JP3058266B2 - Semiconductor integrated circuit device and semiconductor bare chip mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device and a method for mounting the same on a semiconductor bare chip, and more particularly to a heat dissipation structure for a flip-chip mounted semiconductor bare chip.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor integrated circuit device of this kind, a wiring pattern 102 is formed on a substrate 101 as shown in FIG. The semiconductor bare chip 103 is formed by connecting a bump 104 formed on an electrode on a circuit surface to a wiring pattern 1.
02 for electrical connection (flip chip mounting).

The semiconductor bare chip 103 is sealed with a resin 106 to protect a circuit surface. that time,
By mounting the heat radiating material 105 on the back surface of the semiconductor bare chip 103 via the adhesive 107, the heat radiating property is improved.

There is also a connection method (wire bonding method) in which the back surface of a semiconductor bare chip is mounted on a lead frame and wires are bonded from electrodes on the circuit surface of the semiconductor bare chip. This connection method is described in
267500.

[0005] That is, in this connection method, as shown in FIG.
, And the lead frame 113 is
1 is fixed by a fixing pin 114.

The back surfaces of the semiconductor bear chips 115 are fixed to islands (not shown) provided on the lead frame 113 on the insulator 112 with a conductive adhesive or solder (not shown). It is bonded to the lead frame 113, and is sealed with an epoxy resin or a mold resin 117 or the like. The heat generated in the semiconductor bare chip 115 is guided to the heat radiating material 111 via the lead frame 113.

[0007]

In the above-described conventional semiconductor integrated circuit device, when a plurality of semiconductor bare chips are mounted on a substrate and the same heat dissipating material is mounted thereon, the warp and bump height of the substrate, the semiconductor bare chip, Due to the difference in the thickness of the semiconductor bare chip, a step occurs between the mounted semiconductor bare chips, and as a result, the heat radiating material is inclined by a gap formed between the heat radiating material and the semiconductor bare chip. .

Further, when a heat radiating material is mounted on a plurality of semiconductor bare chips, a resin and an adhesive are supplied to each semiconductor bare chip, so that the number of production steps increases, and the production takes time. Further, when a wire bonding method is used as in the connection method described in the above publication, the high-frequency signal characteristics are deteriorated by the wires.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and to perform resin sealing and mounting of a heat radiating material on a plurality of flip-chip mounted semiconductor bare chips at once, which is favorable in flip chip mounting. It is an object of the present invention to provide a semiconductor integrated circuit device capable of obtaining excellent heat dissipation and a method for mounting the semiconductor bare chip.

[0010]

A semiconductor integrated circuit device according to the present invention is a semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on a substrate. The semiconductor integrated circuit device accommodates the substrate and is made of a material having good thermal conductivity. A case, a resin previously supplied into the case, and a hole provided in the case and through which excess resin flows out to the outside when the substrate is accommodated in the case. A circuit back surface of the semiconductor bare chip mounted on one side and the case are fixed with the resin.

Another semiconductor integrated circuit device according to the present invention comprises:
A semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on both sides of a substrate, wherein a case containing the substrate and made of a material having good thermal conductivity, and a first pre-supplied inside the case. A first resin disposed in the case and configured to allow excess resin of the first resin to flow out of the first resin when the substrate is accommodated in the case;
Holes, a second resin supplied on the substrate housed in the case, a radiator pressed from above the second resin, and at least one of the radiator and the case. A second hole provided for allowing excess resin out of the second resin to flow out when the heat dissipating material is pressed, and a circuit of the semiconductor bare chip mounted on both surfaces of the substrate. The back surface, the case, and the heat dissipating material are fixed with the first and second resins.

A semiconductor bare chip mounting method according to the present invention is a semiconductor bare chip mounting method for a semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on a substrate, wherein a resin is previously placed in a case made of a material having good thermal conductivity. Supplying the resin, pressing the substrate onto the resin supplied into the case with a pressing jig, and removing excess resin from a hole provided in the case when the substrate is pressed into the case. And a step of wiping the resin that has flowed out from the hole to the outside, wherein the circuit back surface of the semiconductor bare chip mounted on one side of the substrate and the case are fixed with the resin. .

Another method for mounting a semiconductor bare chip according to the present invention is a method for mounting a semiconductor bare chip on a semiconductor integrated circuit device in which semiconductor bare chips are flip-chip mounted on both sides of a substrate, respectively. First supplying a first resin into the case, storing the substrate on the first resin supplied into the case, and placing a second resin on the substrate housed in the case. Supplying a resin; pressing a heat radiating material from above the second resin; and
Draining excess resin to the outside through a second hole provided in at least one of the heat radiating material and the case when the resin is pressed onto the resin, and removing the resin flowing out from the first and second holes to the outside. Wiping, and the circuit back surface of the semiconductor bare chip mounted on both surfaces of the substrate, the case, and the heat radiating material are fixed with the first and second resins.

