記突起は、フレキシブル接続
基板、または駆動用TABの電極端子を形成する工程中
に、突起を設ける工程が含まれており、この工程により
形成され、又は、フレキシブル接続基板、または駆動用
TABを単品にカットする工程中に、カットと同時に形
成されることを特徴とするものである。
The present invention includes the step of forming the protrusion in the step of forming the flexible connection board or the electrode terminal of the driving TAB, and is formed by this step, or the flexible connection board. Alternatively, it is formed simultaneously with the cutting during the step of cutting the driving TAB into individual pieces.

【0012】[0012]

【作用】本発明の構成により、液晶パネル基板とフレキ
シブル基板又は駆動用TABとを接続するに際して、フ
レキシブル基板又は駆動用TABの電極表面に突起を設
け、接続される電極表面の一方に接着剤を塗布して接合
するため、従来の異方導電性コネクタを用いて接合する
場合と比べて工程数の少なく、フレキシブル基板又は駆
動用TABの電極表面に化学的に形成された突起は液晶
パネル基板の透明電極に対して信頼性の高い、低い接続
抵抗を得ることができる。
According to the structure of the present invention, when connecting the liquid crystal panel substrate and the flexible substrate or the driving TAB, a protrusion is provided on the electrode surface of the flexible substrate or the driving TAB, and an adhesive is applied to one of the electrode surfaces to be connected. Since coating and bonding are performed, the number of steps is smaller than that in the case of bonding using a conventional anisotropically conductive connector, and the protrusions chemically formed on the electrode surface of the flexible substrate or the driving TAB are formed on the liquid crystal panel substrate. It is possible to obtain a highly reliable and low connection resistance for the transparent electrode.

【0013】そして、本発明では、フレキシブル基板の
電極数を液晶パネル基板の電極より多く形成し、隣接す
る電極上に形成した突起の位置をずらして配置したこと
により、リペア工程では、傷のない液晶パネル基板の電
極に対してフレキシブル基板の電極の突起が接触して導
通が得られる。
In the present invention, since the number of electrodes of the flexible substrate is larger than that of the liquid crystal panel substrate and the protrusions formed on the adjacent electrodes are displaced from each other, the repair process has no scratches. The projections of the electrodes of the flexible substrate come into contact with the electrodes of the liquid crystal panel substrate to obtain conduction.

【0014】[0014]

【実施例】液晶表示ユニットにおける電極端子の接続に
おいて、従来の異方導電性コネクタを使用した場合で
は、異方導電性コネクタに含まれる導電性粒子により電
気的接続を行い、同じく接着剤により物理的接続を得て
いるが、本発明では、電気的接続を接合される電極端子
のうちの一方の表面に突起部を形成し、且つ物理的接続
として絶縁性の接着剤を塗布することを特徴とする。
[Example] When a conventional anisotropically conductive connector is used for connection of electrode terminals in a liquid crystal display unit, electrical connection is made by conductive particles contained in the anisotropically conductive connector, and a physical adhesive is also used. However, in the present invention, a protrusion is formed on one surface of the electrode terminals to which the electrical connection is joined, and an insulating adhesive is applied as the physical connection. And

【0015】以下、本発明の実施例を図面に基づいて説
明する。電極端子の表面に突起部を形成する基板とし
て、従来技術で述べた図7又は図8に示された液晶パネ
ル基板と駆動回路基板又は液晶パネル基板とTABとの
間に設けられるフレキシブル基板について、図1により
説明する。フレキシブル基板11は、ポリイミド又はポ
リエステルの材料からなり、そのフレキシブル基板11
の表面には、厚み9〜35μmの銅材料によって電極1
2が構成されている。この点、公知の構成である。
Embodiments of the present invention will be described below with reference to the drawings. A flexible substrate provided between the liquid crystal panel substrate and the drive circuit substrate or the liquid crystal panel substrate and the TAB shown in FIG. 7 or FIG. This will be described with reference to FIG. The flexible substrate 11 is made of a material such as polyimide or polyester.
The surface of the electrode 1 is made of a copper material having a thickness of 9 to 35 μm.
2 are configured. This is a known configuration.