That is, the method for mounting a semiconductor bare chip of the present invention is a method for sealing a plurality of flip-chip mounted semiconductor bare chips at a time and dissipating heat generated on the circuit surface of the semiconductor bare chip to the outside. It has a case made of conductive heat dissipation material.

More specifically, an electrically insulating resin for sealing is supplied to the inside of the case, and the semiconductor bare chip mounted on the substrate is sealed with the supplied resin at the shortest distance, thereby forming a semiconductor bare chip. There is a case in which the heat generated on the circuit surface is improved in radiating heat to the outside.

According to the semiconductor bare chip mounting method of the present invention,
Inject resin into the case, drop the surface of the board on which the semiconductor bare chip is mounted into the case, push the board with a pushing jig, and allow excess resin to flow out of the hole provided in the case to the board, The tallest semiconductor bear chip when mounted is sealed at the bottom of the case.

The heat generated on the circuit surface of the semiconductor bear chip is
The heat is radiated from the back surface of the semiconductor bear chip to the case directly or through the resin. For this reason, good heat dissipation can be obtained.

[0018]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a substrate sealing step according to one embodiment of the present invention. FIG. 1A is a diagram illustrating a state before sealing a substrate according to an embodiment of the present invention, and FIG. 1B is a diagram illustrating a sealing state of the substrate according to an embodiment of the present invention.

In FIG. 1, a substrate 1 has a wiring pattern 2
Are formed, and the semiconductor bare chip 3 is electrically connected to the wiring pattern 2 via bumps 4 formed on the electrodes on the circuit surface of the semiconductor bare chip 3.

When mounting components 7 other than the semiconductor bare chip 3 are mounted, components whose mounting height is higher than the mounting height of the semiconductor bare chip 3 and components that need to be adjusted such as a variable resistor are mounted on a substrate. The semiconductor bare chip 3 is mounted on a surface opposite to the surface on which the semiconductor bare chip 3 is mounted. The mounting component 7 that is lower than the mounting height of the semiconductor bare chip 3 and does not require adjustment may be mounted on either surface.

The case 5 is made of a material having good heat conductivity, and an electrically insulating resin 8 is injected into the case 5. The surface of the substrate 1 on which the semiconductor bare chip 3 is mounted is the resin 8
Put soaked in.

The pushing jig 9 is for pushing the tallest semiconductor bare chip 3a to the bottom of the case 5, and is removed after the pushing is completed. The hole 6 provided in the case 5 has a function of allowing the excess resin 13 to flow out to the outside when the substrate 1 is pressed by the pressing jig 9. The excess resin 13 flowing out of the hole 6 is wiped. Taken.

The substrate 1 has glass epoxy, polyimide,
All materials generally used for electronic circuit boards, such as resin-based materials such as Teflon, glass ceramic, and alumina, can be applied.

The wiring pattern 2 is a conductive material that can be manufactured according to the type of the substrate 1.
Any material can be used as long as it can be connected to the bump 4 formed on the upper electrode. For example, for a glass epoxy substrate, a commonly used copper, for an alumina substrate, a material capable of printing a thick film such as silver or silver-palladium, or a material capable of depositing a thin film such as nickel or copper. I just need. In addition, those that have been subjected to a surface treatment such as gold plating to improve the assemblability are also included.

The bump 4 is made of a metal generally used for flip chip mounting, such as gold, aluminum, solder, or the like.
Alloys are applicable. Case 5 contains aluminum, copper, or copper.
A good heat conductive metal such as tungsten or a good heat conductive ceramic material such as aluminum nitride can be used.

FIG. 2 is a sectional view showing a state during sealing of the substrate 1 according to one embodiment of the present invention, and FIG. 3 is a sectional view showing a heat radiation path in one embodiment of the present invention. These FIGS.
The sealing of the substrate 1 according to one embodiment of the present invention will be described in detail with reference to FIG.

Referring to FIG. 2, the substrate 1 is 40 mm square,
A glass epoxy substrate having a thickness of 1 mm and a warp of the substrate 1 of 300 μm is used, and the wiring pattern 2 is made of copper plated with gold on the surface. Each of the semiconductor bare chips 3a to 3c has a shape of 5 mm square and a thickness of 400 μm, and the bumps 4 formed on the electrodes of the semiconductor bare chips 3a to 3c have a height of 50 mm.
The wiring pattern 2 on the substrate 1 is connected to the wiring pattern 2 with gold of μm under the influence of the warpage of the substrate 1.

The semiconductor bare chips 3b and 3c are each 10 times larger than the semiconductor bare chip 3a due to the warp of the substrate 1.
The mounting height is 0 μm and 200 μm lower. Substrate 1
0.4m height on the surface on which the semiconductor bare chip 3 is mounted
The chip resistor or the like, which is a mounting component 7 m, is mounted on the surface on which the semiconductor bare chip 3 is not mounted.
Is mounted.

The case 5 is made of aluminum and is 0.1 mm from the bottom.
A hole 6 having a diameter of 0.6 mm is formed on 8 mm. The resin 8 is an epoxy resin and is injected in advance to the position of the hole 6 of the case 5. The semiconductor bare chip 3 a on the surface of the substrate 1 in which the semiconductor bare chip 3 is mounted is pressed against the bottom surface of the case 5. When this is done, excess resin 13 flows out of the hole 6 to the outside.

Referring to FIG. 3, when power is supplied to the semiconductor bare chip 3, heat is generated on the circuit surface of the semiconductor bare chip 3. In this mounting method, case 5
By flowing excess resin to the outside from the holes 6 provided in the semiconductor device, the amount of resin between the semiconductor bare chip 3 and the case 5 and the inclination of the heat radiating material due to the step between the semiconductor bare chips 3 can be suppressed.

The heat is transferred not only from the semiconductor bare chip 3 to the substrate 1 via the gold bumps 4 through the same route as in the conventional method (11 in the drawing), but also as a case 5 serving as a heat radiating material.
Efficiently or directly through the resin 8,
In other words, the heat is transmitted from the semiconductor bare chip 3 to the aluminum case 5 via the epoxy resin 8 (12 in the drawing), so that the heat radiation from the semiconductor bare chip 3 can be improved. Therefore, the semiconductor bare chip 3
Can be operated stably.

Next, another embodiment of the present invention will be described with reference to FIG. The dimensions of the semiconductor bear chip 3 are not constant, and can correspond to any dimensions. The number of semiconductor bare chips 3 is not fixed, and any number of semiconductor bare chips 3 may be mounted.

The bumps 4 may be made of a metal or alloy generally used for flip chip mounting, such as solder. The substrate 1 is made of a resin material such as polyimide or Teflon,
All materials generally used for electronic circuit boards, such as glass ceramic and alumina, may be used. Case 5
The material is a metal with good thermal conductivity such as copper or copper-tungsten,
Alternatively, a ceramic material having good thermal conductivity such as aluminum nitride can be used.

Further, the case 5 may have a plurality of holes 6 provided therein, and the dimensions are not constant. The installation position of the hole 6 may be any position as long as it is below the position of the mounting surface of the semiconductor bare chip 3 of the substrate 1 after the substrate 1 is pressed against the bottom surface of the case 5. For example, it may be provided on the bottom surface of the case 5.

FIG. 4 is a sectional view showing a sealed state of the substrate 1 according to another embodiment of the present invention. In the drawing, another embodiment of the present invention has the same configuration as the embodiment of the present invention shown in FIG. 1 except that a heat radiating material 10 is further attached to the case 5, and the same components are denoted by the same reference numerals. It is attached.

The heat dissipating material 10 attached to the case 5 is made of aluminum, so that the heat dissipating property can be further improved. The replacement of each component in another embodiment of the present invention can be the same as that performed for one embodiment of the present invention. The material of the heat radiating material 10 may be a good heat conductive metal such as copper or copper-tungsten, or a good heat conductive ceramic material such as aluminum nitride.

FIG. 5 is a sectional view showing a sealed state of the substrate 1 according to another embodiment of the present invention. In the figure, in another embodiment of the present invention, the semiconductor bare chip 3 of the substrate 1 on the case 5 is shown.
The configuration is the same as that of the embodiment of the present invention shown in FIG. 1 except that the convex portion 14 is provided at a position corresponding to the position where is mounted, and the same components are denoted by the same reference numerals.

The protruding portions 14 are provided on the case 5 at positions corresponding to the semiconductor bare chips 3b and 3c other than the tallest semiconductor bare chip 3a on the substrate 1. As a result, the heat dissipation can be improved in another embodiment of the present invention.

The replacement of each component in another embodiment of the present invention can be the same as that performed for one embodiment of the present invention. Further, instead of the convex portion 14 provided on the case 5, the tall semiconductor bare chip 3 is used.
The portions corresponding to a and 3b may be recessed.