【0016】本発明において、電極12の表面は酸化防
止のために金メッキ或いは半田メッキ層13が施され
る。このメッキ13層の厚みは3μm程度の厚みとす
る。そして、このメッキ層13の表面に電極接続用の突
起を形成するために、電極12の硬さよりも硬い材料の
ステンレスからなり、表面に凹凸部14aを形成したプ
レス型14が電極12の表面を押圧する。このため、プ
レス型14の押圧により、電極12のメッキ層13に相
当する位置には、図2に示されるように、複数の突起1
5が形成される。
In the present invention, the surface of the electrode 12 is plated with gold or solder to prevent oxidation. The thickness of this 13-layer plating is about 3 μm. Then, in order to form protrusions for electrode connection on the surface of the plating layer 13, a press die 14 made of stainless steel, which is harder than the hardness of the electrode 12, and having a concavo-convex portion 14a formed on the surface of the electrode 12, Press. Therefore, as shown in FIG. 2, a plurality of protrusions 1 are formed at a position corresponding to the plating layer 13 of the electrode 12 by pressing the press die 14.
5 is formed.

【0017】その後、電極12の表面に突起15が形成
されたフレキシブル基板11の電極端子表面に、印刷等
の手段により接着剤16が図示のように塗布される。接
着剤16の塗布厚みはフレキシブル基板11の電極12
の厚みによって異なるが、35μmの銅電極の場合、突
起15を薄く被うように20〜30μmの塗布厚みとす
ることにより、良好な接着力が得られた。
After that, an adhesive 16 is applied to the surface of the electrode terminal of the flexible substrate 11 having the projections 15 formed on the surface of the electrode 12 by means of printing or the like as shown in the figure. The coating thickness of the adhesive 16 is the electrode 12 of the flexible substrate 11.
In the case of a copper electrode having a thickness of 35 μm, a good adhesion was obtained by setting the coating thickness of 20 to 30 μm so as to cover the protrusion 15 thinly, although it depends on the thickness of the electrode.

【0018】以上のようにして、電極12表面に突起1
5を形成し、更に接着剤16を塗布したフレキシブル基
板11の接続部と、図7の液晶パネル基板1の透明電極
2の電極端子とを熱圧着すると、フレキシブル基板11
の電極12に形成された突起15は、液晶パネル基板1
の透明電極2の電極端子に圧接される際に、突起15上
に薄く被っている接着剤16を排除しながら、透明電極
2の電極端子との電気的接続を得ることができる。そし
て、両電極12,2間に配置された接着剤16が硬化す
ることにより、物理的接続が得られる。
As described above, the projection 1 is formed on the surface of the electrode 12.
When the connection portion of the flexible substrate 11 on which 5 is formed and further the adhesive 16 is applied and the electrode terminal of the transparent electrode 2 of the liquid crystal panel substrate 1 of FIG.
The protrusions 15 formed on the electrodes 12 of the liquid crystal panel substrate 1
It is possible to obtain an electrical connection with the electrode terminal of the transparent electrode 2 while removing the adhesive 16 thinly coated on the protrusion 15 when being pressed against the electrode terminal of the transparent electrode 2. Then, the adhesive 16 disposed between the electrodes 12 and 2 is cured, whereby a physical connection is obtained.

【0019】本発明においては、異方導電性コネクタを
使用することなく、フレキシブル基板11の電極12の
表面に形成した突起15と、この電極12表面に塗布し
た接着剤16とによって、液晶パネル基板またはと駆動
回路基板とを接続することができる。
In the present invention, the liquid crystal panel substrate is formed by using the projection 15 formed on the surface of the electrode 12 of the flexible substrate 11 and the adhesive 16 applied on the surface of the electrode 12 without using an anisotropic conductive connector. Alternatively, the drive circuit board can be connected to or.

【0020】また、フレキシブル基板11の電極12表
面に設けられたメッキ層13で形成された突起15は、
フレキシブル基板11の電極材料である銅との密着性が
従来の異方導電性コネクタの場合と比べて、はるかに信
頼性が高く、且つ、異方導電性コネクタに比べて、低い
接続抵抗が得られるというメリットがある。
Further, the protrusion 15 formed of the plating layer 13 provided on the surface of the electrode 12 of the flexible substrate 11 is
The adhesiveness with the electrode material copper of the flexible substrate 11 is much more reliable than in the case of the conventional anisotropically conductive connector, and the connection resistance is lower than that of the anisotropically conductive connector. There is an advantage that

【0021】フレキシブル基板11の電極12表面に突
起を形成する手段としては、上記例の他、電極をマスク
して選択的にメッキを施す方法、電極をエッチングによ
って形成した後、再びエッチングによって突起を形成す
る方法、電極をマスクして選択的に蒸着,スプッタリン
グによって突起を形成する方法等を用いることが可能で
あり、格別な工程を必要としない。
As means for forming a protrusion on the surface of the electrode 12 of the flexible substrate 11, other than the above example, a method of selectively plating by masking the electrode, forming the electrode by etching, and then again forming the protrusion by etching. It is possible to use a forming method, a method of masking electrodes and selectively forming vapor deposition, a method of forming protrusions by spattering, or the like, and no special step is required.

【0022】また、一般にフレキシブル基板は200m
m□程度の大きさにシートから所定の大きさにカットし
て使用されている。このカット工程と同時に、フレキシ
ブル基板の電極表面に突起を形成することにより、突起
形成のための工程を必要としない。また、リールに巻か
れた駆動用TABを必要に応じてカットして使用する際
に、同時に電極表面に突起を形成することにより、特別
に工程を要しない。
Generally, the flexible substrate is 200 m
It is used after being cut from a sheet to a predetermined size in the size of m square. By forming the projections on the electrode surface of the flexible substrate at the same time as this cutting step, a step for forming the projections is not required. In addition, when the drive TAB wound on the reel is cut and used as needed, a protrusion is formed on the electrode surface at the same time, so that no special process is required.

【0023】リールに巻かれた長尺の駆動用TABをカ
ットするために、打ち抜き用の型を切断工具として使用
する場合において、カット工程と同時に電極表面に突起
を形成する手段について、図4〜図6により説明する。
図4は、切断工具である上型17,下型18と切断前の
駆動TAB19との配置関係を示し、上型17,下型1
8には、駆動TABのICチップ19aに負荷がかから
ないように、逃げの凹部17a,18aが形成されてい
る。
4 to 5 show means for forming projections on the electrode surface at the same time as the cutting step when a punching die is used as a cutting tool for cutting a long drive TAB wound on a reel. This will be described with reference to FIG.
FIG. 4 shows the positional relationship between the upper die 17 and the lower die 18 which are cutting tools and the drive TAB 19 before cutting.
Evacuation recesses 17a and 18a are formed in the IC 8 so that the IC chip 19a of the driving TAB is not loaded.

【0024】図4のA部を拡大した図5に明らかなよう
に、上型17には、切断用刃部17bが下型との間に2
μm以下のクリアランスを設定して配置されており、上
型の切断刃部17bの近傍には、電極19c表面に突起
を形成するための突起形成部17cが設けられている。
よって、この状態で下型18を駆動TABのベースフイ
ルム19b上に載置し、上型17を押し下げると、先
ず、上型17の刃部17bがベースフイルム19bを切
断し、更に上型17を押し下げるを、上型17の突起形
成部17cは駆動TABの電極19c上に押し付けら
れ、電極19cをプレスし、電極19c表面には、突起
が形成される。19dはレジスト膜である。
As is clear from FIG. 5, which is an enlarged view of the portion A in FIG. 4, the upper die 17 has a cutting blade portion 17b between the lower die and the cutting blade portion 17b.
The clearance is set to be not more than μm, and a protrusion forming portion 17c for forming a protrusion on the surface of the electrode 19c is provided in the vicinity of the upper cutting blade portion 17b.
Therefore, when the lower die 18 is placed on the base film 19b of the driving TAB in this state and the upper die 17 is pushed down, first, the blade portion 17b of the upper die 17 cuts the base film 19b, and the upper die 17 is further cut. When pushed down, the protrusion forming portion 17c of the upper mold 17 is pressed against the electrode 19c of the driving TAB to press the electrode 19c, and a protrusion is formed on the surface of the electrode 19c. 19d is a resist film.