FIG. 6 is a sectional view showing a sealed state of a substrate 1 according to still another embodiment of the present invention. In the drawing, a semiconductor bare chip 3 is provided on both sides of a substrate 1, that is, the substrate 1
The semiconductor bare chips 3a, 3b and 3c are mounted on one surface of the substrate, and the semiconductor bare chip 3d is mounted on the other surface.

The case 5 is provided with holes 6 and 16 above and below the position of the substrate 1 after the substrate 1 is pushed. Substrate 1
One surface is pressed against the bottom surface of the case 5 and sealed in the same manner as in the other embodiments, and then the resin 8 is injected into the other surface. Aluminum heat dissipation material 1 from the top of substrate 1
5 is attached so as to be pressed against the semiconductor bare chip 3 d on the substrate 1. At this time, the excess resin 13 is
It flows out more and is wiped off.

Accordingly, it is possible to cope with the case where the semiconductor bare chips 3 are mounted on both surfaces of the substrate 1, and it is possible to obtain efficient heat radiation.

It should be noted that the replacement of each component in still another embodiment of the present invention can be the same as that performed for one embodiment of the present invention. The material of the heat radiating material 15 may be a good heat conductive metal such as copper or copper-tungsten, or a good heat conductive ceramic type material such as aluminum nitride.

The hole 16 is provided on the heat radiating material 1 instead of the case 5.
5 may be provided. Further, both surfaces of the substrate 1 may be simultaneously sealed. That is, one surface of the substrate 1 is dropped into the case 5 into which the resin 8 is injected, and before the substrate 1 is pressed, the resin 8 is injected onto the other surface, and the two surfaces are simultaneously sealed by pressing with the heat radiating material 15. You may stop. Further, similarly to another embodiment of the present invention, a convex portion or a concave portion is provided at the position of the case 5 and the heat radiating material 15 corresponding to the portion of the substrate 1 where the semiconductor bare chip 3 is mounted, so that the heat transfer path can be further improved. Shortening is also possible.

As described above, the sealing electric insulating resin 8 is supplied inside, and the semiconductor bare chip 3 mounted on the substrate 1 is supplied.
By sealing a to 3c with the resin 8 in the case 5 at the shortest distance, the case 5 in which the heat generated on the circuit surfaces of the semiconductor bare chips 3a to 3c to the outside is improved.

That is, the resin 8 is injected into the case 5, the surface of the substrate 1 on which the semiconductor bare chips 3 a to 3 c are mounted is dropped into the case 5, and the pushing jig 9 pushes the substrate 1 to remove the excess resin 13. By flowing out through the holes 6 and 16 provided in the substrate 5, the tallest semiconductor bear chip 3 a when mounted on the substrate 1 is
Is sealed at the bottom surface.

The heat generated on the circuit surfaces of the semiconductor bear chips 3a to 3c is radiated from the back surfaces of the semiconductor bear chips 3a to 3c directly or through the resin 8 to the case 5.
For this reason, good heat dissipation can be obtained.

As described above, the resin 8 is injected into the case 5 in advance, and when the substrate 1 is dropped,
Is allowed to flow out of the holes 6 and 16 provided in the case, so that the sealing of the semiconductor bare chips 3a to 3d and the attachment of the heat radiating material (the case 5 and the heat radiating material 15) are collectively performed with an appropriate amount of resin. Productivity can be improved.

Further, the heat dissipating material is made into a case type, and the mounting side of the substrate 1 on which the semiconductor bare chips 3a to 3c are mounted is dropped into the case 5 and pressed, whereby the semiconductor bare chip 3a is pressed.
3c and the heat radiating material can be minimized, so that good heat radiating properties can be obtained.

[0050]

As described above, according to the present invention, in a semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on a substrate, the substrate is housed in a case made of a material having good thermal conductivity. Resin is supplied, and excess resin flows out of the holes provided in the case when the board is accommodated in the case, and the circuit and the case of the semiconductor bare chip mounted on one side of the board are separated from the case. In this way, the plurality of semiconductor bare chips on which flip-chip mounting has been performed can be collectively sealed with a resin and a heat radiating material can be attached, and good heat radiation can be obtained in flip-chip mounting. .

[Brief description of the drawings]

FIG. 1A is a diagram illustrating a state before sealing a substrate according to an embodiment of the present invention, and FIG. 1B is a diagram illustrating a sealing state of the substrate according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state during sealing of a substrate according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a heat radiation path in one embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a sealed state of a substrate according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a sealed state of a substrate according to another embodiment of the present invention.