【0025】上型の他の実施例として、図6に示すよう
に、上型20は、刃部20aと刃部20aの間にスプリ
ング20cによって支持された突起形成部20bとの二
つのブロックを組合せた構成からなる。この他、刃部と
突起形成部を夫々、別の型に形成してもよい。
As another embodiment of the upper die, as shown in FIG. 6, the upper die 20 has two blocks, a blade portion 20a and a projection forming portion 20b supported by a spring 20c between the blade portions 20a. It consists of a combination. In addition, the blade portion and the protrusion forming portion may be formed in different molds.

【0026】フレキシブル基板の電極表面に形成される
突起は、接続される電極ピッチが広い場合(≧0.5m
m)には導電ペースト等を印刷又はポッティング等の手
段によって形成してもよい。電極ピッチが狭い場合にお
いても、同様の手段により突起の形成が可能であるが、
導電ペーストが電極表面から流れ出すことにより、隣同
士の電極を短絡する場合を生じるため、ペースト粘度、
印刷/ポッティング条件等を慎重に選定する必要があ
る。
The protrusions formed on the electrode surface of the flexible substrate have a wide electrode pitch (≧ 0.5 m).
A conductive paste or the like may be formed in m) by means such as printing or potting. Even if the electrode pitch is narrow, it is possible to form protrusions by the same means,
When the conductive paste flows out from the electrode surface, it may cause a short circuit between adjacent electrodes.
It is necessary to select printing / potting conditions carefully.

【0027】液晶パネル基板の材料として、ポリマーフ
イルムを使用した場合、電極接続部を接続した後、検査
工程において接続不良と判断されると、前記電極接続部
は剥離され、再接続を行うリペア工程に移行する際、液
晶パネル基板側の透明電極表面にうち、従来の異方導電
性コネクタによる導電性粒子と接触した部分は破壊され
る欠点がある。この点、異方導電性コネクタを使用しな
い本発明の場合も、フレキシブル基板の電極表面の突起
によって、液晶パネル基板側の透明電極表面の一部が破
壊されることは、同様であるが、本発明では、次のよう
に再接続の際、破壊された透明電極表面はフレキシブル
基板の電極表面の突起と接続しない。
When a polymer film is used as the material of the liquid crystal panel substrate, after connecting the electrode connecting portions, if it is judged that the connection is defective in the inspection step, the electrode connecting portions are peeled off and the reconnecting step is performed. There is a drawback in that, when shifting to, the part of the transparent electrode surface on the liquid crystal panel substrate side, which is in contact with the conductive particles by the conventional anisotropic conductive connector, is destroyed. In this respect, even in the case of the present invention which does not use the anisotropic conductive connector, the protrusion of the electrode surface of the flexible substrate causes a part of the transparent electrode surface on the liquid crystal panel substrate side to be destroyed. According to the invention, the broken transparent electrode surface is not connected to the projection on the electrode surface of the flexible substrate during reconnection as described below.

【0028】すなわち、本発明では、フレキシブル基板
の電極数を本来必要な電極の数よりも多く設け、更に、
隣接する電極12a,12b,12cの表面に形成され
る突起15a1 ,15a2 と突起15b1 ,15b2
配置を、図3に示すように異ならしめ、このため、再接
続を行うリペア工程の前後において、液晶パネル基板側
の透明電極に対して、フレキシブル基板の電極を1本分
ずらして接続することにより、液晶パネル基板側の透明
電極の破壊に伴う接続不良を解消している。
That is, in the present invention, the number of electrodes on the flexible substrate is set to be larger than the number of electrodes originally required, and further,
The projections 15a 1 and 15a 2 and the projections 15b 1 and 15b 2 formed on the surfaces of the adjacent electrodes 12a, 12b and 12c are arranged differently as shown in FIG. By connecting the transparent electrode on the liquid crystal panel substrate side to the transparent electrode on the liquid crystal panel substrate side by shifting one electrode, the defective connection due to the breakage of the transparent electrode on the liquid crystal panel substrate side is eliminated.

【0029】フレキシブル基板の電極の突起と液晶パネ
ル基板側の透明電極とが一旦接触した後、再接続のため
分離し、接触した液晶パネル基板側の透明電極の部分が
破壊されても、リペア工程後では、その透明電極に対し
て、突起の位置を異にする隣接のフレキシブル基板の電
極が対応するため、フレキシブル基板の電極の突起は必
ず破壊されていない透明電極の表面と接触し、確実な導
通を得ることができる。
After the protrusion of the electrode of the flexible substrate and the transparent electrode on the liquid crystal panel substrate side once contact, they are separated for reconnection, and even if the contacted transparent electrode portion on the liquid crystal panel substrate side is destroyed, the repair step After that, since the electrodes of the adjacent flexible substrate with different positions of the protrusions correspond to the transparent electrodes, the protrusions of the electrodes of the flexible substrate always contact the surface of the transparent electrode that has not been destroyed, and ensure the Continuity can be obtained.

【0030】前記実施例において、液晶パネル基板とフ
レキシブル基板との接続に関して説明したが、図5に示
すような駆動用TABを、直接液晶パネル基板に接続す
る際に、駆動用TABの電極表面に同様な突起を形成
し、しかる後、該電極表面に接着剤を塗布して、液晶パ
ネル基板の透明電極端子と接続すること可能であり、こ
の場合も、異方導電性コネクタを使用した場合に比較し
て、信頼性の高い接続が得られ、はるかに低い接続抵抗
を得ることができる。
In the above embodiments, the connection between the liquid crystal panel substrate and the flexible substrate has been described. However, when the driving TAB as shown in FIG. 5 is directly connected to the liquid crystal panel substrate, the electrode surface of the driving TAB is directly connected. It is possible to form a similar protrusion, and then apply an adhesive to the surface of the electrode to connect it to the transparent electrode terminal of the liquid crystal panel substrate. In this case as well, when an anisotropic conductive connector is used, In comparison, a reliable connection can be obtained and a much lower connection resistance can be obtained.

【0031】[0031]

【発明の効果】本発明の構成により、フレキシブル基板
又は駆動用TABの電極表面に突起を形成し、その接続
される電極表面に接着剤を塗布して、液晶パネル基板の
透明電極と接合するため、従来の異方導電性コネクタを
用いて接合する場合と比べて工程数の少なく、フレキシ
ブル基板又は駆動用TABの電極表面に化学的に形成さ
れた突起は液晶パネル基板の透明電極に対して信頼性の
高い、低い接続抵抗を得ることができる効果を有し、更
に、リペア接続に際して、前記突起の位置が隣接する電
極表面において異なることにより、分離された液晶パネ
ル基板の透明電極の傷のない部分と前記突起は接続し、
確実な接続を可能とする効果を有する。
According to the structure of the present invention, a protrusion is formed on the electrode surface of a flexible substrate or a driving TAB, and an adhesive is applied to the electrode surface to be connected to bond the transparent electrode of the liquid crystal panel substrate. The number of steps is smaller than that in the case of joining using a conventional anisotropically conductive connector, and the protrusion chemically formed on the electrode surface of the flexible substrate or the driving TAB is reliable for the transparent electrode of the liquid crystal panel substrate. It has the effect of being able to obtain a high connection resistance and low connection resistance, and further, in the repair connection, since the positions of the protrusions are different on the adjacent electrode surfaces, there is no scratch on the transparent electrode of the separated liquid crystal panel substrate. The part and the protrusion are connected,
It has the effect of enabling reliable connection.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例であり、フレキシブル基板の電
極表面に突起を形成する前の状態を示す概略断面図であ
る。
FIG. 1 is a schematic cross-sectional view showing a state before forming a protrusion on an electrode surface of a flexible substrate, which is an embodiment of the present invention.

【図2】図1において電極表面に突起を形成されたフレ
キシブル基板であり、そのフレキシブル基板の電極部分
に接着剤を塗布した状態を示す概略断面図である。
FIG. 2 is a schematic cross-sectional view showing a flexible substrate in which protrusions are formed on the electrode surface in FIG. 1, and a state in which an adhesive is applied to the electrode portion of the flexible substrate.