FIG. 6 is a sectional view showing a sealed state of a substrate according to still another embodiment of the present invention.

FIG. 7 is a sectional view showing a sealed state of a substrate according to a conventional example.

FIG. 8A is a cross-sectional view of a conventional example through a resin, FIG. 8B is a cross-sectional view of FIG.
FIG. 3C is a cross-sectional view taken along line YY in FIG.

[Description of Signs] 1 Substrate 2 Wiring pattern 3a-3d Semiconductor bare chip 4 Bump 5 Case 6,16 hole 7 Mounting part 8 Resin 9 Push-in jig 10,15 Heat radiating material 11,12 Heat radiating path 13 Extra resin 14 Convex part

Claims (10)

(57) [Claims] 1. A semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on a substrate, the case containing the substrate and made of a material having good thermal conductivity, and a resin previously supplied into the case. A circuit back surface of the semiconductor bare chip mounted on one surface of the substrate, the hole being provided in the case and allowing excess resin to flow out when the substrate is accommodated in the case. And the case is fixed with the resin. 2. The case according to claim 1, wherein the case includes at least one of a convex portion and a concave portion provided in advance on a bottom surface to which the resin is supplied according to a mounting height of the semiconductor bare chip. 13. The semiconductor integrated circuit device according to claim 1. 3. The semiconductor device according to claim 1, further comprising a heat radiating member fixed to an outer periphery of said case so as to face a circuit back surface of said semiconductor bare chip and radiating heat generated by said semiconductor bare chip. 13. The semiconductor integrated circuit device according to claim 1. 4. A semiconductor integrated circuit device in which semiconductor bare chips are flip-chip mounted on both sides of a substrate, wherein the case accommodates the substrate and is made of a material having good thermal conductivity, and is supplied in advance to the case. A first resin disposed in the case, and a first hole for allowing excess resin of the first resin to flow out to the outside when the substrate is accommodated in the case, A second resin supplied on the substrate housed in the case, a heat dissipating material pressed from above the second resin, and disposed on at least one of the heat dissipating material and the case; A second hole for letting excess resin out of the second resin flow out when the heat dissipating material is pressed, a circuit back surface of the semiconductor bare chip mounted on both sides of the substrate, and the case; And the heat dissipating material A semiconductor integrated circuit device, which is fixed with first and second resins. 5. The case according to claim 4, wherein the case includes at least one of a convex portion and a concave portion provided in advance on a bottom surface to which the resin is supplied according to a mounting height of the semiconductor bare chip. 13. The semiconductor integrated circuit device according to claim 1. 6. A heat radiating material fixed to an outer periphery of the case so as to face a circuit back surface of the semiconductor bare chip and radiating heat generated in the semiconductor bare chip. 13. The semiconductor integrated circuit device according to claim 1. 7. A semiconductor bare chip mounting method for a semiconductor integrated circuit device in which a semiconductor bare chip is flip-chip mounted on a substrate, wherein a resin is previously supplied into a case made of a material having good thermal conductivity; Pressing the substrate with a pressing jig onto the resin supplied therein, and flowing excess resin to the outside through a hole provided in the case when the substrate is pressed into the case, Wiping the resin flowing out from the hole to the outside, wherein the circuit back surface of the semiconductor bare chip mounted on one side of the substrate and the case are fixed with the resin. Implementation method. 8. The semiconductor according to claim 7, further comprising a step of fixing a heat radiating material for radiating heat generated in the semiconductor bare chip to an outer periphery of the case so as to face a circuit back surface of the semiconductor bare chip. Bare chip mounting method. 9. A method of mounting a semiconductor bare chip in a semiconductor integrated circuit device, wherein semiconductor bare chips are flip-chip mounted on both sides of a substrate, wherein a first resin is supplied in advance to a case made of a material having good thermal conductivity. Performing the step of: accommodating the substrate on the first resin supplied in the case; supplying the second resin on the substrate accommodated in the case; Pressing the heat dissipating material from the top of the second resin, and removing excess resin from the second hole provided in at least one of the heat dissipating material and the case when the heat dissipating material is pressed onto the second resin. A step of wiping out the resin flowing out of the first and second holes, and a step of wiping out the resin flowing out of the first and second holes. A semiconductor bare chip mounting method, wherein the heat sink and the heat dissipating material are fixed with the first and second resins. 10. The method according to claim 9, further comprising the step of: fixing a radiator for radiating heat generated in the semiconductor bare chip to an outer periphery of the case so as to face a circuit back surface of the semiconductor bare chip. Semiconductor bare chip mounting method.