【図3】本発明のフレキシブル基板の電極表面に形成さ
れた突起の位置が隣接する電極の間で相違することを示
す説明図である。
FIG. 3 is an explanatory view showing that the positions of the protrusions formed on the electrode surface of the flexible substrate of the present invention are different between the adjacent electrodes.

【図4】駆動用TABの電極表面に形成する突起を切断
と同時に行う構成についてに概略図である。
FIG. 4 is a schematic view of a configuration in which a projection formed on an electrode surface of a driving TAB is formed at the same time as cutting.

【図5】図4のA部拡大図である。5 is an enlarged view of part A in FIG.

【図6】刃部と突起形成部とを設けた上型の他の実施例
を示す概略断面図である。
FIG. 6 is a schematic cross-sectional view showing another embodiment of the upper die provided with a blade portion and a protrusion forming portion.

【図7】従来の異方導電性コネクタを用いて、パネル基
板と駆動回路基板とをフレキシブル基板で接続した状態
を示す概略側面図である。
FIG. 7 is a schematic side view showing a state in which a panel substrate and a drive circuit substrate are connected by a flexible substrate using a conventional anisotropic conductive connector.

【図8】従来の異方導電性コネクタを用いて、パネル基
板と駆動用TABとをフレキシブル基板で接続した状態
を示す概略側面図である。
FIG. 8 is a schematic side view showing a state in which a panel substrate and a driving TAB are connected by a flexible substrate using a conventional anisotropically conductive connector.

【符号の説明】[Explanation of symbols]

1 液晶パネル基板 2 透明電極端子 3 駆動回路基板 4 配線端子 8 TAB 9 プリント基板 10 半田づけ 11 フレキシブル基板 12 フレキシブル基板に形成された電極 13 メッキ層 14 プレス型 14a 凹凸部 15 突起部 16 接着剤 DESCRIPTION OF SYMBOLS 1 Liquid crystal panel substrate 2 Transparent electrode terminal 3 Drive circuit board 4 Wiring terminal 8 TAB 9 Printed circuit board 10 Soldering 11 Flexible substrate 12 Electrode formed on flexible substrate 13 Plating layer 14 Press mold 14a Concavo-convex portion 15 Protrusion 16 Adhesive

フロントページの続き (72)発明者 板垣 雅訓 東京都大田区中馬込1丁目3番6号 株式 会社リコー内 (72)発明者 高橋 久雄 東京都大田区中馬込1丁目3番6号 株式 会社リコー内 (72)発明者 藤村 浩 東京都大田区中馬込1丁目3番6号 株式 会社リコー内 (72)発明者 坂寄 寛幸 東京都大田区中馬込1丁目3番6号 株式 会社リコー内Front Page Continuation (72) Inventor Masanori Itagaki 1-3-6 Nakamagome, Ota-ku, Tokyo Within Ricoh Co., Ltd. (72) In-house Hisao Takahashi 1-3-6 Nakamagome, Ota-ku, Tokyo Ricoh Co., Ltd. (72) Inventor Hiroshi Fujimura 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd. (72) In-house Hiroyuki Sakayose 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 可撓性フイルムを液晶パネル基板とし、
該液晶パネル基板上に形成した透明電極端子と駆動回路
基板上に形成した配線端子とを接続するに際してフレキ
シブル接続基板を用いる液晶表示ユニットにおいて、前
記フレキシブル接続基板の電極接続端子表面に突起を形
成し、且つフレキシブル接続基板と液晶パネル基板又は
駆動回路基板との接続される各電極端子のいずれか一方
の表面に、絶縁性接着剤を塗布して接続することを特徴
とする液晶表示ユニット。
1. A flexible film as a liquid crystal panel substrate,
In a liquid crystal display unit using a flexible connection substrate when connecting transparent electrode terminals formed on the liquid crystal panel substrate and wiring terminals formed on a drive circuit substrate, a projection is formed on the electrode connection terminal surface of the flexible connection substrate. A liquid crystal display unit, characterized in that an insulating adhesive is applied to the surface of either one of the electrode terminals connected to the flexible connection board and the liquid crystal panel board or the drive circuit board for connection.
【請求項2】 液晶パネル基板及び駆動回路基板と接続
されるフレキシブル接続基板には、液晶パネル基板及び
駆動回路基板に形成される電極数より1本以上多い電極
を備え、且つフレキシブル接続基板の電極接続端子表面
に形成した突起の配置が隣接する電極で異なることを特
徴とする請求項1記載の液晶表示ユニット。
2. The flexible connection board connected to the liquid crystal panel board and the drive circuit board includes one or more electrodes more than the number of electrodes formed on the liquid crystal panel board and the drive circuit board, and the electrodes of the flexible connection board. The liquid crystal display unit according to claim 1, wherein the arrangement of the protrusions formed on the surface of the connection terminal is different between adjacent electrodes.
【請求項3】 可撓性フイルムを液晶パネル基板とし、
該液晶パネル基板上に形成した透明電極端子と駆動用T
ABの電極端子とを接続してなる液晶表示ユニットにお
いて、前記駆動用TABの電極端子表面に突起を形成
し、駆動用TABと液晶パネル基板との接続される電極
端子のいずれか一方の表面に、絶縁性接着剤を接着して
接続することを特徴とする液晶表示ユニット。
3. A flexible film as a liquid crystal panel substrate,
A transparent electrode terminal and a driving T formed on the liquid crystal panel substrate.
In a liquid crystal display unit formed by connecting the electrode terminals of AB, a protrusion is formed on the surface of the electrode terminals of the driving TAB, and the surface of one of the electrode terminals connected to the driving TAB and the liquid crystal panel substrate is formed. A liquid crystal display unit, characterized in that an insulating adhesive is adhered for connection.
【請求項4】 液晶パネル基板に接続されるフレキシブ
ル接続基板、または駆動用TABの電極端子表面に形成
する突起は、フレキシブル接続基板、または駆動用TA
Bの電極端子を形成する工程中に、突起を設ける工程が
含まれており、この工程により形成されることを特徴と
する電極突起形成方法。
4. A flexible connection substrate connected to a liquid crystal panel substrate, or a protrusion formed on a surface of an electrode terminal of a driving TAB is a flexible connection substrate or a driving TA.
A method of forming an electrode projection, characterized in that the step of forming a projection is included in the step of forming the electrode terminal B, and the step is provided by this step.
【請求項5】 液晶パネル基板に接続されるフレキシブ
ル接続基板、または駆動用TABの電極端子表面に形成
する突起は、フレキシブル接続基板、または駆動用TA
Bを単品にカットする工程中に、カットと同時に形成さ
れることを特徴とする電極突起形成方法。
5. The flexible connection substrate connected to the liquid crystal panel substrate, or the protrusion formed on the surface of the electrode terminal of the driving TAB is the flexible connection substrate or the driving TA.
An electrode projection forming method, which is formed simultaneously with the cutting during the step of cutting B into a single piece.
JP30168591A 1991-11-18 1991-11-18 Liquid crystal display unit and formation of electrode projection Withdrawn JPH05142555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30168591A JPH05142555A (en) 1991-11-18 1991-11-18 Liquid crystal display unit and formation of electrode projection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30168591A JPH05142555A (en) 1991-11-18 1991-11-18 Liquid crystal display unit and formation of electrode projection

Publications (1)

Publication Number Publication Date
JPH05142555A true JPH05142555A (en) 1993-06-11

Family

ID=17899909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30168591A Withdrawn JPH05142555A (en) 1991-11-18 1991-11-18 Liquid crystal display unit and formation of electrode projection

Country Status (1)

Country Link
JP (1) JPH05142555A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010095014A (en) * 2000-03-31 2001-11-03 카나야 오사무 Multi-layer display panel, method of manufacturing the same, holding device, pressure-bonding jig and driver element mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010095014A (en) * 2000-03-31 2001-11-03 카나야 오사무 Multi-layer display panel, method of manufacturing the same, holding device, pressure-bonding jig and driver element mounting method

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